CN207560595U - The three-dimensional compound average-temperature structure of lightweight - Google Patents

Abstract

A kind of three-dimensional compound average-temperature structure of lightweight, including：One three-dimensional compound uniform-temperature radiator, it is with compound body of putting more energy into, it is shaped to the thin type sheet body of a preliminary dimension or the D structure of predetermined shape, and carbons fiber or macromolecular fibre of the length for 10nm~10mm are combined as reinforcing structure, being solidified into a surface with folded structure has three-dimensional heat-dissipating structure, and solid compound uniform-temperature radiator of the proportion equal to or less than 2.0.Whereby, the molding compound uniform-temperature radiator of solid of structure is folded with powder die casting, more current metal heat spreader has relatively low weight, temperature uniforming heat radiation effect is preferable, it can be applied on any type of radiating electronic product, and three-dimensional compound uniform-temperature radiator, can corresponding mold be issued according to the stereochemical structure of product, can link and have the function of temperature uniforming heat radiation with heat source or chip.

Description

The three-dimensional compound average-temperature structure of lightweight

Technical field

The utility model is a kind of compound samming material structure of related solid, and espespecially a kind of light-weighted compound samming of solid dissipates Hot device.

Background technology

It eliminates and changes with the continuous upgrading of electronic product, it is highly integrated and high performance electronics growing, at me Daily life used in, with mobile phone, notebook computer or various 3C electronic products for representative, because of working group Part volume size is less and less, and the speed and efficiency of work are higher and higher, and unit volume calorific value is increasing.

Since thermal diffusion can quickly be reached the function of heat dissipation by metal material, in the prior art, the production of 3C electronics Product are by the thermal energy from electronic component mostly, via the good metal of the heat transfer such as copper or aluminium, are transmitted to heat exchange pattern outer It radiates in portion.Metal heat sink 110 shown in Figure 1A as made by a kind of existing aluminium or copper, transverse base 112 are equipped with number A longitudinal radiating fin 114.But it looks into, the density of metal material is higher, wherein the proportion (Specific Gravity) of copper About 8.9, the ratio of aluminium weighs about 2.7.If the radiator of lighter in weight need to be fabricated to, need to more fins be fabricated to complicated technique Formula causes processing cost higher.Moreover the longitudinal direction height (h) of metal heat sink 110 can be increased by being fabricated to radiating fin 114, this For the light and thin types 3C electronic products such as mobile phone and do not apply to.Therefore also have in recent years using graphite flake (Graphite Sheet) Replace metallic plate, but its procedure of processing is complicated, high processing costs, therefore less it is applied to 3C Product.

It is that all U.S. the 6,758,263rd of Advanced Energy Technology Inc. is special shown in Figure 1B Profit discloses a kind of patent by the use of graphite as heat sink material, is in a flat-shaped graphite base (base plate) 134 Bottom surface be equipped with a hole 138, and a metallic copper 132 is set in the hole 138, and have on the pedestal 134 several parallel to each other Radiating fin (Fins) 136.But it looks into, radiator construction 130, though can pass through graphite replaces metal as pedestal, and subtracts The weight of light radiating seat, though because graphite has high thermal conductivity, its directional (Anisotropic), although that is, graphite Plane of structure direction (X-Y directions) heat conductivity it is good, but its heat transfer of longitudinal direction (Z-direction) for intersecting vertically with plane of structure direction Rate is low, so that can not obtain sufficient heat dissipation effect sometimes.So when pedestal 134 absorbs the heat conducted of metallic copper 132 When, which is parallel to heat source direction and has high thermal conductivity because only having, but the channel for having no high heat conduction conduct heat to it is scattered Hot fin 136 so simultaneously can not outwardly spread heat rapidly by means of radiating fin 136, and causes heat that can rest on pedestal 134； Moreover the longitudinal direction height (h) of radiating fin 136 takes up space, and is not also suitable for the light and thin types 3C electronic products such as mobile phone.

In addition, graphite flake cooling fin also has a problem that, that is, graphite belongs to the construction of stratiform, thus while each layer Plane of structure direction molecule, through it is shared with reference to and be bound tightly together, still, with plane of structure direction it is perpendicular intersect it is vertical Direction (Z-direction), then because intermolecular is the combination by Fan get Wa Li (Van der waals ' force), therefore is easily generated The problem of splitting.

Therefore how using metal and graphite material high-termal conductivity feature, be integrally formed in a manner of molding lightweight and The radiator of low processing cost, the major subjects for the present invention.

Utility model content

Technical problem underlying to be solved in the utility model is, overcomes drawbacks described above of the existing technology, and carries For a kind of three-dimensional compound average-temperature structure of lightweight, the metal fever discrete piece that the compound uniform-temperature radiator of the solid can be more current has relatively low Weight, temperature uniforming heat radiation effect is preferable, can be applied to server, machine on table, notebook, tablet computer, set-top box, mobile phone, row Vehicle logger, unmanned empty bat machine, Netcom's product or any type of radiating electronic product；The compound uniform-temperature radiator of the solid, can Corresponding mold is issued according to the stereochemical structure of product, can directly utilize thermal interface material (Thermal Interface Material., TIM) have the function of temperature uniforming heat radiation with chip series winding or without addition thermal interface material.

Technical solution is used by the utility model solves its technical problem：

A kind of three-dimensional compound average-temperature structure of lightweight, including：One three-dimensional compound uniform-temperature radiator, is with compound of putting more energy into Body is shaped to the thin type sheet body of a preliminary dimension or the D structure of predetermined shape；This, which is put more energy into, compound body and is combined with The carbons fiber or macromolecular fibre that length is 10nm~10mm put more energy into compound body warp once as reinforcing structure, and with this Above pressurization makes its folded structure be solidified into a surface with fin-like or wavy three-dimensional heat-dissipating structure, and proportion is equal to or low In the 2.0 compound uniform-temperature radiator of solid.

Feature is taken off in foundation, the compound uniform-temperature radiator of the solid is additionally provided with the high-thermal conductive metal that thermal conductivity values are more than 90W/mK Kernel structure is mixed with the compound body of putting more energy into and is formed.

Feature is taken off in foundation, the compound uniform-temperature radiator of the solid is also formed on its surface layer protecting film.

Feature is taken off in foundation, the compound uniform-temperature radiator of the solid is additionally provided with a protection framework, which has on one Frame and a ring frame that can be fastened on framework bottom inner edge on this, to all around giving the compound uniform-temperature radiator of the solid Cladding.

By technical characteristic is above taken off, the utility model folds composition type with compound body die casting of putting more energy into, and not only has enough Intensity and proportion be equal to or less than 2.0, compared to the proportion 8.9 of copper in metal fever discrete piece, the proportion 2.7 of aluminium has lighter Weight can be applied on any type of radiating electronic product, and graphite material or layered inorganic material in composite material of putting more energy into, put down The thermal energy that heat source generates along the in-plane can be conducted and reach pole by the high thermal conductivity in face direction (X-axis-Y-axis plane) Good heat dissipation and even temperature effect, and add in high-thermal conductive metal particle and mixed with compound body of putting more energy into, more improve thickness direction The heat conduction of (Z-direction), furthermore, the molding compound uniform-temperature radiator of solid of structure is folded in die casting, and there is modularization simultaneously can quickly produce The effect of.

The beneficial effects of the utility model are that the metal fever discrete piece that the compound uniform-temperature radiator of the solid can be more current has relatively low Weight, temperature uniforming heat radiation effect is preferable, can be applied to server, machine on table, notebook, tablet computer, set-top box, mobile phone, Drive recorder, unmanned empty bat machine, Netcom's product or any type of radiating electronic product；The compound uniform-temperature radiator of the solid, Can corresponding mold be issued according to the stereochemical structure of product, can directly utilize thermal interface material (Thermal Interface Material., TIM) have the function of temperature uniforming heat radiation with chip series winding or without addition thermal interface material.

Description of the drawings

The utility model is further illustrated with reference to the accompanying drawings and examples.

Figure 1A is the structure diagram of existing metal heat sink.

Figure 1B is the radiator schematic diagram of existing the 6th, 758, No. 263 patent in the U.S..

Fig. 2 is the stereoscopic figure of the three-dimensional compound uniform-temperature radiator of the utility model.

Fig. 3 is the sectional view of the three-dimensional compound uniform-temperature radiator of the utility model.

Fig. 3 A are the enlarged cross-sectional views of 3A meanings in Fig. 3.

Fig. 4 is the exploded perspective view of the utility model combination outline border.

Fig. 5 is the combination stereogram of the utility model combination outline border.

Fig. 6 is the sectional view of the utility model combination outline border.

Fig. 7 A to Fig. 7 F are the die casting schematic diagrames of the three-dimensional compound average-temperature structure of the utility model.

Fig. 8 is the die casting schematic diagram of another three-dimensional compound average-temperature structure of the utility model.

Fig. 9 is the sensing points position for showing the three-dimensional compound uniform-temperature radiator actual test example of the utility model.

Figure label explanation：

10th, the three-dimensional compound uniform-temperature radiators of 10A

101 bottom surfaces

102 surfaces

103 protective films

11 inorganic filler powders

12 macromolecule sizing materials

13 carbons fibers

14 put more energy into compound body

15 high-thermal conductive metal particles

16 protection frameworks

Frame on 161

162 ring frames

20 add powder equipment

30 die castings

40 molds

41 upper mold seats

411 upper mould caves

412 feeding channels

42 upper cores

421 concaveconvex structures

50 times molds

51 die holders

511 times die cavitys

52 times modes

53 mandrils

H heat sources

1,2,3,4 sensing points 1,2,3,4 of SENSOR

Specific embodiment

First, it please refers to shown in Fig. 2 to Fig. 8, the preferred embodiment of the utility model one includes：One three-dimensional compound samming dissipates Hot device 10 is the D structure of thin type sheet body or predetermined shape that a preliminary dimension is shaped to compound body 14 of putting more energy into； This, which is put more energy into, compound body 14 and is combined with the carbons fiber 13 that length is 10nm~10um and is consolidated as reinforcing structure, and with folded structure Being melted into a surface has three-dimensional heat-dissipating structure, and solid compound uniform-temperature radiator 10 of the proportion less than 2.0.

In the present embodiment, the compound uniform-temperature radiator 10 of the solid is additionally provided with the high-thermal conductive metal that thermal conductivity values are more than 90W/mK Kernel structure 15 is mixed with the compound body 14 of putting more energy into.

In the present embodiment, the compound uniform-temperature radiator 10 of the solid is also formed on its surface layer protecting film 103.

In the present embodiment, the compound uniform-temperature radiator of the solid is additionally provided with a protection framework 16, which has one Upper frame 161 and one can be fastened on a ring frame 162 of 161 bottom inner edge of frame on this, to by the compound uniform-temperature radiator of the solid 10 are all around coated；The protection framework 16 can be made of metal frame.Furthermore its frame can be also enveloped with metal foil Or all, it is fallen so that it is protected to resist to fall.

In the present embodiment, which is with inorganic filler powder 11, adds in macromolecule sizing material 12 Even mixing, to carry out granulation processing, which includes being selected from：Graphite, graphene, Carbon materials or high heat conduction without Machine material, such as the graphite (such as native graphite, electrographite etc.) of any form, graphene (such as graphite oxide of any form Alkene, reduced graphene), carbon nanotubes, carbon 60, bamboo carbon, the carbon black of any form, any class shape carbons fiber (carbon fiber, Graphite fibre, graphene fiber etc.), (such as polyester fiber, resistance to dragon fiber, tow dimension, polyacrylonitrile of Ke Fu are fine for macromolecular fibre Dimension).The inorganic material of high heat conduction include stratiform that silica, boron nitride, aluminium nitride, silicon carbide, diamond or mica etc. formed without Machine material.

Although foregoing graphites and Carbon materials have high thermal conductivity, for the good material of heat dissipation, such material is in itself Structural strength is insufficient, for this purpose, adding in the carbons fiber or macromolecule that length is 10nm~10mm in the inorganic filler powder 11 Fiber 13, as the material of putting more energy into of the inorganic filler powder 11, and after granulation is handled formation length 300um~3.5mm plus Strength compound body 14.That is, the carbons fiber polymer fiber 13 in compound body 14 of putting more energy into, just like the steel in cement Muscle is the same, has effects that promote structural strength.

In the present embodiment, it is granulated processing mode and includes dissolving inorganic filler powder 11 macromolecule sizing material 12 again with solvent Proportioning add in it is dry form or by macromolecule sizing material 12 and inorganic filler powder 11, via composite heating mode (plastics make material) Two kinds of modes, to obtain desired composite wood granule 14 of putting more energy into.The weight of the inorganic filler powder 11 and the macromolecule sizing material 12 It is 80~95%: 5~20% to measure percentage.The weight percent of one preferred embodiment is 85%: 15%.

The aforementioned macromolecule sizing material includes thermoplastic shape or thermosetting shape two kinds such as pitch (Asphalt), polyvinyl alcohol resin (PolyVinylAlcohol., PVA), polyvinyl acetate alcohol resin (PolyVinylAcetate., PVAc), polyimides tree Fat (Polyimide resin., PI), polyurethane (PolyUrethane., PU), polyethylene glycol (Poly Ethylene Glycol., PEG), polyethylene (PolyEthylene., PE), polyvinyl chloride (PolyVinylChloride., PVC), phenolic aldehyde tree Fat (Phenolic Resin), epoxy resin (Epoxy), polymethyl methacrylate (PolyMethylMethAcrylate., PMMA) or any solubilized or fusing high molecular material, macromolecule sizing material can be water-soluble or solvent type.

As shown in Figure 7 B, one adds powder equipment 20, and aforementioned compound body 14 of putting more energy into is placed in this plus powder equipment 20；It should add Powder equipment 20 is sending the compound body 14 of putting more energy into a die casting 30, the die casting 30, including a mold 40 and once mold 50, after which is sent in the die casting 30, with the upper and lower mold 40,50 When pressurizeing the compound body 14 of putting more energy into, wherein N >=1 through n times, and applying pressure first via secondary again after primary pressure plus Pressure, and the die pressing types at least 3 seconds or more such as keep, its folded structure is made to be cured as solid compound samming of the surface with D structure and is dissipated Hot device 10；In the present embodiment, should plus powder equipment 20 with single batch or continous way addition powder in the die casting 30, the powder Die casting 30, then with 30MPa to the pressure between 300MPa, mold 40 is applied to, via primary pressure or secondary pressurized And the die pressing types at least 3 seconds or more, then give stripping forming such as holding.

The compound uniform-temperature radiator 10 of solid through die cast, proportion are equal to or less than 2.0, have solid to form one Construction and the compound uniform-temperature radiator 10 of light-weighted solid, as shown in Figure 2.

Fig. 3 is the sectional view of the utility model, and Fig. 3 A are main construction enlarged diagrams, and the solid that structure is folded through die casting is compound Uniform-temperature radiator 10, thickness (Z-direction) can reach more than 0.5mm, and the bottom surface 101 of the compound uniform-temperature radiator 10 of the solid can For plane, to radiate on the heat sources such as chip to be fitted in, certain bottom surface 101 can also coordinate heat source shape, be set as on-plane surface, Fin-like or wavelike structure can be set as surface 102, helps three-dimensional compound uniform-temperature radiator 10 in thickness direction (Z axis side To) heat dissipation.Combination it is worth noting that, this is put more energy between compound body 14, not conventional graphite piece is with Fan get Wa Power (van der waals ' force) is combined, but the prepared molding of compound body 14 of putting more energy into die casting, and because Carbons fiber 13 is mixed in the compound body 14 of putting more energy into, so material bond strength is good, no conventional graphite piece is also easy to produce The problem of splitting.In short, the utility model overcomes the missing that splitting is also easy to produce with conventional graphite piece, but protect There is the advantages of graphite and Carbon materials face direction (X-Y axial planes) high heat conduction characteristic, in addition being using die cast, so Z axis Direction can be by opening up mold, you can fin-like or wavy is shaped to, and conventional graphite piece can not be shaped to fin-like or wave Wave-like, though and metal heat sink can be equipped with fin, processing is cumbersome, and takes up space.In addition, three-dimensional compound uniform-temperature radiator 10 because Containing graphite and Carbon materials, therefore powdery is presented in surface, although not influencing its temperature uniforming heat radiation function, to avoid the occurrence of Powder, in the present embodiment, the compound uniform-temperature radiator 10 of the solid of die cast may also include with dip-coating (Dipping), packet is penetrated (Mold) or the macromolecule sizing material is dispersed in its surface by spraying (Spray) mode, forms layer protecting film 103.Whereby Picking, fracture can be avoided the occurrence of, appearance is influenced and occurred using phenomenon, improve three-dimensional compound uniform-temperature radiator 10 stability and Reliability.

In the present embodiment, the compound uniform-temperature radiator 10 of the solid include for a preliminary dimension thin type sheet body or according to The molding D structure of predetermined electronic radiation shape of product institute.Although the it is noted that compound uniform-temperature radiator 10 of the solid It is not made of metal, but has passed through the falling test of more than 120cm, have really for industry applications.

Further, as shown in Figure 4, Figure 5, a protection framework 16 is additionally provided with around the thin type sheet body, the protection framework 16 have the ring frame 162 that frame 161 and one on one can be fastened on 161 bottom inner edge of frame on this, to the solid is compound Temperature radiator 10 is all around coated.Thus, compound its overall structure of uniform-temperature radiator 10 of the solid is more solid It is firm.

As shown in Figure 3A, in a preferred embodiment, the utility model further includes a high-thermal conductive metal particle 15, be with Thermal conductivity values are more than the high-thermal conductive metal powder of 90W/MK, which is mixed with the compound body 14 of putting more energy into Merging should add powder equipment 20.In the present embodiment, the high-thermal conductive metal particle 15 include selected from gold, silver, copper, iron, aluminium, titanium or with Particle alloy more than both upper or the two.The weight percent of the high-thermal conductive metal particle 15 and the compound body 14 of putting more energy into It is 10%~25%: 75~90%, the compound uniform-temperature radiator 10 of the solid is improved in thickness by high-thermal conductive metal particle 15 The heat conduction in direction (Z axis height), the two complement each other, and achieve the purpose that quickly diffusion, Homogeneouslly-radiating.

The die casting 30, including being realized with vertical type die casting or swinging die casting, following embodiment will be with straight Vertical die casting mode illustrates that as shown in Fig. 7 A to Fig. 7 F, which is corresponding one possible embodiments and forming process The top of the lower mold 50 is pressed together on, which includes the lower mode that a die holder 51, one is mounted in the die holder 51 52 and one can be in the mandril 53 of lower 52 intrinsic displacement of mode, and the die holder 51 has die cavity 511；The upper mold 40 includes One upper mold seat 41 and one can be in the upper cores 42 of 41 intrinsic displacement of upper mold seat；The upper mold seat 41 have one from its bottom surface center toward Upper 411 and two symmetrical connection of upper mould cave for extending and corresponding to aforementioned lower die cavity 511 is at 411 intermediate altitude of upper mould cave And toward the feeding channel 412 that extends through on tiltedly, wherein the upper cores 42 can upper and lower displacement be accommodated in the upper mould cave 411, and Its bottom surface is equipped with concaveconvex structure 421 according to the compound scheduled three-dimensional shape in 10 surface of uniform-temperature radiator of the solid.

Fig. 7 A show the state that the upper and lower mold 40,50 is opened.Fig. 7 B show that upper mold seat 41 is pressed together on die holder 51 pushes up Face, and using this add powder equipment 20 to insert the compound body 14 of putting more energy into, in the present embodiment, show the compound body of putting more energy into 14 are inserted by the feeding channel 412 of upper mold seat 41, but not limited to this, such as in swinging press casting procedure, compound make of putting more energy into Plastochondria 14 can be inserted directly in lower die cavity 511, and without being inserted by the feeding channel 412 of upper mold seat 41, herein and with explanation. Fig. 7 C show that the upper cores 42 move down, and are laminated by upper and lower mode 42,52, make the compound of putting more energy into lower die cavity 511 Body 14 is compacted, as previously mentioned, the upper mold seat 41 such as keeps at the die pressing types at least 10 seconds or more.Fig. 7 D show 41 liters of the upper mold seat It rises, feeding channel 412 inserts compound body 14 of putting more energy into again.Under Fig. 7 E show upper mold seat 41 and upper cores 42 again It moves, the compound body 14 of putting more energy into for making to insert later folds structure and puts more energy into previous the top of compound body 14, compound make of putting more energy into Plastochondria 14 pressurizes folded structure to the scheduled thickness of institute through n times, becomes solid compound samming of the surface with D structure and dissipates Hot device 10；Wherein N >=1, that is, if three-dimensional compound uniform-temperature radiator 10 thickness (Z-direction) in 4.0mm hereinafter, can add Laminated structure 1 time or 1 time or more.Last Fig. 7 F show that the upper mold seat 41 rises, and the mandril 53 of lower mode 52 will be three-dimensional compound Uniform-temperature radiator 10 jacks out lower die cavity 511, completes demoulding program.

Since the physical property of the compound body 14 of putting more energy into is different from metal, itself there is elasticity, therefore the upper mold , can be first via secondary pressurized again after the primary pressure several seconds when benevolence 42 applies pressure, and the die pressing types such as must keep at least 3 seconds or more, Give stripping forming again.Otherwise after upper cores 42 1 move up, which can expand, and it is multiple that this can not be made to put more energy into It closes granule 14 to be compacted become the compound uniform-temperature radiator 10 of solid solid, therefore keeps the die pressing types that wait of a period of time, just originally It is necessary technological means for invention.

It please refers to shown in Fig. 8, the utility model can issue corresponding mold according to the physique structure of heat dissipation product, i.e., The concaveconvex structure 421 of the upper cores 42 is set as according to the shape of product body structure, and then one predetermined shape of die cast Three-dimensional compound uniform-temperature radiator 10A, appearance do not repeat.

Based on above taking off technological means, the three-dimensional compound uniform-temperature radiator 10 of the utility model or 10A etc., gold that can be more current Belonging to hot discrete piece has relatively low weight and volume, and temperature uniforming heat radiation effect is preferable, can be applied to server, machine on table, notebook, tablet Computer, set-top box, mobile phone or any type of radiating electronic product.

《Actual test example》

Following table is the heat dissipation characteristics actual test example of the utility model, and test method is selected a piece of without addition high heat conduction The compound uniform-temperature radiator 10 of solid of metallic particles 15 and a piece of compound samming of solid for having addition high-thermal conductive metal particle 15 dissipate Hot device 10, length and width dimensions are to grow (58mm) x wide (29mm) x thick (2.4mm) as base material, with traditional aluminum and copper wave Radiating block is made comparisons, and size is identical, and Fig. 9 shows the sensing points position of the three-dimensional compound uniform-temperature radiator 10 of the utility model；Its Middle sensing points 1 (Sensor1) are on heat source (H), and sensing points 2 (Sensor2) are positioned at three-dimensional compound 10 surface of uniform-temperature radiator Relative to the top of sensing points 1 (Sensor1), and sensing points 3,4 (Sensor3,4) distinguish distance perspective measuring point 2 (Sensor2) For 14.5mm and 29mm, the sensing points of traditional aluminum and copper wave radiating block are also identical, and test data is as follows：

