CN207743213U - A kind of encapsulating structure of integrated circuit - Google Patents
A kind of encapsulating structure of integrated circuit Download PDFInfo
- Publication number
- CN207743213U CN207743213U CN201820067760.8U CN201820067760U CN207743213U CN 207743213 U CN207743213 U CN 207743213U CN 201820067760 U CN201820067760 U CN 201820067760U CN 207743213 U CN207743213 U CN 207743213U
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- China
- Prior art keywords
- encapsulated
- cover board
- shell
- integrated circuit
- fixed block
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses a kind of encapsulating structures of integrated circuit,Its structure includes sled mouth,Cover board,Diaphragm,Inner core,Connector,Insert plate,Inside groove,It is encapsulated,Heat shield,Lead,Contact core,Interface,Inner core is located at the lower section of diaphragm,Connector is integrated with inner core,Insert plate is set on encapsulated,Insert plate fits with cover board both sides,Heat shield is located at encapsulated lower section,Lead insertion is mounted in encapsulated,A kind of encapsulating structure of integrated circuit of the utility model,It is mounted on fixed block by the rubber fixed block insertion in cover board shell,To its shell and it is encapsulated between play the role of one it is fixed,It is transferred data on lead by access port,When needing to dismount it,The sled mouth on cover board is inserted by tool,It is levered up with lever,Rubber fixed block can be separated with fixed block,By the encapsulating structure for improveing integrated circuit,It is set to be not easy to be welded,It can carry out easy disassembly,It is allowed to use more convenient and efficient,Hommization.
Description
Technical field
The utility model is a kind of encapsulating structure of integrated circuit, belongs to technical field of integrated circuits.
Background technology
Position of the integrated antenna package in electronics pyramid is both pyramidal pinnacle and pyramidal pedestal, is said
It is in both positions simultaneously very sufficient basis, from the density of electronic component (such as transistor) this angle on come
It says, IC represents the tip of electronics, but IC is a starting point again, is a kind of basic structural unit, is to form us to give birth to
The basis of most of electronic systems in work, equally, IC are not only monolithic chip or basic electronic structure, and the type thousand of IC is poor
Ten thousand other analog circuits, digital circuit, radio circuit, sensor etc., thus it is also different for the demand of encapsulation and requirement, this
Text has done comprehensive review to IC package technology, when describing these indispensable encapsulating structures of manufacture in a manner of broad-brush
The a variety of materials and technique used.
Prior art discloses application No. is：：201720429198.4 a kind of integrated circuit package structure, including encapsulation
It is main structure body, chip fixed seat, integrated chip, fixed cover, binding post, lead, link, Miniature knife switch, LED light, interior
Conducting wire, heat radiation rack, flabellum, miniature electric rotating machine, dirt filtrating screen, the encapsulating structure main body are equipped with chip fixed seat, the core
Piece fixed seat is provided with rectangular recess, and integrated chip built in rectangular recess, and compared with prior art, but the prior art makes
With when, be often packaged using the method for welding, keep it not easy to assemble, bring inconvenience to user of service.
Utility model content
In view of the deficienciess of the prior art, the utility model aim is to provide a kind of encapsulating structure of integrated circuit, with
The prior art of solution when in use, is often packaged using the method for welding, keeps it not easy to assemble, gives user of service
The problem of bringing inconvenience.
To achieve the goals above, the utility model is to realize by the following technical solutions：A kind of integrated circuit
Encapsulating structure, structure include sled mouth, cover board, diaphragm, inner core, connector, insert plate, inside groove, encapsulated, heat shield, lead, connect
Core, interface are touched, the inner core is located at the lower section of diaphragm, and the connector is integrated with inner core, and the insert plate is set to
On encapsulated, the insert plate fits with cover board both sides, and the inside groove is integrated with encapsulated, and the heat shield is located at packet
The lower section of glue, the lead insertion are mounted in encapsulated, and the lead is set to the lower end of heat shield, the contact core insertion installation
Encapsulated interior, the contact core is located at the lower section of inner core, and the interface is integrated with encapsulated, and the cover board is including outside
Shell, sandwich layer, rubber fixed block, fixed valve block, access port, the sandwich layer are set in shell, the rubber fixed block and outer shell phase
Welding, the fixed rubber block are mutually welded with sandwich layer, and the sandwich layer insertion is installed inside the shell, the fixed valve block and outer shell phase
Welding, the fixed valve block fit with fixed rubber block, and the access port is integrated with shell, the access port position
In the lower section of sandwich layer, the shell is located at the top of heat shield.
Further, the sled mouth is integrated with cover board, and the diaphragm is located at the lower section of cover board.
Further, the diaphragm is set in encapsulated, and the inner core insertion is mounted in encapsulated.
Further, the cover board insertion is mounted in encapsulated.
Further, the access port is a diameter 0.1cm, the circular hole of depth 0.5cm.
Further, the rubber fixed block on the cover board can make circuit package carry out easy disassembly.
Further, the cover board is that have the effect of that heatproof is resistance to made of polystyrene and fall.
Advantageous effect
A kind of encapsulating structure of integrated circuit of the utility model is mounted on solid by the rubber fixed block insertion in cover board shell
Determine on block, to its shell and it is encapsulated between play the role of one it is fixed, transferred data on lead by access port, need pair
When it is dismounted, by tool on cover board sled mouth be inserted into, levered up with lever, rubber fixed block can and fixed block
It separates, by improveing the encapsulating structure of integrated circuit, makes it be not easy to be welded, easy disassembly can be carried out, it is allowed to use more
Convenient and efficient, hommization.
Description of the drawings
Upon reading the detailed description of non-limiting embodiments with reference to the following drawings, other spies of the utility model
Sign, objects and advantages will become more apparent upon：
Fig. 1 is a kind of structural schematic diagram of the encapsulating structure of integrated circuit of the utility model；
Fig. 2 is a kind of diagrammatic cross-section of cover board of the utility model.
In figure：Prize mouth -1, cover board -2, diaphragm -3, inner core -4, connector -5, insert plate -6, inside groove -7, encapsulated -8, heat resistanceheat resistant
Layer -9, lead -10, contact core -11, interface -12, shell -201, sandwich layer -202, rubber fixed block -203, fixed valve block -204,
Access port -205.
Specific implementation mode
To make the technical means, creative features, achievement of purpose, and effectiveness of the utility model be easy to understand, below
In conjunction with specific implementation mode, the utility model is expanded on further.
It please refers to Fig.1, Fig. 2, the utility model provides a kind of encapsulating structure technical solution of integrated circuit：Its structure includes
Prize mouth 1, cover board 2, diaphragm 3, inner core 4, connector 5, insert plate 6, inside groove 7, encapsulated 8, heat shield 9, lead 10, contact core 11,
Interface 12, the inner core 4 are located at the lower section of diaphragm 3, and the connector 5 is integrated with inner core 4, and the insert plate 6 is set
On encapsulated 8, the insert plate 6 fits with 2 both sides of cover board, and the inside groove 7 is integrated with encapsulated 8, the heat resistanceheat resistant
Layer 9 is located at encapsulated 8 lower section, and the insertion of the lead 10 is mounted in encapsulated 8, and the lead 10 is set to the lower end of heat shield 9, institute
It states the contact insertion of core 11 to be mounted in encapsulated 8, the contact core 11 is located at the lower section of inner core 4, and the interface 12 is one with encapsulated 8
Body structure, the cover board 2 include shell 201, sandwich layer 202, rubber fixed block 203, fixed valve block 204, access port 205, institute
Sandwich layer 202 is stated in shell 201, the rubber fixed block 203 is welded with 201 phase of shell, the fixed rubber block 203 and core
Layer 202 phases welding, the insertion of the sandwich layer 202 are mounted in shell 201, and the fixed valve block 204 is welded with 201 phase of shell, institute
It states fixed valve block 204 to fit with fixed rubber block 203, the access port 205 is integrated with shell 201, described to connect
Entrance 205 is located at the lower section of sandwich layer 202, and the shell 201 is located at the top of heat shield 9, and the sled mouth 1 is integrated with cover board 2
Change structure, the diaphragm 3 is located at the lower section of cover board 2, and the diaphragm 3 is set in encapsulated 8, and the insertion of the inner core 4 is mounted on encapsulated 8
Interior, the insertion of the cover board 2 is mounted in encapsulated 8, and the access port 205 is a diameter 0.1cm, the circular hole of depth 0.5cm, institute
Stating the rubber fixed block on cover board 2 can make circuit package carry out easy disassembly, and the cover board 2 is the tool made of polystyrene
There is the resistance to effect fallen of heatproof.
The rubber fixed block of cover board 2 described in this patent refers to produces various rubber products by raw material of natural and synthetic rubber
Activity, further include the rubber product using scrap rubber reproduction, the yield of synthetic rubber has substantially exceeded natural rubber, wherein
Maximum yield is butadiene-styrene rubber, and described encapsulated 8 as its name suggests, be exactly TPE flexible glue materials is encapsulated on other materials, generally
The processing method of use has double coloured plastic injection machine one-pass molding, or is molded in two times using encapsulation die with general injection molding machine
Molding.
When carrying out using integrated circuit package structure, inner core 4 is fixed in encapsulated 8 by capping 2, by covering
The insertion of rubber fixed block 203 in 2 shell 201 of plate is mounted on fixed block 204, and one is played between its shell 201 and encapsulated 8
A fixed effect, is transferred data to by access port 205 on lead 10, when needing to dismount it, passes through tool
Sled mouth 2 on cover board 2 is inserted into, is levered up with lever, rubber fixed block 203 can be separated with fixed block 204.
The utility model solves the prior art when in use, is often packaged using the method for welding, makes it not
Easy to assemble, the problem of bringing inconvenience to user of service, the utility model is combined with each other by above-mentioned component, by cover board shell
Rubber fixed block insertion be mounted on fixed block on, to its shell and it is encapsulated between play the role of one it is fixed, by access port
It transfers data on lead, when needing to dismount it, the sled mouth on cover board is inserted by tool, is prized with lever
It rises, rubber fixed block can be separated with fixed block, by improveing the encapsulating structure of integrated circuit, make it be not easy to be welded, Neng Goujin
Accommodating dismounting, allows it to use more convenient and efficient, and hommization is described in detail below:
The advantages of basic principles and main features and the utility model of the utility model have been shown and described above, for
For those skilled in the art, it is clear that the present invention is not limited to the details of the above exemplary embodiments, and without departing substantially from this
In the case of the spirit or essential attributes of utility model, the utility model can be realized in other specific forms.Therefore, no matter
From the point of view of which point, the present embodiments are to be considered as illustrative and not restrictive, and the scope of the utility model is by institute
Attached claim rather than above description limit, it is intended that will fall within the meaning and scope of the equivalent requirements of the claims
All changes are embraced therein.Any reference numeral in claim should not be considered as to the involved right of limitation
It is required that.
In addition, it should be understood that although this specification is described in terms of embodiments, but not each embodiment is only wrapped
Containing an independent technical solution, this description of the specification is merely for the sake of clarity, and those skilled in the art should
It considers the specification as a whole, the technical solutions in the various embodiments may also be suitably combined, forms those skilled in the art
The other embodiment being appreciated that.
Claims (5)
1. a kind of encapsulating structure of integrated circuit, it is characterised in that：Its structure includes sled mouth (1), cover board (2), diaphragm (3), interior
Core (4), connector (5), insert plate (6), inside groove (7), encapsulated (8), heat shield (9), lead (10), contact core (11), interface
(12), the inner core (4) is located at the lower section of diaphragm (3), and the connector (5) is integrated with inner core (4), the insertion
Plate (6) is set on encapsulated (8), and the insert plate (6) fits with cover board (2) both sides, and the inside groove (7) is one with encapsulated (8)
Body structure, the heat shield (9) are located at the lower section of encapsulated (8), and the lead (10) is embedded to be mounted in encapsulated (8), described
Lead (10) is set to the lower end of heat shield (9), and the contact core (11) is embedded to be mounted in encapsulated (8), the contact core (11)
Lower section positioned at inner core (4), the interface (12) are integrated with encapsulated (8), the cover board (2) include shell (201),
Sandwich layer (202), rubber fixed block (203), fixed valve block (204), access port (205), the sandwich layer (202) are set to shell
(201) in, the rubber fixed block (203) is mutually welded with shell (201), the rubber fixed block (203) and sandwich layer (202) phase
Welding, the sandwich layer (202) is embedded to be mounted in shell (201), and the fixed valve block (204) is mutually welded with shell (201), institute
It states fixed valve block (204) to fit with rubber fixed block (203), the access port (205) is integrated knot with shell (201)
Structure, the access port (205) are located at the lower section of sandwich layer (202), and the shell (201) is located at the top of heat shield (9).
2. a kind of encapsulating structure of integrated circuit according to claim 1, it is characterised in that：The sled mouth (1) and cover board
(2) it is integrated, the diaphragm (3) is located at the lower section of cover board (2).
3. a kind of encapsulating structure of integrated circuit according to claim 1, it is characterised in that：The diaphragm (3) is set to packet
In glue (8), the inner core (4) is embedded to be mounted in encapsulated (8).
4. a kind of encapsulating structure of integrated circuit according to claim 1, it is characterised in that：The embedded peace of the cover board (2)
In encapsulated (8).
5. a kind of encapsulating structure of integrated circuit according to claim 1, it is characterised in that：The access port (205) is
One diameter 0.1cm, the circular hole of depth 0.5cm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820067760.8U CN207743213U (en) | 2018-01-15 | 2018-01-15 | A kind of encapsulating structure of integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820067760.8U CN207743213U (en) | 2018-01-15 | 2018-01-15 | A kind of encapsulating structure of integrated circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207743213U true CN207743213U (en) | 2018-08-17 |
Family
ID=63123437
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820067760.8U Expired - Fee Related CN207743213U (en) | 2018-01-15 | 2018-01-15 | A kind of encapsulating structure of integrated circuit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207743213U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115249749A (en) * | 2021-04-25 | 2022-10-28 | 同方威视技术股份有限公司 | Packaging structure of cadmium zinc telluride detector |
-
2018
- 2018-01-15 CN CN201820067760.8U patent/CN207743213U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115249749A (en) * | 2021-04-25 | 2022-10-28 | 同方威视技术股份有限公司 | Packaging structure of cadmium zinc telluride detector |
| CN115249749B (en) * | 2021-04-25 | 2024-01-16 | 同方威视技术股份有限公司 | Encapsulation structure of tellurium-zinc-cadmium detector |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180817 Termination date: 20200115 |
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| CF01 | Termination of patent right due to non-payment of annual fee |