CN207606266U - Board forming die in a kind of mobile phone - Google Patents
Board forming die in a kind of mobile phone Download PDFInfo
- Publication number
- CN207606266U CN207606266U CN201721665451.2U CN201721665451U CN207606266U CN 207606266 U CN207606266 U CN 207606266U CN 201721665451 U CN201721665451 U CN 201721665451U CN 207606266 U CN207606266 U CN 207606266U
- Authority
- CN
- China
- Prior art keywords
- ejection
- die
- lower die
- positioning column
- mobile phone
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
The utility model discloses board forming dies in a kind of mobile phone, including：The upper die and lower die of interaction form die cavity between upper die and lower die, and the upper mold is internally provided with positioning column, and positioning column is revealed in upper mold lower surface, and lower die bottom is provided with ejection, and ejection is obliquely installed；Ejection enters die cavity across lower die and ejects module；The ejection is installed in an installing arm, the end of ejection is in inverted T shaped, it is formed in installing arm and the matched embedded groove of the terminal end shape of ejection, the utility model is provided with the positioning column of protrusion upper mold lower surface in upper mold, and lower die is provided with the ejection for releasing module, can accurately be positioned by positioning column in molding, after the completion of injection molding, module can quickly be released by ejection when die sinking, injection efficiency is high, and defect rate is low.
Description
Technical field
The utility model is related to Cellphone Accessories technical fields, more particularly, to board forming die in a kind of mobile phone.
Background technology
Plate is the important spare part inside mobile phone in mobile phone, and plate is used for printed circuit board in mobile phone, supports remaining mobile phone
Accessory says that plate is that the core component of mobile phone was not also in mobile phone.
However plate is generally all molding by aluminium alloy compression casting in mobile phone, needs to be molded in forming process,
It needs to eject product after molding, conventional mold is ejected using thimble, and thimble and product contact area are small, is on the one hand held
Easily plate surface is left a trace in mobile phone, causes bad, on the other hand be easy to cause force unbalance so that plate becomes in mobile phone
Shape, therefore, the utility model are transformed traditional mold, propose board forming die in a kind of mobile phone.
Utility model content
In view of the deficienciess of the prior art, the purpose of this utility model is to provide board forming die in a kind of mobile phone.
To achieve the goals above, technical solution used by the utility model is：Board forming die in a kind of mobile phone, packet
It includes：The upper die and lower die of interaction form die cavity between upper die and lower die, and the upper mold is internally provided with positioning column, positioning
Column is revealed in upper mold lower surface, and lower die bottom is provided with ejection, and ejection is obliquely installed；Ejection enters die cavity by module across lower die
Ejection, the ejection are installed in an installing arm, and the end of ejection is in inverted T shaped, and the end with ejection is formed in installing arm
The matched embedded groove of shape.
In further technical solution, multiple injecting holes are provided in the lower die, injecting hole penetrates through the upper and lower of lower die
Surface, and in injecting hole connection die cavity.
In further technical solution, the lower die is provided with perforation, and ejection is installed in perforation, and interior setting of perforating
Have protrusion, ejection that place near to the upper end is provided with protrusion, protrusion is supported in protrusion, enable ejection that can stretch out perforation upwards and cannot be to
Under exit perforation.
In further technical solution, the ejection is installed in perforation, and the end face of ejection and the upper surface of lower die are held
It is flat.
In further technical solution, the upper mold offers the mounting hole installed for positioning column, mounting hole taper
Setting, and from top to bottom gradual change is small；The positioning column is matched with installation hole shape, and positioning column is enabled to be stretched out from the lower surface of upper mold
But mounting hole can not be detached from.
With the above structure, the utility model is compared to the prior art advantageously：The utility model is in upper
Mould is provided with the positioning column of protrusion upper mold lower surface, and lower die is provided with the ejection for releasing module, can be by fixed in molding
Position column is accurately positioned, and after the completion of injection molding, when die sinking can quickly be released module by ejection, and it is very high to be molded effect
Effect, in inverted T shaped, contact area is big for the end of ejection, when ejection will not in product surface trace, uniform force, and defect rate
It is low,.
Description of the drawings
The utility model is further illustrated with reference to the accompanying drawings and examples.
Fig. 1 is the stereogram of the utility model；
Fig. 2 is the stereogram of upper mold in the utility model；
Fig. 3 is the exploded view of the utility model；
Fig. 4 is the front view of the utility model；
Fig. 5 is the stereogram of lower die in the utility model.
Specific implementation mode
It is only the preferred embodiment of the utility model below, does not therefore limit the scope of protection of the utility model.
Board forming die in a kind of mobile phone, is shown in shown in Fig. 1-5, including：The upper mold 1 and lower die 2 of interaction, under upper mold 1
Pressure acts on lower die 2, and die cavity, module injection molding in die cavity are formed between upper mold 1 and lower die 2.Specifically, 2 bottom of lower die is set
It is equipped with ejection 3, and ejection 3 is obliquely installed, and ejection 3 passes through lower die 2 module to be ejected into die cavity, and multiple notes are provided in lower die 2
Mole 20, injecting hole 20 penetrates through the upper and lower surface of lower die 2, and injecting hole 20 is connected in die cavity, after lower die 2 is pressed under upper mold 1,
Injection molding liquid, the building form in die cavity are injected by injecting hole 20.And module is after shaping, needs to push away module from lower die 2
Go out, it is of course impossible to be taken out using human hand, therefore be exited by ejection 3.Ejection 3 is installed in an installing arm 31, the end of ejection 3
End is in inverted T shaped, forms in installing arm 31 and is obliquely installed with the matched embedded groove of the terminal end shape of ejection 3, ejection 3, works as installation
When arm 31 drives mobile or lower die 2 to drive mobile by driving device by driving device, all ejection 3 can be made above to be pushed away from lower die 2
Go out, and is to be released from lower surface toward upper surface, therefore the module in lower die 2 can be released.
The lower die 2 is provided with perforation 21, and ejection 3 is installed in perforation 21, and is provided with protrusion, ejection in perforation 21
3 are provided with protrusion 32 by place near to the upper end, and protrusion 32 is supported in protrusion, enable ejection 3 can stretch out upwards perforation 21 and cannot be downward
Exit perforation 21.In injection molding, ejection 3 is installed in perforation 21, and the end face of ejection 3 maintains an equal level with the upper surface of lower die 2, does not influence
Injection molding.
The upper mold 1 is internally provided with positioning column 11, and positioning column 11 stretches out in 1 lower surface of upper mold, and upper mold 1 opens up useful
In the mounting hole 10 that positioning column 11 is installed, the setting of 10 taper of mounting hole, and from top to bottom gradual change is small, positioning column 11 and mounting hole 10
Shape matches, and enables positioning column 11 be stretched out from the lower surface of upper mold 1 but can not be detached from mounting hole.
The use principle of this mold is as follows：
Upper mold 1 or lower die 2 are by driving device driving towards and away from mobile, and in general, which is
Drive cylinder；First, upper mold 1 is molded by driving device driving with lower die 2, and after the pushing of upper mold 1, positioning column 11 is in die cavity
Interior formation anchor point；Then, injection molding liquid injects die cavity by injecting hole 20, and waiting etc. is but molded, and upper mold 1 is opened after module molding
Mould resets；It is moved in ejection 3 after molding and ejects module 1, efficient, defect rate is low.
The above content is only the preferred embodiment of the utility model, for those of ordinary skill in the art, according to this reality
With novel thought, there will be changes in the specific implementation manner and application range, and the content of the present specification should not be construed as
Limitations of the present invention.
Claims (5)
1. board forming die in a kind of mobile phone, including：The upper die and lower die of interaction form die cavity between upper die and lower die,
It is characterized in that：The upper mold is internally provided with positioning column, and positioning column is revealed in upper mold lower surface, and lower die bottom, which is provided with, to push away
Top, ejection are obliquely installed；Ejection enters die cavity across lower die and ejects module, and the ejection is installed in an installing arm, is pushed away
The end on top is in inverted T shaped, is formed in installing arm and the matched embedded groove of the terminal end shape of ejection.
2. board forming die in a kind of mobile phone according to claim 1, it is characterised in that：It is provided in the lower die more
A injecting hole, injecting hole penetrate through the upper and lower surface of lower die, and in injecting hole connection die cavity.
3. board forming die in a kind of mobile phone according to claim 1, it is characterised in that：The lower die, which is provided with, wears
Hole, ejection are installed in perforation, and are provided with protrusion in perforation, and ejection is provided with protrusion by place near to the upper end, and protrusion is supported in convex
On rising, enable ejection that can stretch out perforation upwards and perforation cannot be exited downwards.
4. board forming die in a kind of mobile phone according to claim 3, it is characterised in that：The ejection is installed on perforation
Interior, the end face of ejection and the upper surface of lower die maintain an equal level.
5. board forming die in a kind of mobile phone according to claim 1, it is characterised in that：The upper mold, which offers, to be used for
The mounting hole of positioning column installation, the setting of mounting hole taper, and from top to bottom gradual change is small；The positioning column and installation hole shape
Match, positioning column is enabled to be stretched out from the lower surface of upper mold but mounting hole can not be detached from.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721665451.2U CN207606266U (en) | 2017-12-02 | 2017-12-02 | Board forming die in a kind of mobile phone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721665451.2U CN207606266U (en) | 2017-12-02 | 2017-12-02 | Board forming die in a kind of mobile phone |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207606266U true CN207606266U (en) | 2018-07-13 |
Family
ID=62797107
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721665451.2U Expired - Fee Related CN207606266U (en) | 2017-12-02 | 2017-12-02 | Board forming die in a kind of mobile phone |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207606266U (en) |
-
2017
- 2017-12-02 CN CN201721665451.2U patent/CN207606266U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180713 Termination date: 20181202 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |