CN207350440U - A kind of silicon wafer Electrothermic wall board - Google Patents
A kind of silicon wafer Electrothermic wall board Download PDFInfo
- Publication number
- CN207350440U CN207350440U CN201721408815.9U CN201721408815U CN207350440U CN 207350440 U CN207350440 U CN 207350440U CN 201721408815 U CN201721408815 U CN 201721408815U CN 207350440 U CN207350440 U CN 207350440U
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- silicon wafer
- heating board
- wafer heating
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- thermal
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Abstract
The utility model discloses a kind of silicon wafer Electrothermic wall board, it includes fire-proof and thermal-insulation wallboard；The binding face of fire-proof and thermal-insulation wallboard and metope is equipped with buffering adhesive bed course；The outer side elevation of fire-proof and thermal-insulation wallboard is equipped with silicon wafer heating board；Porous insulation fireprotection layer is equipped between silicon wafer heating board and fire-proof and thermal-insulation wallboard, and porous insulation fireprotection layer passes through resin glue and the mutually compound cementation of silicon wafer heating board；The outer side elevation of silicon wafer heating board is equipped with glass fibre fire prevention layer of cloth；The outer side elevation of glass fibre fire prevention layer of cloth is equipped with the heat-dissipating aluminium plate of undulate；Silicon wafer heating board is equipped with temperature-sensitive thermosensitive probe；Temperature-sensitive thermosensitive probe and silicon wafer heating board are connected by conducting wire with temperature detect switch (TDS) respectively.Using silicon wafer heating board, heating property is stable and lasting, and the fast heating of silicon wafer heating board heating is rapid, can quickly raise indoor temperature；The thermal conversion efficiency of silicon wafer heating board is high, and fever is uniform, and maintenance cost is low and service life is grown.
Description
Technical field
The utility model belongs to electric heater technical field, and in particular to a kind of silicon wafer Electrothermic wall board.
Background technology
In the prior art, electrical heating can all be used in order to warm oneself in the season of cold wet, particularly northern area, people
Electric appliance or gas furnace heater, in addition the mode of central heating is also very universal, but these types of mode all exists necessarily
Deficiency；
Electric heater is using random, pollution-free, and still, after power-off temperature is scattered and disappeared, and fast, power consumption is very high, and human body
Stimulus to the sense organ is obvious, and the uneven comfort level of heat is poor, and the cost in one heating season of average family will be significantly larger than other heating sides
Formula.
Gas furnace heater is to heat the water in caliduct by natural gas, so that indoor temperature is improved, compared to electricity
Spent for warmer less, radiate slow heat remaining time length, can be switched as needed, but heating process is very slow,
Spend fewer than electric heater more than central heating.
The mode popularization degree of central heating is high, and the small comfort level of stimulus to the sense organ is high, but central heating heats for continuation, absolutely
All it is unmanned state in most of man on family's daytime, night can just enjoy, although each home unit is spent less, entirely
Warm oneself enterprise it is of high cost, cause heating enterprise energy energy consumption it is big, of high cost, benefit is difficult to get a profit, and warm oneself enterprise life
Pollution is also big caused by production.
Therefore, it is necessary to a kind of new heating system, the advantages of a variety of heating systems can be integrated, to change current people
Heating mode, save the consumption of the energy, improve energy utilization rate.
The content of the invention
The purpose of this utility model is that the solution prior art has traditional heating mode cost greatly and uses hommization poor
Technical problem, there is provided a kind of silicon wafer Electrothermic wall board, with overcome the deficiencies in the prior art.
In order to achieve the above object, the technical solution adopted in the utility model is：
A kind of silicon wafer Electrothermic wall board, it includes fire-proof and thermal-insulation wallboard；The binding face of the fire-proof and thermal-insulation wallboard and metope is set
There is buffering adhesive bed course；
The outer side elevation of the fire-proof and thermal-insulation wallboard is equipped with silicon wafer heating board；The silicon wafer heating board and fire-proof and thermal-insulation wallboard
Between be equipped with porous insulation fireprotection layer, and porous insulation fireprotection layer passes through resin glue and the mutually compound cementation of silicon wafer heating board；Institute
The outer side elevation for stating silicon wafer heating board is equipped with glass fibre fire prevention layer of cloth；The outer side elevation of the glass fibre fire prevention layer of cloth is equipped with
The heat-dissipating aluminium plate of undulate；
The silicon wafer heating board is equipped with temperature-sensitive thermosensitive probe；The temperature-sensitive thermosensitive probe and silicon wafer heating board pass through respectively
Conducting wire is connected with temperature detect switch (TDS).
Further, the thickness of the buffering adhesive bed course is 2-5 millimeters.
The beneficial effects of the utility model are：Using silicon wafer heating board, heating property is stable and lasting, silicon wafer heating board system
Hot fast heating is rapid, can quickly raise indoor temperature；The thermal conversion efficiency of silicon wafer heating board is high, and fever is uniform, safeguard use into
This low and service life is grown.
Brief description of the drawings
Fig. 1 is the structural representation left view sectional view of the utility model；
Fig. 2 is the structural representation front view of the utility model.
1- heat-dissipating aluminium plates 2- glass fibres fire prevention layer of cloth 3- silicon wafer heating board 4- porous insulation fireprotection layers in figure
5- fire-proof and thermal-insulation wallboard 6- buffering adhesive bed courses.
Embodiment
The technical solution of the utility model is clearly and completely described below in conjunction with Fig. 1 to Fig. 2, it is clear that retouched
The embodiment stated is the utility model part of the embodiment, instead of all the embodiments.Based on the implementation in the utility model
Example, those of ordinary skill in the art's all other embodiments obtained without making creative work, belongs to
The scope of the utility model protection.
Referring to figs. 1 to Fig. 2, the utility model it include fire-proof and thermal-insulation wallboard 5；The fire-proof and thermal-insulation wallboard 5 and metope
Binding face is equipped with buffering adhesive bed course 6；
The outer side elevation of the fire-proof and thermal-insulation wallboard 5 is equipped with silicon wafer heating board 3；The silicon wafer heating board 3 and fire-proof and thermal-insulation
Porous insulation fireprotection layer 4 is equipped between wallboard 5, and porous insulation fireprotection layer 4 is mutually compound with silicon wafer heating board 3 by resin glue
Cementation；The outer side elevation of the silicon wafer heating board 3 is equipped with glass fibre fire prevention layer of cloth 2；Outside the glass fibre fire prevention layer of cloth 2
Side elevation is equipped with the heat-dissipating aluminium plate 1 of undulate；
The silicon wafer heating board 3 is equipped with temperature-sensitive thermosensitive probe；The temperature-sensitive thermosensitive probe and silicon wafer heating board 3 lead to respectively
Conducting wire is crossed to be connected with temperature detect switch (TDS).
Further, the thickness of the buffering adhesive bed course is 2-5 millimeters.
The thermal conversion efficiency of silicon wafer heating board is high in the utility model, and fever is fast, can quickly improve indoor temperature；Buffering adhesive
Bed course can play good shock absorbing effect, prevent deformed damaged caused by relying on；Corrugated heat-dissipating aluminium plate can increase scattered
Hot area, improves radiating efficiency.
The above, is only specific embodiment of the present utility model, but the scope of protection of the utility model is not limited to
In this, any one skilled in the art is in the technical scope that the utility model discloses, the change that can readily occur in
Change or replace, should be covered within the scope of the utility model.
Claims (2)
1. a kind of silicon wafer Electrothermic wall board, it is characterized in that：It includes fire-proof and thermal-insulation wallboard（5）；The fire-proof and thermal-insulation wallboard（5）With wall
The binding face in face is equipped with buffering adhesive bed course（6）；
The fire-proof and thermal-insulation wallboard（5）Outer side elevation be equipped with silicon wafer heating board（3）；The silicon wafer heating board（3）With anti-fire screen
Hot wallboard（5）Between be equipped with porous insulation fireprotection layer（4）, and porous insulation fireprotection layer（4）Pass through resin glue and silicon wafer heating board
（3）Mutual compound cementation；The silicon wafer heating board（3）Outer side elevation be equipped with glass fibre fire prevention layer of cloth（2）；The glass fibers
Dimension fire prevention layer of cloth（2）Outer side elevation be equipped with undulate heat-dissipating aluminium plate（1）；
The silicon wafer heating board（3）It is equipped with temperature-sensitive thermosensitive probe；The temperature-sensitive thermosensitive probe and silicon wafer heating board（3）Lead to respectively
Conducting wire is crossed to be connected with temperature detect switch (TDS).
A kind of 2. silicon wafer Electrothermic wall board according to claim 1, it is characterized in that the buffering adhesive bed course（6）Thickness be 2-
5 millimeters.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721408815.9U CN207350440U (en) | 2017-10-27 | 2017-10-27 | A kind of silicon wafer Electrothermic wall board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721408815.9U CN207350440U (en) | 2017-10-27 | 2017-10-27 | A kind of silicon wafer Electrothermic wall board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207350440U true CN207350440U (en) | 2018-05-11 |
Family
ID=62353290
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721408815.9U Active CN207350440U (en) | 2017-10-27 | 2017-10-27 | A kind of silicon wafer Electrothermic wall board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207350440U (en) |
-
2017
- 2017-10-27 CN CN201721408815.9U patent/CN207350440U/en active Active
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