CN207639074U - A kind of radiator structure of electronic product - Google Patents

A kind of radiator structure of electronic product Download PDF

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Publication number
CN207639074U
CN207639074U CN201721856132.XU CN201721856132U CN207639074U CN 207639074 U CN207639074 U CN 207639074U CN 201721856132 U CN201721856132 U CN 201721856132U CN 207639074 U CN207639074 U CN 207639074U
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CN
China
Prior art keywords
heat emission
baffle
sink
ontology
fixedly installed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201721856132.XU
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Chinese (zh)
Inventor
颜松坤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Chongqing Long News Technology Co Ltd
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Chongqing Long News Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
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Priority to CN201721856132.XU priority Critical patent/CN207639074U/en
Application granted granted Critical
Publication of CN207639074U publication Critical patent/CN207639074U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model discloses a kind of radiator structures of electronic product,Including ontology,First baffle,Second baffle,Heat emission fan,Sink,Water cooling tube and the first heat emission hole,The side of the ontology is fixedly installed first baffle,The other side of the ontology is fixedly installed second baffle,It is fixedly installed heat emission fan on the inside of the first baffle,The inside bottom side of the ontology is fixedly installed sink,The outer tip end of the sink is fixedly installed water cooling tube,The water inlet of the micro pump is connected to the inside of sink,The inside of the ontology offers radiating groove in the upper surface of sink,The top surface of the ontology offers the first heat emission hole,By being fixedly installed heat emission fan on the inside of first baffle,And by the heat dissipation cavity on the inside of its radiating groove and second baffle by ontology,It is fixedly installed the water tank with micro pump in body interior,So that electronic product radiating efficiency in radiation processes is high,Convenient for routine use.

