CN207338423U - A kind of surface mount type LED support - Google Patents
A kind of surface mount type LED support Download PDFInfo
- Publication number
- CN207338423U CN207338423U CN201720503687.XU CN201720503687U CN207338423U CN 207338423 U CN207338423 U CN 207338423U CN 201720503687 U CN201720503687 U CN 201720503687U CN 207338423 U CN207338423 U CN 207338423U
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- CN
- China
- Prior art keywords
- electrode substrate
- heat dissipating
- dissipating layer
- positive electrode
- negative electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
It the utility model is related to technical field of LED illumination,Especially a kind of surface mount type LED support,Bottom including pedestal offers mounting hole,The second heat dissipating layer is installed with the side wall of the mounting groove,The one side of second heat dissipating layer away from mounting groove is bonded with reflector by the 3rd adhesive linkage,The bottom of the mounting groove offers fixing groove,Positive electrode substrate and negative electrode substrate are provided with the fixing groove,Partition plate is provided between the positive electrode substrate and negative electrode substrate,Electric hole is connect described in two and is located at positive electrode substrate respectively,The bottom of negative electrode substrate,The central upper portion of the positive electrode substrate and negative electrode substrate is both provided with convex block,The positive electrode substrate is both provided with the second adhesive linkage with negative electrode substrate close to the surrounding of convex block,The first heat dissipating layer is both provided with the inner wall of the fixing groove,The utility model can effectively improve the heat dissipation effect of LED light,Ensure the light extraction efficiency of LED light,And effectively raise service life.
Description
Technical field
It the utility model is related to technical field of LED illumination, more particularly to a kind of surface mount type LED support.
Background technology
LED (Light Emitting Diode, light emitting diode) is used as forth generation green illumination light source, at present
To being widely applied.When LED chip is lighted, an electrical power part for input is converted into luminous energy, and a part is converted into thermal energy.Its
In, the electrical power of LED inputs usually only 10~15% is converted into luminous energy, and others are converted into thermal energy.It is converted into this of thermal energy
If portion of energy cannot be discharged by modes such as heat transfer, convection current or radiation in time, LED core segment temperature rise can be caused
Height, so as to cause light efficiency to reduce, while can also reduce the service life of LED.And with LED chip integrated level raising and
To the demand of power-type LED, great power LED cooling becomes urgent problem to be solved.
Utility model content
The purpose of this utility model is poor in order to solve to exist in the prior art heat dissipation effect, influences lighting effect and makes
With the service life, using effect is influenced, and a kind of surface mount type LED support proposed.
To achieve these goals, the utility model employs following technical solution：
Design a kind of surface mount type LED support, including the bottom of pedestal offers mounting hole, it is equidistant on the side wall of the pedestal
Leave and be equipped with heat emission hole, the top of the pedestal offers infundibulate mounting groove, and the heat emission hole is connected with mounting groove, the peace
The second heat dissipating layer is installed with the side wall of tankage, the one side of second heat dissipating layer away from mounting groove passes through the 3rd bonding
Layer is bonded with reflector, and the bottom of the mounting groove offers fixing groove, and the fixing groove is connected with heat emission hole, the fixing groove
Positive electrode substrate and negative electrode substrate are inside provided with, partition plate is provided between the positive electrode substrate and negative electrode substrate, the pedestal is close
The bottom of fixing groove offers two and connects electric hole, and electric hole is connect described in two respectively positioned at positive electrode substrate, the bottom of negative electrode substrate, institute
The central upper portion for stating positive electrode substrate and negative electrode substrate is both provided with convex block, and the positive electrode substrate is with negative electrode substrate close to the four of convex block
Be both provided with the second adhesive linkage week, be both provided with the first heat dissipating layer on the inner wall of the fixing groove, first heat dissipating layer with just
Connected between electrode substrate, negative electrode substrate by the first adhesive linkage.
Preferably, first adhesive linkage and the 3rd bonding Rotating fields are identical, and the first adhesive linkage and the 3rd adhesive linkage are equal
For heat-conducting glue.
Preferably, first heat dissipating layer and the second heat dissipating layer are ceramic wafer.
