CN207404197U - A kind of bottom surface packing board for electronic product packaging - Google Patents

A kind of bottom surface packing board for electronic product packaging Download PDF

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Publication number
CN207404197U
CN207404197U CN201721377208.0U CN201721377208U CN207404197U CN 207404197 U CN207404197 U CN 207404197U CN 201721377208 U CN201721377208 U CN 201721377208U CN 207404197 U CN207404197 U CN 207404197U
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CN
China
Prior art keywords
electronic product
cardboard
product packaging
paper layer
support paper
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Expired - Fee Related
Application number
CN201721377208.0U
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Chinese (zh)
Inventor
颜孝儒
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suzhou Hua Jia Paper Products Co Ltd
Original Assignee
Suzhou Hua Jia Paper Products Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
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Priority to CN201721377208.0U priority Critical patent/CN207404197U/en
Application granted granted Critical
Publication of CN207404197U publication Critical patent/CN207404197U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model discloses a kind of bottom surface packing boards for electronic product packaging, belong to product packaging technical field.This is used for the bottom surface packing board of electronic product packaging, including the first cardboard, corrugated paper and the second cardboard, first cardboard and second cardboard are arranged in parallel, support paper layer and mid-board are further included, first cardboard, the support paper layer, the mid-board, the corrugated paper and second cardboard are bonded successively from the bottom to top;Surface of first cardboard away from the support paper layer is provided with multiple bulge-structures;The support paper layer is placed with drier.The utility model passes through said structure, solve electronic product cannot be aerated well in the prior art it is moisture-proof, so as to which electronic product be caused to get rusty, short circuit, influence the normal use of electronic product, and more difficult discovery when being flagged with upward of electronic product packaging printing, electronic product inversion is be easy to cause, so as to be damaged to electronic product.

Description

A kind of bottom surface packing board for electronic product packaging
Technical field
The utility model is related to field of product packaging more particularly to a kind of bottom surface wrapping papers for electronic product packaging Plate.
Background technology
In recent years, consumption electronic product emerges rapidly in China, under the pulling of electronic product growth momentum, paper wrapper skill Art is also rapidly developed with technique.The advantage of paper packing material maximum is raw material sustainable use, and can repeatedly be returned It receives.In addition, consumption electronic product, to the more demanding of packaging structure, inner package structure needs precision, outer packing need to possess good Rigidity, entire package should possess good buffering effect in structure design.And the characteristic that paper packing material is easily worked is proper This demand is catered to easily.In addition, paper packing material has a good printability, and processing technology and equipment compared with into It is ripe, it can realize good printing effect, meet the displaying demand of electronic product packaging.Paper wrapper sweeps across consumption with absolute predominance Electronic product packs market.
But the most of packing boards for still using original bottom surface structure smooth of the packaging of existing electronic product are to electronics Product is packed.When electronic product is stored in warehouse, packing board is directly contacted with ground, if can not be right well Electronic product is aerated moisture-proof, and packaged electronic product is stored in wet air for a long time, and the moisture in air penetrates Paper wrapper, and then condense in the surface of electronic product, penetrates into inside electronic product, so as to which electronic product be caused to get rusty, short circuit, Influence the normal use of electronic product.
Moreover, because most of electronic products there are irreversible particularity, it is necessary to be printed on the wrapper towards above Printed words, and more difficult discovery when being flagged with upward printed be easy to cause electronic product inversion, so as to causing to damage to electronic product Evil.
In view of the above problems, there is an urgent need for design one kind electronic product can be caused to be aerated moisture-proof and with one Determine the bottom surface packing board for electronic product packaging of identification.
Utility model content
One purpose of the utility model is to propose a kind of bottom surface packing board for electronic product packaging, to solve Due to the low easy inversion of identification when the packing case storage of electronic product is easily made moist and placed in the prior art, so as to cause electronics The technical issues of hazard rate is higher.
In order to achieve the above object, the utility model uses following technical scheme:
A kind of bottom surface packing board for electronic product packaging, it is described including the first cardboard, corrugated paper and the second cardboard First cardboard and second cardboard are arranged in parallel, and further include support paper layer and mid-board, first cardboard, the support Paper layer, the mid-board, the corrugated paper and second cardboard are bonded successively from the bottom to top;First cardboard is away from institute It states and is provided with multiple bulge-structures on the face of support paper layer;Drier is placed in the support paper layer.
After this structure, electronic product can be caused to be in the environment of an aeration-drying, avoid electronic product Make moist get rusty, short circuit etc. influences its normal use, so as to significantly reduce the failure rate during electronic product storage;And And by setting bulge-structure, the bottom surface packing board for being used in electronic product packaging has certain identification, avoids electricity More difficult discovery when being flagged with upward of sub- product packaging printing, which be easy to cause electronic product and is inverted the phenomenon that causing its damage, to be occurred.
Further, the bulge-structure is hemisphere domes, quadrangular, cylinder or round platform.
Further, the surface of the bulge-structure and first cardboard are both provided with the surface of the bulge-structure On be provided with waterproof layer.
After this structure so that the bottom surface wrapping paper for electronic product packaging has water-proof function, is produced for electronics Product have stored mostly safely a guarantee.
Further, the support paper layer is the structure that honeycomb or multiple hollow triangular-prisms are composed, described Drier is placed in the honeycomb hollow-core construction of the support paper layer or in the hollow-core construction of the hollow triangular-prism.
After this structure, drier is enabled to be evenly distributed on entire support paper layer, so that entirely Drying effect for the bottom surface packing board of electronic product packaging is more preferably uniform, and paper layer is supported to be also used as electricity The enhancement layer of the bottom surface packing board of sub- product packaging provides certain supporting role for it.
Further, the height of the bulge-structure is 5mm-80mm.
After this structure, and the altitude range of bulge-structure is set, it is ensured that for the bottom of electronic product packaging Bread paper loading plate has certain ventilation effect, will not also be set due to bulge-structure it is excessively high cause electronic product crank and It tilts.
Further, the corrugated paper is E shape structures.
After this structure, it can meet with certain aesthetic and the single-piece bag for being put into appropriate weight electronic product The requirement of dress.
The beneficial effects of the utility model:
1) for the bottom surface packing board that electronic product is packed by setting multiple bulge-structures, and set and be placed with drier Support paper layer, ensure electronic product storage when be in the environment of aeration-drying, solving in the prior art can not be fine Ground is aerated electronic product moisture-proof, and so that electronic product be caused to get rusty, short circuit, the normal use for influencing electronic product is asked Topic significantly reduces the failure rate during electronic product storage;
2) it by setting bulge-structure, can be easy to tell the bottom surface of packing case, avoid electronic product packaging print More difficult discovery when being flagged with upward of brush, which be easy to cause electronic product and is inverted the phenomenon that causing its damage, to be occurred;
3) the support paper layer of drier is placed with by setting, additionally it is possible to be the bottom packed for electronic product as enhancement layer Bread paper loading plate provides certain supporting role.
Description of the drawings
Fig. 1 is a kind of inverted knot of bottom surface packing board for electronic product packaging in the utility model embodiment one Structure schematic diagram;
Fig. 2 is the sectional view of the one of which support paper layer in the utility model embodiment one;
Fig. 3 is a kind of inverted knot of bottom surface packing board for electronic product packaging in the utility model embodiment two Structure schematic diagram.
In figure:
1st, the first cardboard;2nd, the second cardboard, 3, mid-board;4th, paper layer is supported;5th, corrugated paper;6th, bulge-structure.
Specific embodiment
The technical issues of to solve the utility model, the technical solution used and the technique effect reached are clearer, Further illustrate the technical solution of the utility model below with reference to the accompanying drawings and specific embodiments.It is understood that Specific embodiment described herein is used only for explaining the utility model rather than the restriction to the utility model.In addition also need It is noted that illustrate only for ease of description, in attached drawing with the relevant part of the utility model and it is not all.
Embodiment one
Present embodiment discloses a kind of bottom surface packing board for electronic product packaging, including the first cardboard 1, intermediate paper Plate 3, support paper layer 4,5 and second cardboard 2 of corrugated paper.They are bonded successively from the bottom to top and the first cardboard 1, the second cardboard 2 It is mutually arranged in parallel with mid-board 3.Multiple bulge-structures 6 are provided on first face of the cardboard 1 away from support paper layer 4, it is convex It plays structure 6 and could be provided as the various structures such as hemisphere arch shape, quadrangular, cylinder or round platform, and can also be two kinds or more Kind structure combination settings are in the bottom surface packing board packed for electronic product.The bulge-structure 6 of the present embodiment is selected as half Ball domes, as shown in Figure 1.By setting multiple bulge-structures 6 on the first cardboard 1 so that have above-mentioned bottom surface packaging The packing case of cardboard leaves ground certain distance, so that the electronic product in packing case is in draughty ring when storing In border, and by above-mentioned bulge-structure 6, it can be easy to tell the bottom surface of packing case, avoid due to seeing or missing by mistake Mark is placed in printing so that packing case is put upside down the phenomenon that electronic product is caused to damage.The altitude range that bulge-structure 6 is set Generally 5mm-80mm ensures that the bottom surface packing board for electronic product packaging has certain ventilation effect, will not also be by In bulge-structure 6 set it is excessively high cause electronic product crank and run-off the straight.
In the present embodiment, it is preferred that be provided on the surface of bulge-structure 6 and the first cardboard 1 on the surface of bulge-structure 6 Waterproof layer is both provided with, by the setting of the waterproof layer, the bottom surface packing board for electronic product packaging is enabled to have Certain waterproof effect is that electronic product has stored mostly safely a guarantee.
In the present embodiment, above-mentioned support paper layer 4 is the structure that honeycomb or multiple hollow triangular-prisms are composed, and is done Drying prescription is placed in the honeycomb hollow-core construction of support paper layer 4 or in the hollow-core construction of hollow triangular-prism, on the one hand ensure that electronics Product storage when in the environment of a well-ventilated and drying, significantly reduce electronic product storage when due to making moist And the failure rate that it is caused to damage, on the other hand paper layer 4 is supported to be also used as the bottom surface wrapping paper of electronic product packaging The enhancement layer of plate provides certain supporting role for it.And support paper layer 4 is arranged in honeycomb hollow-core construction or multiple skies The structure that heart triangular prism is composed enables to drier to be evenly distributed on entire support paper layer 4, so that entirely Drying effect for the bottom surface packing board of electronic product packaging is more preferably uniform.In the present embodiment, as shown in Fig. 2, shown branch Support paper layer 4 selects the structure that multiple hollow triangular-prisms are composed.
In addition, corrugated paper 5 is E shape structures, it can meet with certain aesthetic and be put into appropriate weight electronic product Packed single requirement.
Embodiment two
Present embodiment discloses it is a kind of for electronic product packaging bottom surface packing board, as shown in figure 3, the present embodiment with Embodiment one differs only in:The bulge-structure 6 of the bottom surface packing board for electronic product packaging of the present embodiment is four Prism.By the way that bulge-structure 6 is arranged to quadrangular, there is processing and fabricating simply and easily benefit.
Remaining structure of the present embodiment and one all same of embodiment, details are not described herein.
Embodiment of above is to elaborate the basic principle and characteristic of the utility model, and the utility model is from above-mentioned reality The mode of applying limits, and on the premise of not departing from the spirit and scope of the utility model, the utility model also has various changes, These changes and modifications are both fallen in claimed the scope of the utility model.The utility model requires protection scope is by appended Claims and its equivalent thereof.

Claims (6)

1. a kind of bottom surface packing board for electronic product packaging, including the first cardboard (1), corrugated paper (5) and the second cardboard (2), first cardboard (1) and second cardboard (2) are arranged in parallel, which is characterized in that further include support paper layer (4) and in Between cardboard (3), first cardboard (1), the support paper layer (4), the mid-board (3), the corrugated paper (5) and described Second cardboard (2) is bonded successively from the bottom to top;Surface of first cardboard (1) away from the support paper layer (4) is provided with more A bulge-structure (6);Drier is placed in the support paper layer (4).
2. the bottom surface packing board according to claim 1 for electronic product packaging, which is characterized in that the protrusion knot Structure (6) is hemisphere domes, quadrangular, cylinder or round platform.
3. the bottom surface packing board according to claim 1 or 2 for electronic product packaging, which is characterized in that described convex The surface and first cardboard (1) for playing structure (6) are provided on the surface of the bulge-structure (6) and are both provided with waterproof Layer.
4. the bottom surface packing board according to claim 1 for electronic product packaging, which is characterized in that the support paper Layer (4) is the structure that honeycomb or multiple hollow triangular-prisms are composed, and the drier is placed on the support paper layer (4) in honeycomb hollow-core construction or in the hollow-core construction of the hollow triangular-prism.
5. the bottom surface packing board according to claim 1 for electronic product packaging, which is characterized in that the protrusion knot The height of structure (6) is 5mm-80mm.
6. the bottom surface packing board according to claim 1 for electronic product packaging, the corrugated paper (5) is E shape knots Structure.
CN201721377208.0U 2017-10-24 2017-10-24 A kind of bottom surface packing board for electronic product packaging Expired - Fee Related CN207404197U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201721377208.0U CN207404197U (en) 2017-10-24 2017-10-24 A kind of bottom surface packing board for electronic product packaging

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201721377208.0U CN207404197U (en) 2017-10-24 2017-10-24 A kind of bottom surface packing board for electronic product packaging

Publications (1)

Publication Number Publication Date
CN207404197U true CN207404197U (en) 2018-05-25

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
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Country Status (1)

Country Link
CN (1) CN207404197U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111099163A (en) * 2019-12-05 2020-05-05 合肥凯邦电机有限公司 Component for separating plastic package motor package partition plate and package partition plate
CN111169092A (en) * 2020-03-03 2020-05-19 东莞市润信环保包装科技有限公司 Preparation process of waterproof stain-resistant corrugated carton

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111099163A (en) * 2019-12-05 2020-05-05 合肥凯邦电机有限公司 Component for separating plastic package motor package partition plate and package partition plate
CN111169092A (en) * 2020-03-03 2020-05-19 东莞市润信环保包装科技有限公司 Preparation process of waterproof stain-resistant corrugated carton

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GR01 Patent grant
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CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20180525

Termination date: 20211024

CF01 Termination of patent right due to non-payment of annual fee