Description

A kind of radiator structure of electronic product
Technical field
The utility model is related to electronic product radiating engineering device technique field, specially a kind of radiator structure of electronic product.
Background technology
China's consumer electronics product refers to for personal and family and broadcast, TV, communicates related audio and video Product includes mainly:Television set, video disc player (VCD, SVCD, DVD), video recorder, video camera, radio, radio cassette player, combination tone Sound, compact disc player (CD), computer, mobile communication product etc..And in some developed countries, then phone, PC, family are done Postulate standby, domestic electronic health care facility, automobile electronics etc. are also returned in consumer electronics product.With technology development and newly The appearance of product new opplication, the products such as digital camera, mobile phone, PDA are also as emerging consumer electronics product.From 20 generation The discipline the nineties later stage, merged computer, Information And Communication, three big field of consumer electronics information household appliances start extensively Go deep into family life generally, it has the function of audiovisual, information processing, bilateral network communication etc., by embeded processor, related branch Support the soft of hardware (such as the reading equipment of display card, storage medium, IC card or credit card), embedded OS and application layer Part packet forms.
The radiator during electronic product use has the following disadvantages in the prior art:
1, radiating mode is simple, and radiating efficiency is relatively low.
2, the stability of radiator structure is poor, influences its normal use.
Utility model content
The purpose of this utility model is to provide a kind of radiator structures of electronic product, to solve to carry in above-mentioned background technology The problem of going out.
To achieve the above object, the utility model provides the following technical solutions:A kind of radiator structure of electronic product, including Ontology, first baffle, second baffle, heat emission fan, sink, water cooling tube and the first heat emission hole, the side fixed setting of the ontology There are first baffle, the other side of the ontology to be fixedly installed second baffle, be fixedly installed on the inside of the first baffle scattered The outside of heat fan, the first baffle offers air admission hole close to the position of heat emission fan, and the inside bottom side of the ontology, which is fixed, to be set It is equipped with sink, cooling water is placed on the inside of the sink, the side of the sink is fixedly installed close to the position of heat emission fan The outer tip end of micro pump, the sink is fixedly installed water cooling tube, the water inlet of the micro pump and the inside of sink Connection, the water outlet of the micro pump are fixed with one end of water cooling tube and are connected to, the other end of the water cooling tube and sink it is another Connection is fixed in one end, and the inside of the ontology offers radiating groove, the air outlet of the heat emission fan and heat dissipation in the upper surface of sink It is connected to by the first intercommunicating pore between slot, the top surface of the ontology offers the first heat emission hole, the radiating groove and the first heat dissipation It is connected between hole, heat dissipation cavity is offered on the inside of the second baffle, is connected to by second between the heat dissipation cavity and radiating groove Hole is connected to, and the heat dissipation cavity offers the second heat emission hole close to the side of first baffle.
Preferably, the water cooling tube be specially U-tube and its at least provided with two.
Preferably, first heat emission hole and the second heat emission hole are disposed as circular through hole.
Preferably, the volume of the cooling water is no more than 4/5ths of sink volume.
Preferably, external power supply has been electrically connected in the heat emission fan and micro pump.
Compared with prior art, the utility model has the beneficial effects that:
1, by being fixedly installed heat emission fan on the inside of first baffle, and it is passed through into the radiating groove and second baffle of ontology The heat dissipation cavity of inside is fixedly installed the water tank with micro pump, so that electronic product was radiating in body interior For Cheng Zhongneng by water cooling and air-cooled two ways, radiating efficiency is high, is convenient for routine use.
2, by being fixedly installed first baffle and second baffle in the both sides of ontology, electronic product is on the inside of two baffles It blocks, so that electronic product can stablize placement in radiation processes, improves the stability that electronic product uses, simple side Just, convenient for promoting the use of.
Description of the drawings
Fig. 1 is the utility model overall structure sectional view;
Fig. 2 is the utility model overall structure vertical view.
In figure:1- ontologies;2- first baffles;3- second baffles;4- heat emission fans;5- air admission holes;6- sinks;7- cooling waters; 8- micro pumps;9- water cooling tubes;10- radiating grooves;The first intercommunicating pores of 11-;The second intercommunicating pores of 12-;The first heat emission holes of 13-;14- dissipates Hot chamber;The second heat emission holes of 15-.
Specific implementation mode
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work The every other embodiment obtained, shall fall within the protection scope of the present invention.
It please refers to Fig.1 and Fig. 2, the utility model provides a kind of technical solution:A kind of radiator structure of electronic product, including Ontology 1, first baffle 2, second baffle 3, heat emission fan 4, sink 6, water cooling tube 9 and the first heat emission hole 13, the side of the ontology 1 It is fixedly installed first baffle 2, the other side of the ontology 1 is fixedly installed second baffle 3, the inside of the first baffle 2 It is fixedly installed heat emission fan 4, the outside of the first baffle 2 offers air admission hole 5, the ontology 1 close to the position of heat emission fan 4 Inside bottom side be fixedly installed sink 6, the inside of the sink 6 is placed with cooling water 7, and the side of the sink 6 is close to dissipating The position of heat fan 4 is fixedly installed micro pump 8, and the outer tip end of the sink 6 is fixedly installed water cooling tube 9, described miniature The water inlet of water pump 8 is connected to the inside of sink 6, and the water outlet of the micro pump 8 is fixed with one end of water cooling tube 9 and is connected to, The other end of the water cooling tube 9 is connected to the fixation of the other end of sink 6, and the inside of the ontology 1 is offered in the upper surface of sink 6 Radiating groove 10 is connected between the air outlet and radiating groove 10 of the heat emission fan 4 by the first intercommunicating pore 11, the top of the ontology 1 Face offers the first heat emission hole 13, is connected between the radiating groove 10 and the first heat emission hole 13, the inside of the second baffle 3 is opened Equipped with heat dissipation cavity 14, it is connected to by the second intercommunicating pore 12 between the heat dissipation cavity 14 and radiating groove 10, the heat dissipation cavity 14 is close The side of first baffle 2 offers the second heat emission hole 15.
In order to improve radiating efficiency, the water cooling tube 9 be specially U-tube and its at least provided with two, described first dissipates Hot hole 13 and the second heat emission hole 15 are disposed as circular through hole.
In order to avoid overflow phenomena occurs for internal water, the volume of the cooling water 7 be no more than 6 volume of sink five/ Four.
For the ease of using, external power supply has been electrically connected in the heat emission fan 4 and micro pump 8.
Operation principle:Electronic product is placed on above ontology 1, when heat dissipation, starts heat emission fan 4 so that cold wind, which passes through, to be dissipated Second heat emission hole 15 of 14 side of the first heat emission hole 13 and heat dissipation cavity above heat channel 10 completes simple air-cooled fan heat, starts micro- Type water pump 8 so that cooling water 7 is flowed by water cooling tube 9 along the top surface of radiating groove 10, and indirect water-cooling heat dissipation, heat dissipation effect are completed Rate is high, convenient for promoting the use of.
It should be noted that herein, relational terms such as first and second and the like are used merely to a reality Body or operation are distinguished with another entity or operation, are deposited without necessarily requiring or implying between these entities or operation In any actual relationship or order or sequence.Moreover, the terms "include", "comprise" or its any other variant are intended to Non-exclusive inclusion, so that the process, method, article or equipment including a series of elements is not only wanted including those Element, but also include other elements that are not explicitly listed, or further include for this process, method, article or equipment Intrinsic element.
While there has been shown and described that the embodiments of the present invention, for the ordinary skill in the art, It is appreciated that can these embodiments be carried out with a variety of variations in the case where not departing from the principles of the present invention and spirit, repaiied Change, replace and modification, the scope of the utility model are defined by the appended claims and the equivalents thereof.

