CN207808727U - A kind of solder mask double-sided printing frame spike devices - Google Patents

A kind of solder mask double-sided printing frame spike devices Download PDF

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Publication number
CN207808727U
CN207808727U CN201721471038.2U CN201721471038U CN207808727U CN 207808727 U CN207808727 U CN 207808727U CN 201721471038 U CN201721471038 U CN 201721471038U CN 207808727 U CN207808727 U CN 207808727U
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China
Prior art keywords
pin
pcb board
nails
columns
several
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Active
Application number
CN201721471038.2U
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Chinese (zh)
Inventor
钟红生
李伟章
曾巨湘
张由春
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SHENZHEN XIANGYU CIRCUIT CO Ltd
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SHENZHEN XIANGYU CIRCUIT CO Ltd
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Priority to CN201721471038.2U priority Critical patent/CN207808727U/en
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Publication of CN207808727U publication Critical patent/CN207808727U/en
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Abstract

The utility model discloses a kind of solder mask double-sided printing frame spike devices, including:Work top, several PIN nails and several wrinkle gummed papers composition, the PIN nails are padded by PIN to be formed with PIN columns, the PIN columns are located at the corner of PIN pads, several PIN nails are bonded in by the wrinkle gummed paper on the work top, and the arrangement mode of the PIN nails and position are determined by pcb board structure.The PIN nails are according to the structural arrangement for the pcb board that need to be printed on work top, the PIN columns are supported on the lay edges of pcb board when pcb board is positioned on the PIN columns, after printing a face pcb board, pcb board can be overturn be positioned over the PIN and nail on and republish another side so that the first face is printed on the ink on pcb board and is not bound on board.Present apparatus cost is relatively low to be easily achieved, and using the present apparatus, pcb board only needs to undergo primary baking when welding resistance is printed, and reduces primary baking compared with prior art so that production efficiency improves and saved cost.

Description

A kind of solder mask double-sided printing frame spike devices
Technical field
The utility model is related to the printing equipment field of PCB more particularly to a kind of solder mask double-sided printing frame spike devices.
Background technology
The printing of PCB welding resistances is that ink is printed onto on PCB surface, and PCB is play a part of to protect and be completely cut off, can prevent from welding Circuit is that PCB manufactures indispensable process by oxidation corrosion when bridging and prevent to use when connecing.PCB is with structural area Single sided board, dual platen, three kinds of multi-layer board can be divided into if point, wherein dual platen and multi-layer board accounts for most of ratio of present PCB. Dual platen, when making, needs all to carry out welding resistance printing treatment to the two sides of plate, existing way is usually first with multi-layer board PCB To carrying out pre-baked solidification after wherein printing on one side, then republishes another side and carry out the roasting solidification of heat again later.Because right PCB is toasted twice, therefore this technique is time-consuming longer, drags slow manufacturing schedule.
Therefore, the prior art is defective, needs to improve.
Utility model content
The purpose of the utility model is to overcome the deficiencies in the prior art, provide a kind of solder mask double-sided printing frame spike devices.
The technical solution of the utility model is as follows:A kind of solder mask double-sided printing frame spike devices, including:It is work top, several PIN is followed closely and several wrinkle gummed papers, and the PIN nails are padded by PIN to be formed with PIN columns, and the PIN columns are located at the corner of PIN pads Place, several PIN nails are bonded in by the wrinkle gummed paper on work top, and the arrangement mode of the PIN nails and position are by PCB Harden structure determines.
Further, the PIN pads are square, and its side length is 20mm, thickness 0.5mm.
Further, the PIN columns are cylinder, and the PIN column diameters are 2mm, are highly 0.16mm.
Using the above scheme, the PIN is followed closely according to the structural arrangement for the pcb board that need to be printed on work top so that Pcb board when being positioned on the PIN columns PIN columns can be supported on the lay edges of pcb board, can after printing a face pcb board Pcb board overturning is positioned over the PIN and nailed on and republishes another side so that the first face, which is printed on the ink on pcb board, to glue On board.Present apparatus cost is relatively low to be easily achieved, and using the present apparatus, pcb board only needs to undergo primary baking when welding resistance is printed It is roasting, reduce primary baking compared with prior art so that production efficiency improves and saved cost.
Description of the drawings
Fig. 1 is the structural schematic diagram of the utility model PIN nails.
Drawing reference numeral explanation:1, PIN columns;2, PIN is padded.
Specific implementation mode
Below in conjunction with the drawings and specific embodiments, the utility model is described in detail.
Referring to Fig. 1, the utility model provides a kind of solder mask double-sided printing frame spike devices, including:It is work top, several PIN is followed closely and several wrinkle gummed papers, and the PIN nails are made of PIN pads 2 and PIN columns 1, and the PIN columns 1 are located at the PIN pads 2 Corner, several PIN nails are bonded in by the wrinkle gummed paper on work top, the arrangement mode of the PIN nails and position It is determined by pcb board structure.
In the present embodiment, the quantity of the PIN nails is 50.The PIN pads 2 are square, and its side length is 20mm, thick Degree is 0.5mm.The PIN columns 1 are cylinder, and 1 a diameter of 2mm of the PIN columns, is highly 0.16mm.
Using the above scheme, the PIN is followed closely according to the structural arrangement for the pcb board that need to be printed on work top so that Pcb board when being positioned on the PIN columns 1 the PIN columns 1 can be supported on the lay edges of pcb board, after printing a face pcb board, Pcb board can be overturn be positioned over the PIN and nail on and republish another side so that the first face is printed on the ink on pcb board will not It is sticked on board.Present apparatus cost is relatively low to be easily achieved, and using the present apparatus, pcb board only needs experience primary when welding resistance is printed Baking, reduces primary baking compared with prior art so that production efficiency improves and saved cost.
The above is only the preferred embodiments of the present utility model only, is not intended to limit the utility model, all in this practicality All any modification, equivalent and improvement etc., should be included in the guarantor of the utility model made by within novel spirit and principle Within the scope of shield.

Claims (1)

1. a kind of solder mask double-sided printing frame spike devices, which is characterized in that including:Work top, several PIN nails and several wrinkle glue Paper, PIN nail is padded by PIN to be formed with PIN columns, and the PIN columns are located at the corner that the PIN is padded, several PIN follow closely by The wrinkle gummed paper is bonded on the work top, and the arrangement mode of the PIN nails and position are determined by pcb board structure, institute PIN pads are stated to be square, its side length is 20mm, thickness 0.5mm, the PIN columns are cylinder, and the PIN column diameters are 2mm, Height is 0.16mm.
CN201721471038.2U 2017-11-07 2017-11-07 A kind of solder mask double-sided printing frame spike devices Active CN207808727U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201721471038.2U CN207808727U (en) 2017-11-07 2017-11-07 A kind of solder mask double-sided printing frame spike devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201721471038.2U CN207808727U (en) 2017-11-07 2017-11-07 A kind of solder mask double-sided printing frame spike devices

Publications (1)

Publication Number Publication Date
CN207808727U true CN207808727U (en) 2018-09-04

Family

ID=63334072

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201721471038.2U Active CN207808727U (en) 2017-11-07 2017-11-07 A kind of solder mask double-sided printing frame spike devices

Country Status (1)

Country Link
CN (1) CN207808727U (en)

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