CN207655420U - Electronics processing point glue equipment - Google Patents
Electronics processing point glue equipment Download PDFInfo
- Publication number
- CN207655420U CN207655420U CN201721791308.8U CN201721791308U CN207655420U CN 207655420 U CN207655420 U CN 207655420U CN 201721791308 U CN201721791308 U CN 201721791308U CN 207655420 U CN207655420 U CN 207655420U
- Authority
- CN
- China
- Prior art keywords
- upper shell
- sebific duct
- processing point
- electronics processing
- point glue
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses a kind of electronics processing point glue equipments, including a packing element, described packing element bottom is connected with dispensing mouth by a sebific duct, described packing element includes upper shell and lower shell, the upper shell is made of elastic material, the lower shell is made of hard prepared material, and upper shell is integrally formed with lower shell, the oil cylinder that stripper plate is provided at the top of upper shell and stripper plate is pushed to move up and down.The electronics processing point glue equipment of the structure, is avoided that the generation of leak adhesive phenomenon, so as to avoid the waste of glue.
Description
Technical field
The utility model is related to spot gluing equipment fields, and in particular to a kind of electronics processing point glue equipment.
Background technology
Dispenser is also known as glue spreader, adhesive dripping machine or glue pouring machine etc., specially controls fluid.And by fluid drop, apply
The automatic machinery of product surface or interiors of products is overlying on, it can be achieved that three-dimensional, four-dimensional path dispensing, there is precise positioning, precisely
The advantages of drawing glue and not wire drawing.Its working principle is that:Glue is stored in the cement storage chamber that packing element and piston are formed, and cement storage chamber passes through
Service pipe is connect with dispensing mouth, and dispensing mouth is provided with valve with service pipe junction, is pushed by air pressure or lead-screw drive mechanism
Piston moves, and when reaching certain pressure, valve opening, glue is flowed out after flowing through service pipe from cement storage chamber by dispensing mouth, you can into
Row dispensing operates.
The dispenser of the prior art, with the extension of usage time, piston is worn, and is easy leak adhesive and is led to glue
Waste.
Utility model content
In view of this, the purpose of this utility model is to provide a kind of electronics processing point glue equipment, it is avoided that leak adhesive phenomenon
Generation, to avoid the waste of glue.
The utility model is solved the above problems by following technological means:A kind of electronics processing point glue equipment, including point
Packing element, described packing element bottom are connected with dispensing mouth by a sebific duct, and described packing element includes upper shell and lower shell, it is described on
Cylinder is made of elastic material, and the lower shell is made of hard prepared material, and upper shell is integrally formed with lower shell, at the top of upper shell
The oil cylinder for being provided with stripper plate and stripper plate being pushed to move up and down.
Further, the upper shell outer cover is equipped with stop collar.
Further, described sebific duct includes the fulcrum sebific duct that principal point sebific duct and Duo Gen are connected to principal point sebific duct, every fulcrum
The end of sebific duct is both provided with dispensing mouth, and glue dispensing valve is both provided on every fulcrum sebific duct.
Further, the axial height of upper shell is more than the axial height of lower shell.
Further, the stripper plate is slidably connected with stop collar sealing.
Further, the glue dispensing valve is overflow valve.
The beneficial effects of the utility model:The electronics processing point glue equipment of the utility model, including packing element, the point
Packing element bottom is connected with dispensing mouth by a sebific duct, and described packing element includes upper shell and lower shell, and the upper shell is by elasticity
Material is made, and the lower shell is made of hard prepared material, and upper shell is integrally formed with lower shell, and extruding is provided at the top of upper shell
Plate and the oil cylinder for pushing stripper plate to move up and down.The electronics processing point glue equipment of the structure, is avoided that the hair of leak adhesive phenomenon
It is raw, so as to avoid the waste of glue.
Description of the drawings
The utility model is further described with reference to the accompanying drawings and examples.
Fig. 1 is the structural schematic diagram of the utility model.
