CN207382671U - A kind of HDI wiring boards containing blind hole - Google Patents

A kind of HDI wiring boards containing blind hole Download PDF

Info

Publication number
CN207382671U
CN207382671U CN201721538343.9U CN201721538343U CN207382671U CN 207382671 U CN207382671 U CN 207382671U CN 201721538343 U CN201721538343 U CN 201721538343U CN 207382671 U CN207382671 U CN 207382671U
Authority
CN
China
Prior art keywords
blind hole
wiring board
hdi
wiring boards
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201721538343.9U
Other languages
Chinese (zh)
Inventor
余燕舞
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jiangxi Competes For Polytron Technologies Inc
Original Assignee
Jiangxi Competes For Polytron Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jiangxi Competes For Polytron Technologies Inc filed Critical Jiangxi Competes For Polytron Technologies Inc
Priority to CN201721538343.9U priority Critical patent/CN207382671U/en
Application granted granted Critical
Publication of CN207382671U publication Critical patent/CN207382671U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

The utility model discloses a kind of HDI wiring boards containing blind hole, including HDI wiring board bodies, the HDI wiring boards body includes the first line plate set gradually from the bottom up, the second wiring board positioned at the first line plate bottom, tertiary circuit plate positioned at the second wiring board bottom, the 4th wiring board positioned at the tertiary circuit plate bottom, and the 5th wiring board positioned at the 4th wiring board bottom, the first line plate is equipped with the first blind hole, the first blind hole one side is equipped with the second blind hole, the 3rd blind hole is equipped on the downside of second blind hole, first blind via bottom is equipped with buried via hole, the buried via hole inner cavity is equipped with conductive rod, the conductive rod opposite side is connected with the 5th wiring board, further include insulating layer, waterproof layer, desiccant layer, frame, mounting hole, fixed plate, handle and pipelined channel;HDI wiring boards provided by the utility model containing blind hole, water resistance is good, small, and light weight is easily carried, easy to use.

Description

A kind of HDI wiring boards containing blind hole
Technical field
The utility model is related to wiring board technology field, more particularly to a kind of HDI wiring boards containing blind hole.
Background technology
Chinese patent literature publication number CN206490890U it is a kind of can random layer interconnection high density HDI wiring boards, including HDI wiring board bodies, the HDI wiring boards bodies top are equipped with first line plate, and the first line plate bottom is connected with the Two wiring boards, the second wiring board bottom are connected with tertiary circuit plate, and the tertiary circuit plate bottom is equipped with the 4th wiring board, The 4th wiring board bottom is equipped with the 5th wiring board, the first line plate, the second wiring board, tertiary circuit plate, the 4th line Insulating cement is all equipped between road plate, the 5th each floor of wiring board, the first line plate is equipped with the first blind hole, first blind hole One side is equipped with the second blind hole, the 3rd blind hole is equipped on the downside of second blind hole, first blind via bottom is equipped with buried via hole, described to bury Hole inner cavity is equipped with conductive rod, and the conductive rod opposite side is connected with the 5th wiring board, and the first line plate is equipped with conductor wire Road.Multilayer circuit board is bonded together by the patent by different side's conducting resinl, while flexibly uses blind hole, buried via hole and conductive rod Cooperation setting in the circuit board enables each interlayer of HDI wiring boards arbitrarily to interconnect, so as to meet the complicated electricity of electronic product The demand of device connection design, while also effectively prevent when deep layer drill and hole metallization caused by liquid medicine exchange energy force difference etc. Various problems.But due to PCB surface described in the patent and it is not provided with related waterproof measure so that wiring board described in the patent It easily intakes and damages wiring board, and be also unfavorable for carrying.
Utility model content
It is the defects of in order to overcome the prior art, a kind of containing blind the technical problem to be solved by the utility model is to propose The HDI wiring boards in hole set insulating layer, waterproof layer, desiccant layer, frame, mounting hole, fixed plate, flowing water on HDI wiring boards Passage;Not only there is good waterproof ability, and it is small, and light weight is easily carried, and is not easy to be disturbed by extraneous factor, therefore Barrier rate is low, easy to use, at low cost.
For this purpose, the utility model uses following technical scheme:
A kind of HDI wiring boards containing blind hole provided by the utility model, including HDI wiring board bodies, the HDI circuits Plate body includes the first line plate, the second wiring board positioned at the first line plate bottom, position set gradually from the bottom up Tertiary circuit plate in the second wiring board bottom, positioned at the tertiary circuit plate bottom the 4th wiring board and be located at 5th wiring board of the 4th wiring board bottom, the first line plate, second wiring board, the tertiary circuit plate, 4th wiring board, the 5th wiring board are fixedly connected by insulating cement, and it is blind that the first line plate is equipped with first Hole, the first blind hole one side are equipped with the second blind hole, the 3rd blind hole, first blind via bottom are equipped on the downside of second blind hole Equipped with buried via hole, the buried via hole inner cavity is equipped with conductive rod, and the conductive rod opposite side is connected with the 5th wiring board, and described first Wiring board is equipped with conducting wire;Insulating layer, waterproof layer, desiccant layer, frame, mounting hole, fixed plate, flowing water is further included to lead to Road;The insulating layer is attached between each adjacent lines plate;The waterproof layer bonding is in first line plate surface;The drying Oxidant layer is covered in the 5th wiring board bottom;The frame is connected by the desiccant layer of bottom;Outside the fixed plate It encloses to be surrounded by the frame and passed through the mounting hole and firmly be placed on the frame;The pipelined channel is through entire In HDI wiring boards.
Preferably, the waterproof layer surface covers one layer of oxide.
Preferably, the material in the insulating layer is different side's conducting resinl.
Preferably, the drier in the desiccant layer is silica-gel desiccant.
Preferably, the material of the frame is megohmite insulant.
Preferably, the frame both sides are provided with handle and jack;The jack is arranged at the handle of the right side frame Lower section.
Preferably, grafting is equipped with water pipe in the pipelined channel.
Preferably, the desiccant layer is provided with earthing rod;The earthing rod by the insertion desiccant layer with it is described The conducting wire of 5th PCB surface is connected.
The beneficial effects of the utility model are:
HDI wiring boards provided by the utility model containing blind hole, by being provided with insulating layer on HDI wiring boards, preventing Water layer, desiccant layer, frame, mounting hole, fixed plate, handle, pipelined channel;Waterproof layer adds water resistance;Desiccant layer Absorb the moisture in wiring board inner air;Fixed plate and frame are installed by mounting hole in the circuit board, on frame Handle is set, is conducive to carry.
Description of the drawings
Fig. 1 is the structure diagram for the HDI wiring boards containing blind hole that specific embodiment of the present invention provides.
The top view for the HDI wiring boards containing blind hole that Fig. 2 specific embodiments of the present invention provide.
In figure:1st, HDI wiring boards body;21st, first line plate;22nd, the second wiring board;23rd, tertiary circuit plate;24th, Four wiring boards;3rd, insulating layer;41st, the first blind hole;42nd, the second blind hole;43rd, the 3rd blind hole;5th, conductive rod;6th, buried via hole;7th, flowing water Passage;8th, water pipe;9th, waterproof layer;10th, desiccant layer;11st, frame;12nd, mounting hole;13rd, handle;14th, fixed plate;15、 Earthing rod;16th, conducting wire;17th, jack.
Specific embodiment
Further illustrate the technical solution of the utility model below with reference to the accompanying drawings and specific embodiments.
Show to Fig. 1 exemplaries a kind of structure diagram of HDI wiring boards containing blind hole provided by the utility model, Including HDI wiring boards body 1, HDI wiring boards body 1 includes the first line plate 21 set gradually from the bottom up, positioned at first Second wiring board 22 of 21 bottom of wiring board, positioned at the tertiary circuit plate 23 of 22 bottom of the second wiring board, positioned at tertiary circuit plate 4th wiring board 24 of 23 bottoms and the 5th wiring board 25 positioned at 24 bottom of the 4th wiring board, first line plate 21, second Wiring board 22, tertiary circuit plate 23, the 4th wiring board 24, the 5th wiring board 25 are fixedly connected by insulating cement, first line Plate 21 is equipped with the first blind hole 41, and 41 one side of the first blind hole is equipped with the second blind hole 42, and 42 downside of the second blind hole is equipped with the 3rd blind hole 43,41 bottom of the first blind hole is equipped with buried via hole 6, and 6 inner cavity of buried via hole is equipped with conductive rod 5, and 5 opposite side of conductive rod is connected with the 5th wiring board 25, first line plate 21 is equipped with conducting wire 16, further includes insulating layer 3, waterproof layer 9, desiccant layer 10, frame 11, fixation Hole 12, fixed plate 14, pipelined channel 7;Insulating layer 3 is attached between each adjacent lines plate;Waterproof layer 6 is binded in first line plate On 21 surfaces;Desiccant layer 10 is covered in 25 bottom of the 5th wiring board;Frame 11 is connected by the desiccant layer 10 of bottom;It is fixed 14 periphery of plate, which is surrounded by frame 11 and passed through mounting hole 12, to be firmly placed on frame 11;Pipelined channel 7 is through entire HDI lines In road plate 1;Waterproof layer 9 adds water resistance, and desiccant layer 10 absorbs the moisture in wiring board inner air.
Further, 9 surface of waterproof layer covers one layer of oxide, so prevents that waterproof layer 9 is lost caused by due to oxidation, Increase whole security.
Further, the material in insulating layer 3 is different side's conducting resinl, is played absolutely with well viscous stickiness using its insulating properties Edge and connection function.
Further, the drier in desiccant layer 10 is silica-gel desiccant, utilizes the water absorbing capacity that silica-gel desiccant is extremely strong Power, by the moisture absorption in wiring board inner air.
Further, the material of frame 11 is megohmite insulant, so can more effectively completely cut off electric current, avoid causing electric shock thing Therefore also avoid the influence caused by wiring board when human body is touched.
Further, 11 both sides of frame are provided with handle 13 and jack 17;Jack 17 is arranged at the handle of Right Border 11 13 lower sections, the handle of setting can be conducive to people's carrying.
Further, grafting is equipped with water pipe 8, position meeting in actual fabrication of pipelined channel 7 in pipelined channel 7 The position that stagger circuitry is laid, the setting of water pipe 8 can cause moisture to be flowed into desiccant layer 10 by water pipe 8, more Effectively wiring board is avoided to be damaged be subject to water.
Further, desiccant layer is provided with earthing rod 15;Earthing rod 15 passes through embedded 10 and the 5th circuit of desiccant layer The conducting wire on 25 surface of plate is connected, and conduct current ground can be ensured safety.
In conclusion the HDI wiring boards containing blind hole disclosed in the utility model, mainly by being set on HDI wiring boards It is equipped with insulating layer, waterproof layer, desiccant layer, frame, mounting hole, fixed plate, handle, pipelined channel;Waterproof layer adds waterproof Performance;Desiccant layer absorbs the moisture in wiring board inner air;Fixed plate and frame are mounted on circuit by mounting hole On plate, handle on frame is set, is conducive to carry.
The utility model is described with reference to the preferred embodiments, and those skilled in the art know, is not departing from this reality In the case of with new spirit and scope, various changes or equivalence replacement can be carried out to these features and embodiment.This reality It is not limited to the particular embodiment disclosed with new, other embodiments fallen into claims hereof all belong to In the scope of the utility model protection.

Claims (8)

1. a kind of HDI wiring boards containing blind hole, including HDI wiring boards body (1), the HDI wiring boards body (1) include from Under up set gradually first line plate (21), the second wiring board (22) positioned at first line plate (21) bottom, position Tertiary circuit plate (23) in the second wiring board (22) bottom, the 4th circuit positioned at tertiary circuit plate (23) bottom Plate (24) and the 5th wiring board (25) positioned at the 4th wiring board (24) bottom, it is the first line plate (21), described Second wiring board (22), the tertiary circuit plate (23), the 4th wiring board (24), the 5th wiring board (25) pass through Insulating cement is fixedly connected, and the first line plate (21) is equipped with the first blind hole (41), and the first blind hole (41) one side is equipped with Second blind hole (42), the second blind hole (42) downside are equipped with the 3rd blind hole (43), and the first blind hole (41) bottom is equipped with and buries Hole (6), buried via hole (6) inner cavity are equipped with conductive rod (5), and conductive rod (5) opposite side is connected with the 5th wiring board (25), the first line plate (21) is equipped with conducting wire (16), it is characterised in that:
Further include insulating layer (3), waterproof layer (9), desiccant layer (10), frame (11), mounting hole (12), fixed plate (14), stream Aquaporin (7);
The insulating layer (3) is attached between each adjacent lines plate;
Waterproof layer (9) bonding is on first line plate (21) surface;
The desiccant layer (10) is covered in the 5th wiring board (25) bottom;
The frame (11) is connected by desiccant layer described in bottom (10);
Fixed plate (14) periphery, which is surrounded by the frame (11) and passed through the mounting hole (12), is firmly placed in the side On frame (11);
The pipelined channel (7) is through in entire HDI wiring boards body (1).
2. the HDI wiring boards according to claim 1 containing blind hole, it is characterised in that:
Waterproof layer (9) surface covers one layer of oxide.
3. the HDI wiring boards according to claim 1 containing blind hole, it is characterised in that:
Material in the insulating layer (3) is different side's conducting resinl.
4. the HDI wiring boards according to claim 1 containing blind hole, it is characterised in that:
Drier in the desiccant layer (10) is silica-gel desiccant.
5. the HDI wiring boards according to claim 1 containing blind hole, it is characterised in that:
The material of the frame (11) is megohmite insulant.
6. the HDI wiring boards according to claim 1 containing blind hole, it is characterised in that:
Frame (11) both sides are provided with handle (13) and jack (17);
The jack (17) is arranged at below the handle (13) of the right side frame (11).
7. the HDI wiring boards according to claim 1 containing blind hole, it is characterised in that:
The interior grafting of the pipelined channel (7) is equipped with water pipe (8).
8. the HDI wiring boards according to claim 1 containing blind hole, it is characterised in that:
The desiccant layer is provided with earthing rod (15);
The earthing rod (15) is connected by the insertion desiccant layer (10) with the conducting wire on the 5th wiring board (25) surface.
CN201721538343.9U 2017-11-16 2017-11-16 A kind of HDI wiring boards containing blind hole Active CN207382671U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201721538343.9U CN207382671U (en) 2017-11-16 2017-11-16 A kind of HDI wiring boards containing blind hole

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201721538343.9U CN207382671U (en) 2017-11-16 2017-11-16 A kind of HDI wiring boards containing blind hole

Publications (1)

Publication Number Publication Date
CN207382671U true CN207382671U (en) 2018-05-18

Family

ID=62333245

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201721538343.9U Active CN207382671U (en) 2017-11-16 2017-11-16 A kind of HDI wiring boards containing blind hole

Country Status (1)

Country Link
CN (1) CN207382671U (en)

Similar Documents

Publication Publication Date Title
CN207382671U (en) A kind of HDI wiring boards containing blind hole
CN104420420B (en) The platform plate insulation system of subway shield door
SE9702725D0 (en) Multilayered interconnect card that can reduce crosstalk noise
CN207382660U (en) A kind of high backlight FPC circuit boards of water resistance
CN207053873U (en) A kind of inexpensive flexible PCB
CN103438910A (en) Novel electromagnetic shielding piezoelectric interlayer
CN207151018U (en) A kind of electrical control cabinet detection means
CN208424905U (en) One kind having accurate full-scale wiring board
CN206525020U (en) A kind of novel multi-layer wiring board
CN206024227U (en) Portable multi-deck wiring board
CN207783285U (en) A kind of integral type HDI wiring boards
CN206314065U (en) A kind of panel computer high density interconnection line plate
CN207783246U (en) A kind of rapid cooling type HDI wiring boards
CN208422292U (en) A kind of buried weather-proof display screen structure
CN207572796U (en) A kind of outdoor electrical control cabinet with guardrail
CN207645550U (en) A kind of electric curl-up film device earthed circuit and automatic rolling system
CN206076674U (en) A kind of intelligent sphere is with intelligent bar and using the intelligent sphere and the building system of intelligent bar
CN205900990U (en) Cable is arranged with stromatolite mother that hard copper combined together
CN206516366U (en) A kind of novel aluminum-magnesium alloy wire
CN201594360U (en) Connecting structure of flexible LED display screen
CN206422972U (en) A kind of hydrocarbon circuit board of high-strength ceramic using the formula design of paving copper
CN216491811U (en) Shielding conductive cloth
CN208029256U (en) A kind of rain-proof protection against electric shock outdoor communication cabinet
CN219204797U (en) Integrated circuit board with good dustproof performance
CN205594107U (en) Be suitable for trouble warning device for 10KV distribution lines

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant
PE01 Entry into force of the registration of the contract for pledge of patent right
PE01 Entry into force of the registration of the contract for pledge of patent right

Denomination of utility model: A kind of HDI circuit board with blind hole

Effective date of registration: 20210120

Granted publication date: 20180518

Pledgee: Bank of Communications Ltd. Ji'an branch

Pledgor: JIANGXI JINGCHAO TECHNOLOGY Co.,Ltd.

Registration number: Y2021360000002

PC01 Cancellation of the registration of the contract for pledge of patent right
PC01 Cancellation of the registration of the contract for pledge of patent right

Date of cancellation: 20220127

Granted publication date: 20180518

Pledgee: Bank of Communications Ltd. Ji'an branch

Pledgor: JIANGXI JINGCHAO TECHNOLOGY CO.,LTD.

Registration number: Y2021360000002