CN207586885U - A kind of flexible bendable CTP and electronic equipment - Google Patents

A kind of flexible bendable CTP and electronic equipment Download PDF

Info

Publication number
CN207586885U
CN207586885U CN201721855157.8U CN201721855157U CN207586885U CN 207586885 U CN207586885 U CN 207586885U CN 201721855157 U CN201721855157 U CN 201721855157U CN 207586885 U CN207586885 U CN 207586885U
Authority
CN
China
Prior art keywords
layers
ctp
layer
nsp
flexible
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201721855157.8U
Other languages
Chinese (zh)
Inventor
刘威
吴德生
崔子龙
张文庆
张涛涛
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Truly Opto Electronics Ltd
Original Assignee
Truly Opto Electronics Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Truly Opto Electronics Ltd filed Critical Truly Opto Electronics Ltd
Priority to CN201721855157.8U priority Critical patent/CN207586885U/en
Application granted granted Critical
Publication of CN207586885U publication Critical patent/CN207586885U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Landscapes

  • Structure Of Printed Boards (AREA)

Abstract

The utility model discloses a kind of flexible bendable CTP and electronic equipment, flexible bendable CTP includes the PI layers, the first NSP prime coats, the first bridge transparent pattern conductive layer, the first OC pattern layers, the second bridge transparent pattern conductive layer, MOALMO metal routings layer, NSP layers of the second whole face and the flexible cover plate layer that set gradually from top to bottom.By using at PI layers, the first NSP prime coats are set, then MOALMO metal routings layer NSP layers of the second whole face of setting on the second bridge transparent pattern conductive layer, complete the making of CTP inductors, realize the flexibility function of touch screen, it can support two-sided bending, avoid existing single side bending that damage caused by reversely bending occurs, improve ease of use and reliability, do not conflict with existing production technology, new equipment need not be increased, product has the characteristics that flexibility is resistant to bending, and defect is few, has good effect in small-medium size.

