CN207327780U - A kind of anti-static type seals electronics patch packaging film structure - Google Patents
A kind of anti-static type seals electronics patch packaging film structure Download PDFInfo
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- CN207327780U CN207327780U CN201721339717.4U CN201721339717U CN207327780U CN 207327780 U CN207327780 U CN 207327780U CN 201721339717 U CN201721339717 U CN 201721339717U CN 207327780 U CN207327780 U CN 207327780U
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Abstract
It the utility model is related to field of electronic devices, more particularly to anti-static type heat-sealing electronics patch packaging film structure.The anti-static type heat-sealing electronics patch packaging film structure from top to bottom includes the first antistatic layer, pet layer, polyolefin layer, tack coat, hot sealing layer, the second antistatic layer successively；First antistatic layer is arranged on the upper surface of pet layer；The lower surface of the pet layer is coated with polyolefin layer；The lower surface of the polyolefin layer is coated with tack coat；The lower surface of the tack coat is provided with hot sealing layer；The lower surface of the hot sealing layer is provided with the second antistatic layer；The thickness of the anti-static type heat-sealing electronics patch packaging film structure is 0.01~1.5 millimeter.
Description
Technical field
It the utility model is related to field of electronic devices, more particularly to anti-static type heat-sealing electronics patch packaging film structure.
Background technology
The encapsulation braid of electronic device delivery conveying (electronics zero, component transporting body) is by automatic taping-machine etc., by electricity
Sub- spare part is inserted in the groove on the carrier band coordinated with original paper, and it is micro- in 50-65 that one layer of plastic thickness is covered above carrier band
A kind of tearability upper capping film of rice, allows a kind of Tearable cover tape with carrier band sealing one by the hot knife on automatic taping-machine
Tool leakproofness is played, electronic device is lain in carrier band groove, is unlikely to come off, while must be fulfilled for being placed in carrier band groove
In electronic device cannot produce property with epiphragma that it is covered above, when SMT patches processs, ensureing when peeling off epiphragma will not general
Electronic device sticks up in the lump, and is rolled into plate-like and is transported.What this technology was generally carried out using full-automatic braider.Using
, it is necessary to which the electronic components of strip disc dress will be rolled into during electronic components, by SMT post-chips machine by a kind of tearability lid
Band is automatic to be peeled off, then the electronic components being placed in inside the groove of carrier band are taken out with robotic arm, is installed on circuit boards,
This automated installation of system has become the main trend of this industry.
With the micromation of electronic product, automation trend, electronization proposes requirements at the higher level；With develop it is a viscosity and
The highly stable encapsulating products of peeling force, to realize the encapsulation of electronic device to the normal component of product packaging in packed and transported
On security and the reliability that uses.
Utility model content
The utility model provides a kind of anti-static type heat-sealing electronics patch packaging film structure, the anti-static type heat-sealing
Electronics patch packaging film structure from top to bottom includes the first antistatic layer, pet layer, polyolefin layer, tack coat, heat-sealing successively
Layer, the second antistatic layer；
First antistatic layer is arranged on the upper surface of pet layer；
The lower surface of the pet layer is coated with polyolefin layer；
The lower surface of the polyolefin layer is coated with tack coat；
The lower surface of the tack coat is provided with hot sealing layer；
The lower surface of the hot sealing layer is provided with the second antistatic layer；
The thickness of the anti-static type heat-sealing electronics patch packaging film structure is 0.01~1.5 millimeter.
As a kind of perferred technical scheme, the thickness of first antistatic layer is：0.001~0.1 millimeter.
As a kind of perferred technical scheme, the thickness of second antistatic layer is：0.001~0.1 millimeter.
As a kind of perferred technical scheme, the thickness of the pet layer is：0.001~0.5 millimeter.
As a kind of perferred technical scheme, the thickness of the polyolefin layer is：0.003~0.4 millimeter.
As a kind of perferred technical scheme, the thickness of the tack coat is：0.002~0.2 millimeter.
As a kind of perferred technical scheme, the thickness of the hot sealing layer is：0.002~0.2 millimeter.
