CN207572716U - Semiconductor laser single-chip sintering equipment - Google Patents
Semiconductor laser single-chip sintering equipment Download PDFInfo
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- CN207572716U CN207572716U CN201721507836.6U CN201721507836U CN207572716U CN 207572716 U CN207572716 U CN 207572716U CN 201721507836 U CN201721507836 U CN 201721507836U CN 207572716 U CN207572716 U CN 207572716U
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Abstract
The utility model provides a kind of semiconductor laser single-chip sintering equipment, belong to chip sintering technology field, including pedestal and fixture, pedestal and fixture are detachably connected, and pedestal includes securing fixtures to the fixation kit on pedestal and the limiting link block for limiting the chucking position.The utility model semiconductor laser single-chip sintering equipment passes through chip fixed plate, heat sink fixed plate, the collective effect of pressure tongue on pedestal and fixture, improve chip positioning precision, and chip is kept to consolidate in sintering process, the sintering finished rate of chip is improved, obtains high infiltration laser.
Description
Technical field
The utility model belongs to chip sintering technology field, is to be related to a kind of semiconductor laser single more specifically
Piece sintering equipment.
Background technology
Single-tube semiconductor laser should in optical fiber laser pump, Laser Processing, laser medicine, laser display and military affairs
It is more and more widely used with the fields of grade, particularly in optical fiber laser pump application, weight small with its
Gently, the advantages that efficiency and reliability is high gains great popularity.Within the past ten years, with single-tube semiconductor laser product further into
It is ripe, it is reachable by optical fiber output power in the butterflies or TO series of products that are packaged into laser single tube by various structures
Several watts even upper tens watts, the demand in fields such as industrial processes, laser ranging, military affairs has very big growth.
Traditional single-tube laser chip sintering using general sintering fixture or attachment by hand, there are working efficiency it is low, when
Between it is long, yield rate is low, it is easy to operate not allow.Higher level infiltration laser in order to obtain will be sintered chucking pressure by adjusting,
During sintering, solder melts at high temperature under chip, and chip is made to be bonded on heat sink under continuous, swashs so as to obtain high infiltration
Light device.The device used at present has displacement when being sintered curing, although the solder used is very thin, in fixture without very
Still there is certain displacement during good fixed chip, thus cannot get the sintering of high precision positioning package, high cannot also infiltrate and swash
Light device, so fixture is particularly important in sintering process.
Utility model content
The purpose of this utility model is to provide a kind of semiconductor laser single-chip sintering equipments, it is intended to solve existing skill
In art in semiconductor laser sintering process, chip and it is heat sink between be subjected to displacement, the problem of laser wellability is low.
To achieve the above object, the technical solution adopted in the utility model is：A kind of semiconductor laser single-chip is provided
Sintering equipment, including pedestal and fixture, the pedestal and fixture are detachably connected；The pedestal includes consolidating the fixture
The fixation kit being scheduled on the pedestal and the limiting link block for limiting the chucking position.
Further, the pedestal is combined by two bevelled trapezoidal support bases of tool, described two support bases it is oblique
The orthogonal connection in face, the inclined-plane angle with horizontal plane of the support base is 30 ° -60 °.
Further, the pedestal upper surface is made of two mutually perpendicular inclined-planes, and described two inclined-planes are formed directly
Angle groove, the inclined-plane angle with horizontal plane are 30 ° -60 °.
Further, the fixation kit is set on the inclined-plane；The limiting link block is set to the inclined-plane
It is intermediate and fitted closely with two inclined-planes.
Further, the fixation kit is at least one and is set to the side of the limiting link block.
Further, the fixation kit includes fixed block and trip bolt；The trip bolt cooperation limiting connects
Block is connect for fixing the fixture.
Further, the fixture includes supporting rack, pedestal, and the bottom of support frame as described above connects the pedestal, the bottom
The part that connect with support frame as described above of seat is mounting table, and the mounting table is used for chip placement and heat sink, on the mounting table
Side is equipped with presses tongue and in the horizontal direction the chip fixed plate of fixed chip, the core for fixed chip in the vertical direction
Piece is placed on heat sink, and the heat sink fixed plate for fixing heat sink is additionally provided on the mounting table.
Further, guide pad is connected on support frame as described above, the pressure tongue is strip structure, and the pressure tongue penetrates institute
It states guide pad and position in the vertical direction is adjustable, the pressure tongue is controlled by the driving mechanism above supporting rack.
Further, the driving mechanism is fixed including one end, the hanging shrapnel of the other end, under the free end of the shrapnel
The upper end of tongue is pressed described in side contacts, the driving mechanism further includes the compression spiral shell for the shrapnel free end to be pushed to move up and down
Nail.
Further, the chip fixed plate and the position of heat sink fixed plate in the horizontal direction are adjustable.
The advantageous effect of air-conditioning system provided by the utility model is：Compared with prior art, the utility model is partly led
Body laser single-chip sintering equipment by chip positioning block on pedestal and fixture, heat sink locating piece, the collective effect for pressing tongue,
Chip positioning precision is improved, and chip is kept to consolidate in sintering process, improves the sintering finished rate of chip, obtains high infiltration laser
Device.
Description of the drawings
It, below will be to embodiment or the prior art in order to illustrate more clearly of the technical scheme in the embodiment of the utility model
Attached drawing is briefly described needed in description, it should be apparent that, the accompanying drawings in the following description is only that this practicality is new
Some embodiments of type, for those of ordinary skill in the art, without having to pay creative labor, can be with
Other attached drawings are obtained according to these attached drawings.
Fig. 1 is the stereochemical structure signal for the semiconductor laser single-chip sintering equipment that the utility model embodiment one provides
Figure；
Fig. 2 is the tridimensional structure diagram of sintering equipment that the utility model embodiment one provides；
Fig. 3 is the fixture dimensional structure diagram one of sintering equipment that the utility model embodiment one provides；
Fig. 4 is the fixture left view of sintering equipment that the utility model embodiment one provides；
Fig. 5 is the fixture dimensional structure diagram two of sintering equipment that the utility model embodiment one provides；
Fig. 6 is the stereochemical structure signal for the semiconductor laser single-chip sintering equipment that the utility model embodiment two provides
Figure；
Fig. 7 is the front view of semiconductor laser single-chip sintering equipment that the utility model embodiment two provides；
Fig. 8 is the fixture dimensional structure diagram of sintering equipment that the utility model embodiment two provides
In figure：1st, pedestal, 2, trip bolt, 3, fixed block, 4, pedestal, 5, supporting rack, 6, shrapnel, 7, housing screw, 8,
Press tongue, 9, guide pad, 10, heat sink fixed plate, 11, chip fixed plate, 12, limiting link block, 13, support base.
Specific embodiment
In order to which technical problem to be solved in the utility model, technical solution and advantageous effect is more clearly understood, with
Lower combination accompanying drawings and embodiments, the present invention is further described in detail.It should be appreciated that specific reality described herein
It applies example to be only used to explain the utility model, is not used to limit the utility model.
It should be noted that when element is referred to as " being fixed on " or " being set to " another element, it can be directly another
On one element or it is connected on another element.When an element is known as " being connected to " another element, it can
To be directly to another element or be indirectly connected on another element.
It is to be appreciated that term " length ", " width ", " on ", " under ", "front", "rear", "left", "right", " vertical ",
The orientation or position relationship of the instructions such as " level ", " top ", " bottom " " interior ", " outer " are to be closed based on orientation shown in the drawings or position
System is for only for ease of the description present invention and simplifies description rather than instruction or imply that signified device or element must have
Specific orientation, with specific azimuth configuration and operation, therefore be not considered as limiting the invention.
In addition, term " first ", " second " are only used for description purpose, and it is not intended that instruction or hint relative importance
Or the implicit quantity for indicating indicated technical characteristic.Define " first " as a result, the feature of " second " can be expressed or
Implicitly include one or more this feature.In the description of the present invention, " multiple " are meant that two or more,
Unless otherwise specifically defined.
A kind of semiconductor laser single-chip sintering equipment, including pedestal and fixture, the pedestal and fixture detachably connect
It connects；The pedestal is including for the fixation kit that the fixture is fixed on the pedestal and for limiting the chucking position
Limiting link block.
Further, the pedestal is combined by two bevelled trapezoidal support bases of tool, described two support bases it is oblique
The orthogonal connection in face, the inclined-plane angle with horizontal plane of the support base is 30 ° -60 °.
Further, the pedestal upper surface is made of two mutually perpendicular inclined-planes, and described two inclined-planes are formed directly
Angle groove, the inclined-plane angle with horizontal plane are 30 ° -60 °.
Further, the fixation kit is set on the inclined-plane；The limiting link block is set to the inclined-plane
It is intermediate and fitted closely with two inclined-planes.
Further, the fixation kit is at least one and is set to the side of the limiting link block.
Further, the fixation kit includes fixed block and trip bolt；The trip bolt cooperation limiting connects
Block is connect for fixing the fixture.
Further, the fixture includes supporting rack, pedestal, and the bottom of support frame as described above connects the pedestal, the bottom
The part that connect with support frame as described above of seat is mounting table, and the mounting table is used for chip placement and heat sink, on the mounting table
Side is equipped with presses tongue and in the horizontal direction the chip fixed plate of fixed chip, the core for fixed chip in the vertical direction
Piece is placed on heat sink, and the heat sink fixed plate for fixing heat sink is additionally provided on the mounting table.
Further, guide pad is connected on support frame as described above, the pressure tongue is strip structure, and the pressure tongue penetrates institute
It states guide pad and position in the vertical direction is adjustable, the pressure tongue is controlled by the driving mechanism above supporting rack.
Further, the driving mechanism is fixed including one end, the hanging shrapnel of the other end, under the free end of the shrapnel
The upper end of tongue is pressed described in side contacts, the driving mechanism further includes the compression spiral shell for the shrapnel free end to be pushed to move up and down
Nail.
Further, the chip fixed plate and the position of heat sink fixed plate in the horizontal direction are adjustable.
Embodiment one
It please refers to Fig.1 and Fig. 2, now semiconductor laser single-chip sintering equipment provided by the utility model is said
It is bright.The sintering equipment includes pedestal 1 and fixture, and pedestal 1 and fixture are detachably connected by the fixation kit being arranged on pedestal
It connects.Limiting link block 12 is additionally provided on pedestal 1, for being limited when fixture links together with pedestal 1 position of fixture
It is fixed.
Preferably, pedestal 1 is spliced by two bevelled trapezoidal support bases of tool, and the inclined-plane of two support bases is mutual
Vertical connection forms a right angle groove so that fixture can be stablized is placed on pedestal.Two trapezoidal support bases are smaller
Flat shape it is identical, and the inclined plane shape of two support bases is identical, and the inclined-plane of two support bases can also be shape difference
Two inclined-planes, but a line on two inclined-planes length is equal.Two inclined-plane angles with horizontal plane are mutually remaining, i.e. two inclined-planes and water
The sum of plane included angle is 90 °.Support base side is equipped with through-hole, and two trapezoidal support bases can be stitched together by bolt,
Form a pedestal 1 with right angle groove.In the present embodiment, one of inclined-plane angle with horizontal plane is 30 °, another is tiltedly
Face angle with horizontal plane is 60 °.The right angle groove of pedestal 1 can make operating personnel during chip is clamped to sintering equipment
Possess bigger observation space, be more advantageous to being accurately positioned during raising chip clamping.
Preferably, fixation kit is set on the inclined-plane of support base, if two inclined-planes are variform inclined-plane, Gu
Determine component to be set on larger inclined-plane.Limiting link block 12 is arranged on fixation kit on same inclined-plane.Limit link block
12 for T-shaped component and are arranged on the centre position on inclined-plane, and two faces and two inclined-planes of pedestal 1 for limiting link block 12 are closely pasted
It closes, ensures closely fit together with pedestal 1 when fixture is mounted on pedestal 1.Fixation kit is including fixed block 3 and tightly
Gu screw 2, fixed block 3 is L-shaped, and fixed block 3 is fixed on the side on the inclined-plane of pedestal 1.Fixed block 3 longer one section is equipped with two
Fixed block 3 can be fixed on the inclined-plane of pedestal 1 by a screw hole by screw.Fixed block 3 shorter one section is equipped with fastening spiral shell
Hole, trip bolt 2 can pass through fastening screw hole, with limiting link block cooperation, play the role of stationary fixture.
Fig. 3 to Fig. 5 is please referred to, fixture includes pedestal 4, supporting rack 5, and pedestal 4 is C-shaped, 4 liang of 5 bottom of supporting rack and pedestal
End is equipped with screw hole, and 5 bottom of supporting rack is detachably connected with pedestal 4 by bolt., part that pedestal 4 is not connect with supporting rack 5
For mounting table, mounting table is equipped with above mounting table for the pressure of fixed chip in the vertical direction for chip placement and heat sink
The chip fixed plate 11 of tongue 8 and in the horizontal direction fixed chip, chip is placed on heat sink, is additionally provided on mounting table for solid
Fixed heat sink heat sink fixed plate 10.4 opening of pedestal is matched with limiting link block 12, can closely be fit together, be made folder
Tool can be stably fixed on pedestal 1, be not subjected to displacement.Guide pad 9 is connected on supporting rack 5, pressure tongue 8 is strip knot
Structure, pressure tongue 8 penetrates guide pad 9 and position in the vertical direction is adjustable, and pressure tongue 8 is controlled by the driving above supporting rack 5
Mechanism.Driving mechanism is fixed on 5 top of supporting rack including one end, and the hanging shrapnel 6 of the other end, shrapnel 6 is T-shaped, symmetrical
Both ends are equipped with screw hole, and supporting rack 5 is correspondingly provided with screw hole with 6 junction of shrapnel, and shrapnel 6 is bolted with supporting rack 5 one
It rises.The upper end of the free end contacts-side-down pressure tongue 8 of shrapnel 6, driving mechanism further include that 6 free end of shrapnel is pushed to move up and down
Housing screw 7.6 free end of shrapnel is equipped with screwing through hole, and housing screw 7 can be corresponding with supporting rack 5 by the screwing through hole
The screw hole of position setting is threadedly coupled.By screwing housing screw 7, shrapnel 6 can be pressed downward pressing tongue 8, enable pressure tongue 8
Fastening is pressed on chip upper surface.The both ends of guide pad 9 are equipped with screw hole, by bolt by the side of guide pad 9 and supporting rack 5
It is attached.The side that guide pad 9 is in reverse to supporting rack 5 is equipped with for the screw hole of fixed pressure tongue 8, can will press tongue by bolt
8 are fixed on a certain position, and pressure tongue 8 is kept to make chip that vertical side not occur relative to fixture the pressure of chip vertical direction
To displacement.Heat sink fixed plate 10 is horizontally placed on 4 upper surface of pedestal, and is fixed by screws on pedestal 4, for fixed heat
It is heavy, make heat sink relative to fixture remains stationary, not occurred level direction displacement.Chip fixed plate 11 is vertically arranged on pedestal 4
Surface, and the side of supporting rack 5 is fixed by screws in, chip is made not to be subjected to displacement relative to heat sink.Heat sink fixed plate 10 with
The through-hole that pedestal 4 connects is strip, and heat sink fixed plate 10 and pressure are realized in the position that can be connect by adjusting screw with through-hole
Horizontal distance between tongue 8 is adjustable, to adapt to different size of heat sink may be mounted on fixture.Likewise, chip is consolidated
The through-hole that fixed board 11 is connect with supporting rack 5 is also strip so that horizontal distance is adjustable between chip fixed plate 11 and pressure tongue 8
, it may be mounted on fixture with adapting to different size of chip.
Specifically used process：
First, fixture is mounted on pedestal 1.Due to limiting the effect of link block 12, fixture is connected by the limiting on pedestal 1
It connects block 12 to be fixed on determining position, and pedestal 4 due to fixture and supporting rack 5 are mutually matched with limiting link block 12,
Fixture can closely be fixed together with limiting link block 12, and fixture is made not to be subjected to displacement.Secondly, by fixation kit with
Limiting link block 12, which coordinates, is fixed fixture, ensures that fixture links together with pedestal 1.Then, in the mounting table of fixture
Upper chip and heat sink.It, can be by chip and heat sink in level due to the effect of chip fixed plate 11 and heat sink fixed plate 10
It is fixed on direction.It rotatably compresses screw 7 and compresses shrapnel 6 downwards, make shrapnel 6 that tongue 8 will be pressed to be pressed on above chip, by chip
It is fixed together with heat sink, the bolt screwed on 9 screw hole of guide pad will press tongue 8 to fix.Complete chip and it is heat sink between determine
Behind position, the trip bolt 2 on fixation kit is unclamped by rotation, fixture is disassembled from pedestal 1.Due to chip fixed plate
11st, heat sink fixed plate 10 and the collective effect of pressure tongue 8, can persistently press chip under the premise of chip is not damaged, reach fixed core
Piece and heat sink purpose.Chip will be installed and heat sink fixture is placed in sintering furnace and is sintered, referred to chip and heat sink
It is fixed together by high temperature.During sintering, chip and it is heat sink between keep low displacement or unshifting, obtain height
Infiltrate laser.
Semiconductor laser single-chip sintering equipment provided in this embodiment detachably detaches knot using pedestal 1 and fixture
Structure, pedestal 1 are spliced by two bevelled support bases of tool, two mutually perpendicular scarf grooves at a right angle, for behaviour
Sufficient observation space is provided as personnel, chip can be accurately positioned with heat sink, in chip fixed plate 11, heat sink fixed plate 10
Under the collective effect of pressure tongue 8, ensure sintering process chips and it is heat sink between low displacement or unshift, improve chip and sinter into
Product rate obtains high infiltration laser.
Embodiment two
Fig. 6 to Fig. 8 is please referred to, the semiconductor laser single-chip sintering equipment provided in the present embodiment includes 1 He of pedestal
Fixture, pedestal 1 and fixture are detachably connected by the fixation kit being arranged on pedestal 1.Limiting link block is additionally provided on pedestal 1
12, for being defined when fixture links together with pedestal 1 to the position of fixture.
Preferably, pedestal 1 is the one-piece member for having right angle groove, and 1 upper surface of pedestal is mutually perpendicular oblique by two
Face forms, and inclined-plane angle with horizontal plane is 45 °.The right angle groove of pedestal 1 can make operating personnel that chip is being clamped to sintering
Possess bigger observation space during device, be more advantageous to being accurately positioned during raising chip clamping.
Preferably, there are two fixation kits for setting on pedestal inclined-plane, are located at the both sides of limiting link block 12 respectively, close to base
The right and left on 1 inclined-plane of seat.When fixture is mounted on pedestal 1, limited by limiting link block 12, fixture is steady with pedestal 1
Gu closely linking together, and pass through the fixation kit at left and right sides of inclined-plane and fixture be fixed with limiting link block 12,
Make what fixture consolidated to be fixed on pedestal.
Preferably, it is solid to include supporting rack 5, pedestal 4, shrapnel 6, housing screw 7, pressure tongue 8, pressure tongue fixed block 9, chip for fixture
Fixed board 11 and heat sink fixed plate 10.Chip fixed plate 11 and heat sink fixed plate 10, heat sink fixed plate 10 are equipped in 8 both sides of pressure tongue
4 upper surface of pedestal is horizontally placed on, it is heat sink for fixing, make heat sink relative to fixture remains stationary, not occurred level direction position
It moves.Chip fixed plate 11 is vertically arranged at 4 upper surface of pedestal, and is fixed by screws in the side of supporting rack 5, makes chip opposite
It is not subjected to displacement in heat sink.The through-hole that heat sink fixed plate 10 is connect with pedestal 4 is strip, can be by adjusting screw and through-hole
The position of connection, realize heat sink fixed plate 10 and press tongue 8 between horizontal distance be it is adjustable, it is different size of heat sink to adapt to
It may be mounted on fixture.Likewise, the through-hole that chip fixed plate 11 is connect with supporting rack 5 is also strip so that chip is solid
Horizontal distance is adjustable between fixed board 11 and pressure tongue 8, be may be mounted on fixture with adapting to different size of chip.
Specifically used process：
First, fixture is mounted on pedestal 1.Due to limiting the effect of link block 12, fixture is connected by the limiting on pedestal 1
It connects block 12 to be fixed on determining position, and pedestal 4 due to fixture and supporting rack 5 are mutually matched with limiting link block 12,
Fixture can closely be fixed together with limiting link block 12, and fixture is made not to be subjected to displacement.Secondly, it is solid by left and right two
Determine component fixture is fixed, ensure that fixture links together with what pedestal 1 more consolidated.Then, core is installed on fixture
Piece and heat sink.It, can be by chip and heat sink due to the effect of the chip fixed plate 11 and heat sink fixed plate 10 of pressure tongue 8 left and right sides
It is fixed in the horizontal direction.It rotatably compresses screw 7 and compresses shrapnel 6 downwards, make shrapnel 6 that tongue 8 will be pressed to be pressed on above chip,
Chip is fixed together with heat sink in vertical direction, the bolt screwed on 9 screw hole of guide pad will press tongue 8 to fix.Complete core
Piece and it is heat sink between positioning after, by rotation unclamp fixation kit on trip bolt 2, under fixture is dismantled from pedestal 1
Come.It, can be lasting to press under the premise of chip is not damaged due to chip fixed plate 11, heat sink fixed plate 10 and the collective effect for pressing tongue 8
Chip is held, reaches fixed chip and heat sink purpose.During sintering, chip and it is heat sink between keep low displacement or not position
It moves, obtains high infiltration laser.
Semiconductor laser single-chip sintering equipment provided in this embodiment detachably detaches knot using pedestal 1 and fixture
Structure, pedestal 1 have the one-piece member of right angle groove, and sufficient observation space is provided for operating personnel, can be accurately positioned
Chip in chip fixed plate 11, heat sink fixed plate 10 and under pressing the collective effect of tongue 8, ensures sintering process chips with heat sink
With it is heat sink between low displacement or unshift, improve the sintering finished rate of chip, obtain high infiltration laser.
In conclusion the utility model embodiment provides semiconductor laser single-chip sintering equipment, pass through pedestal and folder
The collective effect of chip positioning block, heat sink locating piece, pressure tongue on tool, improves chip positioning precision, and protected in sintering process
It holds chip to consolidate, improves the sintering finished rate of chip, obtain high infiltration laser.
The above is only the preferred embodiment of the utility model only, is not intended to limit the utility model, all at this
All any modification, equivalent and improvement made within the spirit and principle of utility model etc., should be included in the utility model
Protection domain within.
Claims (10)
1. semiconductor laser single-chip sintering equipment, it is characterised in that：Including pedestal and fixture, the pedestal and fixture are removable
Unload connection；The pedestal is including for the fixation kit that the fixture is fixed on the pedestal and for limiting the fixture
The limiting link block of position.
