CN207616934U - A kind of ceramics cutter device - Google Patents
A kind of ceramics cutter device Download PDFInfo
- Publication number
- CN207616934U CN207616934U CN201721816456.0U CN201721816456U CN207616934U CN 207616934 U CN207616934 U CN 207616934U CN 201721816456 U CN201721816456 U CN 201721816456U CN 207616934 U CN207616934 U CN 207616934U
- Authority
- CN
- China
- Prior art keywords
- cutting
- working panel
- sides
- motion bar
- ceramic wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
The utility model discloses a kind of ceramic cutter devices, including a bottom plate, a rack is arranged in bottom plate upper end, a working panel is arranged in frame upper end, a cutting mechanism is respectively set in working panel upper end both sides, a piece motion bar is set between two cutting mechanisms, working panel upper end is stretched out at the top of motion bar, bottom passes through working panel, there are one draw rings for its bottom external part setting, there are one accommodating chambers for tool among draw ring, a link block is arranged in the top external part of motion bar, engaging lug is respectively set in the both sides of link block, the outboard end of the engaging lug is provided at least two card slots, a clamping plate is respectively charged into card slot.The utility model is simple in structure, rotation cutting while realizing both sides ceramic wafer using gravity, and ceramic wafer is by being cut in rotation in cutting, therefore more smooth in cutting, prevent that ceramic wafer stress is excessive the case where fracture, and both sides process simultaneously, increase working efficiency.
Description
Technical field
The utility model is related to field of ceramic processing, and in particular to a kind of ceramics cutter device.
Background technology
Ceramic wafer in cutting, since the Property comparison of ceramic wafer is frangible, cutting by cutter device in the prior art
When cutting, the relative angle between cutting blade and ceramic wafer be to maintain it is constant, i.e., cutting blade rotate, ceramic wafer is along blade
Direction feed, therefore when feed, the cutting angle between potsherd and cutting blade be it is thick-and-thin, not due to cutting angle
Become, when being cut to deep, cutting is more and more harder, and entire cutting process all overcomes obstacle by external force extruding, because
This cutting process, which has some setbacks, is likely to result in the rupture of ceramic wafer, in addition, at present in technology when ceramic wafer is cut, Zhi Nengyi
One block of plate of block plate is processed, and working efficiency is relatively low.
Invention content
The technical problem to be solved by the utility model is to provide a kind of ceramic cutter devices, and both sides pottery is realized using gravity
Rotate cutting while porcelain plate, ceramic wafer be in cutting by cut in rotation, therefore it is more smooth in cutting, it is anti-
Only ceramic wafer stress is excessive and the case where be broken, and both sides process simultaneously, increase working efficiency.
The utility model is achieved through the following technical solutions：A kind of ceramics cutter device, including a bottom plate, bottom plate
A rack is arranged in upper end, and a working panel is arranged in frame upper end, and a cutting mechanism, position is respectively set in working panel upper end both sides
A piece motion bar is set between two cutting mechanisms, working panel upper end is stretched out at the top of motion bar, bottom passes through working face
Plate, external part setting in bottom is there are one draw ring, and there are one accommodating chamber, the top external part settings one of motion bar for draw ring centre tool
Link block, the both sides of link block are respectively set engaging lug, and the outboard end of the engaging lug is provided at least two card slots, in card slot
It is respectively charged into a clamping plate, a rotational pin is respectively set in the both sides of clamping plate, and clamping plate side is rotatablely installed by rotational pin in card slot,
The centre of clamping plate is respectively provided with there are one clamping chamber, and ceramic wafer side is respectively charged into clamping chamber, and the ceramic wafer of both sides is inclined
Shape, bottom are contacted with the cut surface of cutting mechanism by gravity respectively.
The upper surface of the working panel is a shiny surface as a preferred technical solution,.
The cutting mechanism includes a cutting blade, drive motor and a motor as a preferred technical solution,
Controller, drive motor are controlled by motor controller and are switched, and cutting blade is installed on the output end of drive motor, cutting blade
It is installed in the cutting groove opened up on working panel, the drive motor is installed on working panel by a motor mount
Side.
The front and back end of the rack is open as a preferred technical solution, is internally provided with an accommodating chamber, motion bar
Bottom is inserted into accommodating chamber.
The utility model has the beneficial effects that：The utility model is simple in structure, and the same of both sides ceramic wafer is realized using gravity
When rotation cutting, ceramic wafer cutting when be by while rotation while cut, therefore cut when it is more smooth, prevent ceramic wafer
Stress is excessive and the case where fracture, and both sides process simultaneously, increase working efficiency.
Description of the drawings
In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment
Or attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, the accompanying drawings in the following description is only
It is some embodiments of the utility model, for those of ordinary skill in the art, in the premise not made the creative labor
Under, other drawings may also be obtained based on these drawings.
Fig. 1 is the overall structure diagram of the utility model；
Fig. 2 is the clamping schematic diagram of the clamping plate and ceramic wafer of the utility model.
Specific implementation mode
All features disclosed in this specification or disclosed all methods or in the process the step of, in addition to mutually exclusive
Feature and/or step other than, can combine in any way.
Any feature disclosed in this specification (including any accessory claim, abstract and attached drawing), except non-specifically chatting
It states, can be replaced by other alternative features that are equivalent or have similar purpose.That is, unless specifically stated, each feature is only
It is an example in a series of equivalent or similar characteristics.