Preferably, first heat dissipating layer is funnel-shaped structure, and second heat dissipating layer is cylindrical empty core structure, and the
The bottom of one heat dissipating layer is connected with the top of the second heat dissipating layer.
Preferably, the partition plate is insulation board, and the both sides of insulation board are fixed with positive electrode substrate, negative electrode substrate connect respectively
Connect.
The utility model proposes a kind of surface mount type LED support, beneficial effect is：By being set on the inner wall of mounting groove
The second heat dissipating layer is put, the second heat dissipating layer is connected with heat emission hole, and is glued in the opposite side of the second heat dissipating layer by the 3rd adhesive linkage
Connect the second heat dissipating layer, the LED light that can quickly disperse using when give off heat, ensure LED light can work normally, improve illumination
Effect, by setting the first heat dissipating layer on the inner wall of fixing groove, the first heat dissipating layer is connected with heat emission hole, and viscous by first
Connect layer to be connected with positive electrode substrate, negative electrode substrate, can effectively absorb positive electrode substrate, the heat that negative electrode substrate sheds, prevent just
The excessive damage LED light of electrode substrate, negative electrode substrate temperature, the utility model can effectively improve the heat dissipation effect of LED light, ensure
The light extraction efficiency of LED light, and effectively raise service life.
Brief description of the drawings
Fig. 1 be the utility model proposes a kind of surface mount type LED support structure diagram.
In figure：Pedestal 1, the first heat dissipating layer 2, the first adhesive linkage 3, connect electric hole 4, positive electrode substrate 5, partition plate 6, negative electrode substrate 7,
Heat emission hole 8, the second adhesive linkage 9, mounting groove 10, reflector 11, the 3rd adhesive linkage 12, the second heat dissipating layer 13.
Embodiment
The following is a combination of the drawings in the embodiments of the present utility model, and the technical scheme in the embodiment of the utility model is carried out
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.
With reference to Fig. 1, a kind of surface mount type LED support, including the bottom of pedestal 1 offer mounting hole, and the side wall of pedestal 1 is first-class
Distance offers heat emission hole 8, and the top of pedestal 1 offers infundibulate mounting groove 10, and heat emission hole 8 is connected with mounting groove 10, installation
The second heat dissipating layer 13 is installed with the side wall of groove 10, the second one side of the heat dissipating layer 13 away from mounting groove 10 is viscous by the 3rd
Connect layer 12 and be bonded with reflector 11, the bottom of mounting groove 10 offers fixing groove, and fixing groove is connected with heat emission hole 8, in fixing groove
Positive electrode substrate 5 and negative electrode substrate 7 are provided with, partition plate 6 is provided between positive electrode substrate 5 and negative electrode substrate 7, partition plate 6 is insulation board,
And the both sides of insulation board are fixedly connected with positive electrode substrate 5, negative electrode substrate 7 respectively, pedestal 1 offers two close to the bottom of fixing groove
A to connect electric hole 4, two connect electric hole 4 and are located at positive electrode substrate 5, the bottom of negative electrode substrate 7, positive electrode substrate 5 and negative electrode substrate 7 respectively
Central upper portion is both provided with convex block, and positive electrode substrate 5 is both provided with the second adhesive linkage 9 with negative electrode substrate 7 close to the surrounding of convex block, Gu
Determine to be both provided with the first heat dissipating layer 2 on the inner wall of groove, the first adhesive linkage 3 is identical with 12 structure of the 3rd adhesive linkage, and the first bonding
3 and the 3rd adhesive linkage 12 of layer is heat-conducting glue, and the first heat dissipating layer 2 is Nian Jie by first between positive electrode substrate 5, negative electrode substrate 7
Layer 3 connects, and the first heat dissipating layer 2 and the second heat dissipating layer 13 are ceramic wafer, and the first heat dissipating layer 2 is funnel-shaped structure, and second radiates
Layer 13 is cylindrical empty core structure, and the bottom of the first heat dissipating layer 2 is connected with the top of the second heat dissipating layer 13.
Workflow：When the utility model is installed, the fixing groove inner wall that is first fixed on the first heat dissipating layer 2 inside pedestal 1
On, then by positive electrode substrate 5, negative electrode substrate 7 be installed on fixing groove in, and between positive electrode substrate 5 and negative electrode substrate 7 set every
Plate 6, then be connected positive electrode substrate 5, negative electrode substrate 7 with the first heat dissipating layer 2 by the first adhesive linkage 3, then by the second heat dissipating layer
13 are installed in the mounting groove 10 on pedestal 1, and reflector 11 is then bonded on the second heat dissipating layer 13 by the 3rd adhesive linkage 12,
Then the second adhesive linkage 9 is smeared on the top of positive electrode substrate 5, negative electrode substrate 7, and bonded LED lamp is bonded in positive electrode substrate
5th, on negative electrode substrate 7.
The above, is only the preferable embodiment of the utility model, but the scope of protection of the utility model is not
This is confined to, any one skilled in the art is in the technical scope that the utility model discloses, according to this practicality
New technical solution and its utility model design are subject to equivalent substitution or change, should all cover the protection model in the utility model
Within enclosing.
Claims (5)
1. a kind of surface mount type LED support, including the bottom of pedestal (1) offers mounting hole, equidistant on the side wall of the pedestal (1)
Leave and be equipped with heat emission hole (8), it is characterised in that：The top of the pedestal (1) offers infundibulate mounting groove (10), the heat dissipation
Hole (8) is connected with mounting groove (10), is installed with the second heat dissipating layer (13) on the side wall of the mounting groove (10), and described
One side of two heat dissipating layers (13) away from mounting groove (10) is bonded with reflector (11), the mounting groove by the 3rd adhesive linkage (12)
(10) bottom offers fixing groove, and the fixing groove is connected with heat emission hole (8), and positive electrode substrate is provided with the fixing groove
(5) and negative electrode substrate (7), partition plate (6) is provided between the positive electrode substrate (5) and negative electrode substrate (7), the pedestal (1) is leaned on
The bottom of nearly fixing groove offers two and connects electric hole (4), and electric hole (4) is connect described in two respectively positioned at positive electrode substrate (5), anode base
The bottom of plate (7), the positive electrode substrate (5) and the central upper portion of negative electrode substrate (7) are both provided with convex block, the positive electrode substrate
(5) the second adhesive linkage (9) is both provided with surrounding of the negative electrode substrate (7) close to convex block, is respectively provided with the inner wall of the fixing groove
There is the first heat dissipating layer (2), first heat dissipating layer (2) and positive electrode substrate (5), negative electrode substrate pass through the first adhesive linkage between (7)
(3) connect.
A kind of 2. surface mount type LED support according to claim 1, it is characterised in that：First adhesive linkage (3) and the 3rd
Adhesive linkage (12) structure is identical, and the first adhesive linkage (3) and the 3rd adhesive linkage (12) are heat-conducting glue.
A kind of 3. surface mount type LED support according to claim 1, it is characterised in that：First heat dissipating layer (2) and second
Heat dissipating layer (13) is ceramic wafer.
A kind of 4. surface mount type LED support according to claim 1, it is characterised in that：First heat dissipating layer (2) is funnel
Shape structure, second heat dissipating layer (13) are cylindrical empty core structure, and the bottom of the first heat dissipating layer (2) and the second heat dissipating layer
(13) top connection.
A kind of 5. surface mount type LED support according to claim 1, it is characterised in that：
The partition plate (6) is insulation board, and the both sides of insulation board are fixedly connected with positive electrode substrate (5), negative electrode substrate (7) respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720503687.XU CN207338423U (en) | 2017-05-09 | 2017-05-09 | A kind of surface mount type LED support |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720503687.XU CN207338423U (en) | 2017-05-09 | 2017-05-09 | A kind of surface mount type LED support |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207338423U true CN207338423U (en) | 2018-05-08 |
Family
ID=62375455
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720503687.XU Expired - Fee Related CN207338423U (en) | 2017-05-09 | 2017-05-09 | A kind of surface mount type LED support |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207338423U (en) |
-
2017
- 2017-05-09 CN CN201720503687.XU patent/CN207338423U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180508 Termination date: 20190509 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |