CN207542222U - Wafer leveling device - Google Patents
Wafer leveling device Download PDFInfo
- Publication number
- CN207542222U CN207542222U CN201721778704.7U CN201721778704U CN207542222U CN 207542222 U CN207542222 U CN 207542222U CN 201721778704 U CN201721778704 U CN 201721778704U CN 207542222 U CN207542222 U CN 207542222U
- Authority
- CN
- China
- Prior art keywords
- wafer
- supporting platform
- platform
- leveling device
- support element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Abstract
The utility model is related to a kind of wafer leveling device, including：Basic platform is provided with wafer-supporting platform above basic platform, is used to carry wafer.Support element and levelling device are provided with below wafer-supporting platform.Support element one end is rotatablely connected with wafer-supporting platform, and the other end is fixedly connected with basic platform.Levelling device is used for being adjusted the levelness of wafer-supporting platform.Levelling device includes at least two extensible members, and above-mentioned extensible member is flexibly connected with wafer-supporting platform and basic platform.Common wafer-supporting platform support element type of attachment only need to be converted to rotation connection by above-mentioned wafer leveling device by being fixedly connected, fast leveling can be realized in another increase extensible member in place, and compared to traditional levelling device, which has simple in structure, it is easily assembled to, the advantages that function is reliable.
Description
Technical field
The utility model is related to wafer manufacture field more particularly to a kind of wafer leveling devices.
Background technology
It is required for keeping the levelness of wafer itself in carrying out photoetching, polishing etc. and needing multi-process, the quality of levelness is tight
Important place affects the uniformity of photoetching quality and polishing, and wafer loss is resulted even under levelness deviation serious situation.Mesh
Has there are a variety of mechanisms for wafer leveling in the preceding country, but mostly complicated, and volume is big, quality weight, it is adaptive should be able to
Force difference, it would therefore be highly desirable to solve the problems, such as this.
Invention content
Problem to be solved in the utility model is to provide a kind of simple in structure, reliable and easy to operation wafer tune of function
Leveling device.
In order to solve the above-mentioned technical problem, the utility model is related to a kind of wafer leveling device, including：Basic platform,
Wafer-supporting platform is provided with above basic platform, is used to carry wafer.Support element and levelling device are provided with below wafer-supporting platform.Branch
Support member one end is rotatablely connected with wafer-supporting platform, and the other end is fixedly connected with basic platform.Levelling device is used for the levelness to wafer-supporting platform
It is adjusted.Levelling device includes at least two extensible members, and above-mentioned extensible member is flexibly connected with wafer-supporting platform and basic platform.
Common wafer-supporting platform support element type of attachment only need to be converted to rotation company by above-mentioned wafer leveling device by being fixedly connected
It connects, leveling can be realized in another increase extensible member in place, and compared to traditional levelling device, which has knot
The features such as structure is simple, is easily assembled to, and function is reliable.
As further improvement of the utility model, the junction of extensible member and wafer-supporting platform is along wafer-supporting platform outer edge circumferential direction
It is uniformly distributed.
The junction of extensible member and wafer-supporting platform is circumferentially uniformly distributed along wafer-supporting platform outer edge, thus, not only so that holding piece
Active force suffered by platform is uniform, and so that the sum of stroke of each extensible member minimum, thereby reduces energy during leveling
Consumption.
As further improvement of the utility model, support element is located at the wafer-supporting platform center.
For the ease of the arrangement of each extensible member, and so that the stress of wafer-supporting platform is more reasonable, support element is arranged in wafer-supporting platform
Lower central position.
As further improvement of the utility model, support element one end is set as spherical, and spherical shape is provided on wafer-supporting platform
The spherical groove being adapted.
The principle of the centre of sphere is forced through using spherical surface, may be such that the power generated on different directions passes through the centre of sphere so that hold piece
Platform and the active force that support element contact site is subject to are uniform, reduce abrasion, improve service life, and can realize multi-direction and micro-
Amount adjustment, it is simple in structure, it is easy to operate.
As further improvement of the utility model, inside of spherical groove is provided with spherical spacer.
Wafer-supporting platform manufacture it is of high cost, in order to prevent its ontology is caused to wear during long-term leveling, its groove with
Spherical spacer is equipped between support element, when support element and overproof spherical spacer fit precision, it is only necessary to which spherical spacer is carried out
It replaces, it is convenient, fast, it is at low cost.