As depicted in figs. 1 and 2, including a rack 14,14 upper end of rack setting, one work is arranged in a bottom plate 1,1 upper end of bottom plate
A cutting mechanism is respectively set in panel 3,3 upper end both sides of working panel, is located at a piece activity of setting between two cutting mechanisms
Bar 11,11 top of motion bar stretch out in 3 upper end of working panel, and bottom passes through working panel 3, and there are one the settings of bottom external part
Draw ring 13, accommodating chamber that there are one 13 centre tools of draw ring, top external part one link block 7 of setting of motion bar 11, the two of link block 7
Engaging lug 8 is respectively set in side, and the outboard end of engaging lug 8 is provided at least two card slots 15, a clamping plate is respectively charged into card slot 15
9, a rotational pin 6 is respectively set in the both sides of clamping plate 9, and 9 side of clamping plate is rotatablely installed by rotational pin 6 in card slot 15, clamping plate 9
Centre is respectively provided with there are one clamping chamber, and 12 side of ceramic wafer is respectively charged into clamping chamber, and the ceramic wafer 12 of both sides is oblique,
Its bottom is contacted with the cut surface of cutting mechanism by gravity respectively.
The upper surface of working panel 3 is a shiny surface.Cutting mechanism include a cutting blade 4, drive motor 2 and
One motor controller, drive motor 2 are controlled by motor controller and are switched, and cutting blade is installed on the output of drive motor
End, cutting blade are installed in the cutting groove opened up on working panel, and drive motor 2 is installed on by a motor mount 5
The side of working panel.The front and back end of rack 14 is open, and is internally provided with an accommodating chamber 16, and 11 bottom of motion bar is inserted into
In accommodating chamber 16.
Since working panel is shiny surface, resistance is small when the bottom of ceramic wafer leans against on working panel, passes through in this way
Under gravity, angle of two ceramic wafers between working panel can be increasing, and notch is moved relative to cutting blade, and notch is deep
Spend increasing, cutting speed is depended on to the applied force of draw ring, and lower pressure is bigger, and cutting is faster, but correspondingly, lower pressure
Crossing conference causes ceramic wafer to be pressurized and impaired situation, therefore should moderately increase lower pressure, and clump weight can be placed in draw ring
Also it can realize, slowly be cut using gravity.When cutting, since the angle between ceramic wafer and working panel is changing always, because
Cutting angle in this cutting process is also changing always, and practical is exactly the cutting mode of an arc, can be more in stress
It is uniform.
The utility model has the beneficial effects that：The utility model is simple in structure, and the same of both sides ceramic wafer is realized using gravity
When rotation cutting, ceramic wafer cutting when be by while rotation while cut, therefore cut when it is more smooth, prevent ceramic wafer
Stress is excessive and the case where fracture, and both sides process simultaneously, increase working efficiency.
Above description is only a specific implementation of the present invention, but the scope of protection of the utility model is not limited to
In this, any change or replacement expected without creative work should be covered within the scope of the utility model.
Therefore, the scope of protection of the utility model should be determined by the scope of protection defined in the claims.
Claims (4)
1. a kind of ceramics cutter device, it is characterised in that：Including a bottom plate, a rack, frame upper end setting is arranged in bottom plate upper end
A cutting mechanism is respectively set in one working panel, working panel upper end both sides, is located at setting one between two cutting mechanisms
Motion bar, motion bar top stretch out in working panel upper end, and bottom passes through working panel, and there are one draw for the setting of bottom external part
Ring, there are one accommodating chamber, the top external parts of motion bar, and a link block is arranged for draw ring centre tool, and the both sides of link block are respectively set
The outboard end of engaging lug, the engaging lug is provided at least two card slots, and a clamping plate, the both sides point of clamping plate are respectively charged into card slot
One rotational pin is not set, and clamping plate side is rotatablely installed by rotational pin in card slot, and the centre of clamping plate is respectively provided with that there are one clampings
Chamber, ceramic wafer side are respectively charged into clamping chamber, the ceramic wafer of both sides is oblique, and bottom is cut with cutting mechanism respectively
Face is contacted by gravity.
2. ceramics cutter device as described in claim 1, it is characterised in that：The upper surface of the working panel is one smooth
Face.
3. ceramics cutter device as described in claim 1, it is characterised in that：The cutting mechanism include a cutting blade,
Drive motor and a motor controller, drive motor are controlled by motor controller and are switched, and cutting blade is installed on driving
The output end of motor, cutting blade are installed in the cutting groove opened up on working panel, and the drive motor passes through a motor
Mounting base is installed on the side of working panel.
4. ceramics cutter device as described in claim 1, it is characterised in that：The front and back end of the rack is open, and inside is set
Accommodating chamber there are one setting, motion bar bottom is inserted into accommodating chamber.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721816456.0U CN207616934U (en) | 2017-12-22 | 2017-12-22 | A kind of ceramics cutter device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721816456.0U CN207616934U (en) | 2017-12-22 | 2017-12-22 | A kind of ceramics cutter device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207616934U true CN207616934U (en) | 2018-07-17 |
Family
ID=62820418
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721816456.0U Expired - Fee Related CN207616934U (en) | 2017-12-22 | 2017-12-22 | A kind of ceramics cutter device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207616934U (en) |
-
2017
- 2017-12-22 CN CN201721816456.0U patent/CN207616934U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180717 Termination date: 20211222 |