CN207793450U - A kind of cathode plate in micro-etch liquid copper recovery system in electrolytic cell - Google Patents
A kind of cathode plate in micro-etch liquid copper recovery system in electrolytic cell Download PDFInfo
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- CN207793450U CN207793450U CN201721838686.7U CN201721838686U CN207793450U CN 207793450 U CN207793450 U CN 207793450U CN 201721838686 U CN201721838686 U CN 201721838686U CN 207793450 U CN207793450 U CN 207793450U
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- cathode plate
- copper
- cathode
- micro
- electrolytic cell
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
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Abstract
The utility model discloses the cathode plates in electrolytic cell in a kind of micro-etch liquid copper recovery system, which is characterized in that the cathode plate is rectangular stainless steel plate, the edge of the cathode plate is provided with resistance plated film, the width of the resistance plated film is 5cm~8cm.The separation of cathode copper and cathode plate can be convenient for avoid the edge copper plating of cathode plate by hindering the setting of plated film, improved the service life of cathode plate, saved production cost.
Description
Technical field
The utility model is related to printed circuit board manufacturing fields, more particularly, in a kind of micro-etch liquid copper recovery system
Cathode plate in electrolytic cell.
Background technology
Micro-etch liquid copper recovery system is mainly used for recycling the micro-corrosion liquid generated in printed circuit board production process etch process
In copper ion, the copper ion in micro-corrosion liquid is plated on cathode plate by electrochemical reaction, achieve the effect that copper recycle.
Cathode plate can be copper coin, and on it after copper facing, since copper-plated purity is higher, the copper plate thickness after copper facing becomes
Thickness can be sold.But for the lower micro-corrosion liquid of copper content, copper plate thickness and plating copper mass after copper facing do not comply with again
Therefore the standard of secondary sale is not suitable for using copper coin as cathode plate.
In the prior art, for the lower micro-corrosion liquid of copper content, stainless steel plate may be used as cathode plate, in stainless steel
Cathode plate on copper facing, after reaching certain thickness, copper facing is removed to collection from stainless steel plate, stainless steel plate can be made by cycle
With.Since the edge of cathode plate in electrolyte is high potential area, copper facing is thicker thereon, it is difficult to detach with stainless steel plate, often lead
It causes to damage stainless steel plate when separation, causes the service life of stainless steel plate short, in order to avoid high potential area accumulates thicker copper facing, need
The interval shorter time carries out copper removal to stainless steel plate, and the above method results in production cost height and reduces production efficiency.
Invention content
The purpose of this utility model is to provide a kind of cathode plates to avoid part by the way that resistance plated film is arranged in high current area
Copper facing is blocked up.
To achieve the above object, the technical solution of the utility model is as follows：
A kind of cathode plate in micro-etch liquid copper recovery system in electrolytic cell, which is characterized in that the cathode plate be it is rectangular not
Become rusty steel plate, the edge of the cathode plate is provided with resistance plated film, the width of the resistance plated film is 5cm~8cm.
The resistance plated film is plastic foil or plastic adhesive tape.
Description of the drawings
Fig. 1 be the utility model a kind of micro-etch liquid copper recovery system in cathode plate in electrolytic cell structural schematic diagram.
Specific implementation mode
Below in conjunction with the accompanying drawings, specific embodiment of the present utility model is described in further detail.
It should be noted that in following specific implementation modes, when the embodiment of the utility model is described in detail, in order to
The structure of the utility model is clearly showed that in order to illustrate, spy does not draw to the structure in attached drawing according to general proportion, goes forward side by side
Gone partial enlargement, deformation and simplify processing, therefore, should avoid in this, as the restriction to the utility model to understand.
Cathode plate in the utility model is mainly used in the electrolytic cell of micro-etch liquid copper recovery system, and the copper in micro-corrosion liquid contains
Amount is less than 25g/L, and when being directly plated to copper in copper cathode sheets with electrolytic recovery copper, the copper coin after copper facing is of poor quality, no
It can sell.Fig. 1 be the utility model a kind of micro-etch liquid copper recovery system in cathode plate in electrolytic cell structural schematic diagram.Such as
Shown in figure, cathode plate 01 is rectangular conductive plate, and the edge of cathode plate is provided with resistance plated film 02, for preventing copper facing from depositing, hinders
Plated film 02 can be insulating materials, such as plastic foil or plastic adhesive tape, and the width of resistance plated film 02 can be 5cm~8cm.
The dimensions of cathode plate can according to the size adjusting of electrolytic cell, in use, the edge of cathode plate can collect compared with
Polyelectron becomes high current area, and electrolyzing rate under high currents is very fast, in same time, high current zone (the i.e. side of cathode plate
Edge) thicker cathode copper can be deposited compared to other regions, when cathode copper is blocked up, due to the binding force of cathode copper and stainless steel plate compared with
Good, cathode copper is detached with stainless steel plate can be extremely difficult, often results in the breakage of stainless steel plate, stainless steel plate is caused to be scrapped.
Resistance plated film is set in high current zone, since resistance plated film insulation is non-conductive, cathode copper can be forbidden to be deposited in high current area, high electricity
Stream area includes the lower edge and lateral edges of cathode plate 01, and in the present embodiment, top edge does not contact electrolyte, therefore, top edge
It can be not provided with resistance plated film.
Copper recycling on the cathode plate of the utility model is recycled using the method for wiping copper sheet off, and cathode plate repeats to make
With.Before improving cathode plate, a stainless steel plate is monthly needed replacing, needs the 4 hours copper carried out on stainless steel plate point every time
From, it, can be with the stainless steel plate of replacement in four months after the utility model, and the time of progress copper separation can shorten every time
Half not only increases production efficiency, reduces human cost, and saved production cost.
The preferable specific implementation mode of the above, only the utility model, but the scope of protection of the utility model is not
Be confined to this, any one skilled in the art within the technical scope disclosed by the utility model, according to this practicality
Novel technical solution and its inventive concept is subject to equivalent substitution or change, should all cover the scope of protection of the utility model it
It is interior.
Claims (2)
1. the cathode plate in a kind of micro-etch liquid copper recovery system in electrolytic cell, which is characterized in that the cathode plate is rectangular stainless
Steel plate is provided with resistance plated film at the edge of the cathode plate, and the width of the resistance plated film is 5cm~8cm.
2. the cathode plate in micro-etch liquid copper recovery system according to claim 1 in electrolytic cell, which is characterized in that the resistance
Plated film is plastic foil or plastic adhesive tape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721838686.7U CN207793450U (en) | 2017-12-25 | 2017-12-25 | A kind of cathode plate in micro-etch liquid copper recovery system in electrolytic cell |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721838686.7U CN207793450U (en) | 2017-12-25 | 2017-12-25 | A kind of cathode plate in micro-etch liquid copper recovery system in electrolytic cell |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207793450U true CN207793450U (en) | 2018-08-31 |
Family
ID=63280976
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721838686.7U Active CN207793450U (en) | 2017-12-25 | 2017-12-25 | A kind of cathode plate in micro-etch liquid copper recovery system in electrolytic cell |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207793450U (en) |
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2017
- 2017-12-25 CN CN201721838686.7U patent/CN207793450U/en active Active
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