As further improvement of the utility model, extensible member is hinged respectively with wafer-supporting platform and basic platform.
Hinge shaft articulated manner is used between extensible member and wafer-supporting platform, between extensible member and basic platform, function is reliable, and side
Just the demolition, installation of extensible member.
As further improvement of the utility model, which further includes horizontal detector, is arranged on and holds
On piece platform, for detecting the levelness of wafer-supporting platform in real time and sending out signal and processing unit, signal is received and at it
It manages and is compared with predetermined inclination angle, generate control signal, in addition, further including control device, receive control signal and root
Action command is sent out to levelling device according to it.
The wafer leveling device generates corresponding driving control accordingly by monitoring the horizontal tilt situation of wafer-supporting platform in real time
Signal processed, adjusts wafer-supporting platform automatic, dynamicly, so as to ensure that it remains horizontality.
As further improvement of the utility model, horizontal detector is electrolevel.
Electrolevel has the features such as small, light weight, high certainty of measurement.
As further improvement of the utility model, electrolevel is set to the back side of wafer-supporting platform.
Electrolevel is set to the back side of wafer-supporting platform, and so, facilitate wafer takes, puts operation, and avoid
Situation about being interfered between electrolevel and related processing equipment.
As further improvement of the utility model, extensible member is driven by multistage hydraulic cylinder.
Hydraulic-driven has the characteristics of compact-sized, flexible arrangement, stable drive and small the moment of inertia.
Description of the drawings
It in order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment
Or attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, the accompanying drawings in the following description is only
It is some embodiments of the utility model, for those of ordinary skill in the art, in the premise not made the creative labor
Under, it can also be obtained according to these attached drawings other attached drawings.
Fig. 1 is the stereoscopic schematic diagram of the utility model wafer leveling device.
Fig. 2 is the stereoscopic schematic diagram of wafer-supporting platform in the utility model wafer leveling device.
Fig. 3 is wafer-supporting platform and support element junction partial sectional view in the utility model wafer leveling device.
Fig. 4 is wafer-supporting platform and extensible member junction partial sectional view in the utility model wafer leveling device.
Fig. 5 is a kind of schematic diagram of embodiment of automatic leveling control system in the utility model wafer leveling device.
1- bases platform；2- wafer-supporting platforms；3- support elements；4- extensible members；5- spherical shape spacers；6- axis pins.
Specific embodiment
With reference to specific embodiment, the content of the utility model is described in further detail：
In order to reach the purpose of this utility model, as shown in Fig. 1,2,3,4, which includes basic platform 1,
Several parts such as wafer-supporting platform 2, support element 3, levelling device.Wafer-supporting platform 2 is arranged on the top of basic platform 1, is used to carry wafer.It holds
It is connected between piece platform 2 and basic platform 1 by support element 3, and 3 one end of support element is rotatablely connected with wafer-supporting platform 2, the other end and basis
Platform 1 is fixedly connected.Wherein, the principle of the centre of sphere, the above-mentioned preferably spherical articulated form of rotation connection, branch are forced through using spherical surface
3 one end of support member is set as spherical, correspondingly, the spherical spherical groove being adapted is provided on wafer-supporting platform 2, holds piece in order to prevent
2 body wear of platform sets spherical spacer 5 between spherical groove and support element 3.When support element 3 and 5 fit precision of spherical spacer
When overproof, it is only necessary to spherical spacer 5 is replaced, it is convenient, fast, it is at low cost.So so that generated on different directions
Power pass through the centre of sphere so that wafer-supporting platform 2 and the active force that 3 contact site of support element is subject to are uniform, greatly reduce abrasion, improve
Service life, and can realize multi-direction, micro adjustment, it is simple in structure, it is easy to operate.In addition, for the ease of the water to wafer-supporting platform 2
Pingdu is adjusted, and is additionally provided with levelling device between wafer-supporting platform 2 and basic platform 1, which includes at least two
Extensible member 4, preferred amount 4, above-mentioned extensible member 4 are flexibly connected with wafer-supporting platform 2 and basic platform 1, preferably axis pin connection mode.
Above-mentioned 4 preferred multistage hydraulic cylinder of extensible member, the ejection end head of hydraulic cylinder are provided with the pin shaft hole penetrated for axis pin 6, the two it
Between for clearance fit, both make that there is certain freedom of movement amount.Certainly, it in addition to above-mentioned axis pin connection mode, can also select
Spherical is hinged, and can also be all other suitable connection modes.Furthermore the levelling device structure of multistage hydraulic cylinder driving is tight
It gathers, stable drive, the moment of inertia is small, and hydraulic oil pipe is convenient for bending, flexible arrangement.
It advanced optimizing, extensible member 4 and the junction of wafer-supporting platform 2 are circumferentially uniformly distributed along 2 outer edge of wafer-supporting platform, and such one
Come, not only so that the active force suffered by wafer-supporting platform 2 is uniform, and so that the sum of stroke of each extensible member 4 during leveling
Minimum reduces energy consumption.And then for the ease of the arrangement of each extensible member 4, and so that the stress of wafer-supporting platform 2 is more reasonable, support
Part 3 is arranged in the lower central position of wafer-supporting platform 2.
It advanced optimizes, as shown in figure 5, the wafer leveling device further includes horizontal detector, the level measurement device
It is preferred that having the electrolevel of the advantages that small, light weight, high certainty of measurement, the back side of wafer-supporting platform 2 is arranged on, is used for
The levelness of wafer-supporting platform 2 is detected in real time and sends out signal.Further include for receive signal and it is handled and with processing fill
The processing unit that predetermined inclination angle is compared is put, control signal is sent out according to comparison, analysis result, which leads to
It crosses control device and corresponding action command is sent out to levelling device.It can conveniently, soon by increasing solenoid valve etc. in hydraulic system
It realizes and automatically controls promptly, and safety valve (not shown) can be increased in hydraulic system, make it have overload protection work(
Can, when hydraulic system breaks down or the connection of extensible member 4 and wafer-supporting platform 2 clamping stagnation occurs, can in time, effectively avoid leveling
Device damages.Thus, the wafer leveling device can monitor the water of wafer-supporting platform in real time by horizontal detector
Flat dip situation, and generate corresponding driving control signal accordingly, can it is automatic, dynamic, safely to the levelness of wafer-supporting platform 2 into
Row adjustment, so as to which it be kept to be in horizontality always.
To the explanation of the disclosed embodiments, professional and technical personnel in the field is enable to realize or new using this practicality
Type.A variety of modifications of these embodiments will be apparent for those skilled in the art, determine herein
The General Principle of justice can be realized in other embodiments without departing from the spirit or scope of the present utility model.Cause
This, the utility model is not intended to be limited to the embodiments shown herein, and is to fit to and principles disclosed herein
The most wide range consistent with features of novelty.
Claims (10)
1. wafer leveling device, which is characterized in that it includes：
Basic platform is provided with wafer-supporting platform above the basic platform, is used to carry wafer；
Support element and levelling device are provided with below the wafer-supporting platform, described support element one end connects with wafer-supporting platform rotation
It connects, the other end is fixedly connected with the basic platform；The levelling device is used for being adjusted the levelness of the wafer-supporting platform；
The levelling device includes at least two extensible members, and the extensible member connects with the wafer-supporting platform and the activity of basic platform
It connects.
2. wafer leveling device according to claim 1, which is characterized in that the connection of the extensible member and the wafer-supporting platform
Place is circumferentially uniformly distributed along the wafer-supporting platform outer edge.
3. wafer leveling device according to claim 1, which is characterized in that the support element is located at the wafer-supporting platform center
Position.
4. according to the wafer leveling device described in claim 1, which is characterized in that described support element one end is set as spherical,
The spherical groove being adapted with above-mentioned spherical shape is provided on the wafer-supporting platform.
5. according to the wafer leveling device described in claim 4, which is characterized in that the inside of spherical groove be provided with it is spherical every
Set.
6. wafer leveling device according to claim 1, which is characterized in that the extensible member respectively with the wafer-supporting platform and
The basis platform is hinged.
7. the wafer leveling device according to any one of claim 1-6, which is characterized in that further include horizontal checkout dress
It puts, is arranged on the wafer-supporting platform, for detecting the levelness of wafer-supporting platform in real time and sending out signal；
Processing unit receives the signal and is handled and compared with predetermined inclination angle, generates control signal；
Control device receives the control signal and sends out action command to the levelling device accordingly.
8. wafer leveling device according to claim 7, which is characterized in that the horizontal detector is electronic horizon
Instrument.
9. wafer leveling device according to claim 8, which is characterized in that the electrolevel, which is set to, described holds piece
The back side of platform.
10. wafer leveling device according to claim 1, which is characterized in that the extensible member is carried out by multistage hydraulic cylinder
Driving.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721778704.7U CN207542222U (en) | 2017-12-19 | 2017-12-19 | Wafer leveling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721778704.7U CN207542222U (en) | 2017-12-19 | 2017-12-19 | Wafer leveling device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207542222U true CN207542222U (en) | 2018-06-26 |
Family
ID=62618715
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721778704.7U Active CN207542222U (en) | 2017-12-19 | 2017-12-19 | Wafer leveling device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207542222U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109244905A (en) * | 2018-09-21 | 2019-01-18 | 林清武 | It is a kind of for ship can self-leveling electric power overhaul stool |
-
2017
- 2017-12-19 CN CN201721778704.7U patent/CN207542222U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109244905A (en) * | 2018-09-21 | 2019-01-18 | 林清武 | It is a kind of for ship can self-leveling electric power overhaul stool |
| CN109244905B (en) * | 2018-09-21 | 2019-12-03 | 诸暨易和项目投资有限公司 | It is a kind of for ship can self-leveling electric power overhaul stool |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110228752A (en) | Adjustable sea wind turbine blade suspender and its hanging method | |
| CN207542222U (en) | Wafer leveling device | |
| CN204666439U (en) | Anchor rod drawing test tripod counter-force bracing or strutting arrangement | |
| CN106677994B (en) | Impeller assembling device and impeller assembling method | |
| CN105271047A (en) | Jack with adjustable base angle | |
| CN110146875A (en) | A kind of tunnel just build radar detection device | |
| CN209673086U (en) | A kind of real estate mapping horizontal-shift device | |
| CN110359940A (en) | A kind of adaptivity temporary support device of roofboltier | |
| CN105384090A (en) | Automatic erecting of a crane | |
| CN205352960U (en) | Paper tube detection device | |
| CN209309605U (en) | A kind of building construction measurement equipment support device | |
| KR101369771B1 (en) | Levelling evaluation device for transition piece of wind power plant | |
| JP6933516B2 (en) | Ballast equipment and crane | |
| CN109629314A (en) | Curtain bed follow-up adjustment device | |
| CN208764602U (en) | A kind of fixed structure for engineering detecting equipment | |
| CN205527380U (en) | Hoist hoist and mount aligning device | |
| CN211971530U (en) | Lifting beam capable of adjusting self balance | |
| CN105042293A (en) | Leveling mechanism for measuring instruments | |
| CN209353852U (en) | A kind of robot protective fence convenient for assembly | |
| CN209443736U (en) | A kind of detection platform of container | |
| CN208043229U (en) | A kind of automatic quadrangle output error update the system of parallel beam load cell | |
| CN110398239A (en) | A kind of architectural engineering testing apparatus for verticality | |
| CN210402357U (en) | Signal receiving device for asset positioning management system | |
| CN104440832B (en) | A kind of aircraft assembling, transport, docking double-layer scaffold | |
| CN214059592U (en) | Hoisting equipment and hoisting system |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: Room 3, No. 248, Chenghu Road, Kunshan Development Zone, Suzhou City, Jiangsu Province 215300 Patentee after: Chenggong Environmental Protection Technology (Nantong) Co.,Ltd. Address before: Room 3, No. 248, Chenghu Road, Kunshan Development Zone, Suzhou City, Jiangsu Province 215300 Patentee before: KUNSHAN CHENGGONG ENVIRONMENTAL PROTECTION TECHNOLOGY CO.,LTD. |
|
| CP01 | Change in the name or title of a patent holder | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20221201 Address after: No. 323, Jinchuan Road, Nantong Hi tech Industrial Development Zone, Nantong, Jiangsu 226399 Patentee after: Jiangsu Sizhi Semiconductor Technology Co.,Ltd. Address before: Room 3, No. 248, Chenghu Road, Kunshan Development Zone, Suzhou City, Jiangsu Province 215300 Patentee before: Chenggong Environmental Protection Technology (Nantong) Co.,Ltd. |
|
| TR01 | Transfer of patent right |