CN207818540U - A kind of semiconductor packaging mold rack - Google Patents
A kind of semiconductor packaging mold rack Download PDFInfo
- Publication number
- CN207818540U CN207818540U CN201721562221.3U CN201721562221U CN207818540U CN 207818540 U CN207818540 U CN 207818540U CN 201721562221 U CN201721562221 U CN 201721562221U CN 207818540 U CN207818540 U CN 207818540U
- Authority
- CN
- China
- Prior art keywords
- rack
- strip
- product shelf
- product
- semiconductor packaging
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Abstract
The utility model discloses a kind of semiconductor packaging mold racks, including rack, rack lid and multiple product shelfs, product shelf is connect with rack, and rack lid is fastened on rack, and gap is provided between product shelf, it further include strip, card slot is provided on product shelf, strip matches with card slot and the slot bottom of strip and card slot is provided with gap, and strip is arranged in the both sides of product shelf, in addition, being detachably connected by fastener between product shelf and rack.The utility model is simple in structure, and space availability ratio is high, and conductor length uncontrollable situation in product both ends caused by being thermally expanded when solving production is detachably connected between product shelf and rack, reduces production and maintenance cost；In addition, the setting of strip improves the stability of product shelf.
Description
Technical field
The utility model is related to semiconductor production field, more particularly to a kind of semiconductor packaging mold rack.
Background technology
In the prior art, conventional integral is molded rack normally only in interfix, and when in use, mold is heated to be will appear
It is unfixed to expand with heat and contract with cold, after product shelf expanded by heating, since the centre to rack is fixed, thermally expands and squeezed to both sides
Pressure, makes the product on product shelf shift, the conductor length of product both sides is caused to be unable to control.
In addition, integral molding rack can not be independently serviced when rack damages, entire rack is needed replacing, is made
Production cost is significantly increased.
Utility model content
For the above defect of the existing technology, the main purpose of the utility model is to overcome the deficiencies in the prior art
Place discloses a kind of semiconductor packaging mold rack, including rack, rack lid and multiple product shelfs, the product shelf and institute
Rack connection is stated, the rack lid is fastened on the rack, and gap is provided between the product shelf.
Further, the rack further includes strip, and card slot, the strip and the card slot are provided on the product shelf
Match and the slot bottom of the strip and the card slot is provided with gap, the strip is arranged in the both sides of the product shelf.
Further, the side of the strip is between the notch and slot bottom of the card slot.
Further, the strip in the product shelf both sides is set with the center line symmetrical setting of the product shelf.
Further, the side of the strip and the gap of the card slot slot bottom are more than or equal to 10mm.
Further, which is characterized in that the rack is wholely set with the strip.
Further, two adjacent product shelfs share a strip.
Further, further include fastener, the product shelf is detachably connected with the rack by the fastener.
Further, the fastener is bayonet lock.
Further, one end that the product shelf is connect with the rack is trapezoidal.
The advantageous effect that the utility model obtains：
The utility model is simple in structure, and space availability ratio is high, product both ends conducting wire caused by being thermally expanded when solving production
The uncontrollable situation of length, is detachably connected between product shelf and rack, reduces production and maintenance cost；In addition, strip
The stability for improving product shelf is set.
Description of the drawings
Fig. 1 is the structural schematic diagram of the utility model rack；
Fig. 2 is the structural schematic diagram of the utility model rack lid；
Fig. 3 is strip and product shelf attachment structure schematic diagram；
Reference numeral is as follows：
1, rack, 2, rack lid, 3, product shelf, 4, strip, 5, card slot, 6, fastener.
Specific implementation mode
In order to make the purpose of the utility model, technical solutions and advantages more clearly understood, below in conjunction with the accompanying drawings and implement
Example is described in further detail the utility model.It should be appreciated that specific embodiment described herein is only explaining this reality
With novel, it is not used to limit the utility model.
A kind of semiconductor packaging mold rack of the utility model, as shown in Figs. 1-2, including rack 1, rack lid 2 and more
A product shelf 3, it is preferred that product shelf is provided with eight, and product shelf 3 is connect with rack 1, and rack lid 2 is fastened on rack 1, phase
Gap is provided between adjacent two product shelfs 3, the gap is more than or equal to 10mm；When in use, 3 expanded by heating of product shelf,
It can extend to both sides, the gap between two neighboring product shelf 3 meets the heated swell increment of product shelf 3 just, adjacent to make
It will not be interfered with each other between product shelf 3, relative position of the product on product shelf 3 is made not change, to control product both sides
Conductor length.
