CN207331056U - Material microcosmic surface syntype coating system - Google Patents
Material microcosmic surface syntype coating system Download PDFInfo
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- CN207331056U CN207331056U CN201721208274.5U CN201721208274U CN207331056U CN 207331056 U CN207331056 U CN 207331056U CN 201721208274 U CN201721208274 U CN 201721208274U CN 207331056 U CN207331056 U CN 207331056U
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Abstract
The utility model open material microcosmic surface syntype coating system, is related to and belongs to surface syntype coating technique field.The system includes：Chemical vapour deposition reaction chamber, the air inlet feed system being connected with reaction chamber side, vacuum-control(led) system positioned at reaction chamber side, lectrothermal alloy wire heating system positioned at reaction chamber top, circulating water cooling system positioned at reaction chamber lower part, the quartz observing window positioned at reaction chamber top.The effect and benefit of the utility model are that formed plated film film layer is nanoscale, and controllable with raw material syntype, dense uniform, thickness；Resistant heating is wound outside device control water bath heating temperature, admission line and feed rate is adjusted by the way of gas flowmeter, eliminate mass flow controller, reduce equipment cost, the configuration of the device is simplified, greatly reduces the possibility that reaction monomers condense in admission line.
Description
Technical field
The utility model belongs to surface syntype coating technique field, is related specifically to carry out nanometer ruler to material microcosmic surface
Spend syntype plated film, the surface hydrophobicity modification system of rank.
Background technology
Hydrophobicity is one of key character of material surface, it is common by the chemical composition and surface geometry of material
Determine.Its property is usually evaluated with water contact angle.In general, water claims on surface of the surface of solids contact angle more than 90 °
For hydrophobic surface.When water in the contact angle of the surface of solids more than 150 ° when, which is known as super hydrophobic surface.
With the development of society, the requirement in industrial and life to material hydrophobic is higher and higher.For waterproof garment,
For many applications such as packaging material, waterproof electronic product, self-cleaning surface, antifogging surface, higher water contact angle is hydrophobic
The most effective key foundation of property.The hydrophobic function for such product need to be improved at present, this is also that each manufacturing enterprise puts forth effort
The technical problem of solution.
The method of material surface hydrophobically modified mainly has Physical and chemical method.Physical modification the result is that modifying agent and material
Material is there are the interaction force between Van der Waals force, hydrogen bond force equimolecular, but there is no covalent bond or ionic bond effect, modified effect
Fruit is unstable.Chemical modification is primarily referred to as modifying agent and is chemically reacted with material surface, the hydrophobic film that forming properties are stablized
Layer.It is most common hydrophobically modified method wherein to carry out graft modification to material surface using silicon fluoride, silane coupling agent etc..[K
Sirichai,Li K.Preparation and characterization of hydrophobic ceramic hollow
fiber membrane[J].Journal of membrane Science,2007,291(1):70-76] utilize perfluor ethoxy
Base silane (FAS) is to Al2O3Ceramic hollow fibrous membrane is modified, and ceramic membrane surface contact angle reaches close to 120 °.Chinese patent
CN103088629A utilizes cetyl trimethylammonium bromide using polyethylene terephthalate (PET) fabric as raw material
PET non-woven fabrics is pre-processed with strong alkali compound etc., is then placed in silane precursor, adds hydrophobic alkyl silanization afterwards
Compound, obtains the hydrophobic surface that water contact angle is more than 150 ° after heat treatment.However, nearly all traditional liquid phase thin film coated side
Method is all prepared by wet method.The shortcomings that wet-process modified is operating time length, and operation sequence is cumbersome；Modified required amount of reagent consumption
Greatly, coating procedure often requires to use organic solution, therefore is not suitable for base material (such as plastics to organic solution sensitivity
Deng)；More difficult control film thickness, the nanoscale film to form uniform syntype is difficult on baroque surface.