Description

A kind of flexible bendable CTP and electronic equipment
Technical field
The utility model is related to capacitance-type touch screen technology field, more particularly to a kind of flexible bendable CTP and electronics Equipment.
Background technology
CTP is writing a Chinese character in simplified form for Capacitive Touch Panel, and Chinese full name is capacitive touch screen.Capacitive touch screen Construction the thin-film body layer of layer of transparent is mainly plated in glass screen, then outside conductor layer plus lastblock protective glass, it is double Glass Design can thoroughly protect conductor layer and inductor.Capacitance type touch control screen can be regarded as simply to be made of four layers of combined screen Screen body:Outermost layer is glassivation, and followed by conductive layer, third layer is nonconducting glass screen, the most interior the 4th layer It is conductive layer.Most inner conducting layer is shielded layer, plays the role of shielding internal electric signal, intermediate conductive layer is entire touch-control The key component of screen has direct lead on four angles or four edges, is responsible for the detection of touch point position.
Existing CTP mainly by nonbreakable glass being set to be fixed, and the characteristics of its circuit itself so that its It is easily damaged when being bent.In use, the parameters such as volume and length, width and height will not change, and existing such as intelligence Mobile phone is all large screen, and it is very inconvenient to carry.Compared to conventional screen, flexible screen is with the obvious advantage, not only in volume more It is frivolous, also below original device in power consumption, contribute to the cruising ability of lifting means, while based on its is flexible, flexibility is good Characteristic, robustness is also much higher than previous screen, reduces the probability of equipment accidental injury, therefore, flexible CTP is future One mainstream of development, exploitation are concerned.
At present, the inductor of flexible CTP in the market is mainly using flexible conductive material nano silver, metal mesh Deng, but there is also many limitations.For example:The flexible CTP of nano silver base material, since nano-silver thread is arranged in a jumble, mist degree can compare It is poor, whiten, it is difficult to accomplish that one is black, large scale can only be applied to;Base material of metal mesh itself is opaque, bottom shadow, More The defects of line, also causes it to be mostly used for large scale.
Utility model content
The purpose of the utility model is to provide a kind of flexible bendable CTP and electronic equipments, realize the two-sided of touch screen Flexible bendable, and have in small-medium size and use well.
In order to solve the above technical problems, the utility model embodiment provides a kind of flexible bendable CTP, including under To PI layers, the first NSP prime coats, the first bridge transparent pattern conductive layer, the first OC pattern layers, the second bridge pattern above set gradually Transparency conducting layer, MOALMO metal routings layer, NSP layers of the second whole face and flexible cover plate layer.
Wherein, it further includes and is arranged on the NSP layers of FPC wiring boards between the flexible cover plate layer of the second whole face.
Wherein, the first bridge transparent pattern conductive layer, the second bridge transparent pattern conductive layer are transparent conductive layer Or graphene transparency conducting layer.
Wherein, it is glued between NSP layers of second whole face, the FPC wiring boards, the flexible cover plate layer by OCA glue-lines It closes.
Wherein, the first OC pattern layers are
In addition to this, the utility model additionally provides a kind of electronic equipment, including flexible bendable CTP as described above.
The flexible bendable CTP and electronic equipment that the utility model embodiment is provided, compared with prior art, have with Lower advantage:
The flexible bendable CTP and electronic equipment set the first NSP prime coats, then the by using at PI layers MOALMO metal routings layer NSP layers of the second whole face of setting on two bridge transparent pattern conductive layers completes the system of CTP inductors Make, realize the flexibility function of touch screen, can support two-sided bending, avoid existing single side bending that damage caused by reversely bending occurs Wound improves ease of use and reliability, does not conflict with existing production technology, and without increasing new equipment, product has soft Property it is resistant to bending the characteristics of, defect is few, in small-medium size have good effect.
Description of the drawings
It in order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment Or attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, the accompanying drawings in the following description is this Some embodiments of utility model, for those of ordinary skill in the art, without creative efforts, also Other attached drawings can be obtained according to these attached drawings.
Fig. 1 is the structural representation of a kind of specific embodiment of flexible bendable CTP that the utility model embodiment provides Figure.
Specific embodiment
The following is a combination of the drawings in the embodiments of the present utility model, and the technical scheme in the embodiment of the utility model is carried out It clearly and completely describes, it is clear that the described embodiments are only a part of the embodiments of the utility model rather than whole Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are without making creative work All other embodiments obtained shall fall within the protection scope of the present invention.
It please refers to Fig.1, Fig. 1 is a kind of specific embodiment of flexible bendable CTP that the utility model embodiment provides Structure diagram.
In a kind of specific embodiment, the flexible bendable CTP, including set gradually from top to bottom PI layers 10, First NSP prime coats 20, the first bridge transparent pattern conductive layer 30, the first OC pattern layers 40, the second bridge transparent pattern conductive layer 50, MOALMO metal routings layer 60, the second whole face NSP layers 70 and flexible cover plate layer 80.
The oneth NSP prime coats 20 are set by using in PI layers 10, then on the second bridge transparent pattern conductive layer 50 MOALMO metal routings layer 60 second whole face NSP layers 70 are set, the flexibility of touch screen is realized in the making of completion CTP inductors Function can support two-sided bending, avoid the bending of existing single side reversely bending occurs caused by damage, improve ease of use and Reliability does not conflict with existing production technology, and without increasing new equipment, product has the characteristics that flexible resistant to bending, defect It is few, there is good effect in small-medium size.
NSP in the utility model is one kind in OVER COTING materials, and full name is transparent absolutely for polyimide-based flex Edge ink is mixed with the presence of PI, polyimides PI on the basis of general OC, assigns material flexibility, while solve PI sheets The shortcomings that body is partially yellow.
OC (over coting) is transparent organic insulation macromolecule, generally there is acrylic (PMMA poly-methyl methacrylates Ester) system and silica gel system etc., the most commonly used is acrylic systems.
In order to further expand the function of flexible bendable CTP or reduce its thickness, integrated more functions, In one embodiment of the utility model, the flexible bendable CTP, which is further included, is arranged on 70 He of the second whole face NSP layers FPC wiring boards between the flexible cover plate layer 80.
By increasing FPC wiring boards, since FPC wiring boards have bent performance in itself, original flexibility is not interfered with The bending performance of bent CTP, but also the function of needing can be increased by FPC wiring boards, meet the diverse requirements of user.
In the utility model, for the first bridge transparent pattern conductive layer 30, the second bridge transparent pattern conductive layer 50 Material is not specifically limited, and the first bridge transparent pattern conductive layer 30, the second bridge transparent pattern conductive layer 50 can be Transparent conductive layer, or graphene transparency conducting layer.
It is because graphene has high carrier mobility, sheet resistance is smaller, thickness using graphene transparency conducting layer It can suitably reduce, be conducive to improve the transparency of product.
The utility model to state the first bridge transparent pattern conductive layer 30, the second bridge transparent pattern conductive layer 50 thickness and Sheet resistance is not specifically limited.
For PI layers 10, the first NSP prime coats 20, the first bridge transparent pattern conductive layer 30, the first OC in the utility model Pattern layer 40, the second bridge transparent pattern conductive layer 50, MOALMO metal routings layer 60, the second whole face NSP layers 70 and flexible cover plate The thickness of layer 80 is not specifically limited, and the laminating type between material and adjacent layer for flexible cover plate layer 80 is not done specifically It limits, is generally glued between the second whole face NSP layers 70, the FPC wiring boards, the flexible cover plate layer 80 by OCA glue-lines It closes.
The utility model is not specifically limited the thickness and material of OCA glue-lines, is arranged on the second whole face NSP layers 70 Between the FPC wiring boards and the tool of OCA glue-lines that is arranged between the FPC wiring boards and the flexible cover plate layer 80 Body type can be the same or different, and thickness can also be equal, can not also be equal.
The utility model is not specifically limited the material and thickness of the first OC pattern layers 40, as long as local is enough Isolation and protective capability, the thickness of the general first OC pattern layers 40 are
In one embodiment of the utility model, by the ITO bridging structures of existing maturation, by using first NSP prime coats 20, then silk-screen NSP layers of the front on upper strata ITO i.e. the second bridge transparent pattern conductive layer 50, without the use of second OC pattern layers obtain and support two-sided bent flexible CTP.In a kind of product, with preferable bendable folding endurance, bending Diameter reach 4mm, bent 100,000 times without bend trace, resistance change colour in 20%.In addition, NSP prime coats and front NSP layers can be completed using prior art, not conflicted with the equipment and technique of existing production line, without being set Standby more capable or improvement, the transparency of ITO can ensure that it uses effect in small-medium size with good.
The manufacture craft of flexible bendable CTP in the utility model a kind of is as follows:
PI layers are coated on large stretch of base plate glass;
Prime coat is used as on PI layers for silk-screen NSP layers;
The first ITO layer is plated on NSP prime coats as the first bridge transparent pattern conductive layer, and carries out bridge pattern making;
The first OC layers of setting in the first ITO layer, and carry out pattern making;
The first the second ITO layer is plated as the second bridge transparent pattern conductive layer, and carry out corresponding bridge pattern system on OC layers Make;
MOALMO metal layers are made in the second ITO layer, the cabling for row metal layer of going forward side by side makes;
Whole face avoids NSP layers of bindings bit silk-screen printing;
FPC layers are bonded on whole face NSP layers;
Flexible cover plate layer is bonded on FPC layers, glass substrate is finally peeled away and obtains product.
In addition to this, the utility model additionally provides a kind of electronic equipment, including flexible bendable CTP as described above.
Since the electronic equipment includes the upper flexible bendable CTP, it should have the beneficial effect of flexible bendable CTP Fruit, details are not described herein for the utility model.
The utility model does not limit which kind of type the electronic equipment is, can be smart mobile phone, by with flexible bendable It rolls over CTP to combine, other components of the smart mobile phone can also be bent accordingly so that entire smart mobile phone has bent Type;It can also be wearable device, such as bracelet, can also be tablet computer etc., as long as can have the electronic equipment of portable function It can be designed to bent equipment to a certain extent.In addition, the electronic equipment can also be that host and display panel are removable Unload electronic computer of connection etc..
In conclusion flexible bendable CTP and electronic equipment that the utility model embodiment provides, flexible bendable CTP And electronic equipment, flexible bendable CTP set the first NSP prime coats by using at PI layers, it is then saturating in the second bridge pattern MOALMO metal routings layer NSP layers of the second whole face of setting on bright conductive layer, completes the making of CTP inductors, realizes and touch The flexibility function of screen can support two-sided bending, and existing single side bending is avoided to occur to damage caused by reversely bending, improves and uses Convenience and reliability do not conflict with existing production technology, and without increasing new equipment, product has flexible spy resistant to bending Point, defect is few, has good effect in small-medium size.
Flexible bendable CTP provided by the utility model and electronic equipment are described in detail above.Herein Specific case is applied to be expounded the principle and embodiment of the utility model, the explanation of above example is only intended to Help understands the method and its core concept of the utility model.It should be pointed out that those skilled in the art are come Say, under the premise of the utility model principle is not departed from, can also to the utility model, some improvement and modification can also be carried out, these change It is also fallen into the protection domain of the utility model claims into modification.