Specific implementation mode
The utility model is described in detail below with reference to attached drawing, as shown in Figure 1:The electronics processing of the present embodiment is used
Point glue equipment, including by 102 integrally formed packing elements of upper shell 101 and lower shell, upper shell is made of rubber, lower shell by
Metal is made, and the axial height of upper shell is more than the axial height of lower shell, and stripper plate 4 is provided at the top of upper shell and is pushed
The oil cylinder 5 that stripper plate moves up and down, lower shell bottom are provided with principal point sebific duct 201 and Duo Gen fulcrums sebific duct 202, principal point sebific duct with
Lower shell is connected to, and fulcrum sebific duct one end is connected to principal point sebific duct, and the other end is provided with dispensing mouth 3, is provided on fulcrum sebific duct excessive
Flow valve 7.In use, glue is stored in a packing element, the movement of oil cylinder pushing stripper plate squeezes upper shell, makes upper shell
Deformation simultaneously gradually squeezes into lower shell, and when pressure reaches certain value, overflow valve is opened, and glue can be flowed out from dispensing mouth, due to
Point packing element be structure as a whole, therefore in extrusion process will not leak adhesive, avoid the waste of glue.
As a further improvement of the above technical scheme, the upper shell outer cover be equipped with stop collar 6, the stripper plate with
Stop collar sealing is slidably connected.During plastic squeeze, stop collar, which limits upper shell, to be expanded around, make upper shell can only be by
Step is squeezed into lower shell, to improve plastic squeeze efficiency.
Finally illustrate, above example is merely intended for describing the technical solutions of the present application, but not for limiting the present application, although ginseng
The utility model is described in detail according to preferred embodiment, it will be understood by those of ordinary skill in the art that, it can be to this
The technical solution of utility model is modified or replaced equivalently, without departing from the objective and model of technical solutions of the utility model
It encloses, should all cover in the right of the utility model.
Claims (6)
1. a kind of electronics processing point glue equipment, including packing element, described packing element bottom is connected with dispensing mouth by a sebific duct,
It is characterized in that:Described packing element includes upper shell and lower shell, and the upper shell is made of elastic material, the lower shell by
Hard prepared material is made, and upper shell is integrally formed with lower shell, and stripper plate is provided at the top of upper shell and pushes stripper plate or more
Mobile oil cylinder.
2. electronics processing point glue equipment according to claim 1, it is characterised in that:The upper shell outer cover is equipped with limit
Position set.
3. the electronics processing point glue equipment according to claim 1-2 any one, it is characterised in that:Described sebific duct packet
The fulcrum sebific duct that principal point sebific duct and Duo Gen are connected to principal point sebific duct is included, the end of every fulcrum sebific duct is both provided with dispensing mouth, often
It is both provided with glue dispensing valve on root fulcrum sebific duct.
4. electronics processing point glue equipment according to claim 1, it is characterised in that:Under the axial height of upper shell is more than
The axial height of cylinder.
5. electronics processing point glue equipment according to claim 2, it is characterised in that:The stripper plate is sealed with stop collar
It is slidably connected.
6. electronics processing point glue equipment according to claim 3, it is characterised in that:The glue dispensing valve is overflow valve.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201721791308.8U CN207655420U (en) | 2017-12-19 | 2017-12-19 | Electronics processing point glue equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201721791308.8U CN207655420U (en) | 2017-12-19 | 2017-12-19 | Electronics processing point glue equipment |
Publications (1)
Publication Number | Publication Date |
---|---|
CN207655420U true CN207655420U (en) | 2018-07-27 |
Family
ID=62941931
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201721791308.8U Expired - Fee Related CN207655420U (en) | 2017-12-19 | 2017-12-19 | Electronics processing point glue equipment |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN207655420U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107876312A (en) * | 2017-12-19 | 2018-04-06 | 重庆鹏鑫达电子科技有限公司 | Electronics processing point glue equipment |
CN112024292A (en) * | 2020-09-08 | 2020-12-04 | 耒阳市亚湘电子科技有限公司 | Glue leakage preventing glue dispensing device for electronic processing |
-
2017
- 2017-12-19 CN CN201721791308.8U patent/CN207655420U/en not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107876312A (en) * | 2017-12-19 | 2018-04-06 | 重庆鹏鑫达电子科技有限公司 | Electronics processing point glue equipment |
CN112024292A (en) * | 2020-09-08 | 2020-12-04 | 耒阳市亚湘电子科技有限公司 | Glue leakage preventing glue dispensing device for electronic processing |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180727 Termination date: 20191219 |
|
CF01 | Termination of patent right due to non-payment of annual fee |