CN207593979U - A kind of die cutting smart card mold - Google Patents
A kind of die cutting smart card mold Download PDFInfo
- Publication number
- CN207593979U CN207593979U CN201721501465.0U CN201721501465U CN207593979U CN 207593979 U CN207593979 U CN 207593979U CN 201721501465 U CN201721501465 U CN 201721501465U CN 207593979 U CN207593979 U CN 207593979U
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- China
- Prior art keywords
- smart card
- chip
- cope plate
- escape groove
- lower template
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Abstract
The utility model discloses a kind of die cutting smart card molds, including top mold frame and lower mold holder, the cope plate and lower template of the top pressure smart card that can cooperate are respectively equipped in top mold frame and lower mold holder, top mold frame is equipped with the punch-pin for being punched smart card, cope plate selects one with lower template and offers escape groove, cope plate is contacted with another in lower template with the chip on smart card, and chip is completely covered in the corresponding rear surface regions of chip in escape groove intelligent card corresponding, the projection of escape groove in the vertical direction.This mold sets an escape groove; the corresponding rear surface regions of chip in intelligent card corresponding; when cope plate and lower template compress smart card; although chip can be in direct contact cope plate or lower template; but escape groove can prevent chip area by direct punching press, and if there is the situation that smart card places deviation, the edge of escape groove can only generate impression, coining at the back side of smart card; will not coup injury chip, so as to protect chip injury-free.
Description
Technical field
The utility model is related to smart card production field more particularly to die cutting smart card equipment.
Background technology
Traditional die cutting smart card uses the form of chip upward, can be generated since card is unavoidable in process of production
Warping phenomenon causes the chip of smart card to be easily in direct contact with the upper mold of mold, gently then leaves impression, pressure in chip surface
Print, and influence product appearance quality；Heavy then chip electrical property is caused to damage, whole sheet smart card scraps.Since this happens rate
It is higher and not noticeable, it often leads to waste product, defect ware is fallen into client's hand, inestimable damage is caused to company brand image
It loses, this is the technical barrier of anxious solution co-pending at the moment.
Utility model content
In order to overcome the above-mentioned deficiencies of the prior art, the utility model, which provides, a kind of can protect chip injury-free
Die cutting smart card mold.
Technical solution is used by the utility model solves its technical problem：
A kind of die cutting smart card mold, including top mold frame and lower mold holder, being respectively equipped in the top mold frame and lower mold holder can
The cope plate and lower template of mutual cooperation top pressure smart card, the top mold frame is equipped with the punch-pin for being punched smart card, described
Cope plate selects one with lower template and offers escape groove, and cope plate is contacted with another in lower template with the chip on smart card,
The corresponding rear surface regions of chip in the escape groove intelligent card corresponding, the projection of the escape groove in the vertical direction are completely covered
Chip.
As an improvement of the above technical solution, the lower template is equipped with the cavity plate for avoiding punch-pin.
As an improvement of the above technical solution, the lower mold holder is equipped with the first vertical lead, the top mold frame set
It is located on the first lead, the top mold frame is equipped with the driving mechanism that it is driven to be moved along the first lead.
As an improvement of the above technical solution, the top of the cope plate is provided through the second lead of top mold frame, institute
Setting between cope plate and top mold frame is stated to have elastic component.
As an improvement of the above technical solution, the cope plate bottom offers escape groove, the lower template and smart card
On chip be in contact, the punch-pin includes three blocks of vertical plates, and mutually separated and compartment of terrain surrounds one between three blocks of plates
Frame is punched, when punch-pin is punched smart card, chip is located inside punching frame, and the projection of the punching frame in the vertical direction is complete
Cover escape groove.
The beneficial effects of the utility model have：
This mold sets an escape groove, the corresponding rear surface regions of chip in intelligent card corresponding, in cope plate and lower template pressure
During tight smart card, although chip can be in direct contact cope plate or lower template, escape groove can prevent chip area by straight
The punching press connect, and if there is the situation that smart card places deviation, the edge of escape groove only can generate pressure at the back side of smart card
Trace, coining, will not coup injury chip, so as to protect chip injury-free.
Description of the drawings
Below in conjunction with the accompanying drawings and specific embodiment the utility model is described in further detail, wherein：
Fig. 1 is the structure diagram of the utility model embodiment；
Fig. 2 is the structure diagram of top mold frame in the utility model embodiment；
Fig. 3 is the partial structural diagram of the utility model embodiment.
Specific embodiment
Referring to Fig. 1, a kind of die cutting smart card mold of the utility model, including top mold frame 1 and lower mold holder 2, the upper mold
The cope plate 3 for the top pressure smart card that can cooperate and lower template 4 are respectively equipped on frame 1 and lower mold holder 2, is set in the top mold frame 1
The punch-pin 5 of punching smart card is useful for, the lower template 4 is equipped with the cavity plate 7 for avoiding punch-pin 5.
Wherein, lower mold holder 2 is equipped with the first vertical lead 8, and the top mold frame 1 is set on the first lead 8, institute
It states top mold frame 1 and is equipped with the driving mechanism that top mold frame 1 is driven to be moved along the first lead 8, the top of the cope plate 3 is provided through
Second lead 9 of top mold frame 1, sets between the cope plate 3 and top mold frame 1 and has elastic component, in the present embodiment, driving machine
Structure is cylinder, and elastic element is compression spring, and driving mechanism drives top mold frame 1, punch-pin 5 and cope plate 3 to move down, when cope plate 3
Position is reached the limit of after contact smart card, top mold frame 1 and punch-pin 5 continue to move down and compression elastic element, until punching
Smart card.
With further reference to Fig. 2, for the present embodiment in blanking process, the chip-side of smart card is placed on lower template 4 downward
On, that is to say, that the face down of smart card, lower template 4 are contacted with the chip on smart card, and the cope plate 3, which offers, to be kept away
Allow slot 6, the corresponding rear surface regions of chip in 6 intelligent card corresponding of escape groove, wherein, the escape groove 6 is in the vertical direction
Projection be completely covered chip, i.e., 6 range of escape groove is more than the range of chip.In addition, in other embodiments, it can also be by intelligence
The face-up placement that can block, cope plate 3 are contacted with the chip on smart card, escape groove 6 are opened up in lower template 4, although core
Piece can all be in direct contact cope plate 3 or lower template 4, as long as ensureing when cope plate 3 and lower template 4 compress smart card, escape groove 6
Chip area can be prevented by direct punching press, if moreover, there is the situation of smart card placement deviation, the edge of escape groove 6
Only can the back side of smart card generate impression, coining, will not coup injury chip, so as to protect chip injury-free.
With further reference to Fig. 3, the punch-pin 5 includes three blocks of vertical plates 511, mutually separated between three blocks of plates 511
And compartment of terrain surrounds a punching frame 51, when punch-pin 5 is punched smart card, chip is located inside punching frame 51, the punching frame 51
Escape groove 6 is completely covered in projection in the vertical direction so that this mold also is able to be applied to punching SIM card field.
The better embodiment of the above, only the utility model, but the utility model is not limited to above-mentioned reality
Example is applied, as long as it reaches the technique effect of the utility model with any same or similar means, should all belong to the utility model
Protection domain.
Claims (7)
1. a kind of die cutting smart card mold, it is characterised in that：Including top mold frame and lower mold holder, divide in the top mold frame and lower mold holder
She You not can cooperate the cope plate and lower template of top pressure smart card, and the top mold frame is equipped with to be punched the convex of smart card
Mould, the cope plate select one with lower template and offer escape groove, cope plate and another in lower template and the core on smart card
Piece contacts, the corresponding rear surface regions of chip in the escape groove intelligent card corresponding, the projection of the escape groove in the vertical direction
Chip is completely covered.
2. a kind of die cutting smart card mold according to claim 1, it is characterised in that：It is convex that the lower template is equipped with avoidance
The cavity plate of mould.
3. a kind of die cutting smart card mold according to claim 1, it is characterised in that：It is vertical that the lower mold holder is equipped with
First lead, the top mold frame are set on the first lead, and the top mold frame, which is equipped with, drives it to be moved along the first lead
Driving mechanism.
4. a kind of die cutting smart card mold according to claim 1 or 3, it is characterised in that：The top of the cope plate is set
There is the second lead across top mold frame, set and have elastic component between the cope plate and top mold frame.
5. a kind of die cutting smart card mold according to claim 1, it is characterised in that：The cope plate bottom, which offers, to be kept away
Allow slot, the lower template is in contact with the chip on smart card.
6. a kind of die cutting smart card mold according to claim 5, it is characterised in that：The punch-pin include three pieces it is vertical
Plate, mutually separated and compartment of terrain surrounds a punching frame between three blocks of plates, and when punch-pin is punched smart card, chip is located at punching
Inside frame.
7. a kind of die cutting smart card mold according to claim 6, it is characterised in that：The punching frame is in the vertical direction
Projection escape groove is completely covered.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721501465.0U CN207593979U (en) | 2017-11-10 | 2017-11-10 | A kind of die cutting smart card mold |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721501465.0U CN207593979U (en) | 2017-11-10 | 2017-11-10 | A kind of die cutting smart card mold |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207593979U true CN207593979U (en) | 2018-07-10 |
Family
ID=62759081
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721501465.0U Active CN207593979U (en) | 2017-11-10 | 2017-11-10 | A kind of die cutting smart card mold |
Country Status (1)
| Country | Link |
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| CN (1) | CN207593979U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110696094A (en) * | 2019-10-25 | 2020-01-17 | 北京银证信通智能卡有限公司 | Seamless punching die |
-
2017
- 2017-11-10 CN CN201721501465.0U patent/CN207593979U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110696094A (en) * | 2019-10-25 | 2020-01-17 | 北京银证信通智能卡有限公司 | Seamless punching die |
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