Claims (6)

1. a kind of flexible bendable CTP, which is characterized in that including set gradually from top to bottom PI layers, the first NSP prime coats, First bridge transparent pattern conductive layer, the first OC pattern layers, the second bridge transparent pattern conductive layer, MOALMO metal routings layer, second NSP layers of whole face and flexible cover plate layer.
2. flexible bendable CTP as described in claim 1, which is characterized in that further include be arranged on NSP layers of second whole face and FPC wiring boards between the flexible cover plate layer.
3. flexible bendable CTP as claimed in claim 2, which is characterized in that the first bridge transparent pattern conductive layer, described Two bridge transparent pattern conductive layers are transparent conductive layer or graphene transparency conducting layer.
4. flexible bendable CTP as claimed in claim 3, which is characterized in that NSP layers of second whole face, the FPC circuits It is bonded between plate, the flexible cover plate layer by OCA glue-lines.
5. flexible bendable CTP as claimed in claim 4, which is characterized in that the thickness of the first OC pattern layers is
6. a kind of electronic equipment, which is characterized in that including the flexible bendable CTP as described in claim 1-5 any one.
CN201721855157.8U 2017-12-25 2017-12-25 A kind of flexible bendable CTP and electronic equipment Active CN207586885U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201721855157.8U CN207586885U (en) 2017-12-25 2017-12-25 A kind of flexible bendable CTP and electronic equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201721855157.8U CN207586885U (en) 2017-12-25 2017-12-25 A kind of flexible bendable CTP and electronic equipment

Publications (1)

Publication Number Publication Date
CN207586885U true CN207586885U (en) 2018-07-06

Family

ID=62740137

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201721855157.8U Active CN207586885U (en) 2017-12-25 2017-12-25 A kind of flexible bendable CTP and electronic equipment

Country Status (1)

Country Link
CN (1) CN207586885U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109343747A (en) * 2018-12-18 2019-02-15 芜湖长信科技股份有限公司 A kind of flexible touch screen and preparation method thereof
CN110570768A (en) * 2019-09-11 2019-12-13 Oppo(重庆)智能科技有限公司 Folding substrate, folding screen and electronic equipment
CN111273732A (en) * 2020-01-20 2020-06-12 维沃移动通信有限公司 Electronic equipment

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109343747A (en) * 2018-12-18 2019-02-15 芜湖长信科技股份有限公司 A kind of flexible touch screen and preparation method thereof
CN110570768A (en) * 2019-09-11 2019-12-13 Oppo(重庆)智能科技有限公司 Folding substrate, folding screen and electronic equipment
CN111273732A (en) * 2020-01-20 2020-06-12 维沃移动通信有限公司 Electronic equipment
CN111273732B (en) * 2020-01-20 2022-09-09 维沃移动通信有限公司 Electronic equipment

Similar Documents

Publication Publication Date Title
CN103376934B (en) Contact panel and hand-hold electronic device
US8946578B2 (en) Touch panel and a manufacturing method thereof
US20110109583A1 (en) Capacitive Touch Screen Panel
US8119937B2 (en) Capacitive touch panel
US20080231605A1 (en) Compound touch panel
CN207586885U (en) A kind of flexible bendable CTP and electronic equipment
TWI394067B (en) Multi - sensor touchpad
CN103593084A (en) Touch panel and electronic device thereof
TWI620103B (en) Touch panel
CN202615358U (en) Capacitance type touch screen
TWM393740U (en) Capacitive touch sensor structure
CN103336639A (en) Capacitive touch screen
CN107589866A (en) Flexible touch sensing and contact panel
US20160026284A1 (en) Circuit connection structure of touch sensor panel
US8842078B2 (en) Touch display device
US20090223723A1 (en) Capacitive touch panel
US20150177873A1 (en) Touch panel and touch screen apparatus including the same
CN203773526U (en) Round projection capacitive touch screen
US20150268779A1 (en) Touch display device
CN207586892U (en) A kind of flexible bendable CTP and electronic equipment
CN207586891U (en) A kind of capacitive touch screen and electronic equipment
CN201369039Y (en) Resistance type touch screen with four-layer structure
CN201548943U (en) Resistance type touch screen with multi-point touch function
GB2456311A (en) Compound Resistive and Capacitive Touch Panel
CN103257775A (en) Capacitive touch screen of G1F structure

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant