CN207373491U - The device of photovoltaic silicon wafer cutting process detection line bow - Google Patents
The device of photovoltaic silicon wafer cutting process detection line bow Download PDFInfo
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- CN207373491U CN207373491U CN201721392036.4U CN201721392036U CN207373491U CN 207373491 U CN207373491 U CN 207373491U CN 201721392036 U CN201721392036 U CN 201721392036U CN 207373491 U CN207373491 U CN 207373491U
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- telephoto lens
- silicon wafer
- bow
- cutting process
- wafer cutting
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Abstract
The utility model proposes a kind of devices of photovoltaic silicon wafer cutting process detection line bow, can effectively solve the problem that the insufficient and inconvenient problem of precision existing in the prior art.The device of detection line bow is the telephoto lens that fixed setting one carries transparent scale outside photovoltaic silicon wafer cutting working region, and there is cross mark in camera lens center;If the visual angle of telephoto lens line of observation bow is θ, by the horizontal distance L0 and the height h0 compared with cutting gauze of measuring telescope head to cutting gauze and silicon rod interface point, according to h=L0tanθ‑h0The correspondence of the θ and h of embodiment calculate and longitudinal height value are marked on transparent scale, i.e., obtain the value h of line bow for directly observing.The testing result of the utility model is accurate (precision 1mm);Without switching cutting bin repeatedly in cutting process during detection;It realizes continuous observation simultaneously, significantly reduces the detection difficulty of technical staff.
Description
Technical field
The utility model is related to the devices of hard brittle material cutting process detection line bow.
Background technology
The method of photovoltaic silicon wafer generally use multi-wire saw silicon rod is manufactured, and the line bow size of cutting process is to close very much
One parameter of key.Be currently generally visually to be observed by cutting process come approximate evaluation, so to cutting process stability, cut
The cutting force of secant (plating diamond wire), the matching degree of cutting technique are assessed and judged, adjusted.So-called line bow, refers to
It is gauze and fore-and-aft distance of the silicon rod interface point apart from home position.
Existing line bends the major defect detected:(distance is remote, inaccurate by estimation for range estimation;Different observers difference compared with
Greatly);It needs to switch cutting bin in cutting process;Discontinuously.
Utility model content
In order to effectively solve the problems, such as that precision existing in the prior art is insufficient and inconvenient, the utility model proposes a kind of light
Lie prostrate the device of silicon chip cutting process detection line bow.
The solution of the utility model is for example as follows:
A kind of device of photovoltaic silicon wafer cutting process detection line bow is included in fixation outside photovoltaic silicon wafer cutting working region and sets
Gauze horizontal level is cut in the telephoto lens put, the position of telephoto lens when being higher than off working state, which has
Cross identifies, and is marked with transparent scale;The transparent scale is marked with several longitudinal height values and treats survey line for intuitively showing
The value h of bow;
Several longitudinal height values determine according to the following formula:H=L0tanθ-h0;
Wherein, h is the value for treating survey line bow, and note cutting line corresponds on the net treats that the position that survey line bends is M points, and L0 is telescope
Head arrives the horizontal distance of M points, and h0 is height of the telephoto lens compared with cutting gauze, and θ is the visual angle of telephoto lens line of observation bow;
The θ and the correspondence of h that several longitudinal height values are embodied according to above formula are calculated.
Further, preferably in multi-line cutting machine bulkhead perforate, the telephoto lens is arranged at position of opening.
Further, the installation site of telephoto lens is higher than horizontal level where silicon rod longitudinal centre line.
Further, illuminator and switch on telephoto lens are installed, illumination is provided for observation.
Further, telephoto lens and illuminator are respectively arranged with protective cover, when the switch of illuminator is opened, look in the distance
The protective cover of camera lens and illuminator is opened.
The method bent using the device detection line, is comprised the following steps:
1) it is M points, measurement to remember that cutting line corresponds to the position (i.e. cutting gauze and silicon rod interface point) treated survey line and bent on the net
The telephoto lens to M points horizontal distance L0 and telephoto lens compared with cutting gauze height h0;
2) visual angle of telephoto lens line of observation bow is set as θ, and the value for treating survey line bow is h, then h=L0tanθ-h0, according to the formula
The correspondence of the θ and h of embodiment calculate and longitudinal height value are marked on the transparent scale;
3) when photovoltaic silicon wafer cuts work, alignment line is identified by the cross for observing camera lens center and bends position, by transparent
The longitudinal height value marked on scale obtains the value h of line bow to be measured.
The utility model has the advantages that:
An independent observation component is set on multi-line cutting machine cutting bulkhead, is detected, tied using geometrical principle
Fruit is accurate (precision 1mm);Detection without switching cutting bin repeatedly in cutting process;It realizes continuous observation simultaneously, significantly reduces
The detection difficulty of technical staff.
On the basis of the utility model, further, visual measurement can be upgraded to and periodically take pictures and store automatically, is grey
Degree identifies and calculates, is integrated into system control, convenient for more timely adjusting process, feedback cutting real-time status.
The application of the utility model is not limited to the crystal silicon material of photovoltaic and semicon industry, is also extrapolated to other hard crisp
Material such as sapphire, neodymium iron boron, ceramics, crystal etc., such equivalent program also should be regarded as the protection domain of the application.
Description of the drawings
Fig. 1 is the schematic diagram of line bow measurement concept, wherein figure (b) is the side view of figure (a).
Fig. 2 is the measurement of the utility model line bow, Computing Principle.
Fig. 3 is the optical schematic diagram of telephoto lens, scale and illuminator in the utility model.
Fig. 4 is the correspondence of transparent scale and observation visual angle.
Fig. 5 is the overhaul flow chart of the utility model.
Drawing reference numeral explanation:
1- silicon rods;2- cuts gauze;The small gauzes of 3-;The first home rolls of 4-;The second home rolls of 5-;6- silicon rod longitudinal centre lines;7-
Multi-line cutting machine cuts bulkhead;8- telephoto lens;9- illuminators.
Specific embodiment
Below in conjunction with drawings and examples, the utility model is described in further detail.
As shown in Figure 1, the essence of line bow measurement is the longitudinal height h of measurement one.
As shown in figure 3, the present embodiment sets an independent observation component on multi-line cutting machine cutting bulkhead 7, i.e., it is main
If there is cross mark in the telephoto lens 8 of a tyre transparent scale, camera lens center.There is protective cover in front of camera lens, beaten before measurement
Open protective cover.
The illuminator 9 and switch that installation can be small-sized in front of camera lens, illumination is provided for observation;Lamps and lanterns have protective cover, open
Switch simultaneously open by protective cover.
Telephoto lens and illuminator are detachable, clean.
Testing process is as shown in Figure 5:
Perforate sets the device first on multi-line cutting machine bulkhead, and position of opening is arranged on silicon rod longitudinal centre line
Side, personnel's visual operation of being highly subject to are convenient.
Then measuring telescope head to the horizontal distance L0 and telephoto lens of cutting gauze and silicon rod interface point compared with cutting
The height h0 of secant net.As shown in Figure 2 and Figure 3, h=L0tanθ-h0。
It is calculated according to the correspondence of θ~h and writes longitudinal height value on transparent scale, as shown in Figure 4.Line bow passes through
Optical measurement and geometric angle calculate, and scale data is calculated (replaceable) by each data.
Actual measurement is only needed the cross mark alignment line bow position in camera lens center.
Claims (5)
1. the device of photovoltaic silicon wafer cutting process detection line bow, it is characterised in that:It is included in outside photovoltaic silicon wafer cutting working region
Gauze horizontal level, the telephoto lens are cut in the telephoto lens of fixed setting, the position of telephoto lens when being higher than off working state
There is cross mark in center, and is marked with transparent scale;The transparent scale is marked with several longitudinal height values for intuitively showing
Treat the value h of survey line bow;
Several longitudinal height values determine according to the following formula:H=L0tanθ-h0;
Wherein, h is the value for treating survey line bow, and note cutting line corresponds on the net treats that the position that survey line bends is M points, and L0 arrives for telephoto lens
The horizontal distance of M points, h0 are height of the telephoto lens compared with cutting gauze, and θ is the visual angle of telephoto lens line of observation bow;It is described
The θ and the correspondence of h that several longitudinal direction height values are embodied according to above formula are calculated.
2. the device of photovoltaic silicon wafer cutting process detection line bow according to claim 1, it is characterised in that:In multi-wire saw
Cabin wall perforate, the telephoto lens are arranged at position of opening.
3. the device of photovoltaic silicon wafer cutting process detection line bow according to claim 1, it is characterised in that:Telephoto lens
Installation site is higher than horizontal level where silicon rod longitudinal centre line.
4. the device of photovoltaic silicon wafer cutting process detection line bow according to claim 1, it is characterised in that:On telephoto lens
Illuminator and switch are installed, illumination is provided for observation.
5. the device of photovoltaic silicon wafer cutting process detection line bow according to claim 4, it is characterised in that:The telescope
Head and illuminator are respectively arranged with protective cover, when the switch of illuminator is opened, the protective cover of telephoto lens and illuminator
Open.
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CN201721392036.4U CN207373491U (en) | 2017-10-25 | 2017-10-25 | The device of photovoltaic silicon wafer cutting process detection line bow |
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CN201721392036.4U CN207373491U (en) | 2017-10-25 | 2017-10-25 | The device of photovoltaic silicon wafer cutting process detection line bow |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107672071A (en) * | 2017-10-25 | 2018-02-09 | 杨凌美畅新材料有限公司 | The method and apparatus of photovoltaic silicon wafer cutting process detection line bow |
CN112078040A (en) * | 2020-07-30 | 2020-12-15 | 长治高测新材料科技有限公司 | Method for automatically adjusting technological parameters during cutting of silicon single crystal rod |
WO2024046000A1 (en) * | 2022-08-31 | 2024-03-07 | Tcl Zhonghuan Renewable Energy Technology Co., Ltd. | Monitoring mechanism, application thereof, and slicing machine with the monitoring mechanism |
-
2017
- 2017-10-25 CN CN201721392036.4U patent/CN207373491U/en active Active
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107672071A (en) * | 2017-10-25 | 2018-02-09 | 杨凌美畅新材料有限公司 | The method and apparatus of photovoltaic silicon wafer cutting process detection line bow |
CN112078040A (en) * | 2020-07-30 | 2020-12-15 | 长治高测新材料科技有限公司 | Method for automatically adjusting technological parameters during cutting of silicon single crystal rod |
WO2024046000A1 (en) * | 2022-08-31 | 2024-03-07 | Tcl Zhonghuan Renewable Energy Technology Co., Ltd. | Monitoring mechanism, application thereof, and slicing machine with the monitoring mechanism |
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GR01 | Patent grant | ||
CP03 | Change of name, title or address |
Address after: 712100 Fuhai Industrial Park, East Weihui Road, Yangling demonstration area, Shaanxi Patentee after: Yangling Mei Chang new material Limited by Share Ltd Address before: 712100 B5, Fuhai Industrial Park, Weihui Road, Yangling demonstration area, Xianyang, Shaanxi Patentee before: Yangling New Material Co., Ltd. |
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