CN207663471U - A kind of modular chip card - Google Patents
A kind of modular chip card Download PDFInfo
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- CN207663471U CN207663471U CN201820064691.5U CN201820064691U CN207663471U CN 207663471 U CN207663471 U CN 207663471U CN 201820064691 U CN201820064691 U CN 201820064691U CN 207663471 U CN207663471 U CN 207663471U
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- deck
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- encapsulating
- chip
- glue groove
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Abstract
The utility model discloses a kind of modular chip cards, including pavcilion plate, encapsulating plate, frame board, cresting plate, deck, chip module, positioning head, coil slot, copper coil, chip module is gently pushed away down along bottom plate, the pin being arranged on chip module is inserted into transition block lower end, shrapnel deformation is contacted with pin, then, chip module is pressed into deck, glue is poured into the downward storage glue groove of glue filling opening, glue is flowed into through glue-filling slot in upper storage glue groove, after glue solidification, deck and encapsulating plate are attached by the glue in lower storage glue groove, deck and chip module are connected by the glue in upper storage glue groove, to which chip module be positioned, it is fixed.The apparatus structure is simple, is designed using modular chip, quickly can be positioned and be fixed, transition piece using the big shrapnel of area as pin effectively reduces the welding difficulty of pin and copper coil, improves welding efficiency, meanwhile using the structure design convenient for encapsulating, effectively improving production efficiency.
Description
Technical field
The utility model is related to a kind of chip card more particularly to a kind of modular chip cards.
Background technology
Existing electronic chip card is that the chip being set on card body by a card body and one is constituted, the card
Piece body interior is embedded to connect the sensing coil to form conducting with chip, to constitute an electronic chip card.Currently, chip and card
Piece ontology is connected by way of bonding, i.e., chip mounting surface applies glue connect with card body, due to chip body
Product is smaller, and direct gluing is more difficult, causes production efficiency relatively low, simultaneously as the pin very little of chip, with sensing coil
It is more difficult when welding.In view of disadvantages described above, it is really necessary to design a kind of modular chip card.
Utility model content
The purpose of this utility model is to provide a kind of modular chip card, which uses modular chip
Design, quickly can be positioned and be fixed, and installation accuracy is improved, moreover, the transition piece using the big shrapnel of area as pin,
The welding difficulty for effectively reducing pin and copper coil improves welding efficiency, meanwhile, using the structure design convenient for encapsulating, effectively
Improve production efficiency.
In order to solve the above technical problems, the technical solution of the utility model is：A kind of modular chip card, including pavcilion
Plate, encapsulating plate, frame board, cresting plate, deck, chip module, positioning head, coil slot, copper coil, the encapsulating plate are located at bottom
Plaque upper end, the encapsulating plate is Nian Jie with pavcilion plate to be connected, and the frame board is located at encapsulating plate upper end, the frame board
Nian Jie with encapsulating plate to be connected, the cresting plate is located at frame board upper end, and the cresting plate is Nian Jie with frame board to be connected, described
Deck through frame board and at the top of encapsulating plate, the deck connected, described chip module position Nian Jie with encapsulating plate
On the inside of deck and it is located at cresting plate lower end, the chip module is Nian Jie with deck to be connected, and the deck is additionally provided with positioning
Head, the positioning head are integrally connected with deck, and the frame board is additionally provided with coil slot, and the coil slot is not through skeleton
Plate body, the copper coil are located in coil slot, and the copper coil is weldingly connected with chip module；
The chip module further includes bottom plate, clamp, chip, pin, transition block, and the bottom plate is located in deck
Side, the bottom plate is Nian Jie with deck to be connected, and the clamp quantity is 2, is symmetrically arranged along the bottom plate, described
Chip is located at bottom plate upper end and between the clamp that two pieces is arranged symmetrically, and the chip is additionally provided with pin, the pin
It is weldingly connected with chip, the transition block is located at bottom plate lower end and at the top of pin, the transition block and bottom plate one
It is connected.
The utility model further improves as follows：
Further, the encapsulating plate is additionally provided with location hole, and the location hole runs through encapsulating plate body.
