CN207341622U - Insulating pot - Google Patents

Abstract

The utility model discloses a kind of insulating pot, including bottom of the pot wall (1), substrate (8) and heating element (4), bottom of the pot wall is grade metal plate of the thickness not less than 0.4mm and no more than 0.8mm, substrate connection is in the bottom surface of bottom of the pot wall, heating element annularly coils the bottom surface for being installed on substrate, the top surface of substrate is formed with substrate recess, filled with low thermal conductivity material of the thermal conductivity factor no more than 40W/mk to form low thermal conductivity material layer (9) in substrate recess, low thermal conductivity material layer is located at the surface of heating element.In the insulating pot of the utility model, by filling low thermal conductivity material in substrate recess in a substrate, and the low thermal conductivity material is located at the surface of heating element, the heat conduction along bottom of the pot wall thickness direction can be slowed down, advantageously reduce the wall superheat degree of bottom of the pot wall, the transverse direction of bottom of the pot wall is heated evenly, the phenomenon that local steam bubble is small and intensive on bottom of the pot wall is can effectively avoid, reaches significant noise reduction.

Description

Insulating pot

Technical field

The utility model belongs to household appliance technical field, and in particular, to a kind of insulating pot.

Background technology

The bottom of the pot wall of conventional insulating pot uses horizontal bottom of the pot wall more, and electric hot tray is installed on the bottom surface of horizontal bottom of the pot wall, directly Horizontal bottom of the pot wall is heated, and then heats the liquid water in insulating pot.Wherein, the heat source of electric hot tray comes from electrothermal tube, leads to Electrothermal tube is crossed horizontal bottom of the pot wall is carried out to concentrate liquid in heating and then heating kettle.

When insulating pot works, electrothermal tube conducts heat to bottom of the pot wall in a manner of thermal contact conductance, and contact area is smaller, makes The degree of superheat of the thermal contact area of bottom of the pot wall and electrothermal tube is larger, so that the steam bubble in thermal contact area generation is small and departs from Frequency is high, departs from the small bubble of bottom of the pot wall and liquid of the heat transfer of itself to periphery can be made small vapour during rising Bubble is easier to rupture because of loss of heat, produces loud noise.

Utility model content

A kind of insulating pot is provided, can effectively be reduced for above-mentioned deficiency of the prior art or defect, the utility model The frequency of bubble departure bottom of the pot wall, so as to reduce the frequency that steam bubble ruptures in water, reaches the effect of noise reduction.

To achieve the above object, the utility model provides a kind of insulating pot, including bottom of the pot wall, substrate and heating element, The bottom of the pot wall is grade metal plate of the thickness not less than 0.4mm and no more than 0.8mm, and the substrate connection is in the bottom of the pot The bottom surface of wall, the heating element annularly coil the bottom surface for being installed on the substrate, and the top surface of the substrate is formed with substrate Groove, the substrate recess is interior to be filled with low thermal conductivity material of the thermal conductivity factor no more than 40W/mk to form low heat conduction system Number material layer, the low thermal conductivity material layer are located at the surface of the heating element.

Preferably, the thermal conductivity factor of the low thermal conductivity material layer is not more than 20W/mk, the low thermal conductivity material The thickness of the bed of material is not less than 0.5mm and is not more than 2mm.

Preferably, the low thermal conductivity material layer is mica layer or ceramic layer.

Preferably, the top surface of the substrate is flushed with the top surface of the low thermal conductivity material layer.

Preferably, the top surface of the substrate is equipped with the circle ring area for being used for arranging the substrate recess；

Wherein, the multiple substrate recess being along the circumferential direction spaced, the substrate are equipped with the circle ring area Groove is the radial direction linear grooves radially extended, the annular heating element and the circle ring area arranged concentric；

Alternatively, multiple straight line connected in stars along the extension of string of a musical instrument direction and parallel interval, annular are equipped with the circle ring area The heating element and the circle ring area arranged concentric；

Alternatively, the substrate recess is annular groove, the annular heating element and the annular groove arranged concentric.

Preferably, the inner peripheral of the low thermal conductivity material layer is not more than the inner peripheral of the heating element, and described The outer peripheral edge of low thermal conductivity material layer is not less than the outer peripheral edge of the heating element.The heating element is towards the bottom of the pot wall Upright projection region be located at the low thermal conductivity material layer towards in the upright projection region of the bottom of the pot wall.

Preferably, the low thermal conductivity material layer and the heating element arranged concentric, the low thermal conductivity material The ring width of layer is not less than 1 and no more than 2 not less than the ring width and the ratio between ring width value of the heating element.

Preferably, the inner peripheral of the low thermal conductivity material layer is more than the inner peripheral of the heating element, and described low The outer peripheral edge of thermal conductivity factor material layer is less than the outer peripheral edge of the heating element.

Preferably, the low thermal conductivity material layer and the heating element arranged concentric, the low thermal conductivity material The ring width of layer is less than the ring width of the heating element and the ratio between ring width value is not less than 0.5 and less than 1.

Preferably, the substrate recess is annular groove, and the annular groove is formed as the with the first circular lance One fan annular, contact heating region of the heating element in the bottom surface of the substrate are formed as having the of the second circular lance Two fan annulars, the arc chord angle of first circular lance are less than the arc chord angle of second circular lance.

Preferably, the substrate is not less than the high thermal conductivity coefficient metallic plate of 100W/mk for thermal conductivity factor, it is preferred that institute It is copper coin or aluminium sheet to state substrate.

Through the above technical solutions, in the insulating pot of the utility model, it is recessed formed with substrate by the top surface in substrate Groove, is filled with low thermal conductivity material of the thermal conductivity factor no more than 40W/mk to form low thermal conductivity in the substrate recess Material layer, and low thermal conductivity material layer is located at the surface of heating element, adds the thickness of thermal contact area, slow down edge The heat conduction in bottom of the pot wall thickness direction, advantageously reduces the wall superheat degree of bottom of the pot wall, is heated evenly the transverse direction of bottom of the pot wall, can have Effect avoids the phenomenon that local steam bubble is small and intensive on bottom of the pot wall, reaches significant noise reduction.

Other features and advantages of the utility model will be described in detail in subsequent specific embodiment part.

Brief description of the drawings

The attached drawing for forming the part of the utility model is used to provide a further understanding of the present invention, this practicality is new The schematic description and description of type is used to explain the utility model, does not form the improper restriction to the utility model. In attached drawing：

Fig. 1 is the front view of the insulating pot of the utility model；

Fig. 2 is the entirety sectional view of the insulating pot of first preferred embodiment of the utility model；

Fig. 3 is the part A enlarged drawing in Fig. 2；

Fig. 4 is the entirety sectional view of the insulating pot of second preferred embodiment of the utility model；

Fig. 5 is the part B enlarged drawing in Fig. 4；

Fig. 6 be the utility model substrate top surface formed with substrate recess when top view, wherein, substrate recess in circle Ring-type；

Fig. 7 be the utility model substrate top surface formed with substrate recess when top view, wherein, substrate recess in fan Ring-type；

Fig. 8 be the utility model substrate top surface formed with substrate recess when top view, wherein, substrate recess is footpath To linear grooves；

Fig. 9 be the utility model substrate top surface formed with substrate recess when top view, wherein, substrate recess is straight Linear groove；

Figure 10 is the entirety sectional view of insulating pot of the prior art；

Figure 11 is installed on the bottom view during bottom surface of bottom of the pot wall for electrothermal tube in the prior art；

Figure 12 is the steam bubble schematic diagram of the top surface of bottom of the pot wall when electrothermal tube is installed on bottom of the pot wall in the prior art；

Figure 13 is bottom of the pot wall when being filled with low thermal conductivity material in the utility model in the substrate recess of bottom of the pot wall The steam bubble schematic diagram of top surface.

Description of reference numerals：

1 bottom of the pot wall, 6 handle

2 bottle body, 7 steam pipe

3 pot lid, 8 substrate

4 heating element, 9 low thermal conductivity material layer

5 shells

Embodiment

Specific embodiment of the present utility model is described in detail below in conjunction with attached drawing.It should be appreciated that herein Described embodiment is only used for describing and explaining the present invention, and is not intended to limit the present invention.

It should be noted that in the case where there is no conflict, the feature in embodiment and embodiment in the utility model can To be mutually combined.

In the utility model, in the case where not making conversely explanation, the noun of locality such as " upper and lower, top, bottom " used is usually It is each component mutual alignment either on vertical, vertical or gravity direction for direction shown in the drawings Relationship description word.

The utility model will be described in detail below with reference to the accompanying drawings and embodiments.

Referring to Figures 1 and 2, the utility model provides a kind of insulating pot, including forms bottom of the pot wall 1,2 and of bottle body of kettle body Pot lid 3, the bottom of bottom of the pot wall 1 are provided with the heating element 4 for being heated to liquid in pot, and the outer gusset of kettle body is equipped with shell 5, should It is connected with handle 6 on shell 5, is equipped with steam pipe 7 in kettle body, in handle 6 or between kettle body and shell 5, the bottom of kettle body is set There is temperature controller, steam pipe 7 guides the steam in kettle body to temperature controller, when temperature controller detects that vapor (steam) temperature reaches preset value By bi-metal plate deformed to disconnect the power supply of heating element 4, or temperature sensor is equipped with kettle body, works as temperature sensor When detecting that the temperature in pot reaches preset value, the power supply of heating element 4 is disconnected by micro-chip processor.

In the insulating pot of the prior art, with reference to Figure 11, set on the bottom surface of bottom of the pot wall 1 and be used for liquid in heating kettle Electrothermal tube, in the whole heating process of insulating pot, electrothermal tube is conducted the heat of itself to bottom of the pot wall 1 in a manner of thermal contact conductance Bottom surface, the thermal contact area is in a ring and area is smaller, make bottom of the pot wall 1 and electrothermal tube thermal contact area heat flow density compared with Greatly, cause the degree of superheat of the thermal contact area also larger.Specifically, the degree of superheat of bottom of the pot wall 1 and the thermal contact area of electrothermal tube Bigger, the gas generated after liquid gasification is supplemented into caused by steam bubble that evaporation power is bigger, then the gas gives steam bubble Lifting force vertically upward it is also bigger, just depart from bottom of the pot wall 1 into without waiting small bubble to grow up, in this way, when by being arranged at When the electrothermal tube of the bottom surface of bottom of the pot wall 1 heats liquid in pot, the steam bubble that is generated on bottom of the pot wall 1 is more difficult to grow up and departs from The frequency of the bottom of the pot wall 1 is also higher, so that departing from, the steam bubble that bottom of the pot wall 1 enters in water is small and intensive, and referring to Figure 12, and this is small Steam bubble is also easier to rupture in water because of loss of heat during rising, produces loud noise.

In view of this, it is the wall superheat degree of the thermal contact area on reduction bottom of the pot wall 1, makes bottom of the pot wall 1 heated evenly, So as to avoid the phenomenon that local steam bubble is small and intensive on bottom of the pot wall 1, reach the effect of noise reduction, with reference to Fig. 2 and Fig. 3, in this practicality In new insulating pot, including bottom of the pot wall 1, substrate 8 and heating element 4, wherein, bottom of the pot wall for thickness not less than 0.4mm and not Grade metal plate more than 0.8mm, substrate 8 are connected to the bottom surface of bottom of the pot wall 1, and annularly coiling is installed on base to heating element 4 The bottom surface of plate 8, for the top surface of substrate 8 formed with substrate recess, substrate recess is interior to be not more than 40W/mk's filled with thermal conductivity factor Low thermal conductivity material to form low thermal conductivity material layer 9, and low thermal conductivity material layer 9 be located at heating element 4 just on Side.So set, the heat of heating element 4 can be made first to be not more than the low thermal conductivity material layer of 40W/mk via thermal conductivity factor 9 conduct to bottom of the pot wall 1 upwards, and then the liquid water in pot is heated through bottom of the pot wall 1 again, has so not only thickened heat transfer Thickness, i.e., heat transfer distances increase, also using the low thermal conductivity of the low thermal conductivity material layer 9, further slow down along pot The heat conduction of 1 thickness direction of bottom wall, so as to be conducive to the horizontal by thermal balance, the wall superheat degree of reduction bottom of the pot wall 1 of bottom of the pot wall 1. Specifically, the wall superheat degree of bottom of the pot wall 1 reduces, and the gas that liquid gasification generates can be made to enter after steam bubble the evaporation power produced Also decrease, correspondingly the gas is given the lifting force vertically upward of steam bubble and also reduced therewith, and then makes steam bubble can be in pot Depart from the bottom of the pot wall 1 again after growing up on bottom wall 1 into larger steam bubble, referring to Figure 13, in this way, bubble departure bottom of the pot can be reduced effectively The frequency of wall 1, reduces the frequency that steam bubble ruptures in water, so that level of noise when reducing insulating pot work, reaches significant drop Make an uproar effect.

Wherein, low thermal conductivity material layer 9 can be various appropriate materials, such as mica layer or ceramic layer, its heat conduction Coefficient should be not more than 40W/mk.Further, to make the heat conduction along 1 thickness direction of bottom of the pot wall slower, low thermal conductivity material The thermal conductivity factor of the bed of material 9 is preferably not greater than 20W/mk.In addition, the thickness of low thermal conductivity material layer 9 should be not less than 0.5mm And it is not more than 2mm.It is to be appreciated that low thermal conductivity material layer 9 is thicker, it is slower along the heat transfer of 1 thickness direction of bottom of the pot wall, Then the wall superheat degree of bottom of the pot wall 1 is also more conducive to noise reduction with regard to smaller, but when the thickness of bottom of the pot wall 1 exceeds certain value, position The temperature of the top surface heating region of bottom of the pot wall 1 directly over heating element 4 can be less than the temperature on periphery, may inversely increase Temperature, and can also reduce heat transfer efficiency if thickness is bigger；But the low thermal conductivity material layer 9 also should not be excessively thin, thinner Words can then weaken low thermal conductivity material layer 9 significantly and slow down the effect that longitudinal direction heat transfer and increase are laterally conducted heat.

Specifically, bottom of the pot wall 1 is preferably grade metal plate of the thickness not less than 0.4 and no more than 0.8.Wherein, bottom of the pot Wall 1 can be the grade metal plate of various appropriate types, such as 304 stainless steel plates of the food-grade after processing. It should be noted that herein and the parameter such as following thickness is limited only to illustrate, or it is reasonable under current working Numerical value, but be not limited to this, and should specifically set as the case may be.

In addition, with reference to Fig. 2 and Fig. 3, heating element 4 by substrate 8 by weld or fastener etc. in a manner of be fixedly connected on pot The bottom surface (i.e. low thermal conductivity material layer 9 be arranged right below heating element 4) of bottom wall 1, in general, heating element 4,8 and of substrate It is preferably soldering connection between bottom of the pot wall 1.Wherein, substrate 8 is usually the high thermal conductivity coefficient that thermal conductivity factor is not less than 100W/mk Metallic plate, such as copper coin, aluminium sheet, thickness direction heat conduction is fast, facilitates the installation of heating element 4, but has substantially no effect on heating unit The heat transfer of part 4.It is well known by those skilled in the art that usually there is dry combustion method piece on substrate 8, the mesh for preventing dry combustion method may also function as 's.

Specifically, cricoid heating element 4 can be various appropriate types, such as can be to be arranged at bottom of the pot wall 1 The electrothermal tube of lower section, or Electric radiant Heating Film (i.e. infrared electrothermal film) or the thick film being attached on the bottom surface of substrate 8, can also be It is arranged on the coil panel or PTC heating plates of the lower section of bottom of the pot wall 1.But electrothermal tube is usually conducted heat in a manner of thermal contact conductance, and and pot The thermocontact area of bottom wall 1 is small, for other heating elements 4, characteristic and heat transfer of the electrothermal tube due to self structure The reason of mode, the heat transfer for being easier to occur to bottom of the pot wall 1 in heating process are uneven so that the portion top surface of bottom of the pot wall 1 The degree of superheat it is higher so that producing small and intensive steam bubble in the local top surface of bottom of the pot wall 1, and then make insulating pot in work Easily produce larger noise when making, after the insulating pot of corresponding electricity consumption heat pipes heat uses the technical solution of the utility model, Lower noise can be made preferably to be improved.

In addition, with reference to Fig. 2 and Fig. 3, the top surface of low thermal conductivity material layer 9 is preferably to be flush with the top surface of substrate 8, i.e., The depth of substrate recess is identical with the thickness of low thermal conductivity material layer 9, is set in this way, working as between bottom of the pot wall 1 and heating element 4 When putting substrate 8, the periphery and central region that can make 8 top surface of bottom surface and substrate of bottom of the pot wall 1 fit closely, and not only contribute to along pot The axial thermal contact conductance of bottom wall 1, and also allow for the firm bottom surface for being entirely installed on bottom of the pot wall 1 of substrate 8.

Specifically, heating element 4 is annular in shape, to reduce the wall superheat degree of bottom of the pot wall 1, in annular heating element 4 The substrate recess for filling low thermal conductivity material is arranged above, setting shape of the substrate recess on the top surface of substrate 8 Formula can have a variety of, such as can be that the top surface of substrate 8 is equipped with and is used to arrange the circle ring area of substrate recess, in the annular regions The multiple substrate recess being along the circumferential direction spaced are equipped with domain, substrate recess is the radial direction linear grooves radially extended, The heating element 4 of annular and circle ring area arranged concentric, with reference to Fig. 8；Can be substrate 8 top surface be equipped be used for arrange substrate The circle ring area of groove, is equipped with multiple straight line connected in stars along the extension of string of a musical instrument direction and parallel interval, ring in the circle ring area The heating element 4 of shape and circle ring area arranged concentric, with reference to Fig. 9；Can also be that substrate recess is annular groove (annular groove bag Include in circular substrate recess and in the cricoid substrate recess of fan), annular heating element 4 and annular groove arranged concentric, With reference to Fig. 6 and Fig. 7；It is, of course, also possible to it is other setting forms, this is no longer going to repeat them.Wherein, radial direction linear grooves are in Ring-type is fanned, special limitation is not done to the central angle of the radial direction linear grooves of fan annular herein, such as the central angle can be It is 10 °, 30 ° or 45 ° etc., specific depending on actual process requirements.In addition, the width of the surface opening to straight line connected in star Special restriction is not done.

Specifically, with reference to Fig. 2 and Fig. 3, the inner peripheral of low thermal conductivity material layer 9 is not more than the inner peripheral of heating element 4, And the outer peripheral edge of low thermal conductivity material layer 9 is not less than the outer peripheral edge of heating element 4, i.e., the ring width of heating element 4 is no more than low The ring width of thermal conductivity factor material layer 9.So set, on the basis of it slow down the heat transfer along 1 thickness direction of bottom of the pot wall, also increase The big horizontal heat affected zone of bottom of the pot wall 1, makes the transverse direction of bottom of the pot wall 1 be heated evenly, is conducive to noise reduction.

Wherein, low thermal conductivity material layer 9 and 4 arranged concentric of heating element, the ring width of low thermal conductivity material layer 9 be not small It should be not less than 1 and no more than 2 in the ring width and the ratio between ring width value of heating element 4.Specifically, low thermal conductivity material layer 9 is with adding The ratio between the ring width value of thermal element 4 is bigger, and correspondingly the ring width of low thermal conductivity material layer 9 is also bigger, is more conducive to slow down along pot The horizontal heat conduction of bottom wall 1, then noise reduction is more obvious, but heat transfer efficiency decreases.Certainly, the ratio between the ring width value is not yet Can be excessive, such as the ratio between low thermal conductivity material layer 9 and the ring width value of heating element 4 should be not more than 2, specifically, in low heat conduction After the ratio between ring width value of index material 9 and heating element 4 exceeds certain numerical value, then increase the low thermal conductivity material layer 9 Width, although being likewise advantageous to slow down along the horizontal heat transfer of bottom of the pot wall 1, to the wall of the bottom of the pot wall 1 away from heating element 4 The influence of the face degree of superheat is but very small, and noise reduction is not evident.In addition, the ring width of low thermal conductivity material layer 9 is bigger, heat transfer efficiency is just It is lower, and the material produced needed for the low thermal conductivity material layer 9 is more, increases production cost, therefore, considers low lead Influence of the ring width of hot index material 9 to noise reduction, heat transfer efficiency and production cost, low thermal conductivity material layer 9 is with adding The ratio between ring width value of thermal element 4 is preferably not greater than 2, is also not necessarily limited to this certainly.

Certainly, with reference to Fig. 4 and Fig. 5, when the inner peripheral of low thermal conductivity material layer 9 is more than the inner peripheral of heating element 4, and When the outer peripheral edge of low thermal conductivity material layer 9 is less than the outer peripheral edge of heating element 4, it can also meet to slow down along 1 thickness side of bottom of the pot wall To heat conduction purpose, i.e. the insulating pot of the utility model uses this technical solution, can also realize the wall mistake for reducing bottom of the pot wall 1 The purpose of temperature, is conducive to noise reduction.

Wherein, in a ring, the ring width of low thermal conductivity material layer 9 is less than for low thermal conductivity material layer 9 and heating element 4 The ring width of heating element 4, and low thermal conductivity material layer 9 and 4 arranged concentric of heating element.Specifically, low thermal conductivity material The ratio between layer 9 and ring width value of heating element 4 more advantageously reduce the wall superheat degree of bottom of the pot wall 1, i.e. noise reduction effect closer to 1 Fruit is more obvious；Conversely, low thermal conductivity material layer 9 and the ratio between the ring width value of heating element 4 are smaller, noise reduction is not more evident, Therefore, the ratio between low thermal conductivity material layer 9 and the ring width value of heating element 4 are preferably not less than 0.5 and less than 1.

In addition, when heater element (such as electrothermal tube) is installed on the underface of low thermal conductivity material layer 9 in fan ring-type, The substrate recess that the top surface of substrate 8 is formed can be that (i.e. the substrate recess can be circular ring shape to annular groove, or have The fan annular of circular lance), referring to Fig. 6 and Fig. 7.

Preferably, with reference to Fig. 7 and Figure 11, the substrate recess formed on the top surface of substrate 8 is annular groove, and the annular is recessed Flute profile becomes the first fan annular with the first circular lance, and contact heating region of the heating element 4 in the bottom surface of substrate 8 is formed It is annular for the second fan with the second circular lance, wherein, the arc chord angle of the first circular lance is less than the circle of the second circular lance Arc angle.Specifically, the heating element 4 (such as electrothermal tube) of insulating pot is fan annular, and concentration heating region on the substrate 8 is correspondingly Substrate recess formed with fan annular, advantageously reduces the wall superheat degree of bottom of the pot wall 1, if but remote concentration on the substrate 8 Formed with the groove that can fill low thermal conductivity material at heating region, these regions can be slowed down and passed along the horizontal heat of bottom of the pot wall 1 Lead, these regional temperatures on bottom of the pot wall 1 is increased slow, be unfavorable for the horizontal by thermal balance of bottom of the pot wall 1.Certainly, substrate is recessed Groove has the first circular lance, that is, is not required to fill low thermal conductivity material at the first circular lance of the substrate recess, in this way, The materials for producing the low thermal conductivity material can be reduced, so as to reduce the production cost of insulating pot.

Hereinafter the utility model is specifically described with four kinds of preferred embodiments.

In the first preferred embodiment, with reference to Fig. 2, Fig. 3 and Fig. 7, insulating pot includes the bottom of the pot wall that thickness is 0.5mm 1, and the bottom of the pot wall 1 is 304 stainless steel plate of food-grade；Aluminium sheet as substrate 8 is connected to the bottom surface of bottom of the pot wall 1, electric heating pipe dish Around the bottom surface for being installed on the aluminium sheet；For the top surface of substrate 8 formed with fanning cricoid substrate recess, which is formed as having the First fan annular of one circular lance, and filled with the cricoid mica layer of fan, the top surface and mica of substrate 8 in the substrate recess The top surface of layer is flush, and the thickness of mica layer is 0.5mm；Electrothermal tube is formed as the second fan annular with the second circular lance, It is located at the underface of mica layer；Mica layer and electrothermal tube arranged concentric, the ring width of mica layer are identical with the ring width of electrothermal tube (i.e. 1) the ratio between ring width value of mica layer and electrothermal tube is, and the arc chord angle of the first circular lance is less than the circular arc of the second circular lance Angle.

In second of preferred embodiment, with reference to Fig. 4, Fig. 5 and Fig. 6, bottom of the pot wall 1 is 304 stainless steel plate of food-grade, its Thickness is 0.8mm；Aluminium sheet is arranged between bottom of the pot wall 1 and electrothermal tube as substrate 8；The top surface of substrate 8 is formed with annular shape Substrate recess, and filled with circular ceramic layer in the substrate recess, the top surface of substrate 8 and the top surface of ceramic layer are mutually neat Flat, the thickness of ceramic layer is 0.5mm；Electrothermal tube coils the underface for being installed on ceramic layer, ceramic layer and electrothermal tube arranged concentric, It is 0.5 that the ring width of ceramic layer, which is less than the ring width of electrothermal tube and the ratio between ring width value,.

In the third preferred embodiment, with reference to Fig. 2, Fig. 3 and Fig. 6, insulating pot includes the bottom of the pot wall that thickness is 0.4mm 1 and electrothermal tube, wherein, bottom of the pot wall 1 is 304 stainless steel plate of food-grade, and the aluminium sheet as substrate 8 is connected to the bottom surface of bottom of the pot wall 1, Electrothermal tube coils the bottom surface for being installed on the aluminium sheet；Substrate recess of the top surface of substrate 8 formed with annular shape, and in the substrate recess Interior to be flush filled with circular ceramic layer, the top surface of substrate 8 and the top surface of ceramic layer, the thickness of ceramic layer is 2mm；Electric heating Pipe is installed on the underface of ceramic layer, ceramic layer and electrothermal tube arranged concentric, and the ring width of ceramic layer is not less than the ring width of electrothermal tube And the ratio between ring width value is 2.

In the 4th kind of preferred embodiment, with reference to Fig. 4, Fig. 5 and Fig. 7, insulating pot includes the bottom of the pot wall that thickness is 0.6mm 1, and the bottom of the pot wall 1 is 304 stainless steel plate of food-grade；Aluminium sheet is arranged between bottom of the pot wall 1 and electrothermal tube as substrate 8；Substrate 8 Top surface be formed as the first fan annular with the first circular lance formed with cricoid substrate recess, the substrate recess is fanned, and Filled with cricoid mica layer is fanned in the substrate recess, the top surface of substrate 8 and the top surface of mica layer are flush, the thickness of mica layer Spend for 2mm；Electrothermal tube is formed as the second fan annular with the second circular lance, it coils the underface for being arranged at mica layer； Mica layer and electrothermal tube arranged concentric, it is 0.5 that the ring width of mica layer, which is less than the ring width of electrothermal tube and the ratio between ring width value, in addition, the The arc chord angle of one circular lance is less than the arc chord angle of the second circular lance.

In the 5th kind of preferred embodiment, with reference to Fig. 2, Fig. 3 and Fig. 8, insulating pot includes the bottom of the pot wall that thickness is 0.5mm 1, and the bottom of the pot wall 1 is 304 stainless steel plate of food-grade；Aluminium sheet as substrate 8 is connected to the bottom surface of bottom of the pot wall 1, electric heating pipe dish Around the bottom surface for being installed on the aluminium sheet；Layout area of the substrate recess on the top surface of substrate 8 is circle ring area, in the circle ring area It is interior equipped with the multiple substrate recess being along the circumferential direction spaced, and substrate recess is the radial direction linear grooves radially extended； Mica layer is filled with radial direction linear grooves, the top surface of substrate 8 and the top surface of mica layer are flush, and the thickness of mica layer is 1mm；Electrothermal tube is installed on the underface of mica layer, mica layer and electrothermal tube arranged concentric, and the ring width of mica layer is not less than electric heating The ring width and the ratio between ring width value of pipe are 1.5.

In the 6th kind of preferred embodiment, with reference to Fig. 2, Fig. 3 and Fig. 9, bottom of the pot wall 1 is 304 stainless steel plate of food-grade, its Thickness is 0.8mm；Aluminium sheet as substrate 8 is connected to the bottom surface of bottom of the pot wall 1, and electrothermal tube coils the bottom surface for being installed on the aluminium sheet； Layout area of the substrate recess on the top surface of substrate 8 is circle ring area, is equipped with along string of a musical instrument direction and extends in the circle ring area And multiple straight line connected in stars of parallel interval；Ceramic layer, the top surface of substrate 8 and the top of ceramic layer are filled with straight line connected in star Face is flush, and the thickness of ceramic layer is 1.5mm；Electrothermal tube is installed on the underface of ceramic layer, ceramic layer and the concentric cloth of electrothermal tube Put, the ring width of ceramic layer is identical with the ring width of electrothermal tube (i.e. the ratio between ring width value of ceramic layer and electrothermal tube is 1).

In the 7th kind of preferred embodiment, with reference to Fig. 4, Fig. 5 and Fig. 8, insulating pot includes the bottom of the pot wall that thickness is 0.4mm 1 and electrothermal tube, wherein, bottom of the pot wall 1 is 304 stainless steel plate of food-grade, and the aluminium sheet as substrate 8 is connected to the bottom surface of bottom of the pot wall 1, Electrothermal tube coils the bottom surface for being installed on the aluminium sheet；Layout area of the substrate recess on the top surface of substrate 8 is circle ring area, at this The multiple substrate recess being along the circumferential direction spaced are equipped with circle ring area, and substrate recess is the radial line radially extended Property groove；Ceramic layer is filled with radial direction linear grooves, the top surface of substrate 8 and the top surface of ceramic layer are flush, ceramic layer Thickness is 1mm；Electrothermal tube is installed on the underface of ceramic layer, ceramic layer and electrothermal tube arranged concentric, and the ring width of ceramic layer is less than The ring width and the ratio between ring width value of electrothermal tube are 0.5.

In the 8th kind of preferred embodiment, with reference to Fig. 4, Fig. 5 and Fig. 9, insulating pot includes the bottom of the pot wall that thickness is 0.6mm 1, and the bottom of the pot wall 1 is 304 stainless steel plate of food-grade；Aluminium sheet as substrate 8 is connected to the bottom surface of bottom of the pot wall 1, electric heating pipe dish Around the bottom surface for being installed on the aluminium sheet；Layout area of the substrate recess on the top surface of substrate 8 is circle ring area, in the circle ring area The interior multiple straight line connected in stars being equipped with along the extension of string of a musical instrument direction and parallel interval；Mica layer, base are filled with straight line connected in star The top surface of plate 8 and the top surface of mica layer are flush, and the thickness of mica layer is 1.5mm；Electrothermal tube is installed on the underface of mica layer, Mica layer and electrothermal tube arranged concentric, it is 0.5 that the ring width of mica layer, which is less than the ring width of electrothermal tube and the ratio between ring width value,.

The insulating pot of eight kinds of embodiments of the above is during liquid water heats in pot, by the substrate 8 Substrate recess in thermal conductivity factor be not more than 40W/mk low thermal conductivity material, and the low thermal conductivity material positioned at heating The surface of element 4, can slow down the heat conduction along 1 thickness direction of bottom of the pot wall, be conducive to the horizontal by thermal balance of bottom of the pot wall 1, reduce The wall superheat degree of bottom of the pot wall 1, and then the intensive phenomenon of the local steam bubble on bottom of the pot wall 1 is can effectively avoid, reach notable noise reduction Effect.

Specific embodiment 1：Using the insulating pot structure shown in Fig. 2, Fig. 3 and Fig. 6, i.e., bottom of the pot wall 1 for food-grade 304 not Become rusty steel plate, its thickness is 0.5mm；In substrate recess of the top surface of substrate 8 formed with annular shape, and filled in the substrate recess There is the mica layer of annular shape, the top surface of substrate 8 and the top surface of mica layer are flush；Aluminium sheet is connected with the bottom surface of bottom of the pot wall 1, electricity Heat pipe is installed on the bottom surface of the aluminium sheet and positioned at the underface of mica layer.

Wherein, the heating power of electrothermal tube：1800W, water in pot：1.7L.

Testing procedure：

1) water of peak level, is put into pot；

2), cooling-water temperature sensor is placed in the middle of the height of water level at kettle center；

3), timing measuring is started by "start" button；

4) timing measuring is stopped when, water temperature rises to 80 DEG C in pot；

5) noise figure of sound power value≤45dB, is rejected, A weighteds are carried out to test noise value, take average acoustical power conduct Decision content.

Obtain noise data such as table 1 below during insulating pot work.

Table 1：Noise data table

Wherein, the ratio between ring width value is mica layer (as low thermal conductivity material layer 9) and electrothermal tube (as heating element 4) The ratio between ring width value, thickness is the thickness of mica layer (as low thermal conductivity material layer 9).Specifically, low thermal conductivity material Layer 9 is thicker, is more conducive to slow down the heat conduction along 1 thickness direction of bottom of the pot wall, then the wall superheat degree of bottom of the pot wall 1 is lower, also More be conducive to noise reduction.In addition, low thermal conductivity material layer 9 and the ratio between the ring width value of heating element 4 are bigger, be more conducive to slow down edge The horizontal heat transfer of bottom of the pot wall 1, then level of noise caused by insulating pot work is also lower.

Comparative example 1：Using the insulating pot structure shown in Figure 10, wherein, the substrate 8 of insulating pot is horizontal circle plate, that is, is existed Substrate recess is formed without on the top surface of substrate 8, correspondingly the insulating pot does not just contain low thermal conductivity material layer 9 yet, in addition, Other experiment parameters are consistent with embodiment 1.

Test result：Maximum sound power value when obtaining insulating pot work is 68.4dB, and average sound power value is 65.2dB.

Comprehensive Correlation embodiment 1 and comparative example 1 understand that the substrate 8 compared to insulating pot is horizontal circle plate, in substrate 8 Top surface forming substrate groove, low thermal conductivity material is filled in the substrate recess, and heating element 4 is arranged at the low heat conduction The underface of coefficient material, its maximum sound power value produced are significantly less than 68.4dB, and average sound power value is also significantly less than 65.2dB, therefore, the substrate recess formed on the substrate 8 are located at the surface of heating element 4, and are filled in the substrate recess There is low thermal conductivity material, the maximum acoustical power and average sound power value sent when insulating pot can be made to work all reduces, so that most Reach the effect of optimization noise reduction eventually.

The above is only the preferred embodiment of the utility model only, is not intended to limit the utility model, all at this Within the spirit and principle of utility model, any modification, equivalent replacement, improvement and so on, should be included in the utility model Protection domain within.

It is further to note that each particular technique feature described in above-mentioned embodiment, in not lance In the case of shield, it can be combined by any suitable means, in order to avoid unnecessary repetition, the utility model is to each The possible combination of kind no longer separately illustrates.

In addition, it can also be combined between a variety of embodiments of the utility model, as long as it is not disobeyed The thought of the utility model is carried on the back, it should equally be considered as content disclosed in the utility model.

Claims (11)

1. a kind of insulating pot, it is characterised in that the insulating pot includes bottom of the pot wall (1), substrate (8) and heating element (4), described Bottom of the pot wall (1) is grade metal plate of the thickness not less than 0.4mm and no more than 0.8mm, and the substrate (8) is connected to the pot The bottom surface of bottom wall (1), the heating element (4) annularly coil the bottom surface for being installed on the substrate (8), the substrate (8) Top surface is formed with substrate recess, the interior low thermal conductivity material for being not more than 40W/mk filled with thermal conductivity factor of the substrate recess To form low thermal conductivity material layer (9), the low thermal conductivity material layer (9) is located at the surface of the heating element (4).

2. insulating pot according to claim 1, it is characterised in that the thermal conductivity factor of the low thermal conductivity material layer (9) No more than 20W/mk, the thickness of the low thermal conductivity material layer (9) not less than 0.5mm and is not more than 2mm.

3. insulating pot according to claim 1, it is characterised in that the low thermal conductivity material layer (9) for mica layer or Ceramic layer.

4. insulating pot according to claim 1, it is characterised in that the top surface of the substrate (8) and the low thermal conductivity The top surface of material layer (9) flushes.

5. insulating pot according to claim 1, it is characterised in that the top surface of the substrate (8), which is equipped with, to be used to arrange institute State the circle ring area of substrate recess；

Wherein, the multiple substrate recess being along the circumferential direction spaced, the substrate recess are equipped with the circle ring area For the radial direction linear grooves radially extended, the annular heating element (4) and the circle ring area arranged concentric；

Alternatively, multiple straight line connected in stars along the extension of string of a musical instrument direction and parallel interval, annular institute are equipped with the circle ring area State heating element (4) and the circle ring area arranged concentric；

Alternatively, the substrate recess is annular groove, the annular heating element (4) and the annular groove arranged concentric.

6. insulating pot according to claim 5, it is characterised in that the inner peripheral of the low thermal conductivity material layer (9) is not More than the inner peripheral of the heating element (4), and the outer peripheral edge of the low thermal conductivity material layer (9) is not less than the heating unit The outer peripheral edge of part (4).

7. insulating pot according to claim 6, it is characterised in that the low thermal conductivity material layer (9) and the heating Element (4) arranged concentric, the ring width of the low thermal conductivity material layer (9) are not less than the ring width and ring of the heating element (4) The ratio between width values are not more than 2.

8. insulating pot according to claim 5, it is characterised in that the inner peripheral of the low thermal conductivity material layer (9) is big Inner peripheral in the heating element (4), and the outer peripheral edge of the low thermal conductivity material layer (9) is less than the heating element (4) outer peripheral edge.

9. insulating pot according to claim 8, it is characterised in that the low thermal conductivity material layer (9) and the heating Element (4) arranged concentric, the ring width of the low thermal conductivity material layer (9) are less than the ring width and ring width of the heating element (4) The ratio between value is not less than 0.5.

10. insulating pot according to claim 1, it is characterised in that the substrate recess is annular groove, and the annular is recessed Flute profile becomes the first fan annular with the first circular lance, contact of the heating element (4) in the bottom surface of the substrate (8) Heating region is formed as the second fan annular with the second circular lance, and the arc chord angle of first circular lance is less than described the The arc chord angle of two circular lances.

11. insulating pot according to claim 1, it is characterised in that the substrate (8) is not less than 100W/ for thermal conductivity factor The high thermal conductivity coefficient metallic plate of mk, it is preferred that the substrate (8) is copper coin or aluminium sheet.