CN207766690U - Controller with elastic compaction mechanism - Google Patents

Controller with elastic compaction mechanism Download PDF

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Publication number
CN207766690U
CN207766690U CN201721735245.4U CN201721735245U CN207766690U CN 207766690 U CN207766690 U CN 207766690U CN 201721735245 U CN201721735245 U CN 201721735245U CN 207766690 U CN207766690 U CN 207766690U
Authority
CN
China
Prior art keywords
oxide
metal
semiconductor
bracket
pressuring plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201721735245.4U
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Chinese (zh)
Inventor
王在峰
陈祖亮
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
XUZHOU KEYA ELECTROMECHANICAL CO Ltd
Original Assignee
XUZHOU KEYA ELECTROMECHANICAL CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by XUZHOU KEYA ELECTROMECHANICAL CO Ltd filed Critical XUZHOU KEYA ELECTROMECHANICAL CO Ltd
Priority to CN201721735245.4U priority Critical patent/CN207766690U/en
Application granted granted Critical
Publication of CN207766690U publication Critical patent/CN207766690U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model is related to a kind of controller with elastic compaction mechanism, it is equipped with spring pressuring plate bracket, metal-oxide-semiconductor bracket and PCB main board card slot in shell, metal-oxide-semiconductor is installed vertically on the side of PCB main board;PCB is responsible for card slot and metal-oxide-semiconductor bracket is respectively placed in the both sides of shell, spring pressuring plate bracket is arranged close to the side of metal-oxide-semiconductor bracket, when PCB main board grafting horizontal with PCB main board card slot, bottom edge on the outside of metal-oxide-semiconductor is supported on metal-oxide-semiconductor bracket, spring pressuring plate is supported by spring pressuring plate bracket and the lower part of spring pressuring plate is pressed in the inside of metal-oxide-semiconductor, and the top of spring pressuring plate is fixed by the housing pin for being installed on side wall of outer shell;Spring pressuring plate fixes metal-oxide-semiconductor with metal-oxide-semiconductor bracket collective effect, metal-oxide-semiconductor is fixed by spring pressuring plate, housing pin, controller is improved and produces efficiency of assembling, traditional type screw is saved and adds insulation grain fixed form, prevent metal-oxide-semiconductor electric leakage hidden danger, improves product quality.

Description

Controller with elastic compaction mechanism
Technical field
The utility model is related to a kind of controllers, and in particular to a kind of controller with elastic compaction mechanism.
Background technology
Currently, the metal-oxide-semiconductor and PCB supervisors in controller are mainly installed with screw and fixed, production efficiency of assembling is relatively low, and In the presence of electric leakage hidden danger, safety is relatively low.
Utility model content
In order to solve the above-mentioned technical problem, the utility model provides a kind of controller with elastic compaction mechanism.
The utility model is achieved through the following technical solutions:A kind of controller with elastic compaction mechanism, including aluminium Proximate matter shell, PCB main board, metal-oxide-semiconductor, spring pressuring plate and housing pin are constituted, and spring pressuring plate bracket, MOS are equipped in the shell Conduit saddle slot and PCB main board card slot, the metal-oxide-semiconductor are installed vertically on the side of PCB main board;PCB supervisor's card slots and metal-oxide-semiconductor Bracket is respectively placed in the both sides of shell, and spring pressuring plate bracket is arranged close to the side of metal-oxide-semiconductor bracket, when PCB main board and PCB main board card When the horizontal grafting of slot, the bottom edge on the outside of metal-oxide-semiconductor is supported on metal-oxide-semiconductor bracket, and spring pressuring plate is supported by spring pressuring plate bracket and bullet The lower part of spring tabletting is pressed in the inside of metal-oxide-semiconductor, and the top of the spring pressuring plate is by being installed on the housing pin pressure of side wall of outer shell It fastens;Spring pressuring plate fixes metal-oxide-semiconductor with metal-oxide-semiconductor bracket collective effect.
The spring pressuring plate is made of the fixinig plate on top and the elastic pressuring plate of lower part, the top connection one of the fixinig plate The elastic piece that section is obliquely installed to side, bottom end is connected with cross-support members;The upper and lower side of the elastic pressuring plate is tablet Shape structure, interlude are arc plate structure.
The cross-support members can be the platy structure of an entirety, can also be made of multiple uniformly distributed supporting legs.
The longitudinal section of the spring pressuring plate bracket is L-shaped, and top and the housing top surface of shell are connected.
The metal-oxide-semiconductor bracket is reversed L-shaped structure, and the side wall of vertical edges and shell is fixed.
The top that the shell is located at setting metal-oxide-semiconductor bracket side is threaded hole, and the connection of threaded hole internal thread compresses spiral shell Silk.
The utility model has the beneficial effects that:A kind of controller with elastic compaction mechanism by spring pressuring plate, compresses spiral shell Metal-oxide-semiconductor is fixed in silk, improves controller and produces efficiency of assembling, saves traditional type screw and adds insulation grain fixed form, Du Exhausted metal-oxide-semiconductor electric leakage hidden danger, improves product quality.
Description of the drawings
Attached drawing 1 is the structural schematic diagram of the utility model.
Attached drawing 2 is the utility model usage state diagram.
In figure, 1. shells, 1-1. PCB main board card slots, 1-2. spring pressuring plate brackets, 1-3. metal-oxide-semiconductor brackets, 2.PCB master Plate, 3.MOS pipes, 4. housing pins, 5. spring pressuring plates, 5-1. elastic pieces, 5-2. fixinig plates, 5-3. cross-support members, 5-4. Elastic pressuring plate.
Specific implementation mode
As shown in Fig. 1, a kind of controller with elastic compaction mechanism, including aluminium section bar shell 1, PCB main board 2, metal-oxide-semiconductor 3, spring pressuring plate 5 and housing pin 4 are constituted, be equipped in the shell 1 spring pressuring plate bracket 1-2, metal-oxide-semiconductor bracket 1-3 and PCB main board card slot 1-1, the metal-oxide-semiconductor 3 are installed vertically on the side of PCB main board 2;The PCB supervisor card slot 1-1 and metal-oxide-semiconductor support Slot 1-3 is respectively placed in the both sides of shell 1, and spring pressuring plate bracket 1-2 is arranged close to the side of metal-oxide-semiconductor bracket 1-3, when PCB main board 2 with When the horizontal grafting of PCB main board card slot 1-1, the bottom edge in 3 outside of metal-oxide-semiconductor is supported on metal-oxide-semiconductor bracket 1-3, and spring pressuring plate 5 is by spring The lower part of tabletting bracket 1-2 supports and spring pressuring plate 5 is pressed in the inside of metal-oxide-semiconductor 3, and the top of the spring pressuring plate 5 is by installing It is fixed in the housing pin 4 of 1 side wall of shell;Spring pressuring plate 5 fixes metal-oxide-semiconductor 3 with metal-oxide-semiconductor bracket 1-3 collective effects.
As shown in Fig. 2, the spring pressuring plate 5 is made of the fixinig plate 5-2 on top and the elastic pressuring plate 5-4 of lower part, it is described The top of fixinig plate 5-2 connects one section of elastic piece 5-1 being obliquely installed to side, and bottom end is connected with cross-support members 5-3;Institute The upper and lower side for stating elastic pressuring plate 5-4 is plate-like structure, and interlude is arc plate structure.
The cross-support members 5-3 can be the platy structure of an entirety, can also be by multiple uniformly distributed supporting leg groups At.
The longitudinal section of the spring pressuring plate bracket 1-2 is L-shaped, and top and the housing top surface of shell 1 are connected.
The metal-oxide-semiconductor bracket 1-3 is reversed L-shaped structure, and vertical edges and the side wall of shell 1 are fixed.
The top that the shell 1 is located at the sides setting metal-oxide-semiconductor bracket 1-3 is threaded hole, threaded hole internal thread connection pressure Tight screw 4.
The assembling sequence of the utility model is,
The first step:PCB main board 2 is packed into aluminium section bar shell 1 with metal-oxide-semiconductor 3;
Second step:By spring pressuring plate 5 mounted in 3 top of metal-oxide-semiconductor, spring pressuring plate 5 tightly suppresses metal-oxide-semiconductor 3;
Third walks:Housing pin 4 is fixed on aluminium section bar shell 1, fixed function is played in pressing spring tabletting 5.

Claims (6)

1. a kind of controller with elastic compaction mechanism, which is characterized in that including aluminium section bar shell, PCB main board, metal-oxide-semiconductor, spring Tabletting and housing pin are constituted, and spring pressuring plate bracket, metal-oxide-semiconductor bracket and PCB main board card slot are equipped in the shell, described Metal-oxide-semiconductor is installed vertically on the side of PCB main board;PCB supervisor's card slots and metal-oxide-semiconductor bracket are respectively placed in the both sides of shell, spring Tabletting bracket is arranged close to the side of metal-oxide-semiconductor bracket, when PCB main board grafting horizontal with PCB main board card slot, on the outside of metal-oxide-semiconductor Bottom edge is supported on metal-oxide-semiconductor bracket, and spring pressuring plate is supported by spring pressuring plate bracket and the lower part of spring pressuring plate is pressed in metal-oxide-semiconductor The top of inside, the spring pressuring plate is fixed by the housing pin for being installed on side wall of outer shell;Spring pressuring plate and metal-oxide-semiconductor bracket Collective effect fixes metal-oxide-semiconductor.
2. a kind of controller with elastic compaction mechanism according to claim 1, which is characterized in that the spring pressuring plate by The fixinig plate on top and the elastic pressuring plate composition of lower part, the top of the fixinig plate connect one section of elasticity being obliquely installed to side Piece, bottom end are connected with cross-support members;The upper and lower side of the elastic pressuring plate is plate-like structure, and interlude is that arc is hardened Structure.
3. a kind of controller with elastic compaction mechanism according to claim 2, which is characterized in that the transverse support portion Part forms either for the platy structure of entirety or by multiple uniformly distributed supporting legs.
4. a kind of controller with elastic compaction mechanism according to claim 1, which is characterized in that the spring pressuring plate support The longitudinal section of slot is L-shaped, and top and the housing top surface of shell are connected.
5. a kind of controller with elastic compaction mechanism according to claim 1, which is characterized in that the metal-oxide-semiconductor bracket For reversed L-shaped structure, the side wall of vertical edges and shell is fixed.
6. a kind of controller with elastic compaction mechanism according to claim 1, which is characterized in that the shell, which is located at, to be set The top for setting metal-oxide-semiconductor bracket side is threaded hole, and threaded hole internal thread connects housing pin.
CN201721735245.4U 2017-12-13 2017-12-13 Controller with elastic compaction mechanism Expired - Fee Related CN207766690U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201721735245.4U CN207766690U (en) 2017-12-13 2017-12-13 Controller with elastic compaction mechanism

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201721735245.4U CN207766690U (en) 2017-12-13 2017-12-13 Controller with elastic compaction mechanism

Publications (1)

Publication Number Publication Date
CN207766690U true CN207766690U (en) 2018-08-24

Family

ID=63186810

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201721735245.4U Expired - Fee Related CN207766690U (en) 2017-12-13 2017-12-13 Controller with elastic compaction mechanism

Country Status (1)

Country Link
CN (1) CN207766690U (en)

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Date Code Title Description
GR01 Patent grant
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20180824

Termination date: 20181213

CF01 Termination of patent right due to non-payment of annual fee