It is shown by the test data of upper table, the compound uniform-temperature radiator 10 of solid of the utility model, compared to traditional aluminum Wave radiating block, heat source temperature (sensing points 1) and surface temperature (sensing points 2) reduce by 16.1 DEG C respectively and (are down to by 64.4 DEG C 48.5 DEG C) and 8.9 DEG C (being down to 31.5 DEG C by 40.4 DEG C), and add metallic particles the compound uniform-temperature radiator of solid its for Heat source has the cooling-down effect (being down to 48.1 DEG C by 64.4 DEG C) of bonus point, but its surface temperature is slightly higher, represents its heat and effectively takes out of；Extremely In corresponding cooling trend is also presented in sensing points 3 and 4.

Therefore the compound uniform-temperature radiator 10 of solid of the utility model, is to fold to be formed with 14 die casting of compound body of putting more energy into Type is not only equal to or less than 2.0 with enough intensity and proportion, is dissipated in block compared to metal fever, the proportion 8.9 of copper, aluminium Proportion 2.7, the compound uniform-temperature radiator 10 of solid of the utility model have lighter weight, can be applied to any type of heat dissipation electricity On sub- product, and graphite material or layered inorganic material in compound body 14 of putting more energy into, the height with in-plane (X-Y axial planes) The thermal energy that electronic product heat source generates along the in-plane (X-Y axial planes) can be conducted and reach splendid by heat conductivility Even temperature effect.Further, it adds in high-thermal conductive metal particle 15 to mix with compound body 14 of putting more energy into, it is compound to improve the solid Temperature radiator 10 complements each other in the heat conduction of thickness direction (Z axis height), the two, achievees the purpose that quickly diffusion, Homogeneouslly-radiating, On the basis of rapid cooling is ensured, the performance of electronic product is improved；Furthermore die casting is folded the molding compound samming of solid of structure and is dissipated Hot device 10 has effects that modularization simultaneously can be produced quickly.

The above descriptions are merely preferred embodiments of the present invention, and not the utility model is made in any form Limitation, it is every according to the technical essence of the utility model to above example made it is any it is simple modification, equivalent variations with Modification, in the range of still falling within technical solutions of the utility model.

In conclusion the utility model in structure design, using on practicability and cost-effectiveness, comply fully with industry development It is required, and revealed structure is also to have unprecedented innovative structure, has novelty, creativeness, practicability, meeting has The regulation of utility model patent important document is closed, therefore lifts application in accordance with the law.

Claims (4)

1. a kind of three-dimensional compound average-temperature structure of lightweight, which is characterized in that including：

One three-dimensional compound uniform-temperature radiator with compound body of putting more energy into, is shaped to the thin type sheet body or predetermined of a preliminary dimension The D structure of shape；And

This, which is put more energy into, compound body and is combined with carbons fiber that length is 10nm~10mm or macromolecular fibre as putting more energy into knot Structure, and its folded structure is made to be solidified into a surface with fin-like or wavy through primary above pressurization with the compound body of putting more energy into Three-dimensional heat-dissipating structure, and solid compound uniform-temperature radiator of the proportion equal to or less than 2.0.

2. the three-dimensional compound average-temperature structure of lightweight according to claim 1, which is characterized in that the compound samming of solid dissipates Hot device is additionally provided with the high-thermal conductive metal grain structure that thermal conductivity values are more than 90W/MK, mixes and is formed with the compound body of putting more energy into.

3. the three-dimensional compound average-temperature structure of lightweight according to claim 1, which is characterized in that the compound samming of solid dissipates Hot device is also formed on its surface layer protecting film.

4. the three-dimensional compound average-temperature structure of lightweight according to claim 3, which is characterized in that the compound samming of solid dissipates Hot device is additionally provided with a protection framework, which has frame on one and one can be fastened on a ring of framework bottom inner edge on this Frame, to all around being coated the compound uniform-temperature radiator of the solid.