CN207800598U - A kind of novel binding structure and electronic device of chip - Google Patents
A kind of novel binding structure and electronic device of chip Download PDFInfo
- Publication number
- CN207800598U CN207800598U CN201820318834.0U CN201820318834U CN207800598U CN 207800598 U CN207800598 U CN 207800598U CN 201820318834 U CN201820318834 U CN 201820318834U CN 207800598 U CN207800598 U CN 207800598U
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- China
- Prior art keywords
- chip
- pedestal
- binding
- electronic device
- wiring board
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Led Device Packages (AREA)
Abstract
The utility model discloses the novel binding structures and electronic device of a kind of chip.The novel binding structure includes wiring board, chip, pedestal and an at least binding line, and the chip and pedestal are arranged on the wiring board, and the pedestal is located at the periphery of the chip；One end of the binding line is electrically connected the chip, and the other end is electrically connected the pedestal；Integration, which makes, on the pedestal stereo circuit, to be electrically connected the binding line and wiring board.The novel binding structure is not necessarily between chip and pedestal reserve spacing for binding line the miniaturization, it can be achieved that electronic device.
Description
Technical field
The present invention relates to chip bonding technology more particularly to the novel binding structures and electronic device of a kind of chip.
Background technology
Wire Bonding（Semiconductor leads bonding techniques）It is that chip and wiring board are realized into electricity in semiconductor applications
Property connection a kind of routine techniques, as shown in Figure 1, passing through binding line 4 '（Usually gold thread）By the first weldering of 2 ' upper surface of chip
Disk 21 ' and the second pad 11 ' of 1 ' upper surface of wiring board carry out binding and are electrically connected.
In some electronic devices, the top assembling function device in the chip 2 ' is needed（For example photographic device is taken the photograph
As the optical diffraction device etc. of head, the light diffuser of laser beam emitting device or structured light device）, then just needing in the circuit
The pedestal 3 ' for being fixed for supporting the function element is pasted on plate 1 ', in order to avoid the pedestal 3 ' interferes with binding line 4 ',
It needs to be the reserved enough spacing C ' of the binding line 4 ' between the chip 2 ' and pedestal 3 '.And the binding line 4 ' is in institute
It states the first binding face on chip 2 ' and is parallel relation between the second binding face on the wiring board 1 ', which results in
The spacing C ' reserved between the chip 2 ' and pedestal 3 ' is too big, is unfavorable for the miniaturization of product.It is described by taking photographic device as an example
Spacing C '=A '+B ' between pedestal 3 ' and image sensor chip 2 ', A ' is between described image sensing chip 2 ' and binding line 4 '
Spacing, spacing of the B ' between the pedestal 3 ' and binding line 4 ', usual A ' >=0.15mm, B ' >=0.10mm, i.e. C ' >=
0.25mm, then photographic device in order to the binding line 4 ' unilateral up to the size for increasing 0.50mm less.
Invention content
In order to solve above-mentioned the deficiencies in the prior art, the present invention provides a kind of novel binding structure and electronics dress of chip
It sets.The novel binding structure is not necessarily between chip and pedestal reserve spacing for binding line the miniaturization, it can be achieved that electronic device.
The technical problems to be solved by the invention are achieved by the following technical programs：
A kind of novel binding structure of chip, including wiring board, chip, pedestal and an at least binding line, the chip and
Pedestal is arranged on the wiring board, and the pedestal is located at the periphery of the chip；One end of the binding line is electrically connected
The chip, the other end are electrically connected the pedestal；Integration, which makes, on the pedestal stereo circuit, to be electrically connected the binding
Line and wiring board.
Further, the first binding face of the binding line on the chip is the upper surface of the chip, described
The second binding face on pedestal is one side of the pedestal towards it.
Further, it is non-parallel relation between the first binding face and the second binding face.
Further, the stereo circuit includes：
At least one first pad, for being electrically connected the binding line；
At least one second pad, for being electrically connected the wiring board；
An at least cabling, for being electrically connected corresponding first pad and the second pad.
Further, first pad is located at the pedestal towards on the one side of the chip, second pad
Positioned at the pedestal towards on the one side of the wiring board.
Further, the stereo circuit is made by embedding technology in LDS techniques, injection molding or MID techniques.
A kind of electronic device, including the novel binding structure of above-mentioned chip and the effector that is arranged on the pedestal
Part.
Further, which is photographic device, and the chip is image sensor chip, and the function element is to take the photograph
As head.
Further, which is laser beam emitting device, and the chip is Laser emission chip, the function element
For light diffuser.
Further, which is structured light device, and the chip is Laser emission chip, the effector
Part is optical diffraction device.
The present invention has the advantages that：The novel not useful binding line of binding structure is directly to the chip
It is bound with wiring board, but first the stereo circuit on chip and the pedestal is bound with the binding line, realized
Electric connection between the chip and stereo circuit, then by the pedestal stereo circuit and the wiring board electrically connect
It connects, a three-dimensional binding structure is formed by bridge of the stereo circuit, thus without being between the chip and pedestal
The binding line reserve spacing, it can be achieved that electronic device miniaturization.
Description of the drawings
Fig. 1 is the binding structure of existing chip；
Fig. 2 is the novel binding structure of chip provided by the invention.
Specific implementation mode
The present invention will be described in detail with reference to the accompanying drawings and examples.
Embodiment one
As shown in Fig. 2, a kind of novel binding structure of chip 2, including wiring board 1, chip 2, pedestal 3 and at least one binding
Line 4, the chip 2 and pedestal 3 are arranged on the wiring board 1, and the pedestal 3 is located at the periphery of the chip 2；It is described
One end of binding line 4 is electrically connected the chip 2, and the other end is electrically connected the pedestal 3；There is vertical integration making on the pedestal 3
Body circuit 31, to be electrically connected the binding line 4 and wiring board 1.
The not useful binding line of the novel binding structure 4 directly binds the chip 2 and wiring board 1, and
It is first to be bound to the stereo circuit 31 on chip 2 and the pedestal 3 with the binding line 4, realizes the chip 2 and solid
Electric connection between circuit 31, then by the pedestal 3 stereo circuit 31 and the wiring board 1 be electrically connected, with described
Stereo circuit 31 is that bridge forms a three-dimensional binding structure, is thus not necessarily between the chip 2 and pedestal 3 be described tie up
Alignment 4 reserve spacing, it can be achieved that electronic device miniaturization.
By taking photographic device as an example, which can at least reduce the size of 0.50mm on unilateral.
First binding face of the binding line 4 on the chip 2 is the upper surface of the chip 2, on the pedestal 3
Second binding face be one side of the pedestal 3 towards it；It is non-parallel between the first binding face and the second binding face
Relationship.
The stereo circuit 31 includes：
At least one first pad 311, for being electrically connected the binding line 4；
At least one second pad 312, for being electrically connected the wiring board 1；
An at least cabling 313, for being electrically connected 311 and second pad 312 of corresponding first pad.
First pad 311 is by 4 points of third pads 21 being connected on the chip 2 of the binding line, and described
Two pads 312 are welded by tin cream or the modes such as point conducting resinl are electrically connected to the 4th pad 11 on the wiring board 1.
The stereo circuit 31 can pass through the making such as embedding technology or MID techniques in LDS techniques, injection molding.
The stereo circuit 31 can be produced on the surface and/or inside of the pedestal 3, but first pad 311 and
Two pads 312 needs expose on the corresponding surface of the pedestal 3；First pad 311 is located at the pedestal 3 towards the core
On the one side of piece 2, second pad 312 is located at the pedestal 3 towards on the one side of the wiring board 1.
Embodiment two
A kind of electronic device, including the novel binding structure of above-mentioned chip 2 and the effector that is arranged on the pedestal 3
Part.
The electronic device includes but not limited to for any in photographic device, laser beam emitting device and structured light device
Kind, if the electronic device is photographic device, the chip 2 is image sensor chip 2, and the function element is camera；If
The electronic device is laser beam emitting device, then the chip 2 is Laser emission chip 2, and the function element is light diffuser；If
The electronic device is structured light device, then the chip 2 is Laser emission chip 2, and the function element is optical diffraction device.
Embodiments of the present invention above described embodiment only expresses, the description thereof is more specific and detailed, but can not
Therefore it is interpreted as the limitation to the scope of the claims of the present invention, as long as skill obtained in the form of equivalent substitutions or equivalent transformations
Art scheme should all be fallen within the scope and spirit of the invention.
Claims (10)
1. a kind of novel binding structure of chip, it is characterised in that：Including wiring board, chip, pedestal and an at least binding line, institute
It states chip and pedestal is arranged on the wiring board, and the pedestal is located at the periphery of the chip；The one of the binding line
End is electrically connected the chip, and the other end is electrically connected the pedestal；Integration, which makes, on the pedestal stereo circuit, with electrical connection
The binding line and wiring board.
2. the novel binding structure of chip according to claim 1, it is characterised in that：The binding line is on the chip
First binding face be the chip upper surface, on the pedestal second binding face be side of the pedestal towards it
Face.
3. the novel binding structure of chip according to claim 2, it is characterised in that：It ties up in the first binding face and second
Determine to be non-parallel relation between face.
4. the novel binding structure of chip according to claim 1, it is characterised in that：The stereo circuit includes：
At least one first pad, for being electrically connected the binding line；
At least one second pad, for being electrically connected the wiring board；
An at least cabling, for being electrically connected corresponding first pad and the second pad.
5. the novel binding structure of chip according to claim 4, it is characterised in that：First pad is located at the base
For seat towards on the one side of the chip, second pad is located at the pedestal towards on the one side of the wiring board.
6. the novel binding structure of the chip according to claim 1,4 or 5, it is characterised in that：The stereo circuit passes through
Embedding technology or MID techniques make in LDS techniques, injection molding.
7. a kind of electronic device, which is characterized in that including the novel binding structure of any chip in claim 1-6 and
Function element on the pedestal is set.
8. electronic device according to claim 7, it is characterised in that：The electronic device is photographic device, and the chip is
Image sensor chip, the function element are camera.
9. electronic device according to claim 7, it is characterised in that：The electronic device is laser beam emitting device, the core
Piece is Laser emission chip, and the function element is light diffuser.
10. electronic device according to claim 7, it is characterised in that：The electronic device is structured light device, described
Chip is Laser emission chip, and the function element is optical diffraction device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820318834.0U CN207800598U (en) | 2018-03-08 | 2018-03-08 | A kind of novel binding structure and electronic device of chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820318834.0U CN207800598U (en) | 2018-03-08 | 2018-03-08 | A kind of novel binding structure and electronic device of chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207800598U true CN207800598U (en) | 2018-08-31 |
Family
ID=63275853
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820318834.0U Active CN207800598U (en) | 2018-03-08 | 2018-03-08 | A kind of novel binding structure and electronic device of chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207800598U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108321141A (en) * | 2018-03-08 | 2018-07-24 | 信利光电股份有限公司 | A kind of novel binding structure and electronic device of chip |
-
2018
- 2018-03-08 CN CN201820318834.0U patent/CN207800598U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108321141A (en) * | 2018-03-08 | 2018-07-24 | 信利光电股份有限公司 | A kind of novel binding structure and electronic device of chip |
| CN108321141B (en) * | 2018-03-08 | 2023-12-26 | 信利光电股份有限公司 | Binding structure of chip and electronic device |
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