CN207379441U - A kind of suspended sensor clearance measurement linear fit and correction of temperature drift circuit - Google Patents

Abstract

The utility model is related to magnetic floating train suspending sensor technical field more particularly to a kind of suspended sensor clearance measurement linear fits and correction of temperature drift circuit.The utility model is using FPGA unit, A/D modular converters, temperature sensor as core；Calculated using FPGA unit, the acquisition of A/D modules, ROM storages, number such as are tabled look-up at the Technology design of digitlization linear fit and correction of temperature drift, solve the problems, such as that debugging step is cumbersome, debug time is long；Reach raising production efficiency and suspended sensor clearance measurement is linear, reduce the technique effect of suspended sensor clearance measurement temperature drift.

Description

A kind of suspended sensor clearance measurement linear fit and correction of temperature drift circuit

Technical field

The utility model is related to magnetic floating train suspending sensor technical fields more particularly to a kind of suspended sensor gap to survey Measure linear fit and correction of temperature drift circuit.

Background technology

Magnetic-levitation train is a kind of new rail vehicle transportation instrument, with running noises are low, climbing capacity is strong, turns partly Footpath is small, safe and reliable high distinguishing feature.The key technology of magnetic-levitation train is suspension control, and the key element for the control that suspends Including suspended sensor.Suspended sensor is the eyes of suspension control system, and the clearance measurement of suspended sensor is that measurement suspends Air gap between electromagnet and track, this air gap are commonly referred to as levitation gap；The acceleration analysis of suspended sensor is measurement The catenary motion acceleration of electromagnet.Suspension controller changes according to more than gap signal and acceleration signal in levitating electromagnet The size of portion's electric current so as to adjust the attraction between levitating electromagnet and track, makes magnetic-levitation train keep stable suspersion state. Medium-and low-speed maglev train suspended sensor exports three road gap signals, and the linear and temperature drift of clearance measurement directly affects suspension control Effect.

The operation principle of suspended sensor clearance measurement is based on eddy current effect, and sensing element is the clearance measurement line of induction It encloses, parallel resonance capacitance on induction coil.In the prior art, debugging resonant capacitance and follow-up analog circuit work ginseng are relied primarily on Number ensures the linear and temperature drift index of suspended sensor, and debugging step is more, and debug time is long so that low production efficiency.

Utility model content

Technical problem to be solved in the utility model is for above-mentioned technical deficiency, provides a kind of suspension Sensor gap measures linear fit and correction of temperature drift circuit, is calculated using FPGA units, AD is gathered, ROM is stored, number is looked into Table etc. digitizes the Technology design of linear fit and correction of temperature drift, solves the problems, such as that debugging step is cumbersome, debug time is long；It reaches Raising production efficiency has been arrived, has improved the linear of suspended sensor clearance measurement, has reduced the temperature drift of suspended sensor clearance measurement Technique effect.

In order to solve the above technical problems, technical solution is used by the utility model：A kind of suspended sensor gap is surveyed Measure linear fit and correction of temperature drift circuit, including FPGA unit, A/D modular converter A, A/D modular converters B, temperature sensor, Gap measures analogue unit and ROM storage modules；The input side of A/D modular converters A is connected with amplifying circuit A, A/D modular converter A By amplifying circuit A connection temperature sensors, the outlet side of A/D modular converters A is connected on the I/O mouths of FPGA unit；A/D turns The input side of mold changing block B is connected with amplifying circuit B, A/D modular converter B by amplifying circuit B connection suspended sensors, and A/D turns The outlet side of mold changing block B is connected on the I/O mouths of FPGA unit；FPGA unit one side serial ports is connected with UART interface A and UART Interface B, FPGA unit are connected with host computer by UART interface A, and ROM storage modules are connected on the I/O mouths of FPGA unit.

Further optimize the technical program, the A/D modular converters A is 6 bit A/D converters, and A/D modular converters B is 14 Bit A/D converter.

Further optimize the technical program, IN0 feet connection amplifying circuit A, the A/D modulus of conversion of the A/D modular converters A The I/O port of the signal output foot connection FPGA unit of block A；

Further optimize the technical program, the UART interface A and UART interface B are asynchronous communication interface circuit；Temperature Degree sensor is PTC1000 thermilinear thermistors.

Compared with prior art, the utility model has the following advantages：1st, the suspended sensor gap of the utility model is surveyed Linear fit and correction of temperature drift circuit are measured, the performance of sensor is improved, the non-linear of sensor is made to be increased to by 1% 0.5%, the temperature drift of sensor is made to be reduced to 0.5mm by 1mm；

2nd, the utility model reduces debugging step, improves production efficiency；

3rd, A/D converts transposition and FPGA system has high speed, high-precision, Low Drift Temperature, outstanding long-term accuracy and repeats Property, the characteristic of low-power consumption, make this circuit have higher accuracy.

Description of the drawings

Fig. 1 is the utility model cut-away view；

Fig. 2 is FPGA unit and ROM storage module circuit structure diagrams；

Fig. 3 is A/D modular converter circuit structure diagrams；

Fig. 4 is amplifying circuit A structure charts；

Amplifying circuit B structure figure during Fig. 5；

Fig. 6 is simulation gap signal datagram；

Fig. 7 is linear fit and the gap signal datagram after correction of temperature drift.

In figure, 1, FPGA unit；2nd, A/D modular converters A；3rd, A/D modular converters B；4th, clearance measurement analogue unit；5th, it is warm Spend sensor；6th, UART interface B；7th, UART interface A；8th, ROM storage modules；9th, host computer；10th, amplifying circuit A；11st, amplify Circuit B.

Specific embodiment

To make the objectives, technical solutions and advantages of the present invention clearer, With reference to embodiment And referring to the drawings, the utility model is further described.It should be understood that these descriptions are merely illustrative, and do not really want Limit the scope of the utility model.In addition, in the following description, the description to known features and technology is omitted, to avoid not Necessarily obscure the concept of the utility model.

Specific embodiment one：As shown in Figs. 1-5, a kind of suspended sensor clearance measurement linear fit and correction of temperature drift electricity Road, including FPGA unit 1, A/D modular converter A2, A/D modular converters B3, clearance measurement analogue unit 4,5 and of temperature sensor ROM storage modules 8；The input side of A/D modular converters A2 is connected with amplifying circuit A10, A/D modular converter A2 and passes through amplifying circuit A10 connections temperature sensor 5, the outlet side of A/D modular converters A2 is connected on the I/O mouths of FPGA unit 1；A/D modular converters The input side of B3 is connected with amplifying circuit B11, A/D modular converter B3 and measures analogue unit by amplifying circuit B11 joint gaps The outlet side of 4, A/D modular converter B3 is connected on the I/O mouths of FPGA unit 1；1 one side serial ports of FPGA unit is connected with UART and connects Mouth A7 and UART interface B6, FPGA unit 1 are connected with host computer, 1 opposite side of FPGA unit parallel connection by UART interface A7 There is key switch；ROM storage modules 8 are connected on the I/O mouths of FPGA unit 1.The A/D modular converters A2 turns for 6 AD Parallel operation, A/D modular converters B3 are 14 bit A/D converters.

The signal output foot of IN0 feet connection amplifying circuit A10, the A/D modular converter A2 of the A/D modular converters A2 connects Connect the PA mouths of FPGA unit 1；The UART interface A6 and UART interface B7 is asynchronous communication interface circuit；Temperature sensor 5 For PTC1000 thermilinear thermistors；

A PTC1000 thermilinear thermistor is disposed about as temperature sensor in clearance measurement analogue unit 4 first 5, by nursing one's health output temperature analog signal.

As shown in Figure 1, the utility model circuit by FPGA unit 1, A/D modular converter A2, A/D modular converters B3, Gap measurement analogue unit 4, temperature sensor 5 and relevant controlling bus, address bus, data/address bus are formed.A/D moduluss of conversion Block A2 is 6 bit A/D converters, and cut-in temperature analog signal, A/D modular converters A2 is that 6 bit A/D converters pass through control with FPGA unit Bus processed, data/address bus are connected；ROM storage modules 8 pass through controlling bus, address bus, data/address bus phase with FPGA unit 1 Connection.FPGA unit 1 is also connected with two asynchronous communication interface circuits of UART interface A6 and UART interface B7, UART interface B7 work In the transceiver mode, function is as communication interface；UART interface A6 works in the transmit mode, and function is gap measurement signal Output.

The utility model is described in detail below in conjunction with the drawings and specific embodiments.

Backlash signal is acquired by A/D modular converters B3, and such as attached drawing 4, there are larger for backlash signal Non-linear distortion, levitation gap is bigger, and the increment of AD values is smaller.Temperature signal is acquired by A/D modular converters A2.A/D Modular converter B3 is 14 ADC, and 0~10V correspondences are quantized into 0~16383；A/D modular converters A2 be 6 ADC, -25 DEG C~100 DEG C correspondence is quantized into 0~63.A/D modular converters A2 and A/D modular converters B3 have shared a multichannel ADC converter, when adopting During sample temperature signal, retention data exports 6 high.

According to the order received from UART interface B7 communication interfaces, FPGA unit 1 can be operated in calibration before, calibration, survey Measure three kinds of operating modes.The operating mode before calibration, FPGA unit 1 control A/D modular converters A2 and A/D to turn by controlling bus Mold changing block B3 is other to be acquired backlash signal and temperature mould signal, and AD is connect after quantifying by UART interface A6 serial communications Mouth is exported to external host computer 9.If 0 DEG C, 25 DEG C, 85 DEG C of totally 3 calibration temperature spots, under each temperature spot, by it is external specially Being respectively at 0mm, 1mm, 2mm with equipment adjustment levitation gap ..., 20mm demarcates gap point, 3 × 21 data outputs for totally 21 To outer computer.3 × 21 data form a two-dimensional array, and external 9 program of host computer uses least square method by data The two-dimensional array of new 64 × 21 data composition is fitted to, this process is correction of temperature drift process.New two-dimensional array, altogether There are 64 rows, corresponding temperature AD values 0~63；Share 21 row, levitation gap AD amounts of the corresponding levitation gap interval 1mm from 0 to 20mm Change value.Next, computer program is fitted every 21 data of row, by least square fitting into 4096 data, structure Into the two-dimensional array of 64 × 4096 data compositions.This array shares 4096 row, from the 0th row to the 4095th corresponding 0mm of row to 20mm.This array data is linear fit and the data after correction of temperature drift.

Under staking-out work pattern, FPGA unit 1 communicates with external host computer 9, after linear fit and correction of temperature drift Data sort according to certain rules to be written in ROM storage modules 8.In the present embodiment, stored using 6 AD values of temperature as ROM High 6 bit address of module 8, low 14 bit address using 14, gap AD values as ROM storage modules 8.It is pressed in ROM storage modules 8 More than address stores corresponding standard clearance value.

Suspended sensor is usually operated under measurement operating mode, and FPGA unit 1 passes through controlling bus control by fixed time sequence A/D modular converters A2 and A/D modular converter B3 processed is respectively acquired backlash signal with temperature analog signal, AD conversion Output is connected to FPGA unit 1, and FPGA unit 1 forms 20 bit address according to current temperature AD values and gap AD values, is stored up from ROM Outputting standard gap width is searched in storing module 8, this standard clearance value have passed through linear fit and correction of temperature drift.Linear fit with Clearance measurement value after correction of temperature drift is finally by UART interface A6 Serial outputs.Linear fit and the gap signal after correction of temperature drift Data are as shown in Figure 5.

It will be apparent to those skilled in the art that technical solution that can be as described above and design, make other various Corresponding change and deformation, and all these changes and deformation should all belong to the guarantor of the utility model claims Within the scope of shield.

Claims (5)

1. a kind of suspended sensor clearance measurement linear fit and correction of temperature drift circuit, it is characterised in that：Including FPGA unit, A/ D modular converter A, A/D modular converters B, clearance measurement analogue unit, temperature sensor and ROM storage modules；The A/D conversions The input side of modules A is connected with amplifying circuit A, A/D modular converter A and passes through amplifying circuit A connection temperature sensors, A/D conversions The outlet side of modules A is connected on the I/O mouths of FPGA unit；The input side of the A/D modular converters B is connected with amplifying circuit B, A/D modular converters B measures analogue unit by amplifying circuit B joint gaps, and the outlet side of A/D modular converters B is connected to FPGA On the I/O mouths of unit；FPGA unit one side serial ports is connected with UART interface A and UART interface B, and FPGA unit passes through UART Interface A is connected with host computer, and the ROM storage modules are connected on the I/O mouths of FPGA unit.

2. a kind of suspended sensor clearance measurement linear fit according to claim 1 and correction of temperature drift circuit, feature It is：The A/D modular converters A is 6 bit A/D converters, and A/D modular converters B is 14 bit A/D converters.

3. a kind of suspended sensor clearance measurement linear fit according to claim 1 and correction of temperature drift circuit, feature It is：The signal output foot connection FPGA of IN0 feet connection amplifying circuit A, the A/D modular converter A of the A/D modular converters A is mono- The I/O port of member.

4. a kind of suspended sensor clearance measurement linear fit according to claim 1 and correction of temperature drift circuit, feature It is：The UART interface A and UART interface B is asynchronous communication interface circuit.

5. a kind of suspended sensor clearance measurement linear fit according to claim 1 and correction of temperature drift circuit, feature It is：The temperature sensor is PTC1000 thermilinear thermistors.