2. semiconductor laser single-chip sintering equipment as described in claim 1, it is characterised in that：The pedestal is by two tools
Bevelled trapezoidal support base is combined into, the orthogonal connection in inclined-plane of described two support bases, the inclined-plane of the support base with
Horizontal plane angle is 30 ° -60 °.
3. semiconductor laser single-chip sintering equipment as described in claim 1, it is characterised in that：The pedestal upper surface by
Two mutually perpendicular inclined-planes compositions, described two scarf grooves at a right angle, the inclined-plane angle with horizontal plane for 30 °-
60°。
4. semiconductor laser single-chip sintering equipment as claimed in claim 2 or claim 3, it is characterised in that：The fixation kit
It is set on the inclined-plane；The limiting link block is set to the centre on the inclined-plane and is fitted closely with two inclined-planes.
5. semiconductor laser single-chip sintering equipment as claimed in claim 4, it is characterised in that：The fixation kit is at least
For one and be set to it is described limiting link block side.
6. semiconductor laser single-chip sintering equipment as claimed in claim 4, it is characterised in that：The fixation kit includes
Fixed block and trip bolt；The trip bolt cooperation limiting link block is used to fix the fixture.
7. semiconductor laser single-chip sintering equipment as described in claim 1, it is characterised in that：The fixture includes support
Frame, pedestal, the bottom of support frame as described above connect the pedestal, and the part that the pedestal is not connect with support frame as described above is places
Platform, the mounting table are equipped with for fixed chip in the vertical direction above the mounting table for chip placement and heat sink
It presses tongue and the chip fixed plate of fixed chip, the chip is placed on heat sink in the horizontal direction, also set on the mounting table
It is useful for fixed heat sink heat sink fixed plate.
8. semiconductor laser single-chip sintering equipment as claimed in claim 7, it is characterised in that：It is connected on support frame as described above
There is a guide pad, the pressure tongue is strip structure, and the pressure tongue penetrates the guide pad and position in the vertical direction is adjustable,
The pressure tongue is controlled by the driving mechanism above supporting rack.
9. semiconductor laser single-chip sintering equipment as claimed in claim 8, it is characterised in that：The driving mechanism includes
One end is fixed, the hanging shrapnel of the other end, and the upper end of tongue, the driving mechanism are pressed described in the free end contacts-side-down of the shrapnel
Further include the housing screw for the shrapnel free end to be pushed to move up and down.
10. semiconductor laser single-chip sintering equipment as claimed in claim 9, it is characterised in that：The chip fixed plate
It is adjustable with the position of heat sink fixed plate in the horizontal direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721507836.6U CN207572716U (en) | 2017-11-13 | 2017-11-13 | Semiconductor laser single-chip sintering equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721507836.6U CN207572716U (en) | 2017-11-13 | 2017-11-13 | Semiconductor laser single-chip sintering equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207572716U true CN207572716U (en) | 2018-07-03 |
Family
ID=62694351
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721507836.6U Active CN207572716U (en) | 2017-11-13 | 2017-11-13 | Semiconductor laser single-chip sintering equipment |
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| Country | Link |
|---|---|
| CN (1) | CN207572716U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108962813A (en) * | 2018-09-06 | 2018-12-07 | 重庆科技学院 | A kind of adjustable chip fixture |
-
2017
- 2017-11-13 CN CN201721507836.6U patent/CN207572716U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108962813A (en) * | 2018-09-06 | 2018-12-07 | 重庆科技学院 | A kind of adjustable chip fixture |
| CN108962813B (en) * | 2018-09-06 | 2023-07-18 | 重庆科技学院 | Adjustable chip clamp |
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| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20221026 Address after: 050200 No. 13, Xintai Street, Luquan District, Shijiazhuang, Hebei Patentee after: Hebei Jiewei Technology Co.,Ltd. Address before: 050000 No. 113, Hezuo Road, Shijiazhuang City, Hebei Province Patentee before: SHIJIAZHUANG MAITEDA ELECTRONIC TECHNOLOGY Co.,Ltd. |
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| TR01 | Transfer of patent right |