LCTF controllers
Technical field
The utility model belongs to color filter tuning technical field more particularly to a kind of LCTF (Liquid
CrystalTunable Filter, liquid crystal tunable optical filter) controller.
Background technology
With economic continuous development, a large amount of optical filter is applied in industrial production, meets the diversified demand of people.
By taking the spectral imaging analysis being widely used at present as an example, when acquiring substance spectra data, need repeatedly to switch different wave length
Optical filter realizes the tuning of wave band.Existing optical filter switching mode is adjusts manually, and wave band tuned speed is slow, tuning precision
It is low, simultaneously because needing artificial participation, increase cost.
Utility model content
In view of this, the utility model embodiment provides a kind of LCTF controllers, to solve to adjust manually in the prior art
Entire filter mating plate, wave band tuned speed is slow, tuning precision is low, it is of high cost the problem of.
The utility model embodiment provides a kind of LCTF controllers, including MCU (MicrocontrollerUnit, micro-control
Unit processed) chip, DAC (Digital to analog converter, digital analog converter) chip, signal amplification unit
And switch unit, the signal amplification unit include the signal amplifier of multiple parallel connections, the switch unit includes multiple simulations
Switch;
External host computer connects the MCU chip, and the host computer exports multiple voltages to the MCU chip, the MCU
Chip connects the DAC chip, and the DAC chip connects the signal amplifier of each parallel connection respectively, and a signal amplifier connects
An analog switch is connect, each analog switch connects LCTF respectively.
In addition, in a specific example, above-mentioned LCTF controllers further include temperature detecting unit and constant temperature unit, described
Temperature detecting unit detects the temperature of the LCTF, and the LCTF is placed in the constant temperature unit, the temperature detecting unit
The MCU chip is connected, the host computer connects the constant temperature unit.
In addition, in a specific example, above-mentioned LCTF controllers further include USB, and (Universal Serial Bus lead to
With universal serial bus) interface and USB turn UART (Universal Asynchronous Receiver/Transmitter, it is general different
Walk receiving-transmitting transmitter) unit, the host computer turns UART units with the USB by the USB interface and connects the MCU core
Piece.
In addition, in a specific example, above-mentioned LCTF controllers further include power supply, and the power supply is respectively
The MCU chip, the DAC chip, the signal amplification unit and switch unit power supply.
In addition, in a specific example, echo signal amplifier includes the first amplification module and the second amplification module, institute
It states the first amplification module and second amplification module is in parallel, the DAC chip connects first amplification module and institute respectively
State the second amplification module, first amplification module and second amplification module difference linking objective analog switch, the mesh
Signal amplifier is marked as any one signal amplifier in the signal amplifier of each parallel connection, the echo signal amplifier connects
Connect the target simulation switch.
In addition, in a specific example, first amplification module includes first resistance, second resistance, third electricity
Resistance and the first operational amplifier, second amplification module include the 4th resistance, the 5th resistance, the 6th resistance, the 7th resistance
And second operational amplifier, the first resistor are arranged on the DAC chip and the homophase input of first operational amplifier
Between end, the second resistance is arranged on the inverting input of first operational amplifier and first operational amplifier
Between output terminal, the 3rd resistor is arranged on the output terminal of first operational amplifier and the target simulation switchs it
Between, the 4th resistance is arranged between the inverting input of the DAC chip and the second operational amplifier, and the described 5th
Resistance is arranged between the inverting input of the second operational amplifier and the output terminal of the second operational amplifier, described
6th resistance is arranged between the output terminal of the second operational amplifier and target simulation switch, and the 7th resistance connects
Connect the normal phase input end of the second operational amplifier.
In addition, in a specific example, the target simulation switch includes the first single-pole double-throw switch (SPDT) and the second hilted broadsword
Commutator, the 3rd resistor connect the first non-moving end of first single-pole double-throw switch (SPDT) and second hilted broadsword pair respectively
Second non-moving end of throw switch, the 6th resistance connect the second non-moving end of first single-pole double-throw switch (SPDT) and described respectively
First non-moving end of the second single-pole double-throw switch (SPDT), the non-moving end of first single-pole double-throw switch (SPDT) and second single-pole double throw are opened
The non-moving end of pass connects the LCTF respectively.
In addition, in a specific example, the MCU chip is STM32F405xx chips.
In addition, in a specific example, the DAC chip is AD5668 chips.
In addition, in a specific example, the signal amplification unit includes 2N signal amplifier in parallel, described to open
It closes unit and includes 2N analog switch, N is positive integer.
Existing advantageous effect is the utility model embodiment compared with prior art:The utility model embodiment uses
LCTF controllers tune LCTF, replace mechanical optical filter runner using electric tuning, realize the quick tuning of wave band, have higher
Spatial resolution and spectral resolution, while LCTF controllers are small, low in energy consumption, light-weight, it is easy to control, to platform stable
Property requirement it is relatively low, solution manually adjust optical filter in the prior art, wave band tuned speed is slow, tuning precision is low, of high cost
Problem.
Description of the drawings
It, below will be to embodiment or the prior art in order to illustrate more clearly of the technical scheme in the embodiment of the utility model
Attached drawing is briefly described needed in description, it should be apparent that, the accompanying drawings in the following description is only that this practicality is new
Some embodiments of type, for those of ordinary skill in the art, without having to pay creative labor, can be with
Other attached drawings are obtained according to these attached drawings.
Fig. 1 is the structure diagram for the LCTF controllers that the utility model embodiment one provides;
Fig. 2 is the structure diagram of signal amplifier in one embodiment provided by the utility model;
Fig. 3 is the structure diagram of analog switch in one embodiment provided by the utility model;
Fig. 4 is being controlled based on LCTF in tuner one shown in Fig. 1 specific example for the offer of the utility model embodiment two
The structure diagram of device.
Specific embodiment
In being described below, in order to illustrate rather than in order to limit, it is proposed that such as tool of particular system structure, technology etc
Body details, to understand thoroughly the utility model embodiment.However, it will be clear to one skilled in the art that there is no these
The utility model can also be realized in the other embodiments of detail.In other situations, omit to well-known system,
The detailed description of device, circuit and method, in case unnecessary details interferes the description of the utility model.
In order to illustrate technical solution described in the utility model, illustrated below by specific embodiment.
The structure diagram for the LCTF controllers that the utility model embodiment one provides is shown in Fig. 1.
As shown in Figure 1, in this embodiment, which includes MCU chip 101, DAC chip 102, signal amplification
Unit 103 and switch unit 104, the signal amplification unit 103 include the signal amplifier 1031 of multiple parallel connections, the switch
Unit 104 includes multiple analog switches 1041.
External host computer 105 connects the MCU chip 101, and the host computer 105 exports multiple voltages to the MCU core
Piece 101, the MCU chip 101 connect the DAC chip 102, and the signal that the DAC chip 102 connects each parallel connection respectively is put
Big device 1031, a signal amplifier 1031 connect an analog switch 1041, and each analog switch 1041 connects respectively
LCTF106。
Here, MCU chip and DAC chip are existing chip, such as MCU chip can be ST companies
STM32F405xx chips, DAC chip are the AD5668 family chips of ADI companies production.Wherein, STM32F405xx is a height
32 technical grade arm processors of performance, STM32F405xx Series of MCU are based on high-performance ARM Cortex-M4 32-bit
RISC core, running frequency are up to 168Mhz.It has merged high speed embedded memory, and (flash memory is up to 1Mbyte, and SRAM is up to
192Kbytes), spare SRAM is up to 4Kbytes, the reinforcing input and output of wide scope and is externally attached to two APB buses,
Three ahb bus and the more ahb bus matrixes of a 32-bit.All devices provide three 12 analog-digital converters, two digital-to-analogues
Converter, a low-power real-time clock, 12 general 16 bit timers can easily meet User Exploitation demand and follow-up each
Kind Function Extension.DAC chip is 8 channel of analog companies, 16, SPI voltage output denseDAC, is integrated in 5ppm/ DEG C of piece
Reference voltage source, each roads of DAC export highly stable analog voltage signal and are sent to back-end processing.