As a kind of perferred technical scheme, the tack coat from top to bottom includes the first tack coat, the second bonding successively
Layer, the 3rd tack coat, the 4th tack coat；Between first tack coat, the second tack coat, the 3rd tack coat, the 4th tack coat
Thickness ratio be 1：10：1：3.
As a kind of perferred technical scheme, the upper surface of the pet layer is provided with some first groove structures；Described
The shape of the vertical section of one groove structure for square, rectangle, it is trapezoidal in any one or a few mixing.
As a kind of perferred technical scheme, the lower surface of the pet layer is provided with some second groove structures；Described
The shape of the vertical section of two groove structures for square, rectangle, it is trapezoidal in any one or a few mixing.
The beneficial effects of the utility model：The anti-static type heat-sealing electronics patch packaging film structure of the utility model, institute
State anti-static type heat-sealing electronics patch packaging film structure from top to bottom includes the first antistatic layer, pet layer, polyolefin successively
Layer, tack coat, hot sealing layer, the second antistatic layer；Using the Double layer anti-static layer of unique design, be the first antistatic layer and
Second antistatic layer, and the first antistatic layer and the second antistatic layer are mutually non-conterminous, wherein, the second antistatic layer can be only
Special plays anlistatig cushioning effect.It has been found that the first antistatic layer is used alone, its antistatic property is shorter
What can be reduced in time is very fast, and uses the antistatic layer of this double-decker that antistatic service life can be caused to prolong significantly
It is long.Meanwhile multi-layered bonded layer, the preferable stripping for controlling anti-static type heat-sealing electronics patch packaging film structure of design
Power so that stripping is very steady, prevents electronic component into line bounce.At the same time so that pet layer, polyolefin layer, tack coat,
Interaction force between hot sealing layer is stronger, due to being respectively arranged with the first groove structure, second on pet layer and polyolefin layer
, easily there is the phenomenon slided in groove structure between overcoming layer by layer.Thus, there is provided the beneficial effects of the utility model.
Brief description of the drawings
In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment
Or attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, drawings in the following description are only
It is some embodiments of the utility model, for those of ordinary skill in the art, in the premise not made the creative labor
Under, other attached drawings can also be obtained according to these attached drawings.
Fig. 1 is the structure diagram that anti-static type seals electronics patch packaging film structure；
Fig. 2 is that the anti-static type of more tack coats seals the structure diagram of electronics patch packaging film structure；
Fig. 3 is the structural representation that electronics patch packaging film structure is sealed containing the anti-static type of groove structure and more tack coats
Figure；
Symbol description：
The first antistatic layers of 1-；2-PET layers；3- polyolefin layers；4- tack coats；5- hot sealing layers；The second antistatic layers of 6-；7-
First tack coat；The second tack coats of 8-；The 3rd tack coats of 9-；The 4th tack coats of 10-；The second groove structures of 11-；12- first is recessed
Slot structure.
Embodiment
Participate in the election of following the utility model the detailed description for being preferable to carry out method and including embodiment can be more easily understood
The content of the utility model.Unless otherwise defined, all technologies used herein and scientific terminology has and the utility model
The normally understood identical implication of one skilled in the art.When there is a conflict, the definition in this specification shall prevail.
The following is a combination of the drawings in the embodiments of the present utility model, and the technical scheme in the embodiment of the utility model is carried out
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are without making creative work
All other embodiments obtained, shall fall within the protection scope of the present invention.
Those skilled in the art of the present technique are appreciated that unless otherwise defined, all terms used herein (including technology art
Language and scientific terminology) there is the meaning identical with the general understanding of the those of ordinary skill in the utility model fields.Also
It should be understood that those terms such as defined in the general dictionary should be understood that with the context of the prior art
The consistent meaning of meaning, and unless defined as here, will not be explained with the implication of idealization or overly formal.
The implication of "and/or" described in the utility model refers to the simultaneous situation of respective individualism or both
In being included in.
The implication of " inside and outside " described in the utility model is referred to relative to equipment itself, inside sensing equipment
Direction be interior, otherwise is outer, rather than the specific restriction of the equipment mechanism to the utility model.
When the implication of " left and right " described in the utility model refers to reader's face attached drawing, the left side of reader is
For a left side, the right as right side, rather than the specific restriction of the equipment mechanism to the utility model of reader.
The implication of " connection " described in the utility model can be between component to be directly connected to can also be between component
Pass through being indirectly connected with for other components.
Embodiment 1：
As shown in Figure 1, the embodiment 1 of the utility model provides a kind of anti-static type heat-sealing electronics patch packaging film knot
Structure, anti-static type heat-sealing electronics patch packaging film structure from top to bottom include successively the first antistatic layer 1, pet layer 2,
Polyolefin layer 3, tack coat 4, hot sealing layer 5, the second antistatic layer 6；
First antistatic layer 1 is arranged on the upper surface of pet layer 2；
The lower surface of the pet layer 2 is coated with polyolefin layer 3；
The lower surface of the polyolefin layer 3 is coated with tack coat 4；
The lower surface of the tack coat 4 is provided with hot sealing layer 5；
The lower surface of the hot sealing layer 5 is provided with the second antistatic layer 6；
The thickness of the anti-static type heat-sealing electronics patch packaging film structure is 0.01 millimeter；
The thickness of first antistatic layer 1 is：0.001 millimeter；
The thickness of second antistatic layer 6 is：0.001 millimeter；
The thickness of the pet layer 2 is：0.001 millimeter；
The thickness of the polyolefin layer 3 is：0.003 millimeter；
The thickness of the tack coat 4 is：0.002 millimeter；
The thickness of the hot sealing layer 5 is：0.002 millimeter.
Wherein, first antistatic layer 1 is polyethylene glycol coating；The polyolefin layer 3 is polypropylene；Described second is anti-
Electrostatic layer 6 is polyethylene glycol coating；Tack coat 3 is SEBS；Hot sealing layer 4 is polyurethane termoplastic elastomer.
Embodiment 2：
As shown in Figure 1, the embodiment 2 of the utility model provides a kind of anti-static type heat-sealing electronics patch packaging film knot
Structure, anti-static type heat-sealing electronics patch packaging film structure from top to bottom include successively the first antistatic layer 1, pet layer 2,
Polyolefin layer 3, tack coat 4, hot sealing layer 5, the second antistatic layer 6；
First antistatic layer 1 is arranged on the upper surface of pet layer 2；
The lower surface of the pet layer 2 is coated with polyolefin layer 3；
The lower surface of the polyolefin layer 3 is coated with tack coat 4；
The lower surface of the tack coat 4 is provided with hot sealing layer 5；
The lower surface of the hot sealing layer 5 is provided with the second antistatic layer 6；
The thickness of the anti-static type heat-sealing electronics patch packaging film structure is 1.5 millimeters；
The thickness of first antistatic layer 1 is：0.1 millimeter；
The thickness of second antistatic layer 6 is：0.1 millimeter；
The thickness of the pet layer 2 is：0.5 millimeter；
The thickness of the polyolefin layer 3 is：0.4 millimeter；
The thickness of the tack coat 4 is：0.2 millimeter；
The thickness of the hot sealing layer 5 is：0.2 millimeter.
Wherein, first antistatic layer 1 is polyethylene glycol coating；The polyolefin layer 3 is polypropylene；Described second is anti-
Electrostatic layer 6 is polyethylene glycol coating；Tack coat 3 is SEBS；Hot sealing layer 4 is polyurethane termoplastic elastomer.
Embodiment 3：
As shown in Figure 1, the embodiment 3 of the utility model provides a kind of anti-static type heat-sealing electronics patch packaging film knot
Structure, anti-static type heat-sealing electronics patch packaging film structure from top to bottom include successively the first antistatic layer 1, pet layer 2,
Polyolefin layer 3, tack coat 4, hot sealing layer 5, the second antistatic layer 6；
First antistatic layer 1 is arranged on the upper surface of pet layer 2；
The lower surface of the pet layer 2 is coated with polyolefin layer 3；
The lower surface of the polyolefin layer 3 is coated with tack coat 4；
The lower surface of the tack coat 4 is provided with hot sealing layer 5；
The lower surface of the hot sealing layer 5 is provided with the second antistatic layer 6；
The thickness of the anti-static type heat-sealing electronics patch packaging film structure is 1.2 millimeters；
The thickness of first antistatic layer 1 is：0.005 millimeter；
The thickness of second antistatic layer 6 is：0.005 millimeter；
The thickness of the pet layer 2 is：0.4 millimeter；
The thickness of the polyolefin layer 3 is：0.3 millimeter；
The thickness of the tack coat 4 is：0.2 millimeter；
The thickness of the hot sealing layer 5 is：0.2 millimeter.
Wherein, first antistatic layer 1 is polyethylene glycol coating；The polyolefin layer 3 is polypropylene；Described second is anti-
Electrostatic layer 6 is polyethylene glycol coating；Tack coat 3 is SEBS；Hot sealing layer 4 is polyurethane termoplastic elastomer.
Embodiment 4：
As shown in Fig. 2, the embodiment 4 of the utility model provides a kind of anti-static type heat-sealing electronics patch packaging film knot
Structure, anti-static type heat-sealing electronics patch packaging film structure from top to bottom include successively the first antistatic layer 1, pet layer 2,
Polyolefin layer 3, tack coat 4, hot sealing layer 5, the second antistatic layer 6；
First antistatic layer 1 is arranged on the upper surface of pet layer 2；
The lower surface of the pet layer 2 is coated with polyolefin layer 3；
The lower surface of the polyolefin layer 3 is coated with tack coat 4；
The lower surface of the tack coat 4 is provided with hot sealing layer 5；
The lower surface of the hot sealing layer 5 is provided with the second antistatic layer 6；
The thickness of the anti-static type heat-sealing electronics patch packaging film structure is 1.2 millimeters；
The thickness of first antistatic layer 1 is：0.005 millimeter；
The thickness of second antistatic layer 6 is：0.005 millimeter；
The thickness of the pet layer 2 is：0.4 millimeter；
The thickness of the polyolefin layer 3 is：0.3 millimeter；
The thickness of the tack coat 4 is：0.2 millimeter；
It is viscous that the tack coat 4 from top to bottom includes the first tack coat 7, the second tack coat 8, the 3rd tack coat the 9, the 4th successively
Tie layer 10；Thickness ratio between first tack coat 7, the second tack coat 8, the 3rd tack coat 9, the 4th tack coat 10 is 1：
10：1：3.
The thickness of the hot sealing layer 5 is：0.2 millimeter.
Wherein, first antistatic layer 1 is polyethylene glycol coating；The polyolefin layer 3 is polypropylene；Described second is anti-
Electrostatic layer 6 is polyethylene glycol coating；Hot sealing layer 4 is polyurethane termoplastic elastomer；First tack coat 7 is SEBS；Second bonds
Layer 8 is rosin resin；3rd tack coat 9 is polyurethane adhesive layer；4th tack coat 10 is SEBS.
Embodiment 5：
As shown in figure 3, the embodiment 5 of the utility model provides a kind of anti-static type heat-sealing electronics patch packaging film knot
Structure, anti-static type heat-sealing electronics patch packaging film structure from top to bottom include successively the first antistatic layer 1, pet layer 2,
Polyolefin layer 3, tack coat 4, hot sealing layer 5, the second antistatic layer 6；
First antistatic layer 1 is arranged on the upper surface of pet layer 2；
The lower surface of the pet layer 2 is coated with polyolefin layer 3；
The upper surface of the pet layer 2 is provided with 7 the first groove structures 12；The vertical section of first groove structure 12
Shape to be trapezoidal；
The lower surface of the polyolefin layer 3 is coated with tack coat 4；
The lower surface of the tack coat 4 is provided with hot sealing layer 5；
The lower surface of the hot sealing layer 5 is provided with the second antistatic layer 6；
The thickness of the anti-static type heat-sealing electronics patch packaging film structure is 1.2 millimeters；
The thickness of first antistatic layer 1 is：0.005 millimeter；
The thickness of second antistatic layer 6 is：0.005 millimeter；
The thickness of the pet layer 2 is：0.4 millimeter；
The thickness of the polyolefin layer 3 is：0.3 millimeter；
The thickness of the tack coat 4 is：0.2 millimeter；
It is viscous that the tack coat 4 from top to bottom includes the first tack coat 7, the second tack coat 8, the 3rd tack coat the 9, the 4th successively
Tie layer 10；Thickness ratio between first tack coat 7, the second tack coat 8, the 3rd tack coat 9, the 4th tack coat 10 is 1：
10：1：3.
The thickness of the hot sealing layer 5 is：0.2 millimeter.
Wherein, first antistatic layer 1 is polyethylene glycol coating；The polyolefin layer 3 is polypropylene；Described second is anti-
Electrostatic layer 6 is polyethylene glycol coating；Hot sealing layer 4 is polyurethane termoplastic elastomer；First tack coat 7 is SEBS；Second bonds
Layer 8 is rosin resin；3rd tack coat 9 is polyurethane adhesive layer；4th tack coat 10 is SEBS.
Embodiment 6：
As shown in figure 3, the embodiment 6 of the utility model provides a kind of anti-static type heat-sealing electronics patch packaging film knot
Structure, anti-static type heat-sealing electronics patch packaging film structure from top to bottom include successively the first antistatic layer 1, pet layer 2,
Polyolefin layer 3, tack coat 4, hot sealing layer 5, the second antistatic layer 6；
First antistatic layer 1 is arranged on the upper surface of pet layer 2；
The lower surface of the pet layer 2 is coated with polyolefin layer 3；
The upper surface of the pet layer 2 is provided with 7 the first groove structures 12；The vertical section of first groove structure 12
Shape to be trapezoidal；
The lower surface of the pet layer 2 is provided with 7 the second groove structures 11；The vertical section of second groove structure 11
Shape to be trapezoidal；
The lower surface of the polyolefin layer 3 is coated with tack coat 4；
The lower surface of the tack coat 4 is provided with hot sealing layer 5；
The lower surface of the hot sealing layer 5 is provided with the second antistatic layer 6；
The thickness of the anti-static type heat-sealing electronics patch packaging film structure is 1.2 millimeters；
The thickness of first antistatic layer 1 is：0.005 millimeter；
The thickness of second antistatic layer 6 is：0.005 millimeter；
The thickness of the pet layer 2 is：0.4 millimeter；
The thickness of the polyolefin layer 3 is：0.3 millimeter；
The thickness of the tack coat 4 is：0.2 millimeter；
It is viscous that the tack coat 4 from top to bottom includes the first tack coat 7, the second tack coat 8, the 3rd tack coat the 9, the 4th successively
Tie layer 10；Thickness ratio between first tack coat 7, the second tack coat 8, the 3rd tack coat 9, the 4th tack coat 10 is 1：
10：1：3.
The thickness of the hot sealing layer 5 is：0.2 millimeter.
Wherein, first antistatic layer 1 is polyethylene glycol coating；The polyolefin layer 3 is polypropylene；Described second is anti-
Electrostatic layer 6 is polyethylene glycol coating；Hot sealing layer 4 is polyurethane termoplastic elastomer；First tack coat 7 is SEBS；Second bonds
Layer 8 is rosin resin；3rd tack coat 9 is polyurethane adhesive layer；4th tack coat 10 is SEBS.
Foregoing example is merely illustrative, some features of the feature for explaining the disclosure.Appended claim
It is intended to require the scope as wide as possible being contemplated that, and embodiments as presented herein is only according to all possible embodiment
Combination selection embodiment explanation.Therefore, the purpose of applicant is that appended claim is not illustrated this practicality
The exemplary selectional restriction of new feature.And the progress in science and technology will be formed due to the inaccuracy of language performance
And the possible equivalent or son not being presently considered are replaced, and these changes should also be interpreted by institute in the conceived case
Attached claim covering.
