CN207503937U - Multi-chamber Wafer processing apparatus - Google Patents
Multi-chamber Wafer processing apparatus Download PDFInfo
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- CN207503937U CN207503937U CN201721754788.0U CN201721754788U CN207503937U CN 207503937 U CN207503937 U CN 207503937U CN 201721754788 U CN201721754788 U CN 201721754788U CN 207503937 U CN207503937 U CN 207503937U
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- gas circuit
- valve
- wafer processing
- gas
- cylinder
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Drying Of Semiconductors (AREA)
Abstract
The utility model is related to a kind of multi-chamber Wafer processing apparatus, including：Multiple wafer processing chambers, each wafer processing chamber include pneumatic door, and the pneumatic door is driven by the cylinder；Gas circuit, multiple gas circuits being connect including main gas circuit and with described main gas circuit one end, the multiple branch gas circuit are respectively connected to each cylinder；Gas source is connect with the gas circuit other end, for inputting compressed gas to each cylinder by the gas circuit；First valve is set in the main gas circuit, for controlling the air-flow in the main gas circuit；Multiple second valves are respectively arranged in each gas circuit, for controlling the air-flow in each gas circuit respectively.Improve the uniform and stable property of pressure in gas circuit so that pneumatic door switch is smooth.
Description
Technical field
The utility model is related to technical field of semiconductors more particularly to a kind of multi-chamber Wafer processing apparatus.
Background technology
Wafer-process technique is carried out in the process system of a multi-chamber, such as one has multiple processing chamber housings
Wafer processing apparatus.
Multi-chamber have multi-chamber Wafer processing apparatus include multiple processing chamber housings, such as deposition chambers, etching cavity,
Annealing chamber etc..A transmission cavity is formed between each processing chamber housing, mechanical arm is set in the transmission cavity, in each chamber
And wafer is transmitted between load locking room.
Each processing chamber housing is provided with Pneumatic vacuum valve close to one end of transit area, as load locking room and transmission
Separation valve door between region.The Pneumatic vacuum valve is driven by the cylinder.Board is supplied respectively to after uniformly adjusting gas pressure
The cylinder of each cavity, for controlling being turned on and off for Vacuum door.But cylinder individual difference causes to flow into the gas of each cylinder
Pressure size is uneven, and pneumatic door switch can occur once in a while and have some setbacks, and part main cavity pneumatic door is caused to open failure so that machinery
Arm cannot normally pass piece work, cause equipment fault.
Therefore, it is necessary to a kind of new gas transfer pipelines, so as to get and the gas pressure up to each cylinder can be met the requirements,
So that cylinder moving smooth-going.
Utility model content
Technical problem to be solved in the utility model is to provide a kind of multi-chamber Wafer processing apparatus so that described more
The pneumatic door switch of chamber Wafer processing apparatus is smooth, avoids equipment fault.
To solve the above-mentioned problems, the utility model provides a kind of multi-chamber Wafer processing apparatus, including：Multiple wafers
Processing chamber housing, each wafer processing chamber include pneumatic door, and the pneumatic door is driven by the cylinder；Gas circuit, including main gas circuit and with
Multiple gas circuits of main gas circuit one end connection, the multiple branch gas circuit are respectively connected to each cylinder；Gas source, it is and described
The gas circuit other end connects, for inputting compressed gas to each cylinder by the gas circuit；First valve is set to the main gas
On the road, for controlling the air-flow in the main gas circuit；Multiple second valves are respectively arranged in each gas circuit, are used for
The air-flow in each gas circuit is controlled respectively.
Optionally, second valve is needle-like valve.
Optionally, first valve and the second valve use the valve of same type.
Optionally, the gas source is for compressed gas of the output pressure for 85Psi~95Psi.
Optionally, pressure sensor is provided on second valve, for detecting the gas pressure intensity in the branch gas circuit.
Optionally, the gas circuit distance between second valve and cylinder is less than the gas circuit between the second valve and main gas circuit
Distance.
Optionally, it is 4s~6s that second valve, which is used to control the switch time of corresponding pneumatic door,.
The gas source of the multi-chamber Wafer processing apparatus of the utility model is connected by a main gas circuit and multiple gas circuits
To multiple cylinders, the second valve is respectively arranged in branch gas circuit, for individually controlling the air-flow in each gas circuit so that gas circuit
Interior pressure is uniform and stable so that each cylinder moving smoothes out that pneumatic door is driven smoothly to switch.
Description of the drawings
Fig. 1 is the structure diagram of the multi-chamber Wafer processing apparatus of one specific embodiment of the utility model.
Specific embodiment
The specific embodiment for providing the utility model multi-chamber Wafer processing apparatus below in conjunction with the accompanying drawings is done specifically
It is bright.
It please refers to Fig.1, the partial structurtes of the multi-chamber Wafer processing apparatus for one specific embodiment of the utility model are shown
It is intended to.
The multi-chamber Wafer processing apparatus includes multiple wafer processing chamber (not shown)s, each wafer-process chamber
Room includes pneumatic door, and the pneumatic door is driven by the cylinder, and controls the opening and closing of pneumatic door.
In the specific embodiment, the multi-chamber Wafer processing apparatus includes n pneumatic door, is driven respectively by n cylinder
It is dynamic, including：Cylinder 1 ..., cylinder n, n >=2.
The multi-chamber Wafer processing apparatus further includes：Gas source 101, for providing by after the same adjustment pressure of board
Compressed gas (CDA), the pressure of the compressed gas is relatively stable, controls in the range of 85Psi~95Psi.
The gas source 101 is connected to each cylinder by a gas circuit, for being divided by the gas circuit to the n cylinder
Indescribably for CDA, to drive cylinder moving.
In the specific embodiment, the gas circuit includes main gas circuit 102 and the n being connect with described main 102 one end of gas circuit
Branch gas circuit, the n branch gas circuit are respectively connected to each cylinder.
Specifically, branch gas circuit 1031 is connected to cylinder 1, branch gas circuit 103n connections that branch gas circuit 1032 is connected to cylinder 2 ... ...
To cylinder n.Gas in gas source 101 branches to each cylinder after the output of main gas circuit 102 by each gas circuit
It is interior.
The multi-chamber Wafer processing apparatus further includes the first valve 201 and n the second valves.
First valve 201 is set in the main gas circuit 102, for controlling the air-flow in the main gas circuit 102.
The on and off of the main gas circuit 102 and the adjustment gas source 101 can be controlled defeated by first valve 201
The total gas flow gone out.But individually output to the air-flow in each cylinder can not be adjusted.It is also, if each
Pressure in branch gas circuit is uneven, also results in the fluctuation of first valve 201, influences gas in entire gas piping and supplies
Stability.
The n the second valves, are respectively arranged in each gas circuit, for controlling respectively in each gas circuit
Air-flow.Specifically, the second valve 2021 is set in branch gas circuit 1031, flowed into cylinder 1 for controlling in branch gas circuit 1031
Air-flow；Second valve 2022 is set in branch gas circuit 1032, for controlling the gas flowed into branch gas circuit 1032 in cylinder 2
Stream；……；Second valve 202n is set on branch gas circuit 103n, for controlling the air-flow flowed into branch gas circuit 103n in cylinder n.
From there through each second valve, the air-flow for flowing into each cylinder can be individually adjusted so that flow into each cylinder
Gas flow size approach, avoid the problem that since secondary gas flow each caused by the individual difference of cylinder is inconsistent so that each
Pipeline inner pressure is uniform and stable, can break down to avoid cylinder, reduces maintenance time and the maintenance cost of equipment, described in raising
The yield of multi-chamber Wafer processing apparatus.
In the specific embodiment, second valve 2021,2022 ... 202n using needle-like valve, have higher
Anti-pressure ability, reliability is higher.In other specific embodiments of the utility model, second valve can also use
The valve of other structures.
In another specific embodiment of the utility model, can also pressure sensing be set on each second valve
Device, for detecting the gas pressure intensity in each gas circuit, convenient for technical staff monitor in real time gas pressure intensity in each branch gas circuit and
When make adjustment.
In the specific embodiment, the gas circuit distance between second valve and cylinder is less than the second valve and branch gas circuit
Between gas circuit distance, it is possible thereby to which the second valve is enabled to carry out more effective accurately adjusting to the air-flow entered in cylinder
It is whole.By being individually adjusted to each second valve so that the pneumatic door that the corresponding cylinder of each second valve is driven
Switch time is 4s~6s, reaches standard speed.
The valve types that first valve 201 uses can be consistent with second valve, can also use other conjunctions
Suitable valve mechanism.
The gas source for the multi-chamber Wafer processing apparatus that above-mentioned specific embodiment provides passes through a main gas circuit and multiple
Branch gas circuit is connected to multiple cylinders, and the second valve is respectively arranged in branch gas circuit, for individually controlling the gas in each gas circuit
Stream so that the pressure in gas circuit is uniform and stable so that each cylinder moving smoothes out that pneumatic door is driven smoothly to switch.
The above is only the preferred embodiment of the utility model, it is noted that for the common skill of the art
Art personnel under the premise of the utility model principle is not departed from, can also make several improvements and modifications, these improvements and modifications
Also it should be regarded as the scope of protection of the utility model.
Claims (7)
1. a kind of multi-chamber Wafer processing apparatus, which is characterized in that including：
Multiple wafer processing chambers, each wafer processing chamber include pneumatic door, and the pneumatic door is driven by the cylinder；
Gas circuit, multiple gas circuits being connect including main gas circuit and with described main gas circuit one end, the multiple branch gas circuit connect respectively
To each cylinder；
Gas source is connect with the gas circuit other end, for inputting compressed gas to each cylinder by the gas circuit；
First valve is set in the main gas circuit, for controlling the air-flow in the main gas circuit；
Multiple second valves are respectively arranged in each gas circuit, for controlling the air-flow in each gas circuit respectively.
2. multi-chamber Wafer processing apparatus according to claim 1, which is characterized in that second valve is needle valve
Door.
3. multi-chamber Wafer processing apparatus according to claim 1, which is characterized in that first valve and the second valve
Using the valve of same type.
4. multi-chamber Wafer processing apparatus according to claim 1, which is characterized in that the gas source is used for output pressure
Compressed gas for 85Psi~95Psi.
5. multi-chamber Wafer processing apparatus according to claim 1, which is characterized in that be provided with pressure on second valve
Force snesor, for detecting the gas pressure intensity in the branch gas circuit.
6. multi-chamber Wafer processing apparatus according to claim 1, which is characterized in that between second valve and cylinder
Gas circuit distance be less than gas circuit distance between the second valve and main gas circuit.
7. multi-chamber Wafer processing apparatus according to claim 1, which is characterized in that second valve is for control pair
The switch time for the pneumatic door answered is 4s~6s.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721754788.0U CN207503937U (en) | 2017-12-15 | 2017-12-15 | Multi-chamber Wafer processing apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721754788.0U CN207503937U (en) | 2017-12-15 | 2017-12-15 | Multi-chamber Wafer processing apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207503937U true CN207503937U (en) | 2018-06-15 |
Family
ID=62508985
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721754788.0U Active CN207503937U (en) | 2017-12-15 | 2017-12-15 | Multi-chamber Wafer processing apparatus |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207503937U (en) |
-
2017
- 2017-12-15 CN CN201721754788.0U patent/CN207503937U/en active Active
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