CN207327428U - A kind of stamping die suitable for mobile phone shell - Google Patents
A kind of stamping die suitable for mobile phone shell Download PDFInfo
- Publication number
- CN207327428U CN207327428U CN201721218915.5U CN201721218915U CN207327428U CN 207327428 U CN207327428 U CN 207327428U CN 201721218915 U CN201721218915 U CN 201721218915U CN 207327428 U CN207327428 U CN 207327428U
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- CN
- China
- Prior art keywords
- die
- driver
- circuit board
- drive circuit
- drivers
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The utility model discloses a kind of stamping die suitable for mobile phone shell,Including the upper mold with stamping parts,Lower die with die cavity,First driver,Some second drivers and drive circuit board,First driver is drivingly connected with upper mold,First driver driving upper mold does straight reciprocating motion in vertical direction,Stamping parts is inserted in die cavity,The top of lower die offers the hole for injecting glue connected with die cavity,Solid plate is provided with the middle part of lower die,Solid plate offers some ventholes and heat emission hole,Some ventholes are connected with die cavity and heat emission hole respectively,Heat emission hole is used to connect with outside,An installation cavity is formed between the lower part of lower die and solid plate,Some second drivers and drive circuit board are fixedly installed in installation cavity respectively,Some second drivers are connected with drive circuit board respectively,Every one second driver is provided with a telescopic rod,Every one second driver drives a telescopic rod to be inserted in a venthole.The stamping die demoulding time is short, and production efficiency is high.
Description
Technical field
It the utility model is related to technical field of mold, more particularly to a kind of stamping die suitable for mobile phone shell.
Background technology
Handset shell is generally produced using die casting, and existing structure of cast die includes upper die and lower die, and lower die has
Die cavity, the melten gel in the stamping parts punching press die cavity of upper mold, to form mobile phone shell.Since the mobile phone shell being stamped and formed out is close to die cavity
It is interior, therefore demoulding time is grown, low production efficiency.
Utility model content
The main purpose of the utility model is to propose a kind of stamping die suitable for mobile phone shell, it is intended to reduces mobile phone shell and takes off
The mould time, there is provided production efficiency.
To achieve the above object, the utility model proposes a kind of stamping die suitable for mobile phone shell, including with punching
The upper mold of casting die, lower die, the first driver, some second drivers and the drive circuit board with die cavity, first driving
Device is drivingly connected with the upper mold, and first driver drives the upper mold to do straight reciprocating motion in vertical direction, described
Stamping parts is inserted in the die cavity；
The top of the lower die offers the hole for injecting glue connected with the die cavity, and cover half is provided with the middle part of the lower die
Plate, the solid plate offer some ventholes and heat emission hole, some ventholes respectively with the die cavity and the heat dissipation
Hole connects, and the heat emission hole is used to connect with outside；
An installation cavity, some second drivers and driving electricity are formed between the lower part of the lower die and the solid plate
Road plate is fixedly installed in the installation cavity respectively, and some second drivers are connected with the drive circuit board respectively, institute
State every one second driver and be provided with a telescopic rod, each second driver drives a telescopic rod to be inserted in described in one
In venthole.
Preferably, wireless power supply is further included, the drive circuit board is connected with the wireless power supply.
Technical solutions of the utility model offer the hole for injecting glue connected with die cavity by using the top of lower die, for injecting
Colloidal sol；Solid plate offers some ventholes and heat emission hole, and in punching press, the second driver driving telescopic rod is extended so that flexible
Bar blocks the venthole of telescopic rod, thus is avoided that the mobile phone shell deformation of die cavity, the second driver driving telescopic rod contracting after punching press
It is short, so that some ventholes are connected with die cavity and heat emission hole respectively, since heat emission hole is used to connect with outside, on the one hand make mobile phone
Air pressure above shell is consistent with the air pressure of lower section, easy to demould, on the one hand easy to radiate, quickly cools down the temperature of lower die, from
And improve production efficiency.
Brief description of the drawings
In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment
Or attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, drawings in the following description are only
It is some embodiments of the utility model, for those of ordinary skill in the art, in the premise not made the creative labor
Under, other attached drawings can also be obtained according to the structure shown in these attached drawings.
Fig. 1 is the structure diagram for one embodiment of stamping die that the utility model is suitable for mobile phone shell；
The embodiments will be further described with reference to the accompanying drawings for the realization, functional characteristics and advantage of the utility model aim.
Embodiment
With reference to Fig. 1, in the utility model embodiment, the stamping die of mobile phone shell should be suitable for, including with stamping parts
110 upper mold 10, lower die 20, the first driver 30, some second drivers 40 and the drive circuit board 50 with die cavity 210,
First driver 30 is drivingly connected with upper mold 10, and the first driver 30 driving upper mold 10 does straight reciprocating motion in vertical direction,
So that stamping parts 110 is inserted in die cavity 210.
The top of lower die 20 offers the hole for injecting glue 220 connected with die cavity 210, and the middle part of lower die 20 is provided with solid plate
230, solid plate 230 offers some ventholes 231 and heat emission hole 232, some ventholes 231 respectively with die cavity 210 and heat dissipation
Hole 232 connects, and heat emission hole 232 is used to connect with outside.
An installation cavity, some second drivers 40 and drive circuit board are formed between the lower part of lower die 20 and solid plate 230
50 are fixedly installed in installation cavity respectively, and some second drivers 40 are connected with drive circuit board 50 respectively, every one second driving
Device 40 is provided with a telescopic rod 60, and every one second driver 40 drives a telescopic rod 60 to be inserted in a venthole 231.For example,
Die cavity 210 is formed between the top of lower die 20 and solid plate 230, some ventholes 231 are located at 210 bottom of die cavity.
Technical solutions of the utility model offer the hole for injecting glue 220 connected with die cavity 210 by using the top of lower die 20,
For injecting colloidal sol；Solid plate 230 offers some ventholes 231 and heat emission hole 232, and in punching press, the second driver 40 drives
Dynamic telescopic rod 60 extends so that telescopic rod 60 blocks the venthole 231 of telescopic rod 60, thus is avoided that the mobile phone shell of die cavity 210 becomes
Shape, after punching press the second driver 40 driving telescopic rod 60 shorten so that some ventholes 231 respectively with die cavity 210 and heat dissipation
Hole 232 connects, and since heat emission hole 232 is used to connect with outside, on the one hand makes the air pressure above mobile phone shell and the air pressure one of lower section
Cause, easy to demould, on the one hand easy to the temperature of heat dissipation, quickly cooling lower die 20, so as to improve production efficiency.
Preferably, wireless power supply 70, the wireless power supply should be further included suitable for the stamping die of mobile phone shell
70 are connected with the drive circuit board 50.Wireless power supply 70 is so that the second driver 40 has the function of wireless power.
The above is only the preferred embodiment of the present invention, and it does not limit the scope of the patent of the present invention,
It is every under the inventive concept of the utility model, equivalent structure made based on the specification and figures of the utility model becomes
Change, or directly/be used in other related technical areas indirectly and be included in the scope of patent protection of the utility model.
Claims (2)
1. a kind of stamping die suitable for mobile phone shell, it is characterised in that including the upper mold with stamping parts, with die cavity
Mould, the first driver, some second drivers and drive circuit board, first driver are drivingly connected with the upper mold, institute
Stating the first driver drives the upper mold to do straight reciprocating motion in vertical direction, and the stamping parts is inserted in the die cavity；
The top of the lower die offers the hole for injecting glue connected with the die cavity, and solid plate, institute are provided with the middle part of the lower die
State solid plate and offer some ventholes and heat emission hole, some ventholes connect with the die cavity and the heat emission hole respectively
Logical, the heat emission hole is used to connect with outside；
An installation cavity, some second drivers and drive circuit board are formed between the lower part of the lower die and the solid plate
It is fixedly installed on respectively in the installation cavity, some second drivers are connected with the drive circuit board respectively, Mei Yisuo
State the second driver and be provided with a telescopic rod, each second driver drives a telescopic rod to be inserted in a ventilation
In hole.
2. it is suitable for the stamping die of mobile phone shell as claimed in claim 1, it is characterised in that wireless power supply is further included,
The drive circuit board is connected with the wireless power supply.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721218915.5U CN207327428U (en) | 2017-09-21 | 2017-09-21 | A kind of stamping die suitable for mobile phone shell |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721218915.5U CN207327428U (en) | 2017-09-21 | 2017-09-21 | A kind of stamping die suitable for mobile phone shell |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207327428U true CN207327428U (en) | 2018-05-08 |
Family
ID=62370036
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721218915.5U Expired - Fee Related CN207327428U (en) | 2017-09-21 | 2017-09-21 | A kind of stamping die suitable for mobile phone shell |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207327428U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109226514A (en) * | 2018-11-17 | 2019-01-18 | 湖南融灏实业有限公司 | A kind of phone housing stamping die |
-
2017
- 2017-09-21 CN CN201721218915.5U patent/CN207327428U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109226514A (en) * | 2018-11-17 | 2019-01-18 | 湖南融灏实业有限公司 | A kind of phone housing stamping die |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180508 Termination date: 20190921 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |