CN207553335U - A kind of nano-porous ceramic thermal insulation thermal insulation board - Google Patents
A kind of nano-porous ceramic thermal insulation thermal insulation board Download PDFInfo
- Publication number
- CN207553335U CN207553335U CN201721723464.0U CN201721723464U CN207553335U CN 207553335 U CN207553335 U CN 207553335U CN 201721723464 U CN201721723464 U CN 201721723464U CN 207553335 U CN207553335 U CN 207553335U
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- China
- Prior art keywords
- mainboard
- subplate
- thermal insulation
- gauge
- card slot
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The utility model discloses a kind of nano-porous ceramic thermal insulation thermal insulation boards, including mainboard, frame, subplate and insulating layer, mainboard side outer wall is uniformly provided with hole, the mainboard is fixedly welded with mainboard end snap-gauge respectively far from hole side face two sides, the mainboard is located at mainboard end snap-gauge side face center and is fixedly welded with card slot in the middle part of mainboard, and card slot is arranged in parallel with mainboard end snap-gauge in the middle part of the mainboard；Subplate side outer wall is uniformly provided with hole, the subplate is fixedly welded with subplate end snap-gauge far from hole side face one end, the utility model using card slot, subplate end snap-gauge, subplate end card slot in the middle part of mainboard end snap-gauge, mainboard between mainboard and subplate by will carry out clamping installation, it so that can be by combining installation between mainboard and subplate, the size needed, it is produced in batches convenient for manufacturer, and convenience in transport.
Description
Technical field
The utility model is related to engineering building materials technology field, specially a kind of nano-porous ceramic thermal insulation thermal insulation board.
Background technology
Porous ceramic film material is using quality raw materials such as emergy, silicon carbide, cordierites as major ingredient, through overmolding and special height
Warm sintering process prepare it is a kind of with open pore size, a kind of porous ceramic materials of high apparent porosity, with high temperature resistant,
High pressure, antiacid, alkali and organic media corrosion, good biologically inert, controllable pore structure and high open porosity use the longevity
The advantages that life is long, product regenerability is good, can be adapted for the secondary filters of various media with detaching, high pressure gas is vented and disappears
Sound, gas distribution and electrolyte membrane etc..
Thermal insulation board is said easy-to-understand exactly to the plank of building heat preservation.Thermal insulation board is using polystyrene resin as raw material
In addition other supplementary materials and poly- inclusion, by heating mixing injecting catalyst simultaneously, then extrusion molding extrusion molding and manufacture
Rigid foam plate has moisture-proof, water resistance, can make reduction building envelope thickness, make so as to increase interior
Use area.
But traditional thermal insulation thermal insulation board is in use there are some drawbacks, such as：
1st, general, thermal insulation thermal insulation board only uses when having insulation to need building, such as some factories, due to needing
Keep indoor temperature that could be produced, it is therefore desirable to thermal insulation thermal insulation board, but traditional thermal insulation thermal insulation board is merely able to carry out
Function of heat insulation, it is impossible to noise huge in factory weaken the effect of barrier.
2nd, traditional nano-porous ceramic thermal insulation thermal insulation board needs whole manufacture mostly when in use, but due to whole system
It is too big to make volume, it is not readily transportable, and the size of plank is required for being customized, therefore manufactures also cumbersome.
Utility model content
The purpose of this utility model is to provide a kind of nano-porous ceramic thermal insulation thermal insulation board, to solve above-mentioned background technology
The problem of middle proposition.
To achieve the above object, the utility model provides following technical solution：A kind of nano-porous ceramic thermal insulation thermal insulation board,
Including mainboard, frame, subplate and insulating layer, mainboard side outer wall is uniformly provided with hole, and the mainboard is far from hole institute
It is fixedly welded with mainboard end snap-gauge respectively in one side two sides, the mainboard is located in the snap-gauge side face of mainboard end
The heart is fixedly welded with card slot in the middle part of mainboard, and card slot is arranged in parallel with mainboard end snap-gauge in the middle part of the mainboard；The subplate side
Outer wall is uniformly provided with hole, and the subplate is fixedly welded with subplate end snap-gauge far from hole side face one end, described
Another side that subplate is located at subplate end snap-gauge side face is fixedly welded with subplate end card slot, subplate end card
Plate is arranged in parallel with subplate end card slot；Mainboard end snap-gauge is fixed with subplate end card slot and is clamped, the subplate end
Snap-gauge is fixed with card slot in the middle part of mainboard and is clamped, and is filled between the mainboard and subplate and uniformly and is protected between mainboard and mainboard
Warm layer.
Further, described hole opens up half of the depth dimensions for mainboard or subplate thickness.
Further, fixation is connected with frame to the mainboard jointly with subplate edge.
Further, one side surface area of subplate is the half of main one side surface area of plate.
Further, the mainboard is manufactured with subplate using porous ceramics.
Compared with prior art, the beneficial effects of the utility model are：
1st, by opening up hole in mainboard and subplate outer wall so that the utility model can rely on mainboard when in use
Reflection-absorption is carried out to sound wave with the hole on subplate, can absorption decrease effectively be carried out to sound wave.
2nd, by the way that mainboard end snap-gauge, mainboard middle part card slot, subplate end snap-gauge, subplate will be utilized between mainboard and subplate
End card slot carries out clamping installation so that can be by combining installation, the size needed, convenient for factory between mainboard and subplate
Quotient produces in batches, and convenience in transport.
Description of the drawings
Fig. 1 combines main structure diagram for the utility model；
Fig. 2 combines schematic cross-sectional view for the utility model；
Fig. 3 is the utility model mainboard main structure diagram；
Fig. 4 is the utility model mainboard overlooking the structure diagram；
Fig. 5 is the utility model subplate main structure diagram；
Fig. 6 is the utility model subplate overlooking the structure diagram.
In Fig. 1-6：1- holes；2- mainboards；3- frames；4- subplates；Card slot in the middle part of 5- mainboards；6- subplates end card slot；7-
Subplate end snap-gauge；8- insulating layers；9- mainboards end snap-gauge.
Specific embodiment
The following is a combination of the drawings in the embodiments of the present utility model, and the technical scheme in the embodiment of the utility model is carried out
It clearly and completely describes, it is clear that the described embodiments are only a part of the embodiments of the utility model rather than whole
Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are without making creative work
All other embodiments obtained shall fall within the protection scope of the present invention.
- 6 are please referred to Fig.1, the utility model provides a kind of technical solution：A kind of nano-porous ceramic thermal insulation thermal insulation board, packet
Mainboard 2, frame 3, subplate 4 and insulating layer 8 are included, the 2 side outer wall of mainboard is uniformly provided with hole 1, and the mainboard 2 is far from hole
1 side face two sides of hole are fixedly welded with mainboard end snap-gauge 9 respectively, and the mainboard 2 is located at where mainboard end snap-gauge 9
One side center is fixedly welded with card slot 5 in the middle part of mainboard, and card slot 5 is arranged in parallel with mainboard end snap-gauge 9 in the middle part of the mainboard；Institute
It states 4 side outer wall of subplate and is uniformly provided with hole 1, the subplate 4 is fixedly welded with subplate far from 1 side face one end of hole
End snap-gauge 7, another side that the subplate 4 is located at 7 side face of subplate end snap-gauge are fixedly welded with subplate end card
Slot 6, subplate end snap-gauge 7 are arranged in parallel with subplate end card slot 6；Mainboard end snap-gauge 9 and subplate end card slot 6
Fixed clamping, subplate end snap-gauge 7 is fixed with card slot 5 in the middle part of mainboard and is clamped, between the mainboard 2 and subplate 4, Yi Jizhu
Insulating layer 8 is uniformly filled between plate 2 and mainboard 2.
The half that depth dimensions are 4 thickness of mainboard 2 or subplate is opened up by described hole 1, convenient for right using hole 1
The reflection-absorption of sound wave enables the utility model to have the function that weaken noise, is total to by the mainboard 2 and 4 edge of subplate
Frame 3 is connected with fixation, convenient for mainboard 2 and subplate 4 are fixed, avoids occurring to slide relatively between mainboard 2 and subplate 4
It is dynamic, by the half that 4 one side surface area of subplate is main 2 one side surface area of plate, the splicing of mainboard 2 is carried out convenient for subplate 4
Ending, makes the plank spliced have more globality, is manufactured by the mainboard 2 and subplate 4 using porous ceramics so that this
Utility model heat insulation effect is more preferably.
