CN207783228U - A kind of DALI interface circuits with bootstrapping function - Google Patents
A kind of DALI interface circuits with bootstrapping function Download PDFInfo
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Abstract
The utility model discloses a kind of DALI interface circuits with bootstrapping function, the DALI interface circuits are powered by a power supply circuit, and include a rectification module, one communication radiating circuit being electrically connected with the rectification module, and one with it is described communicate radiating circuit electric connection signal input part, it is characterised in that：The communication radiating circuit includes a metal-oxide-semiconductor Q2 and a boostrap circuit being electrically connected with the metal-oxide-semiconductor Q2.The utility model its by the circuit design of high voltage drive MOS, then circuit can be caused to become complicated, circuit overall power is got higher, the utility model simplifies scheme, reduces component, reduces cost, the space on circuit board is also saved, simpler also more stable is become for communication logic.
Description
Technical field
The utility model is related to one kind being based on digital addressable lighting interface circuit, be related specifically to a kind of with bootstrapping work(
The DALI interface circuits of energy.
Background technology
Lighting control system is exactly to be used according to some region of function, period, room light brightness or the purposes in the region
The method that computer, communication and digital dimming technology are combined, makes lighting system automate.With building automatic and illumination
The rapid development of industry will be certainty that illumination market develops with energy-saving design and the digital control lighting control system for core
Trend.
Digital addressable lighting interface agreement DALI (Digital Addressable Lighting Interface) is
The Lighting control communication protocol of International Publication specification, communication speed are 1200BPS ± 10%.Be mainly used for multiple fluorescent lamps and
The brightness adjustment control of LED illumination, DALI can constitute network by maximum 64 short addresses and 16 group address, and a host can
To control one or more slave, communicated in a half duplex manner.
DALI interface communications protocols encode simple, reliable communications, and essential electrical feature is as follows：1. asynchronous serial communication,
Rate of information throughput 1200baud/s；2. the transmission of half-duplex, two-wire differential driving, data uses Manchester's code mode；
3. by judging the voltage difference of DALI buses come the height of decision level, voltage difference is 1 between 9.5~22.5V ,-6.5-
It is 0 between 6.5V；4. DALI bus currents are less than 250mA；5. the rising and falling time of DALI signals is 10~100 μ s.
The level of DALI buses is different from the level of microcontroller, in order to complete the communication between host and slave, it is necessary to have
Interface circuit realizes the level conversion between DALI buses and microcontroller.Interface circuit is the difficult point of DALI systems design, main
If it must satisfy the electrical characteristic of DALI agreements.
DALI interface circuits include host interface circuit and slave interface circuit, and the application is carried out for slave interface circuit
It improves, in the prior art, in the communication process of DALI buses, needs DALI buses carrying out short circuit operation, by bus voltage
Low level is pulled down to from high level.During operation short circuit operation is carried out usually using N-channel MOS pipe.The MOS of N-channel
The cut-in voltage of pipe is not effective to ensure that metal-oxide-semiconductor between 2~4V, but since microcontroller supply voltage is usually 3.3V
It is opened.So power unit needs to design the power supply of a 5V or more specially to metal-oxide-semiconductor in existing product design
Driving circuit, which is powered, can open metal-oxide-semiconductor.However, the design of the power circuit causes entire circuit to become complicated, at
This rising, stability decline.
Utility model content
In view of this, it is necessary to provide a kind of DALI interface circuits with bootstrapping function, can solve metal-oxide-semiconductor driving
The powerup issue of circuit, and old can be saved, also save the space on circuit board.
The utility model is realized according to following technical scheme：
A kind of DALI interface circuits with bootstrapping function, which is powered by a power supply circuit, and is wrapped
A rectification module is included, a communication radiating circuit being electrically connected with the rectification module and one communicate hair with described
The signal input part that transmit-receive radio road is electrically connected, the communication radiating circuit include a metal-oxide-semiconductor Q2 and one and the metal-oxide-semiconductor
The boostrap circuit that Q2 is electrically connected, the boostrap circuit include diode D4, resistance R7, resistance R10, capacitance C11, resistance R9,
The anode of diode D4 and the output end of the power supply circuit are electrically connected, the cathode of diode D4 and one end phase of resistance R7
Even, capacitance C11 is connected in series with resistance R9 and is connected in parallel again with resistance R10, and one end of resistance R10 connects with the other end of resistance R7
It connects, the other end ground connection of resistance R10, the grid of the metal-oxide-semiconductor Q2 is electrically connected between resistance R7 and resistance R10, described whole
The output end of flow module is connected with the drain electrode of the metal-oxide-semiconductor Q2, the source electrode ground connection of the metal-oxide-semiconductor Q2, the signal input part electricity
Property is connected between capacitance C11 and resistance R9.
Further, the boostrap circuit further includes capacitance C10, and one end of the capacitance C10 is electrically connected at the MOS
The grid of pipe Q2, the other end ground connection of capacitance C10.
Further, the DALI interface circuits further include the communications reception circuit being electrically connected with the rectification module and
One signal receiving end being electrically connected with the communications reception circuit, the communications reception circuit includes diode D3, resistance
R5, resistance R6, metal-oxide-semiconductor Q1, resistance R2, resistance R3, wherein the output end phase of the anode of diode D3 and the rectification module
Even, the cathode of diode D3 is connected with one end of resistance R5, the other end of resistance R5 and one end of resistance R6 and metal-oxide-semiconductor Q1's
Grid is connected, and the source electrode of the metal-oxide-semiconductor Q1 is connected and is grounded with the other end of resistance R6, and one end of resistance R2 connects power supply circuit
Output end, the other end of resistance R2 is connected with the drain electrode of one end of resistance R3 and metal-oxide-semiconductor Q1, the other end and letter of resistance R3
Number receiving terminal is connected.
Further, the DALI interface circuits further include with the communications reception circuit and it is described communicate radiating circuit electricity
Property connection MCU processor, the MCU processor controls metal-oxide-semiconductor Q2 on or off, the square wave differential of DALI buses believed
It number is handled, it will treated DALI digital signals output.
Further, the power supply circuit is electrically connected with the rectification module and the MCU processor respectively, described
Power supply circuit converts input voltage into output voltage, is powered to the MCU processor by transformed output voltage.
Further, the MCU processor is MSP430FR2032 models.
Further, the power supply circuit includes voltage shaping circuit and voltage conversion circuit, the voltage shaping electricity
The one end on road is connected with the output end of the rectification module, the other end of the voltage shaping circuit and the voltage conversion circuit
One end be connected, the other end of the voltage conversion circuit is connected with the MCU processor.
Further, the voltage shaping circuit includes capacitance D1, varistor FV1, capacitance C2, capacitance C3, wherein electricity
Holding C2 and capacitance C3 to be connected in parallel, the feeder ear of 9-18V is connect with one end of the anode of diode D1 and varistor FV1,
The cathode of diode D1 is connect with the one end capacitance C2；The voltage conversion circuit include power supply chip, capacitance C1, diode D2,
Inductance L1, resistance R1, resistance R4, capacitance C4, capacitance C5, capacitance C6, wherein the one end capacitance C3 is connected to the 4 of power supply chip and draws
Foot and 5 pins, 2 pins of other end connection power supply chip are simultaneously grounded, and 1 pin of power supply chip passes through capacitance C1 and power supply chip
6 pins, diode D2 cathode and inductance L1 one end be connected, the plus earth of diode D2, capacitance C4, capacitance C5,
Capacitance C6 is in parallel, and the other end of inductance L1 connect and connect supply voltage VDD with resistance R1, the one end capacitance C4, and resistance R1's is another
One end is connected with 3 pins of one end of resistance R4 and power supply chip, and capacitance C4 is connected and is grounded with the other end of resistance R4.
Further, the power supply circuit includes varistor FV2, resistance R8, triode Q4, regulator block N2, resistance
R11, resistance R12, capacitance C7, wherein the feeder ear of 9-18V and the collector of triode Q4 and resistance R8, varistor FV2
One end be connected, the other end of resistance R8 is connected with the cathode of the base stage of triode Q4 and regulator block N2, the hair of triode Q4
Emitter-base bandgap grading connect with one end of resistance R11 and capacitance C7 and connects VDD, the anode of regulator block N2 and one end of resistance R12 and electricity
Hold C7, the other end of varistor FV2 is connected and is grounded, the other end of resistance R11 and the other end and regulator block of resistance R12
The reference edge of N2 is connected.
Further, which further includes signal input circuit, at the signal input circuit and the MCU
Device connection is managed, the signal input circuit includes push button signalling input circuit, RF signal input circuits, infrared remote-controlled signal input
Circuit or wire signal input circuit it is one or more.
Compared with prior art, the utility model has the following technical effects：
The utility model efficiently solves low voltage circuit, the problem of metal-oxide-semiconductor driving circuit can not be effectively ensured.It is passing
Unite circuit in, if to ensure metal-oxide-semiconductor driving reliability, other than the MCU low voltage power supply circuits of itself, will also there are one
The metal-oxide-semiconductor driving voltage power supply circuit of high voltage.It can then cause circuit to become by the circuit design of high voltage drive MOS
Complexity, circuit overall power are got higher.The design simplifies scheme, reduces component, reduces cost, also save on circuit board
Space, simpler also more stable is become for communication logic.
Description of the drawings
The embodiments of the present invention are described below in conjunction with attached drawing, wherein：
Fig. 1 is the DALI interface circuit structure principle schematics of the utility model；
Fig. 2 is the DALI interface circuit schematic diagrames of the utility model；
Fig. 3 is one embodiment schematic diagram of the power supply circuit of the utility model；
Fig. 4 is another embodiment schematic diagram of the power supply circuit of the utility model；
Fig. 5 is the interface diagram of the MCU processor of the utility model；
Wherein, 1- rectification modules, 2- communications reception circuits, 3- communicate radiating circuit, 4-MCU processors, 5,5 '-power supply electricity
Road, 6- push button signalling input circuits, 7-RF signal input circuits, 8- infrared remote-controlled signal input circuits, the input of 9- wire signals
Circuit, 10- boostrap circuits, 11- voltage shaping circuits, 12- voltage conversion circuits.
Specific implementation mode
Specific embodiment of the utility model is further elaborated below based on attached drawing.It should be appreciated that herein
Described specific embodiment is only used as embodiment, is not used to limit the scope of protection of the utility model.
It please refers to Fig.1 and Fig. 2, is respectively the DALI interface circuit structures principle schematic and circuit of the utility model
Schematic diagram, the utility model with bootstrapping function DALI interface circuits, the DALI interface circuits by a power supply circuit (5,
5 ') it powers, and includes a rectification module 1, a communication radiating circuit 3, Yi Jiyi being electrically connected with the rectification module 1
It is a with the signal input part for communicating the electric connection of radiating circuit 3, the communication radiating circuit 3 including metal-oxide-semiconductor Q2 with
And a boostrap circuit 10 being electrically connected with the metal-oxide-semiconductor Q2, the boostrap circuit 10 include diode D4, resistance R7, electricity
R10, capacitance C11, resistance R9 are hindered, the anode of diode D4 and the output end of the power supply circuit (5,5 ') are electrically connected, two poles
The cathode of pipe D4 is connected with one end of resistance R7, and capacitance C11 is connected in series with resistance R9 and is connected in parallel again with resistance R10, resistance
One end of R10 is connect with the other end of resistance R7, and the other end ground connection of resistance R10, the grid of the metal-oxide-semiconductor Q2 is electrically connected at
Between resistance R7 and resistance R10, the output end of the rectification module is connected with the drain electrode of the metal-oxide-semiconductor Q2, the metal-oxide-semiconductor Q2's
Source electrode is grounded, and the signal input part is electrically connected between capacitance C11 and resistance R9.
The boostrap circuit 10 of the utility model further includes capacitance C10, and one end of the capacitance C10 is electrically connected at described
The grid of metal-oxide-semiconductor Q2, the other end ground connection of capacitance C10.
The application is to ensure that it is 0V to export low level in DALI_TX by the resistance of regulation resistance R7 and resistance R10
When voltage be 2.0V, ensure metal-oxide-semiconductor Q2 cut-off, then it is 2.0V that the both ends capacitance C11, which keep pressure difference,.When TX signal ends start to send number
According to when, TX signal ends can become high level 3.3V, because capacitance C11 both end voltage pressure differences are unable to transient change, metal-oxide-semiconductor Q2
Base voltage then becomes 5.3V (5.3V=2V+3.3V) and ensures metal-oxide-semiconductor Q2 conductings.
Attached drawing 2 is please referred to again, and the DALI interface circuits of the utility model further include being electrically connected with the rectification module 1
Communications reception circuit 2 and a signal receiving end being electrically connected with the communications reception circuit 2, the communications reception circuit
2 include diode D3, resistance R5, resistance R6, metal-oxide-semiconductor Q1, resistance R2, resistance R3, wherein the anode of diode D3 with it is described whole
The output end of flow module 1 is connected, and the cathode of diode D3 is connected with one end of resistance R5, and the other end of resistance R5 is with resistance R6's
The grid of one end and metal-oxide-semiconductor Q1 are connected, and the source electrode of the metal-oxide-semiconductor Q1 is connected and is grounded with the other end of resistance R6, resistance R2
One end connection power supply circuit output end, the other end of resistance R2 is connected with the drain electrode of one end of resistance R3 and metal-oxide-semiconductor Q1,
The other end of resistance R3 is connected with signal receiving end.
The DALI interface circuits of the utility model further include and the communications reception circuit 2 and the communication radiating circuit
3 MCU processors 4 being electrically connected, the MCU processor 4 controls metal-oxide-semiconductor Q2 on or off, by the square wave of DALI buses
Differential signal is handled, and by treated, DALI digital signals export.Wherein, the communications reception circuit 2 of DALI interface circuits
Be by DALI buses high voltage and function that low voltage transition is the high and low level signal that can be identified for MCU processor 4,
And it is high-low voltage that the communication radiating circuit 3 of DALI interface circuits, which is by the high and low level conversion of the I/O pin of MCU processor 4,
To influence the variation of the level in DALI buses signal is transmitted in DALI buses to reach.
Below in conjunction with the accompanying drawings 2 introduce the utility model DALI interface circuits operation principle：
When MCU processor does not send signal, then TX signal ports keep low level constant, at this point, the poles G of metal-oxide-semiconductor Q2
Level is codetermined by VDD and diode D4, resistance R7 and resistance R10, by the resistance value of regulation resistance R7 and R10, ensures Q2
The poles G level between 1.7V~2.0V so that metal-oxide-semiconductor Q2 cut-off, then DALI buses are 9.5~22.5V high level, and are defined
The high level signal is 1, and the both ends capacitance C11 pressure difference is 1.7V~2.0V at this moment.When starting to DALI bus sender's wave numbers
When word signal, TX signal I/O port moments become high level 3.3V, due to capacitance both end voltage can not transient change characteristic, then
The voltage of the poles G of metal-oxide-semiconductor Q2 can be lifted to 5V or so capacitance C11 moments, i.e., the 3.3V that the TX signals access is added to
On 1.7V~2.0V originally, rectifier diode D4 ends at this time, maintains the voltage of the poles G of metal-oxide-semiconductor Q2 so that metal-oxide-semiconductor Q2
It is connected, the 250mA electric currents exported by external constant-current source in DALI buses are all bled off by metal-oxide-semiconductor Q2, DALI bus voltage quilts
It is pulled down to the low level signal of -6.5V~6.5V, and it is 0 to define the low level signal.When TX signals I/O port becomes low electricity again
When flat 0V, the G pole tensions of Q2 can be retracted 1.7~2.0V voltages again by capacitance C11, diode D4 conductings, with resistance R7,
Resistance R10 common guarantee G pole tensions maintain 1.7~2.0V, Q2 cut-offs, and DALI buses become the high level of 9.5~22.5V again,
To realize the transmitting of binary digital signal.
The utility model is in the design process, it should be noted that：The value of capacitance C11 will be far longer than capacitance C10 and MOS
The parasitic capacitance of the poles pipe G ensures that capacitance C11 can raise the voltage of the poles metal-oxide-semiconductor G moment.
The resistance value of regulation resistance R7, resistance R10 ensure that voltage is had between 1.7V~2.0V, have if too big
Risk constantly on Q2；If too small, when the TX of MCU processor is high level, it can not ensure that Q2 is centainly connected.Adjust electricity
The proportioning with capacitance C11 for hindering R7, resistance R10 ensures that, when TX is the maintenance stage of high level, resistance R7, resistance R10 discharge
Cannot be too fast, otherwise the G pole tensions of metal-oxide-semiconductor Q2 can slide too fast, cause during TX signal receiving ends maintain high level
Shutdown, signal send failure.
When DALI buses have square-wave signal arrival to need to receive, if in bus being square wave high level, 9.5~
For 22.5V by rectifier diode D3 and resistance R5, resistance R6 after partial pressure, the G step voltages of communications reception circuit metal-oxide-semiconductor Q1 are big
In 4V, the RX signal receiving ends of MCU processor N4 are low level；If be square wave low level in bus, -6.5V~6.5V
By rectifier diode D3 and resistance R5, resistance R6 after partial pressure, the G pole tensions of metal-oxide-semiconductor Q2 are less than 2V, and metal-oxide-semiconductor Q1 ends,
The RX signal receiving ends of MCU processor N4 are high level.In this way, the square wave digital difference signal of DALI buses is turned
Turn to the digital signal that MCU processor can parse.
The power supply circuit (5,5 ') of the utility model electrically connects with the rectification module 1 and the MCU processor 4 respectively
It connects, the power supply circuit (5,5 ') converts input voltage into output voltage, by transformed output voltage at the MCU
Device 4 is managed to power.
The utility model uses two different power supply circuits, please refers to attached drawing 3, is the power supply circuit of the utility model
One embodiment schematic diagram, one of which power supply circuit 5 include voltage shaping circuit 11 and voltage conversion circuit 12, it is described
One end of voltage shaping circuit 11 is connected with the output end of the rectification module 1, the other end of the voltage shaping circuit 11 with
One end of the voltage conversion circuit 12 is connected, and the other end of the voltage conversion circuit 12 is connected with the MCU processor 4.
In the first power supply circuit, the voltage shaping circuit 11 includes capacitance D1, varistor FV1, capacitance C2, electricity
Hold C3, wherein capacitance C2 and capacitance C3 is connected in parallel, the feeder ear of 9-18V and the anode of diode D1 and varistor FV1
One end connection, the cathode of diode D1 connect with the one end capacitance C2；The voltage conversion circuit 12 includes power supply chip, capacitance
C1, diode D2, inductance L1, resistance R1, resistance R4, capacitance C4, capacitance C5, capacitance C6, wherein the one end capacitance C3 is connected to electricity
4 pins and 5 pins of source chip, 2 pins of other end connection power supply chip are simultaneously grounded, and 1 pin of power supply chip passes through capacitance
C1 is connected with one end of 6 pins of power supply chip, the cathode of diode D2 and inductance L1, the plus earth of diode D2, electricity
Hold C4, capacitance C5, capacitance C6 parallel connections, the other end of inductance L1 connect with resistance R1, the one end capacitance C4 and connects supply voltage
The other end of VDD, resistance R1 are connected with 3 pins of one end of resistance R4 and power supply chip, and capacitance C4 is another with resistance R4's
End is connected and is grounded.
Specifically, the power supply chip of voltage conversion circuit uses SY8290, the power supply core of the model in the present invention
Piece is the prior art.The application can also select other satisfactory chips, not do any restriction.
Fig. 4 is another embodiment schematic diagram of the power supply circuit of the utility model, as shown in figure 4, powering at second
In circuit, power supply circuit 5 ' includes varistor FV2, resistance R8, triode Q4, regulator block N2, resistance R11, resistance R12, electricity
Hold C7, wherein the feeder ear of 9.5-22.5V and the collector and resistance R8 of triode Q4, one end phase of varistor FV2
Even, the other end of resistance R8 is connected with the cathode of the base stage of triode Q4 and regulator block N2, emitter and the electricity of triode Q4
One end of resistance R11 and capacitance C7 connects and connects VDD, the anode of regulator block N2 and one end of resistance R12 and capacitance C7, pressure-sensitive
The other end of resistance FV2 is connected and is grounded, the reference of the other end of resistance R11 and the other end of resistance R12 and regulator block N2
End is connected.The application can also select other reduction voltage circuits, be not limited only to above-mentioned reduction voltage circuit.
In this application, MCU processor 4 is MSP430FR2032 models, and Fig. 5 is the MCU processor 4 of the utility model
Interface diagram.It should be noted that the application is also an option that the microcontroller of other models, only connect with data transmission
Mouthful, it can realize the data conversion operation of DALI.
In specific implementation process, the application further includes signal input circuit, at the signal input circuit and the MCU
It manages device 4 to connect, the signal input circuit includes push button signalling input circuit 6, RF signal input circuits 7, infrared remote-controlled signal
Input circuit 8 or wire signal input circuit 9 it is one or more.Push button signalling input circuit 6 is responsible for human-computer interaction, uses
Person sends out instruction by button, and to control all illuminations, button includes that brightness increases and decreases, power switch, state switching,
Reset etc..Infrared remote-controlled signal input circuit works as detection by detecting whether that someone is further sent out instruction by lighting area
When passing through to someone, illuminator illumination can be controlled, while sending a signal to control terminal, intelligently open or close illuminator,
User is also an option that the input of RF signals and wire signal input.Further, user can indicate MCU in several ways
What what concurrent instruction processor 4, which will do, is realized with reaching the expection control effect of illumination to the brightness of light, group, field
Scape, broadcast, automatic addressing lamp function.The utility model is the control circuit based on DAILI communication bus, by that can be matched by user
The instruction set realizes there is extremely strong flexibility and scalability.
The utility model is the control circuit based on DALI communication bus, is realized by the instruction that can configure by user, tool
There is extremely strong flexibility and scalability.Therefore, the utility model effective solution powerup issue of metal-oxide-semiconductor driving circuit, subtracts
Lack the power supply circuit of a 5V, so saving cost, also saved the space on circuit board, and reduces three poles
Pipe becomes simpler also more stable for communication logic, and ensure that the stability of DALI interface circuit signal transmissions.
The above is only the preferred embodiment of the utility model only, is not intended to limit the utility model, all at this
All any modification, equivalent and improvement etc., should be included in the utility model made by the spirit of utility model and the interior of principle
Protection domain within.
Claims (10)
1. a kind of DALI interface circuits with bootstrapping function, which is powered by a power supply circuit, and includes
One rectification module, one communicates transmitting with the communication radiating circuit of rectification module electric connection and one with described
The signal input part that circuit is electrically connected, it is characterised in that：The communication radiating circuit include a metal-oxide-semiconductor Q2 and one with
The boostrap circuit that the metal-oxide-semiconductor Q2 is electrically connected, the boostrap circuit includes diode D4, resistance R7, resistance R10, capacitance
C11, resistance R9, the anode of diode D4 and the output end of the power supply circuit are electrically connected, the cathode and resistance of diode D4
One end of R7 is connected, and capacitance C11 is connected in series with resistance R9 and is connected in parallel again with resistance R10, one end and the resistance R7 of resistance R10
Other end connection, the other end ground connection of resistance R10, the grid of the metal-oxide-semiconductor Q2 be electrically connected at resistance R7 and resistance R10 it
Between, the output end of the rectification module is connected with the drain electrode of the metal-oxide-semiconductor Q2, the source electrode ground connection of the metal-oxide-semiconductor Q2, the signal
Input terminal is electrically connected between capacitance C11 and resistance R9.
2. a kind of DALI interface circuits with bootstrapping function according to claim 1, it is characterised in that：The bootstrapping electricity
Road further includes capacitance C10, and one end of the capacitance C10 is electrically connected at the grid of the metal-oxide-semiconductor Q2, the other end of capacitance C10
Ground connection.
3. a kind of DALI interface circuits with bootstrapping function according to claim 1, which is characterized in that the DALI interfaces
Circuit further includes that the communications reception circuit being electrically connected with the rectification module and one are electrical with the communications reception circuit
The signal receiving end of connection, the communications reception circuit include diode D3, resistance R5, resistance R6, metal-oxide-semiconductor Q1, resistance R2, electricity
Hinder R3, wherein the anode of diode D3 is connected with the output end of the rectification module, the cathode of diode D3 and the one of resistance R5
End be connected, the other end of resistance R5 is connected with the grid of one end of resistance R6 and metal-oxide-semiconductor Q1, the source electrode of the metal-oxide-semiconductor Q1 and
The other end of resistance R6 is connected and is grounded, the output end of one end connection power supply circuit of resistance R2, the other end and the electricity of resistance R2
The drain electrode of one end and metal-oxide-semiconductor Q1 for hindering R3 is connected, and the other end of resistance R3 is connected with signal receiving end.
4. a kind of DALI interface circuits with bootstrapping function according to claim 3, which is characterized in that the DALI interfaces
Circuit further include with the communications reception circuit and the MCU processor for communicating radiating circuit electric connection, at the MCU
It manages device and controls metal-oxide-semiconductor Q2 on or off, the square wave differential signal of DALI buses is handled, it will treated DALI numbers
Word signal exports.
5. a kind of DALI interface circuits with bootstrapping function according to claim 4, which is characterized in that the power supply electricity
Road is electrically connected with the rectification module and the MCU processor respectively, and the power supply circuit converts input voltage into defeated
Go out voltage, is powered to the MCU processor by transformed output voltage.
6. a kind of DALI interface circuits with bootstrapping function according to claim 5, which is characterized in that the MCU
Processor is MSP430FR2032 models.
7. the DALI interface circuits according to claim 5 with bootstrapping function, which is characterized in that the power supply circuit packet
Include voltage shaping circuit and voltage conversion circuit, the output end phase of one end of the voltage shaping circuit and the rectification module
Even, the other end of the voltage shaping circuit is connected with one end of the voltage conversion circuit, the voltage conversion circuit it is another
One end is connected with the MCU processor.
8. the DALI interface circuits according to claim 7 with bootstrapping function, which is characterized in that the voltage shaping electricity
Road includes capacitance D1, varistor FV1, capacitance C2, capacitance C3, and wherein capacitance C2 and capacitance C3 is connected in parallel, the power supply of 9-18V
End is connect with one end of the anode of diode D1 and varistor FV1, and the cathode of diode D1 is connect with the one end capacitance C2；Institute
It includes power supply chip, capacitance C1, diode D2, inductance L1, resistance R1, resistance R4, capacitance C4, capacitance to state voltage conversion circuit
C5, capacitance C6, wherein the one end capacitance C3 is connected to 4 pins and 5 pins of power supply chip, and the 2 of other end connection power supply chip draws
Foot is simultaneously grounded, and 1 pin of power supply chip passes through 6 pins of capacitance C1 and power supply chip, the cathode of diode D2 and inductance L1
One end be connected, the plus earth of diode D2, capacitance C4, capacitance C5, capacitance C6 are in parallel, the other end and resistance of inductance L1
R1, the one end capacitance C4 connect and connect supply voltage VDD, the other end of resistance R1 and one end of resistance R4 and power supply chip
3 pins are connected, and capacitance C4 is connected and is grounded with the other end of resistance R4.
9. the DALI interface circuits according to claim 5 with bootstrapping function, which is characterized in that the power supply circuit packet
Include varistor FV2, resistance R8, triode Q4, regulator block N2, resistance R11, resistance R12, capacitance C7, wherein the confession of 9-18V
Electric end is connected with one end of the collector of triode Q4 and resistance R8, varistor FV2, the other end and triode of resistance R8
The base stage of Q4 and the cathode of regulator block N2 are connected, and the emitter of triode Q4 is connect with one end of resistance R11 and capacitance C7
And VDD is met, the anode of regulator block N2 connect and connects with the other end of one end of resistance R12 and capacitance C7, varistor FV2
The other end on ground, resistance R11 is connected with the reference edge of the other end of resistance R12 and regulator block N2.
10. the DALI interface circuits according to claim 4 with bootstrapping function, which is characterized in that the DALI interface electricity
Road further includes signal input circuit, and the signal input circuit is connect with the MCU processor, and the signal input circuit includes
The one of push button signalling input circuit, RF signal input circuits, infrared remote-controlled signal input circuit or wire signal input circuit
Kind is a variety of.
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| CN201721655537.7U CN207783228U (en) | 2017-12-01 | 2017-12-01 | A kind of DALI interface circuits with bootstrapping function |
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