Chemical vapor deposition (CVD, Chemical Vapor Deposition) is another method of chemical modification,
It is containing other gases introducings needed for the gaseous reactant or the steam of liquid reactants and reaction for forming film element
Reative cell, chemically reacts in substrate surface, and solid product is deposited to the process of Surface Creation film.It includes 4
Main Stage：1. reacting gas is spread to material surface；2. reacting gas is adsorbed on the surface of material；3. produced in material surface
Chemical reaction；4. gaseous by-product departs from material surface.
Conventional chemical vapor deposition mainly includes plasma reinforced chemical vapour deposition (PECVD) and laser chemistry gas phase is sunk
Product (LCVD) etc..Plasma reinforced chemical vapour deposition is that the plasma produced by gas glow discharge carrys out intensified response thing
The chemism of matter, promotes the chemical reaction between gas.But plasma generation process can attach higher energy, to surface
Fluoro-containing group needed for hydrophobically modified has larger destruction, and the chemical constitution of film can not accurately control and required functional group
It is not easy to maintain；Heatproof requirement to required hydrophobically modified material is also higher.In addition, the energy needed for PECVD reactions is higher, it is unfavorable
In the control of surface hydrophobicity modified condition and modified cost.
So exploitation a kind of easy to operate, mild condition, process control, applied widely, nanoscale and raw material
The coating system of surface syntype is extremely important.
Utility model content
Present situation and existing deficiency for the processing of above material surface, the utility model are directed to a kind of technique letter
It is single, equipment is simple, mild condition, process control, material microcosmic surface syntype coating system applied widely, the system energy
It is enough to form the uniform nanoscale hydrophobic film of a layer thickness in material surface, and reach good syntype effect.
To reach above purpose of utility model, the technical solution adopted in the utility model is：
Material microcosmic surface syntype coating system, including chemical vapour deposition reaction chamber, air inlet feed system, vacuum control
System processed, lectrothermal alloy wire heating system, circulating water cooling system, quartz observing window.
The chemical vapour deposition reaction chamber (32) includes lower cavity and dismountable upper chamber, the lower chamber
Body and upper chamber add fluorine rubber ring to seal by bolt；
Its underpart cavity bottom sets sample stage, for holding material to be plated；The chemical vapour deposition reaction chamber
Top sets quartz observing window, and material film plating is handled on real-time monitored chemical vapour deposition reaction chamber bottom sample platform
Process；Air inlet feed system is connected with chemical vapour deposition reaction chamber side, for chemical vapour deposition reaction chamber
Reactant monomer and initiator are provided；Vacuum-control(led) system is connected with chemical vapour deposition reaction chamber side, for controlling
Vacuum environment in chemical vapour deposition reaction chamber；Lectrothermal alloy wire heating system and chemical vapour deposition reaction chamber top
It is connected, the temperature for controlling lectrothermal alloy wire reaches initiator and cracks required temperature；Circulating water cooling system is with changing
Learn vapour deposition reaction chamber lower part to be connected, for controlling chemical vapour deposition reaction chamber bottom sample platform and sample stage
The temperature of material to be plated.
The air inlet feed system includes initiator inlet duct and reactant monomer inlet duct two parts, for controlling
Reactant monomer and initiator charge flow rate ratio.Wherein, reactant monomer inlet duct includes water bath heating device, reactant list
Body container, reactant gas flow meter, reactant air induction conduit, reactant outtake tube, DC power supply and lectrothermal alloy wire；Water
Bath heating unit is located at below reactant monomer container, is gasified by water bath heating device to reactant monomer；The reaction
Thing monomer container is connected by reactant gas flow meter with reactant air induction conduit one end, for controlling reactant gas air inlet
Flow；The reactant air induction conduit other end is connected with chemical vapour deposition reaction chamber, for chemical vapour deposition reaction chamber
Supply response thing gas in room；The endcapped of the reactant outtake tube, in chemical vapor deposition reaction chamber, it is opened
Junction of the mouth end with reactant air induction conduit on chemical vapour deposition reaction chamber communicates, the tube wall of reactant outtake tube
On be provided with gas port, for reactant gas equably to be imported in reaction chamber.The lectrothermal alloy wire is wrapped in reaction
Outside thing air induction conduit, and it is connected with DC power supply, for heating the reactant gas in air induction conduit, prevents its condensation.Institute
The initiator inlet duct stated, including trigger agent container, initiator gas flowmeter, initiator air induction conduit, initiator outlet
Conduit and air valve；The initiation agent container is connected by gas flowmeter with initiator air induction conduit one end, is triggered for controlling
Agent gas inlet flow；The initiator air induction conduit other end is connected by air valve with chemical vapour deposition reaction chamber, for controlling
Initiator gas processed enters reaction chamber；The initiator outtake tube is located in chemical vapour deposition reaction chamber, it is open
The junction with initiator air induction conduit on chemical vapour deposition reaction chamber is held to communicate, it is anti-for initiator gas to be imported
Answer in chamber.