Specifically, number of the signal amplification unit including signal amplifier in parallel can be set according to actual needs, example
Such as include two signal amplifiers in parallel, four signal amplifiers in parallel or six signal amplifiers in parallel.If letter
Number amplifying unit includes two signal amplifiers in parallel, then signal amplification unit is two channel signal amplifying units, similarly, if
Signal amplification unit includes four signal amplifiers in parallel, then signal amplification unit is four-way signal amplification unit etc..On
Position machine exports multiple voltages to MCU chip, and port number of the host computer in signal amplification unit exports multiple voltages to MCU core
There are two channels, each channel of host computer in piece, such as signal amplification unit to export a voltage, that is, exports two voltages and arrive
MCU chip.The amplitude size of output voltage can flexibly be controlled by host computer, facilitate different application places.Host computer output is more
The voltage of few amplitude, MCU chip control DAC chip generate the analog voltage output of respective magnitudes, and the analog voltage of generation passes through
After signal amplification unit carries out certain ratio enlargement, here, using amplifying in proportion, total temperature excursions are minimum, then
The square-wave signal of different amplitudes is exported by analog switch, to drive LCTF LCD panels, reaches the mesh for selecting corresponding optical band
, while export square wave amplitude stability height.
Operation principle:After modulation circuit is connected to host computer, the voltage of input certain value is verified in host computer, controls LCTF
Controller exports the square-wave signal of certain amplitude.Host computer sets how many amplitude, and LCTF controllers just export the side of how many amplitude
Wave so as to allow the square-wave signal of this different amplitude, to drive LCTF LCD panels, achievees the purpose that the corresponding optical band of selection.
Specifically:Host computer is run first, MCU chip is communicated with host computer, and communication successful connection will appear corresponding serial ports SN,
Host computer inputs different voltage values, and MCU chip control DAC chip generates the analog voltage output of different value, the simulation of generation
After voltage carries out certain ratio enlargement by signal amplification unit, by analog switch, the square wave differential of different amplitudes is exported
Signal.
It is evidenced from the above discussion that the utility model embodiment tunes LCTF using LCTF controllers, replaced using electric tuning
Mechanical optical filter runner realizes the quick tuning of wave band, has higher spatial resolution and spectral resolution, while LCTF is controlled
Device processed is small, low in energy consumption, light-weight, easy to control, relatively low to platform stabilization requirement, and solution manually adjusts in the prior art
Optical filter, wave band tuned speed is slow, tuning precision is low, it is of high cost the problem of.
In addition, in a specific example, above-mentioned LCTF controllers further include temperature detecting unit and constant temperature unit, described
Temperature detecting unit detects the temperature of the LCTF, and the LCTF is placed in the constant temperature unit, the temperature detecting unit
The MCU chip is connected, the host computer connects the constant temperature unit.
Here, the temperature of temperature detecting unit detection LCTF, external host computer obtain temperature detecting unit by MCU chip
The temperature of the LCTF of detection, host computer can show the temperature of the LCTF of acquisition, and related technical personnel is facilitated to understand working as LCTF
Preceding temperature, related technical personnel can set corresponding thermostat temperature on host computer according to actual needs, and host computer is according to upper
The temperature of thermostat temperature control constant temperature unit is stated, and then the temperature of LCTF is made to meet actual needs, it can be conveniently subsequently to LCTF
Carry out processing experiment.
In addition, in a specific example, above-mentioned LCTF controllers further include USB interface and USB turns UART units, described
Host computer turns UART units with the USB by the USB interface and connects the MCU chip.
Specifically, USB interface is more commonly used interface, can connect multiple equipment, and above-mentioned host computer passes through USB interface
Turn UART units with USB and connect MCU chip, there is the protocol resource that can refer to, modification is convenient, flexible.USB interface can be with simultaneously
Support LCD show that VGA is shown, can root Ju need arbitrary extension, expansion capability is strong.
In addition, in a specific example, above-mentioned LCTF controllers further include power supply, and the power supply is respectively
The MCU chip, the DAC chip, the signal amplification unit and switch unit power supply.Here, power supply is direct
Power supply provides other power supplys without outside, is suitble to application again.
In addition, in a specific example, echo signal amplifier includes the first amplification module and the second amplification module, institute
It states the first amplification module and second amplification module is in parallel, the DAC chip connects first amplification module and institute respectively
State the second amplification module, first amplification module and second amplification module difference linking objective analog switch, the mesh
Signal amplifier is marked as any one signal amplifier in the signal amplifier of each parallel connection, the echo signal amplifier connects
Connect the target simulation switch.
Specifically, echo signal amplifier is any one signal amplification in the signal amplifier of above-mentioned each parallel connection
Device, the composition of each signal amplifier is as the composition of the echo signal amplifier of foregoing description.
In addition, in a specific example, as shown in Fig. 2, first amplification module includes first resistance, the second electricity
Resistance, 3rd resistor and the first operational amplifier, second amplification module include the 4th resistance, the 5th resistance, the 6th resistance,
7th resistance and second operational amplifier, the first resistor are arranged on the DAC chip and first operational amplifier
Between in-phase input end, the second resistance is arranged on the inverting input of first operational amplifier and first operation
Between the output terminal of amplifier, the 3rd resistor is arranged on the output terminal of first operational amplifier and the target simulation
Between switch, the 4th resistance is arranged between the inverting input of the DAC chip and the second operational amplifier, institute
State the 5th resistance be arranged on the second operational amplifier inverting input and the second operational amplifier output terminal it
Between, the 6th resistance is arranged between the output terminal of the second operational amplifier and target simulation switch, and described the
Seven resistance connect the normal phase input end of the second operational amplifier.
In addition, in a specific example, as shown in figure 3, target simulation switch includes the first single-pole double-throw switch (SPDT)
With the second single-pole double-throw switch (SPDT), the 3rd resistor connects the first non-moving end of first single-pole double-throw switch (SPDT) and described respectively
Second non-moving end of the second single-pole double-throw switch (SPDT), the 6th resistance connect the second of first single-pole double-throw switch (SPDT) not respectively
Moved end and the first non-moving end of second single-pole double-throw switch (SPDT), the non-moving end of first single-pole double-throw switch (SPDT) and described second
The non-moving end of single-pole double-throw switch (SPDT) connects the LCTF respectively.
In addition, in a specific example, the MCU chip is STM32F405xx chips, STM32F405xx series cores
Piece is small, low in energy consumption, technical grade chip, has unified framework.
In addition, in a specific example, the DAC chip is AD5668 chips.
In addition, in a specific example, the signal amplification unit includes 2N signal amplifier in parallel, described to open
It closes unit and includes 2N analog switch, N is positive integer.
Embodiment two
Above equipment in order to better understand, the application example of this practicality LCTF controllers detailed below.
As shown in figure 4, in the present embodiment, LCTF controllers can include:MCU chip, DAC chip, signal amplification are single
Member, switch unit, temperature detecting unit, constant temperature unit, USB interface, USB turn UART units and power supply, and above-mentioned signal is put
Big unit includes four signal amplifiers in parallel, and above-mentioned switch unit includes four analog switches.MCU chip is
STM32F405xx chips, DAC chip are AD5668 chips.Temperature detecting unit detects the temperature of LCTF, and LCTF is placed on constant temperature
In unit, temperature detecting unit connection MCU chip, host computer connection constant temperature unit.Power supply is respectively MCU chip, DAC cores
Piece, signal amplification unit, switch unit, temperature detecting unit, constant temperature unit and USB turn the power supply of UART units.Above-mentioned host computer
For PC machine.
External host computer turns UART units with the USB by the USB interface and connects MCU chip, host computer output four
A voltage is to the MCU chip, MCU chip connection DAC chip, and DAC chip connects the signal amplifier of each parallel connection respectively, and one
A signal amplifier connects an analog switch, and each analog switch connects LCTF respectively.
Wherein, echo signal amplifier include the first amplification module and the second amplification module, first amplification module and
Second amplification module is in parallel, and the echo signal amplifier is any one signal in four signal amplifiers in parallel
Amplifier, the echo signal amplifier connect the target simulation switch.
First amplification module includes first resistance, second resistance, 3rd resistor and the first operational amplifier, described
Second amplification module includes the 4th resistance, the 5th resistance, the 6th resistance, the 7th resistance and second operational amplifier, and described the
One resistance is arranged between the in-phase input end of the DAC chip and first operational amplifier, the second resistance setting
Between the inverting input of first operational amplifier and the output terminal of first operational amplifier, the 3rd resistor
It is arranged between the output terminal of first operational amplifier and target simulation switch, the 4th resistance is arranged on described
Between the inverting input of DAC chip and the second operational amplifier, the 5th resistance is arranged on second operation and puts
Greatly between the inverting input of device and the output terminal of the second operational amplifier, the 6th resistance is arranged on second fortune
It calculates between the output terminal of amplifier and target simulation switch, the 7th resistance is connecting the second operational amplifier just
Phase input terminal.
The target simulation switch includes the first single-pole double-throw switch (SPDT) and the second single-pole double-throw switch (SPDT), the 3rd resistor point
The first non-moving end of first single-pole double-throw switch (SPDT) and the second non-moving end of second single-pole double-throw switch (SPDT) are not connected, it is described
6th resistance connect respectively first single-pole double-throw switch (SPDT) the second non-moving end and second single-pole double-throw switch (SPDT) first
The non-moving end of non-moving end, the non-moving end of first single-pole double-throw switch (SPDT) and second single-pole double-throw switch (SPDT) connects described respectively
LCTF。
It is evidenced from the above discussion that the present embodiment tunes LCTF using LCTF controllers, machinery is replaced to filter using electric tuning
Piece runner realizes the quick tuning of wave band, has higher spatial resolution and spectral resolution, while LCTF controller volumes
It is small, low in energy consumption, light-weight, it is easy to control, platform stabilization is required relatively low.USB interface is supported to communicate with host computer, having can join
The protocol resource examined, modification are convenient, flexible.Power supply is directly powered, and other power supplys are provided again without outside.Output is carried by DAC
For output square wave amplitude stability is high, and maximum output amplitude is up to 12V.Output channel number is expansible, and square wave frequency is adjustable, frequency
Rate stability is high.Support LCD show that VGA is shown, can root Ju need arbitrary extension, expansion capability is strong.It is same using high-accuracy amplifier
Proportion adjustment, total temperature (- 45~+75) excursions are minimum.Amplitude size is flexibly controllable by upper computer software, facilitates different
Application places.
It is apparent to those skilled in the art that for convenience of description and succinctly, only with above-mentioned each work(
Can module division progress for example, in practical application, can be as needed and by above-mentioned function distribution by different functions
Unit, module are completed, i.e., the internal structure of described device are divided into different functional units or module, to complete above description
All or part of function.Can be that each unit is individually physically present in embodiment, it can also two or more lists
Member is integrated in a unit, and the form that hardware had both may be used in above-mentioned integrated unit is realized, can also use software function
The form of unit is realized.In addition, the specific name of each functional unit, module is also only to facilitate mutually differentiation, is not used to
Limit the protection domain of the application.The specific work process of module in above-described embodiment can refer to pair in previous embodiment
Process is answered, details are not described herein.
In the above-described embodiments, it all emphasizes particularly on different fields to the description of each embodiment, is not described in detail or remembers in some embodiment
The part of load may refer to the associated description of other embodiments.
Those of ordinary skill in the art may realize that each exemplary moulds described with reference to the embodiments described herein
Block can be realized with the combination of electronic hardware or computer software and electronic hardware.These functions actually with hardware still
Software mode performs, specific application and design constraint depending on technical solution.Professional technician can be to each
It is specific to apply to realize described function using distinct methods, but this realization is it is not considered that beyond the utility model
Range.
In embodiment provided by the utility model, it should be understood that disclosed device, it can be by others side
Formula is realized.For example, the apparatus embodiments described above are merely exemplary, for example, the division of the module, only one
Kind of division of logic function, can there is an other dividing mode in actual implementation, for example, multiple units or component can combine or
It is desirably integrated into another system or some features can be ignored or does not perform.Another point, it is shown or discussed it is mutual it
Between coupling or direct-coupling or communication connection can be by some interfaces, the INDIRECT COUPLING or communication of device or unit connect
It connects, can be electrical, machinery or other forms.
The unit illustrated as separating component may or may not be physically separate, be shown as unit
The component shown may or may not be physical unit, you can be located at a place or can also be distributed to multiple
In network element.Some or all of unit therein can be selected according to the actual needs to realize the mesh of this embodiment scheme
's.
In addition, can be that each unit is individually physically present in each embodiment of the utility model, can also two or
More than two units integrate in a unit.The form that hardware had both may be used in above-mentioned integrated unit is realized, can also be adopted
It is realized with the form of SFU software functional unit.
Embodiment described above is only to illustrate the technical solution of the utility model, rather than its limitations;Although with reference to before
Embodiment is stated the utility model is described in detail, it will be understood by those of ordinary skill in the art that:It still can be with
It modifies to the technical solution recorded in foregoing embodiments or equivalent replacement is carried out to which part technical characteristic;And
These modifications are replaced, the spirit for various embodiments of the utility model technical solution that it does not separate the essence of the corresponding technical solution
And range, it should be included within the scope of protection of this utility model.