Claims (10)
1. a kind of anti-static type seals electronics patch packaging film structure, it is characterised in that the anti-static type heat-sealing electronics patch
Piece packaging film structure from top to bottom includes the first antistatic layer, pet layer, polyolefin layer, tack coat, hot sealing layer, second successively
Antistatic layer；
First antistatic layer is arranged on the upper surface of pet layer；
The lower surface of the pet layer is coated with polyolefin layer；
The lower surface of the polyolefin layer is coated with tack coat；
The lower surface of the tack coat is provided with hot sealing layer；
The lower surface of the hot sealing layer is provided with the second antistatic layer；
The thickness of the anti-static type heat-sealing electronics patch packaging film structure is 0.01~1.5 millimeter.
2. anti-static type as claimed in claim 1 seals electronics patch packaging film structure, it is characterised in that described first is anti-
The thickness of electrostatic layer is：0.001~0.1 millimeter.
3. anti-static type as claimed in claim 1 seals electronics patch packaging film structure, it is characterised in that described second is anti-
The thickness of electrostatic layer is：0.001~0.1 millimeter.
4. anti-static type as claimed in claim 1 seals electronics patch packaging film structure, it is characterised in that the pet layer
Thickness be：0.001~0.5 millimeter.
5. anti-static type as claimed in claim 1 seals electronics patch packaging film structure, it is characterised in that the polyolefin
Layer thickness be：0.003~0.4 millimeter.
6. anti-static type as claimed in claim 1 seals electronics patch packaging film structure, it is characterised in that the tack coat
Thickness be：0.002~0.2 millimeter.
7. anti-static type as claimed in claim 1 seals electronics patch packaging film structure, it is characterised in that the hot sealing layer
Thickness be：0.002~0.2 millimeter.
8. anti-static type as claimed in claim 1 seals electronics patch packaging film structure, it is characterised in that the tack coat
From top to bottom include the first tack coat, the second tack coat, the 3rd tack coat, the 4th tack coat successively；First tack coat,
Thickness ratio between two tack coats, the 3rd tack coat, the 4th tack coat is 1：10：1：3.
9. anti-static type as claimed in claim 1 seals electronics patch packaging film structure, it is characterised in that the pet layer
Upper surface be provided with some first groove structures；The shape of the vertical section of first groove structure for square, rectangle,
Any one or a few mixing in trapezoidal.
10. anti-static type as claimed in claim 1 seals electronics patch packaging film structure, it is characterised in that the pet layer
Lower surface be provided with some second groove structures；The shape of the vertical section of second groove structure for square, rectangle,
Any one or a few mixing in trapezoidal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721339717.4U CN207327780U (en) | 2017-10-18 | 2017-10-18 | A kind of anti-static type seals electronics patch packaging film structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721339717.4U CN207327780U (en) | 2017-10-18 | 2017-10-18 | A kind of anti-static type seals electronics patch packaging film structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207327780U true CN207327780U (en) | 2018-05-08 |
Family
ID=62365470
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721339717.4U Active CN207327780U (en) | 2017-10-18 | 2017-10-18 | A kind of anti-static type seals electronics patch packaging film structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207327780U (en) |
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2017
- 2017-10-18 CN CN201721339717.4U patent/CN207327780U/en active Active
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Address after: East, 4th and 5th Floor, Building 16, Changxing Science and Technology Park, Wan'an Road, Shayi Community, Shajing Street, Baoan District, Shenzhen, Guangdong, 518000 Patentee after: Shenzhen xinchuangyuan Precision Intelligent Manufacturing Co.,Ltd. Address before: 518101 4th floor, building 16, Changxing Science Park, Shayi community, Shajing street, Bao'an District, Shenzhen City, Guangdong Province Patentee before: SHENZHEN XCY ELECTRICAL PARTS CO.,LTD. |
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