CN207336716U

CN207336716U - The temperature detect switch (TDS) synchronism detection plate of miniaturized structure

Info

Publication number: CN207336716U
Application number: CN201720976697.5U
Authority: CN
Inventors: 龙双
Original assignee: Individual
Current assignee: Individual
Priority date: 2017-08-07
Filing date: 2017-08-07
Publication date: 2018-05-08
Anticipated expiration: 2027-08-07

Abstract

The utility model discloses a kind of temperature detect switch (TDS) synchronism detection plate of miniaturized structure, includes pcb board and the multiple wire connection terminals being arranged on pcb board, multiple first relays, multiple inductance, multiple first capacitances, multiple first resistors, multiple second resistances, multiple second relays, two DIP IC stands, two 3rd resistors, two second capacitances and two triodes；Multiple wire connection terminal spacing side by side are arranged in the surface cephalolateral margin of pcb board；Multiple first relay spacing side by side set and are located at the rear side of multiple wire connection terminals, multiple inductance and multiple first capacitances are located at the surface left border of pcb board, multiple inductance are arranged side by side, multiple first capacitances are arranged side by side and are located at the rear side of multiple inductance, multiple first resistor arrays are arranged in the margo dexter on pcb board surface, and multiple second resistances, multiple second relays, two DIP IC stands, two 3rd resistors, two second capacitances and two triodes are respectively positioned on the surface posterior lateral margin of pcb board.

Description

The temperature detect switch (TDS) synchronism detection plate of miniaturized structure

Technical field

Test device field technology is the utility model is related to, refers in particular to a kind of same pacing of the temperature detect switch (TDS) of miniaturized structure Test plate (panel).

Background technology

Temperature detect switch (TDS) synchronism detection plate is mainly used for the synchronizing function of temperature detect switch (TDS), its primary structure include pcb board with And it is arranged at multiple wire connection terminals, multiple first relays, multiple inductance, multiple first capacitances, multiple first electricity on pcb board Resistance, multiple second resistances, multiple second relays, two DIP-IC stands, two 3rd resistors, two second capacitances and two triodes Deng.However, since above-mentioned each component arrangement is unreasonable, cause entirely to test that plate suqare is larger, occupy larger installation position Put, make troubles to use.

Utility model content

In view of this, in view of the existing deficiencies of the prior art, it is small that its main purpose is to provide a kind of structure to the utility model The temperature detect switch (TDS) synchronism detection plate of type, it can effectively solve each component arrangement of existing temperature detect switch (TDS) synchronism detection plate not The problem of rationally causing test plate suqare larger and occupying installation site.

To achieve the above object, the utility model is using following technical solution：

A kind of temperature detect switch (TDS) synchronism detection plate of miniaturized structure, includes pcb board and is arranged at multiple on pcb board It is wire connection terminal, multiple first relays, multiple inductance, multiple first capacitances, multiple first resistors, multiple second resistances, multiple Second relay, two DIP-IC stands, two 3rd resistors, two second capacitances and two triodes；Multiple wire connection terminal spacing side by side It is arranged in the surface cephalolateral margin of pcb board；Multiple first relay spacing side by side set and are located at the rear side of multiple wire connection terminals, more A inductance and multiple first capacitances are located at the surface left border of pcb board, and multiple inductance are arranged side by side, and multiple first capacitances are set side by side Put and be located at the rear side of multiple inductance, multiple first resistor arrays are arranged in the margo dexter on pcb board surface, multiple second electricity Resistance, multiple second relays, two DIP-IC stands, two 3rd resistors, two second capacitances and two triodes are respectively positioned on the table of pcb board Face posterior lateral margin, multiple second resistances are distributed in the rear side of the rear side of the first capacitance and the first relay of the leftmost side, and every one second One first diode is both provided with by the side of resistance, multiple second relays are arranged side by side, and two DIP-IC stands are respectively positioned at more The left and right sides of a second relay, two 3rd resistors are located at the right side of two DIP-IC stands, two second capacitances difference position respectively On the right side of two 3rd resistors, which is located at the rear side of two DIP-IC stands, two 3rd resistors and two second capacitances respectively.

As a preferred embodiment, the pcb board is rectangle, its four edges are both provided with a mounting hole.

As a preferred embodiment, the wire connection terminal is five be arranged side by side.

As a preferred embodiment, first relay is three, and every one first relay is and spring relay.

As a preferred embodiment, one the 4th resistance and one the 2nd 2 pole are both provided between adjacent two first relay Pipe.

As a preferred embodiment, the inductance is two.

As a preferred embodiment, first capacitance is three, and the first capacitance is CBB electric capacity.

As a preferred embodiment, the first resistor is four, and four first resistors are in the row arrangement of two rows two, every 1 the One resistance is fixed carbon resister.

As a preferred embodiment, the second resistance is three, and each second resistance is fixed carbon resister.

As a preferred embodiment, second relay is three, and every one second relay is Panasonic's relay.

The utility model has clear advantage and beneficial effect compared with prior art, specifically, by above-mentioned technology Scheme is understood：

By carrying out rational deployment to each component so that the overall structure simple and compact of this product, the sky on pcb board Between sufficiently efficiently used so that test board area reduce, reduce the installation space occupied, realize that structure is small-sized Change, brought convenience for use.

More clearly to illustrate the architectural feature of the utility model and effect, come below in conjunction with the accompanying drawings with specific embodiment pair The utility model is described in detail.

Brief description of the drawings

Fig. 1 is the front view of the preferred embodiment of the utility model.

Attached drawing identifier declaration：

100th, pcb board 101, mounting hole.

Embodiment

It refer to shown in Fig. 1, that show the concrete structure of the preferred embodiment of the utility model, include pcb board 100 and multiple wire connection terminals, multiple first relays, multiple inductance, multiple first capacitances, more for being arranged on pcb board 100 A first resistor, multiple second resistances, multiple second relays, two DIP-IC stands, two 3rd resistors, two second capacitances and two Triode.

The pcb board 100 is rectangle, its four edges are both provided with a mounting hole 101, also, the pcb board 100 Length be 135mm, width 70mm.

The plurality of wire connection terminal spacing side by side is arranged in the surface cephalolateral margin of pcb board 100；In the present embodiment, it is described to connect Line terminals are five be arranged side by side, it is from left to right followed successively by wire connection terminal S6, wire connection terminal S1, wire connection terminal S5, wiring Terminal S4, wire connection terminal S3.

The plurality of first relay spacing side by side sets and is located at the rear side of multiple wire connection terminals, in the present embodiment, institute The first relay is stated as three, its from left to right respectively positioned at relay S40, relay S39, relay S2, every one first after Electric appliance be with spring relay, be both provided with one the 4th resistance S19, S21 and one the 2nd 2 pole between adjacent two first relay Pipe S37, S38.

The plurality of inductance and multiple first capacitances are located at the surface left border of pcb board 100, and multiple inductance are arranged side by side, more A first capacitance is arranged side by side and is located at the rear side of multiple inductance, and in the present embodiment, the inductance is two, it is located at respectively Inductance L1, inductance L2, first capacitance are three, it is located at capacitance S9, capacitance S10 and capacitance S12, and every one first respectively Capacitance is CBB electric capacity.

The plurality of first resistor array is arranged in the margo dexter on 100 surface of pcb board, in the present embodiment, described first Resistance is four, it is resistance S23, resistance S24, resistance S25 and resistance S26 respectively, and four first resistors are in the row row of two rows two Cloth, each first resistor are fixed carbon resister.

The plurality of second resistance, multiple second relays, two DIP-IC stands S27, S28, two 3rd resistor S20, S22, Two second capacitance S29, S30 and two triode S31, S32 are respectively positioned on the surface posterior lateral margin of pcb board 100, multiple second resistance distributions The first capacitance rear side and the leftmost side the first relay S40 rear side, be both provided with one by the side of each second resistance One diode, in the present embodiment, the second resistance are three, it is resistance S13, resistance S14 and resistance S17 respectively, often One second resistance is fixed carbon resister, corresponding, which is three, it is located at diode S15, S16, S18 respectively.

Multiple second relays are arranged side by side, and two DIP-IC stands S27, S28 are located at a left side for multiple second relays respectively Right both sides, two 3rd resistors S20, S22 are located at the right side of two DIP-IC stands S27, S28, two second S29, S30 points of capacitances respectively Wei Yu not be on the right side of two 3rd resistors S20, S2, the triode S31, S32 are respectively positioned at two DIP-IC stands S27, S28, two the 3rd The rear side of resistance S20, S22 and two second capacitance S29, S3.In the present embodiment, second relay is three, it is from a left side To it is right be relay S33, relay 35 and relay S34 respectively, every one second relay is Panasonic's relay.

The connection relation of above-mentioned each component is as shown in Figure 1, the mating reaction of its connection mode and each component Principle is the prior art, and the mating reaction principle of connection mode and each component at this to above-mentioned each component is not made Narration in detail, this test board coordinate PLC to be used for the synchronizing function for detecting Kick type temperature controller, include the action synchronization of temperature detect switch (TDS) Detection and the synchronous detection of reset.

Realization principle：Contact by High Level AC Voltage by temperature controller, passes through photoelectrical coupler（Model：4N25 505Q） The break-make of relay is driven, to detect the synchronization time of temperature detect switch (TDS) action and homing action.The contact of detectable contact at the same time Quality.

The operation principle of Kick type temperature controller：After being warmed to certain temperature to temperature controller, the contact of temperature controller can act（Often Close and be changed into opening a way, or normally opened be changed into turning on）.Then temperature controller is cooled down, detects the action of contact（Recover it is normally closed or It is normally opened）.PLC calculates the time, to judge the synchronism of temperature controller by the past contact action signal of giving of test board.

The design focal point of the utility model is：By to each component carry out rational deployment so that this product it is whole Body is simple and compact for structure, and the space on pcb board is sufficiently efficiently used, so that the area of test board reduces, reduces The installation space occupied, realizes miniaturized structure, is brought convenience for use.

The above descriptions are merely preferred embodiments of the present invention, and not the technical scope of the utility model is made Any restrictions, therefore every any trickle amendment made according to the technical essence of the utility model to above example, equivalent change Change and modification, in the range of still falling within technical solutions of the utility model.

Claims

1. a kind of temperature detect switch (TDS) synchronism detection plate of miniaturized structure, include pcb board and be arranged on pcb board multiple connects Line terminals, multiple first relays, multiple inductance, multiple first capacitances, multiple first resistors, multiple second resistances, Duo Ge Two relays, two DIP-IC stands, two 3rd resistors, two second capacitances and two triodes；It is characterized in that：Multiple wire connection terminals Spacing side by side is arranged in the surface cephalolateral margin of pcb board；Multiple first relay spacing side by side set and are located at multiple wire connection terminals Rear side, multiple inductance and multiple first capacitances be located at the surface left border of pcb board, and multiple inductance are arranged side by side, multiple first Capacitance is arranged side by side and is located at the rear side of multiple inductance, and multiple first resistor arrays are arranged in the margo dexter on pcb board surface, more A second resistance, multiple second relays, two DIP-IC stands, two 3rd resistors, two second capacitances and two triodes are respectively positioned on The surface posterior lateral margin of pcb board, multiple second resistances are distributed in the rear side of the rear side of the first capacitance and the first relay of the leftmost side, One first diode is both provided with by the side of each second resistance, multiple second relays are arranged side by side, two DIP-IC stands point Not Wei Yu multiple second relays the left and right sides, two 3rd resistors respectively be located at two DIP-IC stands right side, two second electricity Hold respectively on the right side of two 3rd resistors, which is located at two DIP-IC stands, two 3rd resistors and two second capacitances respectively Rear side.

2. the temperature detect switch (TDS) synchronism detection plate of miniaturized structure according to claim 1, it is characterised in that：The pcb board For rectangle, its four edges are both provided with a mounting hole.

3. the temperature detect switch (TDS) synchronism detection plate of miniaturized structure according to claim 1, it is characterised in that：The terminals Son is five be arranged side by side.

4. the temperature detect switch (TDS) synchronism detection plate of miniaturized structure according to claim 1, it is characterised in that：Described first after Electric appliance is three, and every one first relay is and spring relay.

5. the temperature detect switch (TDS) synchronism detection plate of miniaturized structure according to claim 1, it is characterised in that：Adjacent two first One the 4th resistance and one second diode are both provided between relay.

6. the temperature detect switch (TDS) synchronism detection plate of miniaturized structure according to claim 1, it is characterised in that：The inductance is Two.

7. the temperature detect switch (TDS) synchronism detection plate of miniaturized structure according to claim 1, it is characterised in that：First electricity Hold for three, the first capacitance is CBB electric capacity.

8. the temperature detect switch (TDS) synchronism detection plate of miniaturized structure according to claim 1, it is characterised in that：First electricity Hinder for four, for four first resistors in the row arrangement of two rows two, each first resistor is fixed carbon resister.

9. the temperature detect switch (TDS) synchronism detection plate of miniaturized structure according to claim 1, it is characterised in that：Second electricity Hinder for three, each second resistance is fixed carbon resister.

10. the temperature detect switch (TDS) synchronism detection plate of miniaturized structure according to claim 1, it is characterised in that：Described second Relay is three, and every one second relay is Panasonic's relay.