Further, the encapsulating plate is additionally provided with glue filling opening, and the glue filling opening runs through encapsulating plate body.
Further, the deck is additionally provided with spacing head, and the spacing head is located on the inside of deck, the spacing head
It is integrally connected with deck.
Further, the deck is additionally provided with glue-filling slot, and the glue-filling slot runs through deck.
Further, the deck is additionally provided with storage glue groove, and the upper storage glue groove is located at deck inside bottom, described
Upper storage glue groove not through deck main body.
Further, the deck is additionally provided with lower storage glue groove, and the lower storage glue groove is located at deck exterior bottom, described
Lower storage glue groove not through deck main body, the axis of the lower storage glue groove is overlapped with the axis of upper storage glue groove.
Further, the transition block further includes supporting rack, shrapnel, and the supporting rack is integrally connected with bottom plate, institute
Through supporting rack and at the top of pin, the shrapnel is connected with supporting rack close-fitting and welds phase with copper coil the shrapnel stated
Even.
Compared with prior art, the modular chip card, when processing, by chip module along bottom plate from top to bottom gently under
It pushes away, by chip module or so limit and fixation, the pin being arranged on chip module is inserted into the clamp that two pieces is arranged symmetrically
Then, chip module is pressed into deck, is arranged on deck at this point, shrapnel deformation is completely attached to pin for transition block lower end
Spacing head by chip module clamping, then, by the positioning head being arranged on deck be inserted into location hole in, then, through glue filling opening
Glue is poured into downward storage glue groove, glue is flowed into through glue-filling slot in upper storage glue groove, and after glue solidification, the glue in lower storage glue groove will
Deck is attached with encapsulating plate, and deck and chip module are connected by the glue in upper storage glue groove, to position chip module,
It is fixed, then, copper coil and shrapnel are weldingly connected by frame board and encapsulating plate fixation, then, by cresting plate,
Pavcilion plate is Nian Jie connected successively with frame board and encapsulating plate respectively.The apparatus structure is simple, is designed using modular chip,
Quickly it can be positioned and be fixed, improve installation accuracy, moreover, the transition piece using the big shrapnel of area as pin, effectively
The welding difficulty of pin and copper coil is reduced, welding efficiency is improved, meanwhile, using the structure design convenient for encapsulating, effectively improve
Production efficiency.
Description of the drawings
Fig. 1 shows the utility model structure diagram
Fig. 2 shows the utility model deck vertical views
Fig. 3 shows the utility model chip module vertical view
Fig. 4 shows the utility model transition block structural schematic diagram
In figure：Pavcilion plate 1, encapsulating plate 2, frame board 3, cresting plate 4, deck 5, chip module 6, positioning head 7, coil slot 8,
Copper coil 9, location hole 201, glue filling opening 202, spacing head 501, glue-filling slot 502, upper storage glue groove 503, lower storage glue groove 504, bottom plate
601, clamp 602, chip module 603, pin 604, transition block 605, supporting rack 606, shrapnel 607.
Specific implementation mode
As shown in Figure 1, Figure 2, Figure 3, Figure 4, a kind of modular chip card, including pavcilion plate 1, encapsulating plate 2, frame board 3, top
Plaque 4, deck 5, chip module 6, positioning head 7, coil slot 8, copper coil 9, the encapsulating plate 2 are located at 1 upper end of pavcilion plate, institute
The encapsulating plate 2 stated is Nian Jie with pavcilion plate 1 connected, and the frame board 3 is located at 2 upper end of encapsulating plate, the frame board 3 and encapsulating
The bonding of plate 2 is connected, and the cresting plate 4 is located at 3 upper end of frame board, and the cresting plate 4 is Nian Jie with frame board 3 to be connected, described
Deck 5 through frame board 3 and positioned at the top of encapsulating plate 2, the deck 5 connected, described chip dies Nian Jie with encapsulating plate 2
Block 6 is located at 5 inside of deck and is located at 4 lower end of cresting plate, and the chip module 6 is Nian Jie with deck 5 to be connected, the deck 5
It is additionally provided with positioning head 7, the positioning head 7 is integrally connected with deck 5, and the frame board 3 is additionally provided with coil slot 8, described
Coil slot 8 is located at not through 3 main body of frame board, the copper coil 9 in coil slot 8, the copper coil 9 and chip module 6
It is weldingly connected, the chip module 6 further includes bottom plate 601, clamp 602, chip 603, pin 604, transition block 605, described
Bottom plate 601 be located at the inside of deck 5, the bottom plate 601 is Nian Jie with deck 5 connected, and the clamp quantity is 2, along institute
It states bottom plate 601 to be symmetrically arranged, the clamp 602 that the chip 603 is located at 601 upper end of bottom plate and is arranged symmetrically positioned at two pieces
Between, the chip 603 is additionally provided with pin 604, and the pin 604 is weldingly connected with chip 603, the transition block
605 are located at 601 lower end of bottom plate and are located at 604 top of pin, and the transition block 605 is integrally connected with bottom plate 601, the filling
Offset plate 2 is additionally provided with location hole 201, and the location hole 201 runs through 2 main body of encapsulating plate, and the encapsulating plate 2 is additionally provided with glue filling opening
202, the glue filling opening 202 runs through 2 main body of encapsulating plate, and the deck 5 is additionally provided with spacing head 501, the spacing head 501
Positioned at 5 inside of deck, the spacing head 501 is integrally connected with deck 5, and the deck 5 is additionally provided with glue-filling slot 502, described
Glue-filling slot 502 run through deck 5, the deck 5 is additionally provided with storage glue groove 503, and the upper storage glue groove 503 is located at deck 5
Inside bottom, for the upper storage glue groove 503 not through 5 main body of deck, the deck 5 is additionally provided with lower storage glue groove 504, described
Lower storage glue groove 504 is located at 5 exterior bottom of deck, and the lower storage glue groove 504 is not through 5 main body of deck, the lower storage glue groove 504
Axis overlapped with the axis of upper storage glue groove 503, the transition block 605 further includes supporting rack 606, shrapnel, the support
Frame 606 is integrally connected with bottom plate 601, and the shrapnel 607 is through supporting rack 606 and positioned at 604 top of pin, the shrapnel
607 are connected with 606 close-fitting of supporting rack and are weldingly connected with copper coil 9, the modular chip card, when processing, by chip module 603
It is gently pushed away down from top to bottom along bottom plate 601, chip module 603 or so is limited simultaneously fix tightly by the clamp 602 that two pieces is arranged symmetrically
Gu the pin 604 being arranged on chip module 603 is inserted into 605 lower end of transition block, at this point, 607 deformation of shrapnel and pin 604 are complete
Chip module 6 is then pressed into deck 5 by Full connected, the spacing head 501 that is arranged on deck 5 by 6 clamping of chip module, with
Afterwards, the positioning head on deck 57 will be arranged to be inserted into location hole 201, then, filled in 202 downward storage glue groove 504 of glue filling opening
Enter glue, glue is flowed into through glue-filling slot 502 in upper storage glue groove 503, and after glue solidification, glue in lower storage glue groove 504 is by deck 5
It is attached with encapsulating plate 2, deck 5 and chip module 6 are connected by the glue in upper storage glue groove 503, to determine chip module 6
Position is fixed, and then, copper coil 9 and shrapnel 607 are weldingly connected by frame board 3 and 2 fixation of encapsulating plate, then,
Cresting plate 4, pavcilion plate 1 is Nian Jie connected successively with frame board 3 and encapsulating plate 2 respectively.The apparatus structure is simple, using mould
Block formula chip designs, and quickly can be positioned and be fixed, and installation accuracy is improved, and draws moreover, being used as using the big shrapnel 607 of area
The transition piece of foot 604 effectively reduces the welding difficulty of pin 604 and copper coil 9, improves welding efficiency, meanwhile, using convenient for filling
The structure design of glue, effectively improves production efficiency.
The utility model is not limited to above-mentioned specific embodiment, and those skilled in the art visualize from above-mentioned
Hair, without performing creative labour, the various transformation made are all fallen within the scope of protection of the utility model.
Claims (8)
1. a kind of modular chip card, it is characterised in that including pavcilion plate, encapsulating plate, frame board, cresting plate, deck, chip dies
Block, positioning head, coil slot, copper coil, the encapsulating plate are located at pavcilion plate upper end, encapsulating plate phase Nian Jie with pavcilion plate
Even, the frame board is located at encapsulating plate upper end, and the frame board is Nian Jie with encapsulating plate to be connected, and the cresting plate is located at bone
Frame plate upper end, the cresting plate is Nian Jie with frame board to be connected, and the deck is through frame board and at the top of encapsulating plate, institute
The deck stated is Nian Jie with encapsulating plate to be connected, and the chip module is located on the inside of deck and is located at cresting plate lower end, the core
Piece module and card seat bonding is connected, and the deck is additionally provided with positioning head, and the positioning head is integrally connected with deck, described
Frame board is additionally provided with coil slot, and not through skeleton plate body, the copper coil is located in coil slot the coil slot, described
Copper coil be weldingly connected with chip module；
The chip module further includes bottom plate, clamp, chip, pin, transition block, and the bottom plate is located on the inside of deck, institute
The bottom plate stated is Nian Jie with deck to be connected, and the clamp quantity is 2, is symmetrically arranged along the bottom plate, the chip
Positioned at bottom plate upper end and between the clamp that two pieces is arranged symmetrically, the chip is additionally provided with pin, the pin and core
Piece is weldingly connected, and the transition block is located at bottom plate lower end and at the top of pin, and the transition block is integrally connected with bottom plate.
2. modular chip card as described in claim 1, it is characterised in that the encapsulating plate is additionally provided with location hole, described
Location hole runs through encapsulating plate body.
3. modular chip card as described in claim 1, it is characterised in that the encapsulating plate is additionally provided with glue filling opening, described
Glue filling opening runs through encapsulating plate body.
4. modular chip card as described in claim 1, it is characterised in that the deck is additionally provided with spacing head, the limit
Potential head is located on the inside of deck, and the spacing head is integrally connected with deck.
5. modular chip card as described in claim 1, it is characterised in that the deck is additionally provided with glue-filling slot, the filling
Glue groove runs through deck.
6. modular chip card as described in claim 1, it is characterised in that the deck is additionally provided with storage glue groove, described
Upper storage glue groove is located at deck inside bottom, and the upper storage glue groove is not through deck main body.
7. modular chip card as described in claim 1, it is characterised in that the deck is additionally provided with lower storage glue groove, described
Lower storage glue groove is located at deck exterior bottom, the lower storage glue groove not through deck main body, the axis of the lower storage glue groove with it is upper
The axis of storage glue groove overlaps.
8. modular chip card as described in claim 1, it is characterised in that the transition block further includes supporting rack, shrapnel,
The supporting rack is integrally connected with bottom plate, and the shrapnel is through supporting rack and at the top of pin, the shrapnel and branch
Support close-fitting is connected and is weldingly connected with copper coil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820064691.5U CN207663471U (en) | 2018-01-16 | 2018-01-16 | A kind of modular chip card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820064691.5U CN207663471U (en) | 2018-01-16 | 2018-01-16 | A kind of modular chip card |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207663471U true CN207663471U (en) | 2018-07-27 |
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ID=62945346
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820064691.5U Active CN207663471U (en) | 2018-01-16 | 2018-01-16 | A kind of modular chip card |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207663471U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108108803A (en) * | 2018-01-16 | 2018-06-01 | 梵利特智能科技（苏州）有限公司 | A kind of modular chip card |
-
2018
- 2018-01-16 CN CN201820064691.5U patent/CN207663471U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108108803A (en) * | 2018-01-16 | 2018-06-01 | 梵利特智能科技（苏州）有限公司 | A kind of modular chip card |
| CN108108803B (en) * | 2018-01-16 | 2024-04-16 | 梵利特智能科技（苏州）有限公司 | Modular chip card |
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