CN207624556U - A kind of chip surface installation thin film capacitor - Google Patents
A kind of chip surface installation thin film capacitor Download PDFInfo
- Publication number
- CN207624556U CN207624556U CN201721397995.5U CN201721397995U CN207624556U CN 207624556 U CN207624556 U CN 207624556U CN 201721397995 U CN201721397995 U CN 201721397995U CN 207624556 U CN207624556 U CN 207624556U
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- CN
- China
- Prior art keywords
- capacitor
- thin film
- capacitor body
- chip surface
- outer end
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
The utility model discloses a kind of chip surfaces to install thin film capacitor comprising：Capacitor body；It is provided with capacitor body on the capacitor body, the capacitor body two side ends are provided with outgoing line components, the capacitor body outer end is provided with film layer, the film layer outer end is provided with insulating layer, the insulating layer outer end is provided with shell, and one side of shell is provided with lead；The utility model is simple and reasonable, easy to use, small, and capacity is big, capacitance current-carrying safety and stability, and service life is long.
Description
Technical field
The utility model is related to a kind of chip surfaces to install thin film capacitor, belong to capacitor technology field.
Background technology
Thin film capacitor is due to many excellent characteristics, being a kind of capacitor of excellent performance, largely being made
With on analog circuit, during existing capacitor is for the use of some circuits, current-carrying is dangerous and unstable, or even burns
The danger of damage, reduces the service life.
Invention content
（One）Technical problems to be solved
To solve the above problems, the utility model provides, one kind is simple and reasonable, and easy to use, small, capacity is big,
Thin film capacitor is installed on capacitance current-carrying safety and stability, chip surface with long service life.
（Two）Technical solution
A kind of chip surface of the utility model is installed by thin film capacitor comprising：Capacitor body；The capacitor
Capacitor body is provided on ontology, the capacitor body two side ends are provided with outgoing line components, the capacitor core
Sub- outer end is provided with film layer, and the film layer outer end is provided with insulating layer, and the insulating layer outer end is provided with
Shell is provided with lead in one side of shell.
Further, the capacitor body thickness is set as 0.1~0.5cm.
Further, it is provided with electrode contact between the outgoing line components and the capacitor body.
Further, the thin film layer thickness is set as 0.01~0.05cm.
Further, it is provided with heat eliminating medium between the insulating layer and the shell.
（Three）Advantageous effect
Compared with the prior art, the utility model has the following beneficial effects：The utility model is simple and reasonable,
Easy to use, small, capacity is big, capacitance current-carrying safety and stability, and service life is long.
Description of the drawings
In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment
Or attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, the accompanying drawings in the following description is only
It is some embodiments of the utility model, for those of ordinary skill in the art, in the premise not made the creative labor
Under, other drawings may also be obtained based on these drawings.
Fig. 1 is the structural schematic diagram of the utility model.
1- capacitor bodies；2- capacitor bodies；3- outgoing line components；4- film layers；5- insulating layers；6- shells；7- draws
Line.
Specific implementation mode
A kind of chip surface as shown in Figure 1 is installed by thin film capacitor comprising：Capacitor body 1；The capacitor
Capacitor body 2 is provided on ontology 1,2 two side ends of capacitor body are provided with outgoing line components 3, the capacitance
2 outer end of device fuse is provided with film layer 4, and 4 outer end of film layer is provided with insulating layer 5, outside the insulating layer 5
End is provided with shell 6, and 6 one side of shell is provided with lead 7；
Wherein, 1 thickness of capacitor body is set as 0.1~0.5cm；
It is provided with electrode contact between the outgoing line components 3 and the capacitor body 2；
4 thickness of film layer is set as 0.01~0.05cm；
It is provided with heat eliminating medium between the insulating layer 5 and the shell 6.
The utility model is simple and reasonable, easy to use, small, and capacity is big, and capacitance current-carrying safety and stability uses the longevity
Life length.
In the present invention, capacitor body 1 includes capacitor body 2, outgoing line components 3, film layer 4 and lead 7
A capacitor is formed, capacitance is big, and current-carrying is stablized, and is wrapped up by insulating layer 5 and the packaging of shell 6, securely and reliably.
Embodiment described above is only that preferred embodiments of the present invention are described, not to this practicality
Novel conception and scope is defined.Without departing from the design concept of the present utility model, ordinary people in the field couple
The all variations and modifications that the technical solution of the utility model is made, should fall within the protection scope of the present utility model, this reality
With novel claimed technology contents, all record in detail in the claims.
Claims (5)
1. thin film capacitor is installed on a kind of chip surface, it is characterised in that：Including capacitor body（1）；The capacitor sheet
Body（1）On be provided with capacitor body（2）, the capacitor body（2）Two side ends are provided with outgoing line components（3）, described
Capacitor body（2）Outer end is provided with film layer（4）, the film layer（4）Outer end is provided with insulating layer（5）, institute
The insulating layer stated（5）Outer end is provided with shell（6）, in the shell（6）One side is provided with lead（7）.
2. thin film capacitor is installed on a kind of chip surface according to claim 1, it is characterised in that：The capacitor sheet
Body（1）Thickness is set as 0.1~0.5cm.
3. thin film capacitor is installed on a kind of chip surface according to claim 1, it is characterised in that：The lead-out wire group
Part（3）With the capacitor body（2）Between be provided with electrode contact.
4. thin film capacitor is installed on a kind of chip surface according to claim 1, it is characterised in that：The film layer
（4）Thickness is set as 0.01~0.05cm.
5. thin film capacitor is installed on a kind of chip surface according to claim 1, it is characterised in that：The insulating layer
（5）With the shell（6）Between be provided with heat eliminating medium.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721397995.5U CN207624556U (en) | 2017-10-27 | 2017-10-27 | A kind of chip surface installation thin film capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721397995.5U CN207624556U (en) | 2017-10-27 | 2017-10-27 | A kind of chip surface installation thin film capacitor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207624556U true CN207624556U (en) | 2018-07-17 |
Family
ID=62827109
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721397995.5U Expired - Fee Related CN207624556U (en) | 2017-10-27 | 2017-10-27 | A kind of chip surface installation thin film capacitor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207624556U (en) |
-
2017
- 2017-10-27 CN CN201721397995.5U patent/CN207624556U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180717 Termination date: 20201027 |