CN207696999U - Low-pressure injection molding glue melting device - Google Patents

Low-pressure injection molding glue melting device Download PDF

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Publication number
CN207696999U
CN207696999U CN201721218676.3U CN201721218676U CN207696999U CN 207696999 U CN207696999 U CN 207696999U CN 201721218676 U CN201721218676 U CN 201721218676U CN 207696999 U CN207696999 U CN 207696999U
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China
Prior art keywords
heating coil
injection molding
low
electromagnetic heating
pressure injection
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CN201721218676.3U
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Chinese (zh)
Inventor
张加宽
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Kunshan Hua Yu Robotization Science And Technology Ltd
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Kunshan Hua Yu Robotization Science And Technology Ltd
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Abstract

The utility model is related to a kind of low-pressure injection molding glue melting devices, including melten gel cylinder body, electromagnetic heating coil and insulated heat body, and electromagnetic heating coil uniform winding is on melten gel cylinder body.Insulated heat body is located at the lower section of electromagnetic heating coil.Using above-mentioned technical proposal, the electromagnetic heating coil of the utility model more energy saving than existing Resistant heating coil 30% 80%;Due to being no more than 100 DEG C using the surface temperature of no heat source heating technique, low-pressure injection molding glue melting device, environment temperature can be significantly reduced;For electromagnetic heating coil continuous operation temperature at 100 DEG C or so, electromagnetic heating coil service life is long, relative to existing Resistant heating coil, reduces the cost for replacing heating device;The heating efficiency of the low-pressure injection molding glue melting device of the utility model is high, can substantially reduce temperature rising-time, improves product quality.

Description

Low-pressure injection molding glue melting device
Technical field
The utility model is related to a kind of low-pressure injection molding glue melting devices.
Background technology
The heating device of existing low-pressure injection molding glue melting device is formed by resistance wire coiling, the inside and outside Double-side heating of circle, Its inner face is thermally conducted on low-pressure injection molding glue melting device, and the heat of outside is largely lost in air, causes electric energy Loss and waste.Since heat largely scatters and disappears, ambient temperature is caused to increase, especially summer influences production environment very big, Work on the spot temperature has been more than 45 DEG C, and enterprise has to reduce temperature using air-conditioning, and energy source secondary is caused to waste.Due to using electricity Silk fever is hindered, heating temperature is up to 300 DEG C or so, and resistance wire is easy to blow because of high temperature ageing, and common electric heating coil uses Service life, therefore, the workload of repair was relatively large about in or so half a year.It is additionally present of the low problem of power density, in some need Want the occasion of higher temperature that can not adapt to.
Utility model content
The technical problems to be solved in the utility model is:A kind of energy saving, cost-effective low-pressure injection molding melten gel is provided Device.
In order to solve the above-mentioned technical problem, the technical solution adopted in the utility model is:
A kind of low-pressure injection molding glue melting device, including:
Melten gel cylinder body;
Electromagnetic heating coil, uniform winding is on melten gel cylinder body;
Insulated heat body is located at the lower section of electromagnetic heating coil.
Using above-mentioned technical proposal, the electromagnetic heating coil of the utility model is more energy saving than existing Resistant heating coil 30%-80%;It, can be notable due to being no more than 100 DEG C using the surface temperature of no heat source heating technique, low-pressure injection molding glue melting device Reduce environment temperature;Electromagnetic heating coil continuous operation temperature is at 100 DEG C or so, and electromagnetic heating coil service life is long, relatively In existing Resistant heating coil, reduce the cost for replacing heating device;The low-pressure injection molding glue melting device of the utility model Heating efficiency it is high, temperature rising-time can be substantially reduced, improve product quality.
Preferably, the melten gel cylinder body is made by stainless steel material.
Preferably, the insulated heat body is made by nanometer magnetic field guide material.
Description of the drawings
Fig. 1 is the structural schematic diagram of the low-pressure injection molding glue melting device of the utility model embodiment.
Specific implementation mode
To keep the above objects, features, and advantages of the utility model more obvious and easy to understand, below in conjunction with the accompanying drawings to this The specific implementation mode of utility model is described in detail.Elaborate many details in order to abundant in the following description Understand the utility model.But the utility model can be much to implement different from other manner described here, this field Technical staff can do similar improvement without prejudice to the utility model connotation, therefore the utility model is not by following public affairs The limitation for the specific embodiment opened.
It should be noted that when element is referred to as " being fixed on " another element, it can be directly on another element Or there may also be elements placed in the middle.When an element is considered as " connection " another element, it can be directly connected to To another element or it may be simultaneously present centering elements.
Unless otherwise defined, all of technologies and scientific terms used here by the article is led with the technology for belonging to the utility model The normally understood meaning of technical staff in domain is identical.Terminology used in the description of the utility model herein only be The purpose of description specific embodiment, it is not intended that in limitation the utility model.Term " and or " used herein includes Any and all combinations of one or more relevant Listed Items.
As shown in Figure 1, the low-pressure injection molding glue melting device 100 of the present embodiment, including melten gel cylinder body 110, electromagnetic heating coil 120 and insulated heat body 130,120 uniform winding of electromagnetic heating coil is on melten gel cylinder body 110, it is ensured that homogeneous heating.Insulation every Hot body 130 is located at the lower section of electromagnetic heating coil 120.Using above-mentioned technical proposal, the electromagnetic heating coil ratio of the utility model The existing energy saving 30%-80% of Resistant heating coil;Due to using no heat source heating technique, low-pressure injection molding glue melting device 100 Surface temperature be no more than 100 DEG C, environment temperature can be significantly reduced;Electromagnetic heating coil continuous operation temperature at 100 DEG C or so, Electromagnetic heating coil service life is long, relative to existing Resistant heating coil, reduces the cost for replacing heating device;This The heating efficiency of the low-pressure injection molding glue melting device 100 of utility model is high, can substantially reduce temperature rising-time, improves product quality.
Preferably, melten gel cylinder body 110 is made by stainless steel material, and stainless steel material has corrosion-resistant, heat safe Physical property enables to 110 service life of melten gel cylinder body long.
Preferably, insulated heat body 130 is made by nanometer magnetic field guide material so that low-pressure injection molding glue melting device 100 are heated evenly, and magnetic field will not be made to spread.
Each technical characteristic of embodiment described above can be combined arbitrarily, to keep description succinct, not to above-mentioned reality It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited In contradiction, it is all considered to be the range of this specification record.
Above-described embodiments merely represent several embodiments of the utility model, the description thereof is more specific and detailed, But therefore it can not be interpreted as the limitation to utility model patent range.It should be pointed out that for the common skill of this field For art personnel, without departing from the concept of the premise utility, various modifications and improvements can be made, these are belonged to The scope of protection of the utility model.Therefore, the protection domain of the utility model patent should be determined by the appended claims.

Claims (1)

1. a kind of low-pressure injection molding glue melting device(100), which is characterized in that including:
Melten gel cylinder body(110);
Electromagnetic heating coil(120), uniform winding is in melten gel cylinder body(110)On;
Insulated heat body(130), it is located at electromagnetic heating coil(120)Lower section,
The melten gel cylinder body(110)It is made by stainless steel material,
The insulated heat body(130)It is made by nanometer magnetic field guide material.
CN201721218676.3U 2017-09-21 2017-09-21 Low-pressure injection molding glue melting device Active CN207696999U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201721218676.3U CN207696999U (en) 2017-09-21 2017-09-21 Low-pressure injection molding glue melting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201721218676.3U CN207696999U (en) 2017-09-21 2017-09-21 Low-pressure injection molding glue melting device

Publications (1)

Publication Number Publication Date
CN207696999U true CN207696999U (en) 2018-08-07

Family

ID=63021034

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201721218676.3U Active CN207696999U (en) 2017-09-21 2017-09-21 Low-pressure injection molding glue melting device

Country Status (1)

Country Link
CN (1) CN207696999U (en)

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