CN207705187U - Flip-chip assembly and flip chip packaging structure - Google Patents
Flip-chip assembly and flip chip packaging structure Download PDFInfo
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- CN207705187U CN207705187U CN201721924156.4U CN201721924156U CN207705187U CN 207705187 U CN207705187 U CN 207705187U CN 201721924156 U CN201721924156 U CN 201721924156U CN 207705187 U CN207705187 U CN 207705187U
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Abstract
The utility model provides a kind of flip-chip assembly and flip chip packaging structure, the flip-chip assembly include chip and be set to the conductive column of chip surface；The conductive column includes the soft conductive layer for being connected to the cylinder of chip surface and being connected to cylinder away from the end of chip, the flip-chip assembly further includes the insulating layer being arranged in the conductive column side, and the soft conductive layer exceeds the insulating layer along the direction projection away from the chip.The utility model flip-chip assembly and flip chip packaging structure promote product yield by adjusting production operation mode, and making technology is more succinct；And be conducive to chip vendor product benefit it is further excavation and its quality control to subsequent product.
Description
Technical field
The utility model is related to technical field of electronic encapsulation more particularly to a kind of flip-chip assembly and Flip-Chip Usings
Structure.
Background technology
With the development of electronics industry, integrated antenna package is accordingly towards miniaturization, high performance trend development.Currently,
The connection of most chips and substrate still uses wire bonding mode, and lead setting is longer, the performance of packaging part obtained by
It limits larger；Especially in some high-end accurate device fields, Wire Bonding Technology has significant limitation.It has disclosed in the industry more
The chip-packaging structure of kind pattern, and still weed out the old and bring forth the new constantly.Wherein, the encapsulation of flip-chip (flip chip) is logical
Prefabricated convex algorithm (tin-lead ball or copper post) is crossed, is then combined chip overturning heating with substrate using the convex algorithm of melting.Phase
Compared with traditional wire bonding mode, chip front side can form most short circuit towards substrate, reduce resistance, improve electrical table
It is existing, and reduce package dimension；Especially the means of similar SMT technologies may be used to process in it.Therefore, flip chip technology (fct)
In recent years by more and more concerns and attention in the industry.
Flip-chip processing procedure is firstly the need of on being etched with the disk (wafer) of chip circuit in groups, to the connection of each chip
Contact surface carries out salient point bottom metallization (UBM) and handles, and then uses vapor deposition, plating, Solder-Paste Printing, ailhead, puts ball or weldering
The methods of material transfer forms pedestal (bump) on the surface after UBM；Meanwhile at group substrate (substrate
Panel the pad on) must also carry out metalized appropriate.Then by disk and substrate cut at single chip and right
The substrate answered；It assembles (assembly) technique by chip again chip and substrate interconnection get up, connection method can pass through weldering
Material, thermal compression welding, thermoacoustic welding or conductive glue connection etc..After being completed, then underfill solidification and element are carried out to chip
Plastic packaging (modeling compound), to complete the encapsulation of flip-chip.Making technology is more complex, and underfill solidification adopts
With epoxide resin material, this process is likely to occur resin filling not exclusively, time-consuming longer, and is unfavorable for chip manufacturer to subsequently producing
The quality control of product.
In consideration of it, it is necessary to provide a kind of new flip-chip assemblies and flip chip packaging structure.
Utility model content
The purpose of this utility model is to provide a kind of flip-chip assembly and flip chip packaging structure, adjustment production is made
Industry mode promotes product yield so that making technology is more succinct；And be conducive to the raising of chip manufacturer benefit and to product
Quality control.
To realize above-mentioned purpose of utility model, the utility model provides a kind of flip-chip assembly, including chip and sets
It is placed in the conductive column of chip surface；The conductive column includes being connected to the cylinder of chip surface and being connected to cylinder to deviate from chip
The soft conductive layer of end, the flip-chip assembly further includes the insulating layer being arranged in the conductive column side, described soft
Conductive layer exceeds the insulating layer along the direction projection away from the chip.
The soft conductive layer is set as soft gold layer as a further improvement of the utility model,；The cylinder is set as
Copper post.
The conductive column further includes being set between the copper post and soft gold layer as a further improvement of the utility model,
Adhesive layer, the adhesive layer is set as metallic nickel.
The setting height of the insulating layer opposite chip surfaces exceeds the column as a further improvement of the utility model,
The height of body, and the insulating layer is formed with binding face away from the side of the chip；The insulating layer also has from the patch
Conjunction face is recessed and storage tank corresponding with the conductive column position.
The storage tank extends soft without departing from described towards chip recess as a further improvement of the utility model,
Matter conductive layer.
There is the storage tank bottom wall and peripheral wall, the conductive column to be located at institute as a further improvement of the utility model,
The center of storage tank is stated, so that the periphery of the soft conductive layer is consistent with the radial clearance of the peripheral wall.
The insulating layer is set as polyimide resin coating as a further improvement of the utility model,.
The utility model also provides a kind of flip chip packaging structure, including substrate and above-mentioned flip-chip assembly；It is described
Flip-chip assembly is arranged with substrate stacked on top, and the insulating layer is fitted closely with substrate surface, and the soft conductive layer
The substrate surface is pressed on to realize the electric connection of the substrate and chip.
The utility model has the beneficial effects that：Using the utility model flip-chip assembly and flip chip packaging structure,
By the way that in the prefabricated insulating layer of chip surface, substitution underfill cures (under-fill) technique, and processing procedure is more succinct, promotes production
Product yield；And is conducive to the raising of chip manufacturer benefit and the quality control to product, while increasing client's selectance.
Description of the drawings
Fig. 1 is the schematic diagram of the utility model flip-chip assembly；
Fig. 2 is the schematic diagram of the utility model flip chip packaging structure.
Specific implementation mode
The utility model is described in detail below with reference to embodiment shown in the drawings.But the embodiment is not
Limit the utility model, structure that those skilled in the art are made according to the embodiment, method or functionally
Transformation is all contained in the scope of protection of the utility model.
Referring to Fig. 1, flip-chip assembly 100 provided by the utility model includes chip 1, is set to 1 surface of chip
Conductive column 2 and insulating layer 3 in 2 side of the conductive column is set, 3 tight of the insulating layer is in the side of conductive column 2.
The conductive column 2 includes the end for being connected to the cylinder 21 on 1 surface of chip and being connected to the cylinder 21 away from chip 1
The soft conductive layer 22 at end.The insulating layer 3 is uniformly covered in the surface of chip 1, and the chip 1 relatively of the insulating layer 3
The setting height on surface exceeds the height of the cylinder 21；Meanwhile the soft conductive layer 22 is along away from the direction of the chip 1
Projection exceeds the insulating layer 3.
In the present embodiment, the cylinder 21 is set as copper post；The soft conductive layer 22 is set as soft gold layer, described soft
The Vickers hardness number of layer gold is preferably 50 or so, so that the soft gold layer can be deformed smoothly in subsequently pressing encapsulation process
Realize the encapsulation of chip 1.Preferably, the conductive column 2 further includes being set between the cylinder 21 and soft conductive layer 22
Adhesive layer 23, the adhesive layer 23 are set as metallic nickel.
The insulating layer 3 is set as polyimide resin (PI) coating.The insulating layer 3 deviates from the side of the chip 1
It is also formed with binding face 31, the binding face 31 is arranged and substantially parallel with the surface of the chip 1 in plane.The insulating layer
3 also have the storage tank 32 formed from the recess of the binding face 31, the storage tank 32 opposite with the position of the conductive column 2
It answers.The storage tank 32 extends towards the recess of the chip 1 without departing from the soft conductive layer 22, avoid the conductive column 2 with
Being retained after packaging is accomplished between insulating layer 3 has gap.The storage tank 32 has bottom wall 321 and peripheral wall 322；The conductive column
2 are preferably provided with the center that the cylindrical and described conductive column 2 is located at the storage tank 32, so that the soft conductive layer
22 periphery is consistent with the radial clearance of the peripheral wall 322.
The flip-chip assembly 100 by the prefabricated insulating layer 3 in 1 surface of chip, improving the structural strength of chip 1, and
Preferable protection is formed to the circuitous pattern and conductive column 2 of the setting of 1 surface of chip；More so that subsequent Flip-Chip Using work
Skill processing procedure is more succinct, and more product options are provided for client.
Join Fig. 2, the utility model also provides a kind of flip chip packaging structure 200, including described in stacked on top setting
Flip-chip assembly 100 and substrate 4.The insulating layer 3 of the flip-chip assembly 100 is fitted closely with 4 surface of substrate, and described
Soft conductive layer 22 presses on the commitment positions on 4 surface of the substrate to realize the electric connection of the substrate 4 and chip 1.
In 200 actual production processing procedure of the utility model flip chip packaging structure, first, conduction is made on 1 surface of chip
Column 2, the conductive column 2 include being connected to the cylinder 21 on 1 surface of chip and being connected to cylinder 21 away from the soft of the end of chip 1
Conductive layer 22；Secondly, insulating layer 3 is prepared on the surface of the chip 1, the thickness of the insulating layer 3 beyond cylinder 21 and makes
The soft conductive layer 22 exceeds the insulating layer 3 along the direction projection away from the chip 1；Insulating layer 3 will will be completed again to make
Standby chip 1 is placed into 4 top of substrate, and encapsulation is completed in positioning pressing.It can also be in the insulating layer 3 in above-mentioned encapsulation process
Binding face 31 and 4 surface of substrate coat adhesive layer between the two, in order to the pressure of the flip-chip assembly 100 and substrate 4
It closes, and then obtains corresponding encapsulating products.
In conclusion using the utility model flip-chip assembly 100 and flip chip packaging structure 200, by core
The prefabricated insulating layer 3 in 1 surface of piece replaces underfill in follow-up encapsulation procedure to cure (under-fill) technique, so that falling
Cored chip packaging process is more succinct, promotes product yield；And be conducive to the raising of chip manufacturer benefit and the quality to product
Control, while increasing client's selectance.
It should be appreciated that although this specification is described in terms of embodiments, but not each embodiment only includes one
A independent technical solution, this description of the specification is merely for the sake of clarity, and those skilled in the art should will say
As a whole, the technical solution in each embodiment may also be suitably combined to form those skilled in the art can for bright book
With the other embodiment of understanding.
Tool of the series of detailed descriptions listed above only for the feasible embodiment of the utility model
Body illustrates that they are all without departing from made by the utility model skill spirit not to limit the scope of protection of the utility model
Equivalent implementations or change should be included within the scope of protection of this utility model.
Claims (8)
1. a kind of flip-chip assembly, including chip and the conductive column for being set to chip surface, it is characterised in that：The conductive column
Including being connected to the cylinder of chip surface and being connected to cylinder away from the soft conductive layer of the end of chip, the flip-chip group
Part further includes the insulating layer being arranged in the conductive column side, and the soft conductive layer is super along the direction projection away from the chip
Go out the insulating layer.
2. flip-chip assembly according to claim 1, it is characterised in that：The soft conductive layer is set as soft gold layer；
The cylinder is set as copper post.
3. flip-chip assembly according to claim 2, it is characterised in that：The conductive column further includes being set to the copper
Adhesive layer between column and soft gold layer, the adhesive layer are set as metallic nickel.
4. flip-chip assembly according to claim 1, it is characterised in that：The setting of the insulating layer opposite chip surfaces
Height exceeds the height of the cylinder, and the insulating layer is formed with binding face away from the side of the chip；The insulating layer
Also have from binding face recess and storage tank corresponding with the conductive column position.
5. flip-chip assembly according to claim 4, it is characterised in that：The storage tank prolongs towards chip recess
It stretches without departing from the soft conductive layer.
6. flip-chip assembly according to claim 4, it is characterised in that：The storage tank has bottom wall and peripheral wall, institute
The center that conductive column is located at the storage tank is stated, so that between the periphery and the radial direction of the peripheral wall of the soft conductive layer
Gap is consistent.
7. flip-chip assembly according to claim 1, it is characterised in that：The insulating layer is set as polyimide resin
Coating.
8. a kind of flip chip packaging structure, it is characterised in that：The encapsulating structure includes substrate, such as claim 1-7 any
Flip-chip assembly described in；The flip-chip assembly is arranged with substrate stacked on top, the insulating layer and substrate surface
It fits closely, and the soft conductive layer presses on the substrate surface to realize the electric connection of the substrate and chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721924156.4U CN207705187U (en) | 2017-12-30 | 2017-12-30 | Flip-chip assembly and flip chip packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721924156.4U CN207705187U (en) | 2017-12-30 | 2017-12-30 | Flip-chip assembly and flip chip packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207705187U true CN207705187U (en) | 2018-08-07 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721924156.4U Active CN207705187U (en) | 2017-12-30 | 2017-12-30 | Flip-chip assembly and flip chip packaging structure |
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| CN (1) | CN207705187U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107994006A (en) * | 2017-12-30 | 2018-05-04 | 颀中科技（苏州）有限公司 | Flip-chip assembly, flip chip packaging structure and method for packing |
-
2017
- 2017-12-30 CN CN201721924156.4U patent/CN207705187U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107994006A (en) * | 2017-12-30 | 2018-05-04 | 颀中科技（苏州）有限公司 | Flip-chip assembly, flip chip packaging structure and method for packing |
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