But since product shelf 3 and the bonding strength of rack 1 are limited, product shelf 3 is vacantly in rack 1, in order to when in use
Product shelf 3 is set to keep stablizing with rack 1, rack 3 further includes strip 4, and strip 4 is wholely set with rack 1, as shown in figure 3, production
The card slot 5 to match with strip 4 is provided on product frame 3, in addition, there is gap, preferably between strip 4 and the slot bottom of card slot 5
, the gap between strip 4 and the slot bottom of card slot 5 is more than or equal to 10mm；It can ensure between product shelf 3 and strip 4 in this way
It is arranged to float, meets the swell increment of product shelf 3；When the utility model is not used, the side of strip 4 is in the slot of card slot 5
Between mouth and slot bottom.Strip 4 is arranged in the both sides of product shelf 3, and the strip 4 of 3 both sides of product shelf is symmetrical with the center line of product shelf 3
Setting；In order to improve space utilization rate and save production cost, a strip 4 is shared between two neighboring product shelf 3.
In another embodiment, further include fastener 6, product shelf 3 is removably connected with rack 1 by fastener 6
It connects；Fastener 6 can be bayonet lock, matched on product shelf 3 and rack 1 and be provided with through-hole for fixing, when two through-hole phases
To rear, bayonet lock is inserted into through-hole and fixes rack 1 and product shelf 3.Trapezoidal, the trapezoidal upper bottom of product shelf 3 and 1 connecting pin of rack
While with rack 1 while contact, ensure product shelf 3 install when can stablize fixation.
When the utility model is used, product shelf 3 moves horizontally after strip 4 is inserted into card slot 5, when product shelf 3 and rack 1
On through-hole relatively after, be fixed by fastener 6, successively by eight product shelfs 3 be mounted on rack 1 on, product is placed
On product shelf 3, then rack lid 2 is fastened on rack 1, is pushed into equipment and carries out encapsulating, since glue has centainly
Temperature, product shelf 3 can be influenced to expand by temperature, but due to being provided with gap between adjacent product frame 3, this gap can
To meet the swell increment of product shelf 3, make to work independently between adjacent product frame 3, to ensure that phase of the product on product shelf 3
It does not change to position, ensure that the conductor length of product both sides.In addition, gap between strip 4 and the card slot 5 of product shelf 3
Setting makes product shelf 3 that can not be limited by strip 4 expansion is mobile while enhancing 3 stability of product shelf, i.e. strip 4
Being arranged not influences the movement of product shelf 3.
The utility model is simple in structure, and space availability ratio is high, product both ends conducting wire caused by being thermally expanded when solving production
The uncontrollable situation of length, is detachably connected between product shelf and rack, reduces production and maintenance cost；In addition, strip
The stability for improving product shelf is set.
It these are only the preferred embodiment of the utility model, be not used for limiting the scope of the utility model；If
The spirit and scope for not departing from the utility model, are modified or replaced equivalently the utility model, should all cover in this reality
In novel scope of the claims.
Claims (9)
1. a kind of semiconductor packaging mold rack, which is characterized in that including rack, rack lid and multiple product shelfs, the product
Frame is connect with the rack, and the rack lid is fastened on the rack, and gap is provided between the product shelf；The rack
Further include strip, be provided with card slot on the product shelf, the strip match with the card slot and the strip with it is described
The slot bottom of card slot is provided with gap, and the strip is arranged in the both sides of the product shelf.
2. a kind of semiconductor packaging mold rack according to claim 1, which is characterized in that the side of the strip is in
Between the notch and slot bottom of the card slot.
3. a kind of semiconductor packaging mold rack according to claim 1, which is characterized in that be arranged in the product shelf two
The strip of side is with the center line symmetrical setting of the product shelf.
4. a kind of semiconductor packaging mold rack according to claim 1, which is characterized in that the side of the strip and institute
The gap for stating card slot slot bottom is more than or equal to 10mm.
5. a kind of semiconductor packaging mold rack according to claim 1, which is characterized in that the rack and the strip
It is wholely set.
6. a kind of semiconductor packaging mold rack according to claim 1, which is characterized in that two adjacent product shelfs are total
With a strip.
7. a kind of semiconductor packaging mold rack according to claim 1, which is characterized in that further include fastener, it is described
Product shelf is detachably connected with the rack by the fastener.
8. a kind of semiconductor packaging mold rack according to claim 7, which is characterized in that the fastener is bayonet lock.
9. a kind of semiconductor packaging mold rack according to claim 7, which is characterized in that the product shelf and the material
One end of frame connection is trapezoidal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721562221.3U CN207818540U (en) | 2017-11-21 | 2017-11-21 | A kind of semiconductor packaging mold rack |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721562221.3U CN207818540U (en) | 2017-11-21 | 2017-11-21 | A kind of semiconductor packaging mold rack |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207818540U true CN207818540U (en) | 2018-09-04 |
Family
ID=63334106
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721562221.3U Expired - Fee Related CN207818540U (en) | 2017-11-21 | 2017-11-21 | A kind of semiconductor packaging mold rack |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207818540U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107768289A (en) * | 2017-11-21 | 2018-03-06 | 太仓佳锐精密模具有限公司 | A kind of semiconductor packaging mold bin |
-
2017
- 2017-11-21 CN CN201721562221.3U patent/CN207818540U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107768289A (en) * | 2017-11-21 | 2018-03-06 | 太仓佳锐精密模具有限公司 | A kind of semiconductor packaging mold bin |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180904 Termination date: 20201121 |