CN207716467U - A kind of electromagnetic oven with the readily removable assembling structure of ceramic wafer - Google Patents
A kind of electromagnetic oven with the readily removable assembling structure of ceramic wafer Download PDFInfo
- Publication number
- CN207716467U CN207716467U CN201721710518.XU CN201721710518U CN207716467U CN 207716467 U CN207716467 U CN 207716467U CN 201721710518 U CN201721710518 U CN 201721710518U CN 207716467 U CN207716467 U CN 207716467U
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- China
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- ceramic wafer
- shell
- electromagnetic oven
- fixed frame
- readily removable
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Abstract
The utility model is related to electromagentic furnace technology fields, more particularly to a kind of electromagnetic oven with the readily removable assembling structure of ceramic wafer, electromagnetic oven include shell and ceramic wafer, the readily removable assembling structure of ceramic wafer includes ceramic wafer fixed frame, ceramic wafer is bonded in ceramic wafer fixed frame, and ceramic wafer fixed frame is detachably connected with shell.Compared with the existing technology, electromagnetic oven provided by the utility model with the readily removable assembling structure of ceramic wafer, which increase ceramic wafer fixed frame, ceramic wafer is bonded on the ceramic wafer fixed frame, and ceramic wafer is mounted on shell with realizing by the way that ceramic wafer fixed frame is connected on shell.All kinds of connection structures for being connect with shell can be set on the increased ceramic wafer fixed frame, facilitate the shell of ceramic wafer fixed frame and electromagnetic oven to be detachably connected to, make ceramic wafer convenient for disassembly and assembly indirectly；The connection structure that ceramic wafer is connect with shell is transferred to from ceramic wafer on ceramic wafer fixed frame, avoids damaging ceramic wafer.
Description
Technical field
The utility model is related to electromagentic furnace technology field more particularly to a kind of electromagnetism with the readily removable assembling structure of ceramic wafer
Stove.
Background technology
Electromagnetic oven is a kind of stove for making metal cooking utensil generation eddy-current heating that food to be cooked using the electricity generation magnetic line of force
Tool, it is very welcomed by the people since it does not have flame.
The external structure of existing electromagnetic oven generally comprises plastic casing and top plate, and top plate is pushed up for carrying cooking utensil
Ceramic wafer is usually used in plate, since the material character of ceramic wafer makes it be difficult to auger shell pit, it is also difficult to be processed on ceramic wafer
For the structure of fixed ceramic plate, therefore, the ceramic wafer in current electromagnetic oven is all directly to be bonded in electromagnetic oven using viscose
Plastic casing on.And which results in problems with：Ceramic wafer is bonded on plastic casing, when subsequent maintenance electromagnetic oven, is had
When need to dismantle ceramic wafer, connected by the way of bonding so that ceramic wafer is difficult to dismantle, and installed again after repair ceramic
It is glued again again when plate, tedious process and inconvenience.
Utility model content
(1) technical problems to be solved
In order to solve the above problem of the prior art, the utility model provides a kind of with the readily removable assembling structure of ceramic wafer
Electromagnetic oven, ceramics are convenient for disassembly and assembly.
(2) technical solution
To achieve the above object, the main technical schemes of the utility model use include：
The utility model provides a kind of electromagnetic oven with the readily removable assembling structure of ceramic wafer, the electromagnetic oven include shell and
Ceramic wafer, the readily removable assembling structure of ceramic wafer include ceramic wafer fixed frame, and the ceramic wafer is bonded in the ceramic wafer fixed frame,
The ceramic wafer fixed frame is detachably connected with the shell.
Further, the ceramic wafer fixed frame is metal holder, and the metal holder is located at the ceramic wafer
Edge.
Further, the ceramic wafer fixed mount setting has threaded hole, the shell to be provided with through-hole, and setting screw passes through
It is connect with the threaded hole after the through-hole, so that the ceramic wafer fixed frame is connect with the shell.
Further, the shell includes bottom plate and the side plate that upwardly extends of surrounding positioned at the bottom plate, at least one piece
The side plate is provided with towards the recessed inner fovea part of the inner horizontal of the shell, and is formed and rolled in the upper end of the inner fovea part
Side；The flanging includes the lower surface towards the upper surface of the ceramic wafer fixed frame and backwards to the ceramic wafer fixed frame, institute
It states upper surface and is used to support the ceramic wafer fixed frame.
Further, in the flanging, the through-hole runs through the upper and lower surface of the flanging for the through-hole setting.
Further, the inner fovea part extends to the bottom of the shell from the flanging.
Further, the shell includes two blocks of opposite side plates, is both provided on two blocks of opposite side plates described
Inner fovea part and the formation flanging.
Further, the electromagnetic oven is touch electromagnetic oven.
Further, it is provided with sealing joint strip between the ceramic wafer fixed frame and shell.
Further, the ceramic wafer fixed frame includes two companies being arranged at two opposite edges of the ceramic wafer
Narrow bars are provided with the flanging on the shell on two side plates corresponding with opposite two edges institute.
(3) advantageous effect
The utility model has the beneficial effects that：Compared with the existing technology, provided by the utility model easy with ceramic wafer
The electromagnetic oven of disassembly and assembly structure, which increase ceramic wafer fixed frame, ceramic wafer is bonded on the ceramic wafer fixed frame, by ceramics
Plate fixed frame is connected on shell to be mounted on ceramic wafer on shell with realizing.It can be arranged on the increased ceramic wafer fixed frame
All kinds of connection structures for being connect with shell facilitate the shell of ceramic wafer fixed frame and electromagnetic oven to be detachably connected to,
Make ceramic wafer convenient for disassembly and assembly indirectly；The connection structure that ceramic wafer is connect with shell is transferred to ceramic wafer fixed frame from ceramic wafer
On, connection structure processing on ceramic wafer fixed frame, avoid damaging ceramic wafer.
Description of the drawings
Fig. 1 is the structural schematic diagram of the electromagnetic oven with the readily removable assembling structure of ceramic wafer of the utility model；
Fig. 2 is the sectional view of the electromagnetic oven with the readily removable assembling structure of ceramic wafer of the utility model.
【Reference sign】
1- shells, 11- bottom plates, 12- side plates, 13- through-holes, 14- flangings, 15- inner fovea parts；
2- ceramic wafers；
3- ceramic wafers fixed frame, 31- threaded holes.
Specific implementation mode
It is below in conjunction with the accompanying drawings, right by specific implementation mode in order to understand in order to preferably explain the utility model
The utility model is described in detail.
The utility model provides a kind of electromagnetic oven with the readily removable assembling structure of ceramic wafer, as depicted in figs. 1 and 2, electromagnetism
Stove includes shell 1 and ceramic wafer 2, and the readily removable assembling structure of ceramic wafer includes ceramic wafer fixed frame 3, and it is solid that ceramic wafer 2 is bonded in ceramic wafer
Determine frame 3, ceramic wafer fixed frame 3 is detachably connected with shell 1.
Based on above structure, the electromagnetic oven provided by the utility model with the readily removable assembling structure of ceramic wafer, which increase
Ceramic wafer fixed frame, ceramic wafer are bonded on the ceramic wafer fixed frame, by the way that ceramic wafer fixed frame is connected on shell with reality
Now ceramic wafer is mounted on shell.All kinds of connections for being connect with shell can be set on the increased ceramic wafer fixed frame
Structure, facilitates the shell of ceramic wafer fixed frame and electromagnetic oven to be detachably connected to, and makes ceramic wafer convenient for disassembly and assembly indirectly；Pottery
The connection structure that porcelain plate is connect with shell is transferred to from ceramic wafer on ceramic wafer fixed frame, and connection structure is processed and is consolidated in ceramic wafer
Determine on frame, avoids damaging ceramic wafer.
Electromagnetic oven of this kind with the readily removable assembling structure of ceramic wafer has further the advantage that in production：In the prior art pottery
Porcelain plate is directly bonded on shell, when at production, due to needing to install all kinds of electrical equipments in the shell of electromagnetic oven, is
It installs and reuses viscose after all kinds of electrical equipments ceramic wafer is bonded on shell, at this moment just need installing electrical member
The shell of part is sent back to adhesive stations and is bonded using viscose again, complex steps.And the utility model is easy with ceramic wafer
The electromagnetic oven of disassembly and assembly structure, bonding work can be carried out, after producing ceramic wafer, is directly stained in the bottom of ceramic wafer ahead of time
Then the ceramic wafer with ceramic wafer fixed frame is sent to installation station by ceramic wafer fixed frame, staff is to electromagnetic oven
After interior electrical equipment completes installation, directly ceramic wafer is also mounted on shell, shell is no longer needed to send adhesive stations back to,
Without using viscose in electromagnetic oven installation process, production stage is reduced, production efficiency is improved.
In the present embodiment, ceramic wafer fixed frame 3 is preferably metal holder, and certainly, ceramic wafer fixed frame 3 can also be used
Such as plastic or other material, used material needs that all kinds of connection structures for connecting with shell 1 are arranged.And use metal
The ceramic wafer fixed frame 3 of material has the advantages that high strength, service life length, and due to electromagnetic oven ceramic wafer 2 at work
Temperature it is higher, use the ceramic wafer fixed frame 3 of metal material for safety.When using the ceramic wafer fixed frame 3 of metal material,
The magnetic line of force of electromagnetic oven heats metal holder in order to prevent, and metal holder is located at the edge of ceramic wafer 2.Metal is solid
The edge of ceramic wafer 2 can be surrounded by determining frame, certainly, can be also positioned only on two edges therein, as long as ensureing that connection is strong
Degree is enough.
In the present embodiment, ceramic wafer fixed frame 3 is provided with threaded hole 31, and shell 1 is provided with through-hole 13, and setting screw is worn
(certainly, the ailhead of screw is withstood at the entity of through-hole surrounding) connect with threaded hole 31 after crossing through-hole 13, so that ceramic wafer is fixed
Frame 3 is connect with shell 1.Being detachably connected for ceramic wafer fixed frame 3 and shell 1 is realized by using screw, connection it is reliable and
Manufacturing cost is low.Certainly, can also be used be removably clamped mode realize as described in be detachably connected.
In the present embodiment, shell 1 includes bottom plate 11 and the side plate 12 that upwardly extends of surrounding positioned at bottom plate 11, and at least one
Block side plate 12 is provided with towards the recessed inner fovea part 15 of the inner horizontal of shell 1, and forms flanging 14 in the upper end of inner fovea part 15.
Flanging 14 includes the lower surface towards the upper surface of ceramic wafer fixed frame 3 and backwards to ceramic wafer fixed frame 3, and upper surface is used to support
Ceramic wafer fixed frame 3.Preferably, the setting of through-hole 13 runs through the upper and lower surface of flanging 14 in flanging 14, through-hole 13.The folding
Side 14 can support ceramic wafer 2 so that the support column that is used to support ceramic wafer 2 excessive without the setting in shell 1 simplifies note
The structure of mould.Meanwhile when through-hole 13 is arranged when the upper and lower surface of flanging 14 is run through in flanging 14 and hole, flanging 14
On mounting hole and ceramic wafer fixed frame 3 on 31 distance of threaded hole closer to and observing 31 institute of threaded hole convenient for staff
Position, convenient for alignment；Meanwhile also ceramic wafer fixed frame 3 can be made to be connected with shell 1 using shorter screw.This kind of structure
Through-hole 13 also avoid the shell 1 of the electromagnetic oven such as the prior art, need on shell 1 injection molding from the bottom of shell 1
The slot hole for accommodating screw upwardly extended, it is easy to produce, simplify the structure of injection mold.
In the present embodiment, inner fovea part 15 extends to the bottom of shell 1 from flanging 14.Inner fovea part 15 extends to shell 1
Bottom has the benefit that：Since the inner fovea part 15 extends to the bottom of shell 1, it is seen from the bottom up from the bottom of shell 1
When examining, there is no the entity structures that can block screw, in this way, when dismounting screw, preferable sight is provided for staff
With more operating space, facilitate the dismounting of screw；Especially when this kind of electromagnetic oven is used as embedded electromagnetic oven, shell 1 is solid
When being scheduled on dining table and being difficult to split out, it is arranged and is easy sight when the inner fovea part 15 can allow staff to be observed from the bottom up under dining table
Observe the position where screw, easy disassembly.
Preferably, shell 1 includes two blocks of opposite side plates 12, and inner fovea part is both provided on two blocks of opposite side plates 12
15 and formed flanging 14.It is of course also possible to be respectively provided with inner fovea part 15 on the side plate 12 of the surrounding of shell 1 and form flanging 14.
In the present embodiment, sealing joint strip (not shown) is provided between ceramic wafer fixed frame 3 and shell 1.It passes
The ceramic wafer of the electromagnetic oven of system with shell due to being bonded using viscose, deposited between ceramic wafer and shell
In the structure for sealing.And the ceramic wafer fixed frame 3 of the electromagnetic oven of the utility model and shell 1 are connected by screw
Connect, inevitably have the presence in gap between ceramic wafer fixed frame 3 and shell 1, thus ceramic wafer fixed frame 3 and shell 1 it
Between be provided with sealing joint strip, prevent water or other sundries from entering the inside of electromagnetic oven using sealing joint strip.
In the present embodiment, as shown in Figure 1, ceramic wafer fixed frame 3 includes being arranged at two opposite edges of ceramic wafer 2
Two connection straps, which is also the bottom that ceramic wafer 2 is fixed on by way of bonding, on shell 1 with the phase
To corresponding two side plates 12 of two edges institute on be both provided with flanging 14.This way, it is not necessary to be arranged in the bottom of ceramic wafer 2
Two connection straps need to be only arranged in the ceramic wafer fixed frame surrounded entirely, save material；It simultaneously also need not be at four pieces of shell 1
It is respectively provided with flanging on side plate, flanging need to be only set on two blocks of side plates, simplifies mold, also reduces follow-up work when assembled
Sequence.
It should be noted that the electromagnetic oven of the utility model meaning is that can be key electromagnetic oven, touch electromagnetic oven
Or embedded electromagnetic oven.
In the absence of conflict, the feature in above-mentioned embodiment and embodiment can be combined with each other.
It is to be appreciated that above to the description of specific embodiment of the utility model progress simply to illustrate that this practicality
Novel technology path and feature, its object is to allow those skilled in the art that can understand the content of the utility model simultaneously
Implement according to this, but the utility model is not limited to above-mentioned particular implementation.Every range in the utility model claims
The various change inside made or modification should all be covered within the protection scope of the present utility model.
Claims (10)
1. a kind of electromagnetic oven with the readily removable assembling structure of ceramic wafer, the electromagnetic oven includes shell and ceramic wafer, it is characterised in that：
The readily removable assembling structure of ceramic wafer includes ceramic wafer fixed frame, and the ceramic wafer is bonded in the ceramic wafer fixed frame, the pottery
Porcelain plate fixed frame is detachably connected with the shell.
2. the electromagnetic oven according to claim 1 with the readily removable assembling structure of ceramic wafer, it is characterised in that：The ceramic wafer is solid
It is metal holder to determine frame, and the metal holder is located at the edge of the ceramic wafer.
3. the electromagnetic oven according to claim 1 with the readily removable assembling structure of ceramic wafer, it is characterised in that：The ceramic wafer is solid
Fixed set up is equipped with threaded hole, and the shell is provided with through-hole, and setting screw is connect after passing through the through-hole with the threaded hole, with
The ceramic wafer fixed frame is set to be connect with the shell.
4. the electromagnetic oven according to claim 3 with the readily removable assembling structure of ceramic wafer, it is characterised in that：The shell includes
Bottom plate and the side plate that upwardly extends of surrounding positioned at the bottom plate, at least one block of side plate are provided with towards in the shell
The recessed inner fovea part of portion's level, and form flanging in the upper end of the inner fovea part；
The flanging includes the lower surface towards the upper surface of the ceramic wafer fixed frame and backwards to the ceramic wafer fixed frame, institute
It states upper surface and is used to support the ceramic wafer fixed frame.
5. the electromagnetic oven according to claim 4 with the readily removable assembling structure of ceramic wafer, it is characterised in that：The through-hole setting
In the flanging, the through-hole runs through the upper and lower surface of the flanging.
6. the electromagnetic oven according to claim 5 with the readily removable assembling structure of ceramic wafer, it is characterised in that：The inner fovea part from
The flanging extends to the bottom of the shell.
7. the electromagnetic oven according to claim 6 with the readily removable assembling structure of ceramic wafer, it is characterised in that：The shell includes
Two blocks of opposite side plates are both provided with the inner fovea part on two blocks of opposite side plates and form the flanging.
8. the electromagnetic oven according to claim 1 with the readily removable assembling structure of ceramic wafer, it is characterised in that：The electromagnetic oven is
Touch electromagnetic oven.
9. the electromagnetic oven according to claim 1 with the readily removable assembling structure of ceramic wafer, it is characterised in that：In the ceramic wafer
Sealing joint strip is provided between fixed frame and shell.
10. according to the electromagnetic oven with the readily removable assembling structure of ceramic wafer described in claim 4, it is characterised in that：The ceramic wafer is solid
It includes two connection straps being arranged at two opposite edges of the ceramic wafer to determine frame, with described opposite two on the shell
It is provided with the flanging on corresponding two side plates of a edge institute.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721710518.XU CN207716467U (en) | 2017-12-11 | 2017-12-11 | A kind of electromagnetic oven with the readily removable assembling structure of ceramic wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721710518.XU CN207716467U (en) | 2017-12-11 | 2017-12-11 | A kind of electromagnetic oven with the readily removable assembling structure of ceramic wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207716467U true CN207716467U (en) | 2018-08-10 |
Family
ID=63060420
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721710518.XU Active CN207716467U (en) | 2017-12-11 | 2017-12-11 | A kind of electromagnetic oven with the readily removable assembling structure of ceramic wafer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207716467U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108167877A (en) * | 2017-12-11 | 2018-06-15 | 深圳国创名厨商用设备制造有限公司南海分公司 | A kind of electromagnetic oven with the readily removable assembling structure of ceramic wafer |
-
2017
- 2017-12-11 CN CN201721710518.XU patent/CN207716467U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108167877A (en) * | 2017-12-11 | 2018-06-15 | 深圳国创名厨商用设备制造有限公司南海分公司 | A kind of electromagnetic oven with the readily removable assembling structure of ceramic wafer |
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