Claims (5)

1. a kind of radiator structure of electronic product, including ontology (1), first baffle (2), second baffle (3), heat emission fan (4), water Slot (6), water cooling tube (9) and the first heat emission hole (13), it is characterised in that:The side of the ontology (1) is fixedly installed first gear The other side of plate (2), the ontology (1) is fixedly installed second baffle (3), the inside fixed setting of the first baffle (2) There are heat emission fan (4), the outside of the first baffle (2) to offer air admission hole (5), the ontology close to the position of heat emission fan (4) (1) inside bottom side is fixedly installed sink (6), and cooling water (7) is placed on the inside of the sink (6), the sink (6) Side is fixedly installed micro pump (8) close to the position of heat emission fan (4), and the outer tip end of the sink (6) is fixedly installed The water inlet of water cooling tube (9), the micro pump (8) is connected to the inside of sink (6), the water outlet of the micro pump (8) It fixes and is connected to one end of water cooling tube (9), the other end of the water cooling tube (9) is connected to the fixation of the other end of sink (6), described The inside of ontology (1) offers radiating groove (10), the air outlet and radiating groove of the heat emission fan (4) in the upper surface of sink (6) (10) it is connected to by the first intercommunicating pore (11) between, the top surface of the ontology (1) offers the first heat emission hole (13), the heat dissipation It is connected between slot (10) and the first heat emission hole (13), heat dissipation cavity (14), the heat dissipation is offered on the inside of the second baffle (3) It is connected to by the second intercommunicating pore (12) between chamber (14) and radiating groove (10), the heat dissipation cavity (14) is close to first baffle (2) Side offers the second heat emission hole (15).
2. a kind of radiator structure of electronic product according to claim 1, it is characterised in that:The water cooling tube (9) is specific For U-tube and it is at least provided with two.
3. a kind of radiator structure of electronic product according to claim 1, it is characterised in that:First heat emission hole (13) It is disposed as circular through hole with the second heat emission hole (15).
4. a kind of radiator structure of electronic product according to claim 1, it is characterised in that:The body of the cooling water (7) 4/5ths of product no more than sink (6) volume.
5. a kind of radiator structure of electronic product according to claim 1, it is characterised in that:The heat emission fan (4) and micro- External power supply has been electrically connected in type water pump (8).
CN201721856132.XU 2017-12-27 2017-12-27 A kind of radiator structure of electronic product Expired - Fee Related CN207639074U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201721856132.XU CN207639074U (en) 2017-12-27 2017-12-27 A kind of radiator structure of electronic product

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201721856132.XU CN207639074U (en) 2017-12-27 2017-12-27 A kind of radiator structure of electronic product

Publications (1)

Publication Number Publication Date
CN207639074U true CN207639074U (en) 2018-07-20

Family

ID=62853037

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201721856132.XU Expired - Fee Related CN207639074U (en) 2017-12-27 2017-12-27 A kind of radiator structure of electronic product

Country Status (1)

Country Link
CN (1) CN207639074U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109150223A (en) * 2018-10-25 2019-01-04 南京北宇新通科技有限公司 A kind of installing mechanism of Beidou module short message speech communication terminal

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109150223A (en) * 2018-10-25 2019-01-04 南京北宇新通科技有限公司 A kind of installing mechanism of Beidou module short message speech communication terminal

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GR01 Patent grant
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20180720

Termination date: 20181227

CF01 Termination of patent right due to non-payment of annual fee