Operation principle：In use, by card slot 5, pair in the middle part of mainboard end snap-gauge 9, mainboard is passed through between mainboard 2 and subplate 4
Plate end snap-gauge 7, subplate end card slot 6 carry out clamping installation so that user can assemble monoblock plank, when user needs
When wanting area larger plank, by the internal matching relationship by card slot 5 in the middle part of mainboard end snap-gauge 9 and mainboard,
Extend the length of the whole plank after assembling so that can be by combining installation, the ruler needed between mainboard 2 and subplate 4
It is very little, it is produced in batches convenient for manufacturer, and convenience in transport；The hole 1 opened up simultaneously in mainboard 2 with 4 side of subplate can be effectively right
Sound wave is reflected so that sound wave is weakened in reflection process, avoids indoor noise effect to external environment.
It should be noted that herein, relational terms such as first and second and the like are used merely to a reality
Body or operation are distinguished with another entity or operation, are deposited without necessarily requiring or implying between these entities or operation
In any this practical relationship or sequence.Moreover, term " comprising ", "comprising" or its any other variant are intended to
Non-exclusive inclusion, so that process, method, article or equipment including a series of elements not only will including those
Element, but also including other elements that are not explicitly listed or further include as this process, method, article or equipment
Intrinsic element.
While there has been shown and described that the embodiment of the utility model, for the ordinary skill in the art,
It is appreciated that can these embodiments be carried out with a variety of variations in the case of the principle and spirit for not departing from the utility model, repaiied
Change, replace and modification, the scope of the utility model are defined by the appended claims and the equivalents thereof.
Claims (5)
1. a kind of nano-porous ceramic thermal insulation thermal insulation board, including mainboard（2）, frame（3）, subplate（4）And insulating layer（8）, it is special
Sign is：The mainboard（2）Side outer wall is uniformly provided with hole（1）, the mainboard（2）Far from hole（1）Side face
Two sides are fixedly welded with mainboard end snap-gauge respectively（9）, the mainboard（2）Positioned at mainboard end snap-gauge（9）Side face
Center is fixedly welded with card slot in the middle part of mainboard（5）, mainboard middle part card slot（5）With mainboard end snap-gauge（9）It is arranged in parallel；Institute
State subplate（4）Side outer wall is uniformly provided with hole（1）, the subplate（4）Far from hole（1）Weldering is fixed in side face one end
It is connected to subplate end snap-gauge（7）, the subplate（4）Positioned at subplate end snap-gauge（7）Weldering is fixed in another side in side face
It is connected to subplate end card slot（6）, subplate end snap-gauge（7）With subplate end card slot（6）It is arranged in parallel；The mainboard end
Snap-gauge（9）With subplate end card slot（6）Fixed clamping, subplate end snap-gauge（7）With card slot in the middle part of mainboard（5）Fixing card
It connects, the mainboard（2）With subplate（4）Between and mainboard（2）With mainboard（2）Between uniformly be filled with insulating layer（8）.
2. a kind of nano-porous ceramic thermal insulation thermal insulation board according to claim 1, it is characterised in that：Described hole（1）It opens
If depth dimensions are mainboard（2）Or subplate（4）The half of thickness.
3. a kind of nano-porous ceramic thermal insulation thermal insulation board according to claim 1, it is characterised in that：The mainboard（2）With
Subplate（4）Fixation is connected with frame jointly at edge（3）.
4. a kind of nano-porous ceramic thermal insulation thermal insulation board according to claim 1, it is characterised in that：The subplate（4）One
Side surface area is mainboard（2）The half of one side surface area.
5. a kind of nano-porous ceramic thermal insulation thermal insulation board according to claim 1, it is characterised in that：The mainboard（2）With
Subplate（4）Manufactured using porous ceramics.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721723464.0U CN207553335U (en) | 2017-12-12 | 2017-12-12 | A kind of nano-porous ceramic thermal insulation thermal insulation board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721723464.0U CN207553335U (en) | 2017-12-12 | 2017-12-12 | A kind of nano-porous ceramic thermal insulation thermal insulation board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207553335U true CN207553335U (en) | 2018-06-29 |
Family
ID=62662644
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721723464.0U Expired - Fee Related CN207553335U (en) | 2017-12-12 | 2017-12-12 | A kind of nano-porous ceramic thermal insulation thermal insulation board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207553335U (en) |
-
2017
- 2017-12-12 CN CN201721723464.0U patent/CN207553335U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180629 Termination date: 20181212 |