The vacuum-control(led) system includes vacuum pump, vacuum meter and air valve；The vacuum pump and chemical vapour deposition reaction
Chamber is connected, for the indoor air of abstraction reaction chamber and byproduct of reaction etc., to keep the indoor vacuum environment of reaction chamber；
Chemical vapour deposition reaction chamber is connected by vacuum meter with computer, for measuring the indoor pressure of reaction chamber in real time, and will
The data feedback of measurement is to computer；The air valve is connected with chemical vapour deposition reaction chamber, for adjusting reaction chamber
Interior vacuum pressure.
The lectrothermal alloy wire heating system includes B alloy wire rack, DC power supply and temperature sensor；The B alloy wire
Rack includes lectrothermal alloy wire, ceramic bowl, adjustable support, and in deposition reaction chamber, lectrothermal alloy wire is arranged in B alloy wire
On rack, and it is wrapped on ceramic bowl, to ensure insulating properties；Ceramic bowl is located at the both ends of B alloy wire rack, for fixing alloy
Silk；B alloy wire rack bottom is in contact by adjustable support with the indoor sample stage of reaction chamber；Adjustable support by varying height,
To adapt to the material to be plated of different-thickness；DC power supply is connected with the lectrothermal alloy wire both ends of B alloy wire rack；Temperature sensing
Device is connected with the lectrothermal alloy wire on B alloy wire rack and digital readout system respectively, for measuring the temperature of lectrothermal alloy wire in real time,
And the temperature value of measurement is fed back into digital readout system.
The circulating water cooling system includes reative cell cooling chamber, bosh, water pump and temperature sensor；The reaction
Room cooling chamber is located at the lower part of sample stage, and is connected respectively with bosh and water pump, and inside holds coolant.The cooling
Chamber both ends are connected with bosh and water pump respectively；Water pump is connected with bosh and cooling chamber respectively, for that will cool down
Coolant in sink is delivered in cooling chamber；Temperature sensor positioned at cooling chamber top is connected with digital readout system, is used for
The temperature on measurement cooling chamber top in real time, and the temperature value of measurement is fed back into digital readout system.
Further, which further includes the online sedimentation rate monitoring system at the top of chemical vapour deposition reaction chamber
System, for monitoring the sedimentation rate and deposit thickness of material surface hydrophobic film layer to be plated inside chemical vapour deposition reaction chamber；
Flow perturbation device inside chemical vapour deposition reaction chamber, including electronic rotation motor and electronic rotation revolution
Axis, electronic rotation motor are fixedly connected by rotation axis with deposition reaction chamber, for disturbing the indoor gas of deposition reaction chamber；
The tail gas collection system outside chemical vapour deposition reaction chamber is further included, it is connected with the gas outlet of vacuum pump, uses
In byproduct and tail gas caused by collection deposition reaction, in order to avoid environment is polluted.
Preferably, the chemical vapour deposition reaction chamber includes lower cavity and dismountable upper chamber, under described
Portion's cavity and upper chamber add fluorine rubber ring to seal by bolt.
Preferably, the shape of chemical vapour deposition reaction chamber is rectangle, circle, ellipse or hexagon etc..
Preferably, the number of sample stage is 1-6；Further, the sample stage horizontal can rotate at a high speed, electronic rotation
Turn motor with sample stage to be connected, and be fixedly connected by rotation axis with chemical vapour deposition reaction chamber.
Preferably, the heating-up temperature of water bath heating device is 40-100 DEG C.
Preferably, reactant monomer feed rate is 0.1-10.0 times of initiator feed rate.
Preferably, the feed rate of reactant monomer is 0.1-3.0sccm.
Preferably, the diameter of the air induction conduit is greater than or equal to the diameter of outtake tube, the reactant air induction conduit
1.0-6.0 times of a diameter of reactant outtake tube diameter.
Preferably, a diameter of 2.0-10.0mm of the air induction conduit.
Preferably, a diameter of 1.0-6.0mm of the gas port.The spacing of the gas port is 10-30mm.The air guide
The number in hole is 2-10.
Preferably, the initiator outtake tube is located at 5-25mm above lectrothermal alloy wire rack.
Preferably, the reactant outtake tube is located at 5-25mm below lectrothermal alloy wire rack.
Preferably, the gas-guide tube is corrosion-resistant, good heat conductivity pipe, such as stainless steel tube.
Preferably, it is 10-4000Pa that the vacuum pump, which controls the pressure of reaction chamber,.
Preferably, the lectrothermal alloy wire is nichrome wire.
Preferably, a diameter of 0.1-1.0mm of air induction conduit outside lectrothermal alloy wire；The winding side of the B alloy wire
Formula is screw type.
Preferably, the lectrothermal alloy wire heating system includes an at least lectrothermal alloy wire for heating, is preferably
2-16 root heater strips.
Preferably, the spacing of lectrothermal alloy wire is 5-20mm in the lectrothermal alloy wire heating system.
Preferably, in the lectrothermal alloy wire heating system lectrothermal alloy wire a diameter of 0.6-3.0mm.The electric heating closes
The diameter of spun gold can make choice according to actual conditions.
Preferably, the height of electrothermal alloy flight lead reaction chamber bottom sample platform is 20- in the lectrothermal alloy wire rack
50mm。
Preferably, the DC power supply using control voltage it is constant, adjustment size of current by the way of change B alloy wire temperature.
Voltage control below, ensures the security of experiment in safe voltage (24V).
Preferably, flow of cooling water trend includes but is not limited to S types, hollow and spiral in the reative cell cooling chamber
Type.
Preferably, the coolant in the reative cell cooling chamber is cooling water.
Preferably, the quartz observing window at the top of reaction chamber by fluorine rubber ring with being sealed.
Preferably, the shape of the quartz observing window is rectangle, circle, ellipse or hexagon etc..
The beneficial effects of the utility model are：
1. the plated film film layer that system described in the utility model is formed is nanoscale, the pellicle film energy and former material
Expect syntype, dense uniform, thickness is controllable, does not influence the original shape of material and structure.
2. reaction monomers wind resistance outside using control water bath heating temperature, admission line in system described in the utility model
Silk is heated and feed rate is adjusted by the way of gas flowmeter, compared with conventionally employed mass flow controller, is eliminated
Mass flow controller, reduces equipment cost, simplifies the configuration of the device, greatly reduces reaction monomers in admission line
The possibility of middle condensation, and reduce process costs.
3. system described in the utility model uses reactant gas guiding device, reactant monomer is uniformly divided through gas port
Be distributed in deposition reaction chamber, substantially increase the utilization ratio of reactant monomer, enhance coating effects, reduce plated film into
This.
4. high vacuum environment is not required in system described in the utility model, operable scope is wide, is remained in low vacuum environment
Nanoscale syntype plated film is carried out to material.
5. the utility model heats lectrothermal alloy wire by the way of DC power supply, adjustment voltage is taken in experiment
Change B alloy wire temperature with the size of electric current, voltage in the range of safe voltage (24V), ensure that the safety of experiment always
Property.
6. B alloy wire rack is detachable in system lectrothermal alloy wire heating system described in the utility model, adjustable height,
For coating process carry out provide many convenience.
7. the utility model is placed in reaction chamber upper top cover using large scale quartz plate, feelings are deposited easy to real-time monitored coating
Condition.
8. hydrophobically modified effect is fine.Compared with traditional surface graft modification etc., film table made from the utility model
Face hydrophobic effect is more preferable, and water contact angle is more than 120 °, and for rough surface, modified surface water contact angle can reach super thin
Water rank (>150°).
Brief description of the drawings
Attached drawing 1 is the schematic diagram of material microcosmic surface syntype coating system described in the utility model.
Attached drawing 2 is the SEM of the polyacrylonitrile non-woven constructions tunica fibrosa before and after the syntype plated film hydrophobic treatment of surface in embodiment 1
Figure：(a) before processing；(b) after handling.
Attached drawing 3 is the thin of the polyacrylonitrile non-woven constructions tunica fibrosa before and after the syntype plated film hydrophobic treatment of surface in embodiment 1
The test result figure of water measure of merit：(a) before processing；(b) after handling.
Attached drawing 4 is that the water of the polyacrylonitrile non-woven constructions tunica fibrosa after the syntype plated film hydrophobic treatment of surface in embodiment 1 connects
Feeler test chart.
In figure：1 air inlet feed system；2 initiator outtake tubes；3 air valves；4 initiator air induction conduits；5 initiator gases
Flowmeter；；6 initiator inlet ducts；7 trigger agent container；8 reactant monomer inlet ducts；9 water bath heating devices；10 reactions
Thing monomer container；11 reactant gas flow meters；12 reactant air induction conduits；13 DC power supplies；14 lectrothermal alloy wires；15 reactions
Thing outtake tube；16 sample stages；17 materials to be plated；18 circulating water cooling systems；19 water pumps；20 reative cell cooling chambers；21 coolings
Sink；22 temperature sensors；23 vacuum-control(led) systems；24 vacuum meters；25 air valves；26 vacuum pumps；27 lectrothermal alloy wires heating system
System；28 temperature sensors；29 DC power supplies；30 quartz observing windows；31 lectrothermal alloy wire racks；32 chemical vapour deposition reactions
Chamber.
Embodiment
In order to which the purpose of this utility model, technical solution and beneficial effect is better described, with reference to embodiments into one
Step narration specific embodiment of the present utility model in detail.It is to be understood that the embodiment described be merely to illustrate the utility model and
It is not used in limitation the scope of the utility model.
The utility model is based on chemical vapour deposition technique and carries out syntype plated film to material microcosmic surface.Chemical vapour deposition technique
It is a kind of new functional polymer method for manufacturing thin film of green.It combines traditional liquid phase free radical polymerisation and chemical gas
Phase deposition technique, method will polymerize required initiator and function monomer gasification introduces cavity, be induced under relatively low heating-up temperature
Initiator cracks, and monomer polymerization is deposited on into macromolecule membrane in substrate.
Specifically, it is the material microcosmic surface syntype coating system designed by the utility model as shown in Figure 1, it includes：
Chemical vapour deposition reaction chamber 32, the air inlet feed system 1 being connected with reaction chamber side, positioned at reaction chamber side
Vacuum-control(led) system 23, the lectrothermal alloy wire heating system 27 positioned at reaction chamber top, the circulation positioned at reaction chamber lower part
Water cooling system 18, the quartz observing window 30 positioned at reaction chamber top.
During system work described in the utility model, recirculating cooling water system 18 is first turned on, is injected into bosh 21
Mixture of ice and water, opens water pump 19, and cooling water is injected reative cell cooling chamber 20 by water pipe, makes 20 top of reative cell cooling chamber
Temperature be kept at room temperature.Respectively reactant monomer and initiator are added to reactant monomer container 10 and initiation agent container 7.
Initiator inlet duct 6 is then turned on, initiator is output to initiator gas flowmeter 5, initiator gas from initiation agent container 7
Lectrothermal alloy wire rack 31 in chemical vapour deposition reaction chamber 32 is reached by air valve 3, air induction conduit 4 and outtake tube 2
Top.The flow for being passed through initiator gas is determined by initiator gas flowmeter 5 and air valve 3.It is then turned on vacuum-control(led) system
23, air valve 25 is closed, opens vacuum pump 26, controls the vacuum environment in chemical vapour deposition reaction chamber 32.It is then turned on electricity
Heat seal spun gold heating system 27, opens DC power supply 29, adjusts the voltage and current of DC power supply 29, makes lectrothermal alloy wire rack
Lectrothermal alloy wire temperature on 31 reaches initiator and cracks required temperature.Treat that vacuum meter 24 reads registration and temperature sensor
When 28 reading registrations are stablized, reactant monomer inlet duct 8 is opened, opens water bath heating device 9 and DC power supply 13, setting is instead
Answer the temperature needed for thing air inlet.Reactant monomer is output to reactant gas flow meter 11 from reactant monomer container 10, reaction
Thing gas reaches lectrothermal alloy wire rack 31 in chemical vapour deposition reaction chamber 32 by air induction conduit 12 and outtake tube 15
Lower part.The flow of reactant gas is passed through by winding Resistant heating and reactant gas outside water bath heating temperature, admission line
Flowmeter body determines.When gas passes through the lectrothermal alloy wire for reaching predetermined temperature, initiator can be induced to be cracked into free radical, make
Reactant monomer aggregates into macromolecule membrane, and one layer of uniform syntype hydrophobic film coating is formed in substrate surface.
Embodiment 1
Polyacrylonitrile non-woven constructions tunica fibrosa using 14wt% made from method of electrostatic spinning is the painting to be plated of the present embodiment
The material of layer.Polyacrylonitrile non-woven constructions tunica fibrosa is put on the sample stage of material microcosmic surface syntype coating system.Trigger
Agent is di-t-butyl peroxide, and reactant monomer is divinylbenzene (DVB).The pressure for controlling reaction chamber is 1500Pa, control
It is 30 DEG C that system, which triggers the temperature of agent container, and the temperature for controlling reactant monomer container is 40 DEG C, and the temperature for controlling heater strip is 225
DEG C, reactant monomer and initiator are with 2:1 flow-rate ratio is passed through reaction chamber, and the wherein flow of reactant monomer is 2.0sccm,
The flow of initiator is 1.0 sccm.The reactive deposition time is 60min.Since polyacrylonitrile non-woven constructions tunica fibrosa porosity can
Up to 90%, fiber film thickness is 100 μm or so, and the tow sides of tunica fibrosa can form hydrophobic film in a coating process
Layer.
The polyacrylonitrile non-woven constructions tunica fibrosa that hydrophobic coating plated film has been completed to the present embodiment carries out SEM image collection.
The morphology observations of tunica fibrosa are carried out using tengsten lamp scanning electron microscope (QUANTA 450), collection result is as shown in Figure 2.Figure
2 (a) is the tunica fibrosa SEM pictures of surface hydrophobicity before modified, and Fig. 2 (b) is the modified tunica fibrosa SEM pictures of surface hydrophobicity.Can
To find, significant change does not occur for the structure snd size of rear fiber before modified, illustrates hydrophobic coating and former film surface syntype.
The polyacrylonitrile non-woven constructions tunica fibrosa that hydrophobic coating plated film has been completed to the present embodiment carries out hydrophobic effect test.
Test result is as shown in Figure 3.Fig. 3 (a) is design sketch before modified, and water droplet soaks polyacrylonitrile fibre membrane, illustrates poly- third quickly
Alkene nitrile tunica fibrosa is in hydrophily；Fig. 3 (b) is modified design sketch, and drop is in polyacrylonitrile fibre membrane surface aggregation, glomeration
Or ellipsoid, do not penetrate into polyacrylonitrile fibre membrane, illustrate that the polyacrylonitrile non-woven constructions tunica fibrosa in the present embodiment is hydrophobic
Modified effect is fine.
The polyacrylonitrile non-woven constructions tunica fibrosa that hydrophobic coating plated film has been completed to the present embodiment carries out water contact angle test,
Test result is as shown in Figure 4.Tunica fibrosa surface water contact angle is more than 150 °, illustrates the polyacrylonitrile non-woven constructions in the embodiment
Tunica fibrosa hydrophobically modified effect is fine.
The polypropylene of surface hydrophobicity modification has been completed to the present embodiment using homemade waterpower osmosis pressure (LEP) test device
Nitrile non-woven constructions tunica fibrosa carries out waterpower osmosis pressure (LEP) test, and it is 0.5mL/min to inject speed.The maximum of the tunica fibrosa
LEP values are 15.6psi (108kPa).The result shows that the surface hydrophobicity of the polyacrylonitrile non-woven constructions tunica fibrosa in the embodiment
Modified effect is fine.
Embodiment described above is only the preferred embodiment of the utility model, and the implementation of the utility model is not limited with this
Scope.It will be understood by those of skill in the art that the change that all shape, principles according to the utility model are made, should all cover
It is within the protection scope of the present utility model.
Claims (10)
1. material microcosmic surface syntype coating system, it is characterised in that supplied including chemical vapour deposition reaction chamber (32), air inlet
To system (1), vacuum-control(led) system (23), lectrothermal alloy wire heating system (27), circulating water cooling system (18), quartz observing
Window (30)；
The chemical vapour deposition reaction chamber (32) includes lower cavity and dismountable upper chamber, the lower cavity and
Upper chamber adds fluorine rubber ring to seal by bolt；
Its underpart cavity bottom sets sample stage (16), for holding material to be plated；The chemical vapour deposition reaction chamber
(32) quartz observing window (30) is set at the top of upper chamber；Air inlet feed system (1) and vacuum-control(led) system (23) respectively with
Chemical vapour deposition reaction chamber (32) side connects, lectrothermal alloy wire heating system (27) and chemical vapour deposition reaction chamber
(32) top is connected；Circulating water cooling system (18) is connected with chemical vapour deposition reaction chamber (32) lower part；
The air inlet feed system (1) includes initiator inlet duct (6) and reactant monomer inlet duct (8) two parts；Its
In, reactant monomer inlet duct includes water bath heating device (9), reactant monomer container (10), reactant gas flow meter
(11), reactant air induction conduit (12), reactant outtake tube (15), DC power supply (13) and lectrothermal alloy wire (14)；Water-bath
Heating unit is located at below reactant monomer container；The reactant monomer container passes through reactant gas flow meter and reactant
Air induction conduit one end is connected；The reactant air induction conduit other end is connected with chemical vapour deposition reaction chamber；The reactant goes out
The endcapped of airway (15), in chemical vapor deposition reaction chamber, its openend is with reactant air induction conduit in chemistry
Junction on vapour deposition reaction chamber communicates, and gas port is provided with the tube wall of reactant outtake tube, for that will react
Thing gas is equably imported in reaction chamber；The lectrothermal alloy wire is wrapped in outside reactant air induction conduit, and and direct current
Source is connected；The initiator inlet duct (6), including trigger agent container (7), initiator gas flowmeter (5), initiator into
Airway (4), initiator outtake tube (2) and air valve (3)；The initiation agent container passes through gas flowmeter and initiator air inlet
Tube at one end is connected；The initiator air induction conduit other end is connected by air valve with chemical vapour deposition reaction chamber；The initiation
Agent outtake tube is located in chemical vapour deposition reaction chamber, its openend is anti-in chemical vapor deposition with initiator air induction conduit
The junction on chamber is answered to communicate；
The vacuum-control(led) system (23) includes vacuum pump (26), vacuum meter (24) and air valve (25)；The vacuum pump and chemistry
Vapour deposition reaction chamber is connected；Chemical vapour deposition reaction chamber is connected by vacuum meter with computer；The air valve with
Chemical vapour deposition reaction chamber is connected；
The lectrothermal alloy wire heating system (27) includes B alloy wire rack (31), DC power supply (29) and temperature sensor
(28)；The B alloy wire rack includes lectrothermal alloy wire, ceramic bowl, adjustable support, in deposition reaction chamber, electrothermal alloy
Silk is arranged on B alloy wire rack, and is wrapped on ceramic bowl；Ceramic bowl is located at the both ends of B alloy wire rack (31), for fixing
B alloy wire；B alloy wire rack bottom is in contact by adjustable support with the indoor sample stage of reaction chamber (16)；DC power supply is with closing
The lectrothermal alloy wire both ends of spun gold rack are connected；Temperature sensor respectively with the lectrothermal alloy wire and digital display on B alloy wire rack
System is connected；
The circulating water cooling system (18) includes reative cell cooling chamber (20), bosh (21), water pump (19) and temperature and passes
Sensor (28)；The reative cell cooling chamber is located at the lower part of sample stage, and is connected respectively with bosh and water pump, and inside is contained
Put coolant；The cooling chamber both ends are connected with bosh and water pump respectively；Water pump respectively with bosh and cooling chamber
It is connected；Temperature sensor positioned at cooling chamber top is connected with digital readout system.
2. material microcosmic surface syntype coating system according to claim 1, it is characterised in that the system, which further includes, to be located at
Online sedimentation rate monitoring system at the top of chemical vapour deposition reaction chamber, for monitoring in chemical vapour deposition reaction chamber
The sedimentation rate and deposit thickness of portion's material surface hydrophobic film layer to be plated；Air-flow inside chemical vapour deposition reaction chamber
Disturbance device, including electronic rotation motor and electronic rotation motor revolving shaft, electronic rotation motor are anti-with deposition by rotation axis
Chamber is answered to be fixedly connected, for disturbing the indoor gas of deposition reaction chamber；Further include outside chemical vapour deposition reaction chamber
The tail gas collection system in portion, it is connected with the gas outlet of vacuum pump.
3. material microcosmic surface syntype coating system according to claim 1 or 2, it is characterised in that the sample stage with
Electronic rotation motor is connected, and is fixedly connected by rotation axis with chemical vapour deposition reaction chamber.
4. material microcosmic surface syntype coating system according to claim 1 or 2, it is characterised in that the heating water bath
The heating-up temperature of device (9) is 40-100 DEG C.
5. material microcosmic surface syntype coating system according to claim 1 or 2, it is characterised in that reactant monomer into
Gas velocity rate is 0.1-10 times of initiator feed rate；The feed rate of reactant monomer is 0.1-3.0sccm.
6. material microcosmic surface syntype coating system according to claim 1 or 2, it is characterised in that the reactant into
1.0-6.0 times of a diameter of reactant outtake tube diameter of airway；A diameter of 2.0-10mm of the air induction conduit.
7. material microcosmic surface syntype coating system according to claim 1 or 2, it is characterised in that the reactant goes out
A diameter of 1.0-6mm of gas port on airway；The spacing of gas port is 10-30mm；The number of the gas port is 2-10
It is a.
8. material microcosmic surface syntype coating system according to claim 1 or 2, it is characterised in that the initiator goes out
Airway is located at 5-25mm above lectrothermal alloy wire rack；The reactant outtake tube is located at 5- below lectrothermal alloy wire rack
25mm。
9. material microcosmic surface syntype coating system according to claim 1 or 2, it is characterised in that the vacuum pump control
The pressure of chemical vapour deposition reaction chamber processed is 10-4000Pa.
10. material microcosmic surface syntype coating system according to claim 1 or 2, it is characterised in that lectrothermal alloy wire platform
The height of electrothermal alloy flight lead reaction chamber bottom sample platform is 20-50mm in frame；A diameter of 0.6- of the lectrothermal alloy wire
3.0mm；The spacing of the lectrothermal alloy wire is 5-20mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107488837A (en) * | 2017-09-20 | 2017-12-19 | 大连理工大学 | Material microcosmic surface syntype coating system |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107488837A (en) * | 2017-09-20 | 2017-12-19 | 大连理工大学 | Material microcosmic surface syntype coating system |
| CN107488837B (en) * | 2017-09-20 | 2019-04-16 | 大连理工大学 | Material microcosmic surface syntype coating system |
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