CN207299347U - A kind of semiconductor refrigerating heating fan device and elevator applied to elevator - Google Patents
A kind of semiconductor refrigerating heating fan device and elevator applied to elevator Download PDFInfo
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- CN207299347U CN207299347U CN201721318579.1U CN201721318579U CN207299347U CN 207299347 U CN207299347 U CN 207299347U CN 201721318579 U CN201721318579 U CN 201721318579U CN 207299347 U CN207299347 U CN 207299347U
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Abstract
The utility model discloses a kind of semiconductor refrigerating heating fan device and elevator applied to elevator, including crossflow fan and semiconductor cooler, the crossflow fan includes shell and the cross flow fan being fixed in shell, the shell is provided with air inlet and air outlet, the air inlet and air outlet are arranged on the both sides of cross flow fan, the semiconductor cooler includes semiconductor chilling plate, first caloriscope and the second caloriscope, first caloriscope is arranged on crossing current air passage, the crossing current air passage is by the air inlet, air outlet and shell are formed inside the shell, second caloriscope is arranged at outside shell；The air inlet is towards in elevator, or the air inlet is connected towards in elevator by guide duct；And the air outlet is towards in elevator, or the air outlet is connected towards in elevator by guide duct.The utility model can be directed to the effect that elevator realizes semiconductor refrigerating heating.
Description
Technical field
It the utility model is related to elevator technology field, more particularly to a kind of semiconductor refrigerating heating fan applied to elevator
Device and elevator.
Background technology
The supply air system that present lift car uses generally uses conventional fan, crossflow fan (also referred to as cross flow fan),
There are individual elevators that common air-conditioning is installed.Conventional fan, crossflow fan do not reach control lift car humiture and other effects, in sweltering heat
Summer and cold winter, seating elevator can be made to become extremely uncomfortable.Lift car installs common air-conditioning, although electricity can be solved
Terraced carriage temperature problem, but due to：1) limited be subject to lift car space, make the installation of air-conditioning, maintenance extremely difficult；2) by
More in elevator shaft dust, heat sink of air conditioner is difficult easily to block, and makes air-conditioning is more difficult to reach expected cooling or heating effect；
3) air-conditioning is expensive, and power consumption is big；4) traditional air conditioner carries compressor, and running noises are larger.Since traditional air conditioner is installed on
Used on elevator, a large amount of water droplets can be produced on the ceiling of car top, influenced elevator safety and passenger uses, in addition traditional air conditioner
The water of generation is also required to uninterruptedly check and processing, so the scheme of elevator installation common air-conditioning hardly results in popularization, it is also more difficult
Solve the problems, such as that elevator ride is comfortable.
Utility model content
For overcome the deficiencies in the prior art, the utility model provides a kind of semiconductor refrigerating applied to elevator and heats wind
Fan device and elevator, can be directed to the effect that elevator realizes semiconductor refrigerating heating.
The utility model provides a kind of semiconductor refrigerating heating fan device applied to elevator, the semiconductor refrigerating
Heating fan device can be fixed on elevator car top or in carriage, including crossflow fan and semiconductor cooler, the horizontal stroke
Flow fan includes shell and the cross flow fan being fixed in shell, and the shell is provided with air inlet and air outlet, the inlet air
Mouth and air outlet are arranged on the both sides of cross flow fan, and semiconductor cooler described in elevator includes semiconductor chilling plate, the first heat
Device and the second caloriscope, first caloriscope are arranged on crossing current air passage, and the crossing current air passage is by the air inlet, air outlet
Formed inside the shell with shell, second caloriscope is arranged at outside shell；The air inlet is towards in lift car, Huo Zhesuo
Air inlet is stated to be connected towards in lift car by guide duct；And the air outlet is towards in lift car, or the outlet air
Mouth is connected towards in lift car by guide duct.
Radiator fan is additionally provided with second caloriscope.
The semiconductor cooler is installed in semiconductor refrigerating heating fan device using integral way, wherein：
The semiconductor cooler is integrally fixed on the housing using embedded mode, and first caloriscope is fixed
On the crossing current air passage, second caloriscope is located at outside the shell.
The semiconductor cooler is installed in semiconductor refrigerating heating fan device using split mode, wherein：
The body of the semiconductor cooler can be fixed on elevator or on the shell, and first caloriscope includes
Liquid transmission pump and evaporator, evaporator and the liquid transmission are connected between pumping by liquid delivery line, the liquid transmission
Pump is on body, and the evaporator is on the crossing current air passage.
First caloriscope is located on the crossing current air passage of air outlet side, or first caloriscope is located at air inlet
On the crossing current air passage of side.
Collecting box or drainage pipeline are provided with the shell.
Discharge outlet is provided with the collecting box.
When first caloriscope is radiator, second caloriscope is cooler；Or first caloriscope is
During cooler, second caloriscope is radiator.
The semiconductor chilling plate includes the semiconductor chilling plate of one or more.
Correspondingly, the utility model additionally provides a kind of elevator, the elevator includes lift car such as claim 1 to 9
Any one of them semiconductor refrigerating heating fan device, the air inlet towards in lift car, or the air inlet by
Guide duct is connected towards in lift car；And the air outlet is towards in lift car, or the air outlet is by guide duct
Connect towards in lift car.
Corresponding semiconductor cooler is provided with semiconductor refrigerating heating fan device in the utility model, based on half
Conductor refrigerator produces heat, the air circulation of cab interior is realized by cross flow fan, it is achieved thereby that the sky of elevator interior
Gas freezes or the effect of heating.Since the air outlet and air inlet of whole semiconductor refrigerating heating fan device are all directed towards elevator
In carriage, the control flow that can be realized under the work of cross flow fan inside lift car is imported and exported, in semiconductor refrigerating
When device works, air can realize cold or hot effect under the heat effect that semiconductor cooler produces in whole elevator,
Enter in whole elevator, so as to fulfill the cold or hot effect of air in whole lift space.Using this semiconductor system
Cooler, cold and hot control by multiple semiconductor chilling plates on semiconductor cooler complete cold-thermal effect, there is no compressor,
There is no the equipment such as refrigerant, and whole equipment is also convenient for installation on the elevator car, whole power consumption is also more much smaller than air-conditioning, nothing
The influence of noise that compressor produces.
Brief description of the drawings
In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment
Or attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, drawings in the following description are only
It is some embodiments of the utility model, for those of ordinary skill in the art, in the premise not made the creative labor
Under, other attached drawings can also be obtained according to these attached drawings.
Fig. 1 is the semiconductor refrigerating heating fan device first embodiment knot applied to lift car in the utility model
Structure schematic diagram；
Fig. 2 is the semiconductor refrigerating heating fan device second embodiment knot applied to lift car in the utility model
Structure schematic diagram；
Fig. 3 is the semiconductor refrigerating heating fan device 3rd embodiment knot applied to lift car in the utility model
Structure schematic diagram；
Fig. 4 is the semiconductor refrigerating heating fan device fourth embodiment knot applied to lift car in the utility model
Structure schematic diagram；
Fig. 5 is the elevator car roof structure diagram in the utility model.
Embodiment
Below in conjunction with the attached drawing in the embodiment of the present invention, the technical scheme in the embodiment of the utility model is carried out clear
Chu, be fully described by, it is clear that described embodiment is only part of the embodiment of the present invention, instead of all the embodiments.
Based on the embodiments of the present invention, what those of ordinary skill in the art were obtained without creative efforts is all
Other embodiments, shall fall within the protection scope of the present invention.
The semiconductor refrigerating heating fan device applied to elevator involved by the utility model, this semiconductor refrigerating system
Hot wind fan device can be fixed on elevator car top or in carriage, including crossflow fan and semiconductor cooler, the crossing current
Wind turbine includes shell and the cross flow fan that is fixed in shell, which is provided with air inlet and air outlet, the air inlet and goes out
Air port is arranged on the both sides of cross flow fan, which includes semiconductor chilling plate, the first caloriscope and the second heat
Device, first caloriscope be arranged at crossing current air passage on, the crossing current air passage by the air inlet, air outlet and shell inside the shell
Formed, which is arranged at outside shell.
In specific implementation process, air inlet and air outlet here can be directly set towards in lift car, here
Air inlet, air outlet can also be realized by guide duct, for example be connected on air inlet in guide duct access lift car, in outlet air
Connected on mouth in guide duct access lift car.
It should be noted that air inlet and air outlet here is accessed in lift car, it is and the air in lift car
The air circulation in lift car can be formed.
In specific implementation process, which is integrally fixed on semiconductor refrigerating heating wind using embedded mode
On the shell of fan device；Or the semiconductor cooler is installed in semiconductor refrigerating heating fan device using split mode.
In specific implementation process, first caloriscope and the second caloriscope realize that cooling and warming exchanges according to control system,
When the first caloriscope is radiator, the second caloriscope is cooler；Or when the first caloriscope is cooler, the second heat
Device is radiator.The semiconductor chilling plate includes the semiconductor chilling plate of one or more.
Specifically, Fig. 1 shows that the semiconductor refrigerating applied to lift car in the utility model embodiment heats wind
Fan device first embodiment structure diagram, it is cross-sectional view, is specifically included：Lift car (10), crossflow fan
(11) and semiconductor cooler (12), the crossflow fan (11) include shell (111) and the cross flow fan being fixed in shell
(112).With reference to lift car (10) practical application scene, semiconductor refrigerating heating fan device is fixed on lift car (10) top
Portion is most preferred, and can also be fixed on the top of lift car (10), detailed description below this structure particular content.
Crossflow fan (11) includes：Air inlet (113), air outlet (118), cross flow fan (112) and shell (111), into
Air port (113) and air outlet (118) may be provided at the both sides of cross flow fan (112), air inlet (113) and air outlet (118) court
In to lift car (10), crossflow fan (11), can be by the sky in lift car (10) under the work of cross flow fan (112)
Gas is by air inlet (113) into the air for then promoting to circulate goes out via crossing current air passage (114) to air outlet (118).Here horizontal stroke
Stream air passage (114) is formed inside the shell by air inlet (113), air outlet (118) and shell, based on crossflow fan (11) realization pair
Elevator car structure inner air circulation principle designs.
It should be noted that crossflow fan (11) generally comes with motor (not shown), this motor can drive crossing current wind
The rotation of (112) is fanned, so as to promote the air in lift car (10) to realize circulation.Certainly, it is also not necessarily limited to motor drive mode
To realize the rotation to cross flow fan (112).
Semiconductor chilling plate is the instrument of a heat transfer, i.e., when one piece of N-type semiconductor material and one block of P-type semiconductor material
Expect the thermocouple centering that is coupled to have electric current by when, heat transfer will be produced between both ends, heat will be shifted from one end
To the other end, so that producing the temperature difference forms hot and cold side.But semiconductor itself will when electric current passes through semiconductor there are resistance
Heat is produced, so that heat transfer can be influenced.And the heat between two pole plates can also pass through air and semi-conducting material itself
Carry out reverse heat transfer.When hot and cold side reaches certain temperature difference, when the amount of both heat transfers is equal, a balance will be reached
Point, just reverse heat transfer are cancelled out each other.The temperature of hot and cold side would not continue to change at this time.In order to reach lower temperature
Degree, can take the modes such as heat dissipation to reduce the temperature in hot junction to realize.It is cooling piece that the effect of fan and heat sink, which is mainly,
Hot-side heat dissipation.Between the temperature difference of usual semiconductor chilling plate hot and cold side can reach 40~65 degree, if passing through active heat removal
Mode reduce hot-side temperature, that cold junction temperature can also decline accordingly, so as to reach lower temperature.When one piece of N-type half
When conductor material and one piece of p-type semiconductor material are coupled to galvanic couple pair, after connecting DC current in this circuit, it can just produce
The transfer of energy, the connector that electric current is flowed to p-type element by N-type element absorb heat, become cold end；N-type member is flowed to by p-type element
The connector release heat of part, becomes hot junction.Heat absorption and exothermic size are the size and semi-conducting material N, P by electric current
Element logarithm determines.
Semiconductor cooler (12) includes：First caloriscope (123), the second caloriscope (121) and semiconductor chilling plate
(122), according to the cooling and warming operation principle of semiconductor cooler, when one end is heating end, the other end must be refrigeration end.So
During corresponding to cooling and warming effect：When first caloriscope is radiator, which is cooler；Or first caloriscope
For cooler when, which is radiator.
Whole semiconductor chilling plate (122) is located among the first caloriscope (123) and the second caloriscope (121), semiconductor
Cooling piece (122), which is based on operation principle, can produce hot junction heat and cold end heat, then based on the first caloriscope (123) surrounded
Promote hot junction heat and cold end heat that energy transfer occurs with the second caloriscope (121), that is, need real to lift car (10)
When now cooling down, then the first caloriscope (123) is used as cold end radiator, by cold end heat caused by semiconductor chilling plate (122)
Amount comes out, the air on cooling crossing current air passage (114), so as to fulfill the air cooling in lift car (10), while the
Two caloriscopes (121) are used as hot-side heat dissipation device, and hot junction heat caused by semiconductor chilling plate (122) is come out, with full
Sufficient semiconductor chilling plate (122) continuous firing；When needing to realize heating to lift car (10), then the first caloriscope
(123) hot-side heat dissipation device is used as, hot junction heat caused by semiconductor chilling plate (122) is come out, heating crossing current air passage
(114) air on, so as to fulfill the air heating in lift car (10), while the second caloriscope (121) is dissipated as cold end
Hot device, cold end heat caused by semiconductor chilling plate (122) is come out, to meet that semiconductor chilling plate (122) continues
Work.In whole energy transfer process, since the operation principle of semiconductor chilling plate (122) can realize hot junction heat, then
Hot junction heat is transferred out by hot junction heat by the hot-side heat dissipation device supported, cold end heat is by the cold end radiator supported
Cold end hot junction is transferred out.
It should be noted that the first caloriscope (123), the second caloriscope (121) on semiconductor cooler (12), by electricity
Terraced carriage (10) is actually needed, and realizes the effect of cooling and warming by control terminal, for example, the positive revertive control of electrode or electric current it is positive and negative
The modes such as control are the cold-thermal effect that can be achieved in lift car.
In specific implementation process, the first caloriscope (123) is directly acted on crossing current air passage (114), so as to cool down or add
Moving air on heat crossing current air passage (114), which is formed when being worked by crossflow fan (11), by crossflow fan
(11) under the action of the cross flow fan (112) and the first caloriscope (123) in, the air stream in lift car (10) can be promoted
It is logical, and accelerate heated or be cooled.Second caloriscope (121) acts on the outside of crossflow fan (115), in order to promote the second heat
Measuring device (121) carries out energy exchange, and radiator fan (124) is additionally provided with the second caloriscope (121).Here the first caloriscope
(123) and the second caloriscope (121) is generally guide card (the thermally conductive sheet, cool guide sheet) composition for conducting cold and hot energy, can be quickly from half
Energy is obtained on conductor cooling piece (12), and energy conduction is gone out, ensures energy heat source not on semiconductor chilling plate (12)
Accumulation, but (lift car or exterior space) is transferred in corresponding space.Radiator fan (124) can accelerate second
Energy conduction on caloriscope (121), and cross flow fan (112) can also promote the energy conduction on the first caloriscope (123).
Semiconductor cooler (12) shown in Fig. 1 is installed on semiconductor refrigerating heating fan device using integral way
In, i.e., semiconductor cooler (12) is fixed on the shell (111) of crossflow fan (11) using embedded mode, the first caloriscope
(123) it is fixed on crossing current air passage (114), the second caloriscope (121) is located at shell (111) outside, with reference to crossflow fan (11)
Operating mode, under controlled effect, only one end heat source carries out the air in lift car (10) heat conduction, other end heat
Source is directly discharged to lift car (10) exterior space, so as to fulfill the air heats in lift car (10) or is cooled.This
Air of the semiconductor cooler (12) by one end Source in lift car (10) in invention, it is achieved thereby that elevator car
Railway carriage or compartment (10) interior air being cooled or being heated.
The semiconductor cooler (12) is arranged on the crossing current air passage (114) of air outlet (118) side, relative to partly leading
Corresponding collecting box (116) is additionally provided with below chiller (12), is had between the collecting box (116) and air outlet (118)
Water proof catch, avoids ponding from entering lift car (10), and also has discharge outlet (117) on corresponding collecting box (116), should
Discharge outlet (117) can discharge ponding in time.In specific implementation process, collecting box is set in shell with the exception that, can also
Corresponding drainage pipeline is set, in time discharges ponding.Certainly, ponding here, can also also without disposable drained
Reserve corresponding water and realize humidification function for semiconductor refrigerating heating fan device.
In specific implementation process, one or more semiconductor chilling plate is provided with the semiconductor cooler (12)
(122), the quantity in semiconductor chilling plate (122) is actually opened according to cold cooling and warming effect.Certainly, quantity is fewer, its
Integrally cooling heating effect is less rapid, and quantity is more, its integrally cooling heating effect can be than faster realizing.The semiconductor
The multiple semiconductor chilling plates (122) arranged in a certain order are equipped with refrigerator (12), it can be along crossing current air passage (114)
Wind direction be arranged in order multiple semiconductor chilling plates (122), according to this sequential arrangement, based on crossing current air passage (114) circulation
Air can be cooled or be heated with continuation.
In specific implementation process, air sterilization device (115) is additionally provided with the semiconductor refrigerating heating fan device, should
For air sterilization device (115) on crossing current air passage (114), which can be ultraviolet sterilization, also may be used
To be ozone sterilization etc..
Specifically, Fig. 2 shows that the semiconductor refrigerating heating fan applied to lift car in the embodiment of the present invention fills
Second embodiment structure diagram is put, it is cross-sectional view, is specifically included：Lift car (20), crossflow fan (21)
With semiconductor cooler (22), which includes shell (211) and the cross flow fan (212) being fixed in shell.
With reference to lift car (20) practical application scene, semiconductor refrigerating heating fan device is fixed at the top of lift car (20) the most
It is good, detailed description below this structure particular content.
Crossflow fan (21) includes：Air inlet (213), air outlet (218), cross flow fan (212) and shell (211), into
Air port (213) and air outlet (218) may be provided at the both sides of cross flow fan (212), air inlet (213) and air outlet (218) court
In to lift car (20), crossflow fan (21), can be by the sky in lift car (20) under the work of cross flow fan (212)
Gas is by air inlet (213) into the air for then promoting to circulate goes out via crossing current air passage (214) to air outlet (218).Here horizontal stroke
Stream air passage (214) is formed inside the shell by air inlet (213), air outlet (218) and shell, based on crossflow fan (21) realization pair
Elevator structure inner air circulation principle designs.
It should be noted that crossflow fan (21) generally comes with motor (not shown), this motor can drive crossing current wind
The rotation of (212) is fanned, so as to promote the air in lift car (20) to realize circulation.Certainly, it is also not necessarily limited to motor drive mode
To realize the rotation to cross flow fan (212).
Semiconductor cooler (22) includes：First caloriscope (223), the second caloriscope (221) and semiconductor chilling plate
(222), according to the cooling and warming operation principle of semiconductor cooler, when one end is heating end, the other end must be refrigeration end.So
During corresponding to cooling and warming effect：When first caloriscope is radiator, which is cooler；Or first caloriscope
For cooler when, which is radiator.
Whole semiconductor chilling plate (222) is located among the first caloriscope (223) and the second caloriscope (221), semiconductor
Cooling piece (222), which is based on operation principle, can produce hot junction heat and cold end heat, then based on the first caloriscope (223) surrounded
Promote hot junction heat and cold end heat that energy transfer occurs with the second caloriscope (221), that is, need real to lift car (20)
When now cooling down, then the first caloriscope (223) is used as cold end radiator, by cold end heat caused by semiconductor chilling plate (222)
Amount comes out, the air on cooling crossing current air passage (214), so as to fulfill the air cooling in lift car (20), while the
Two caloriscopes (221) are used as hot-side heat dissipation device, and hot junction heat caused by semiconductor chilling plate (222) is come out, with full
Sufficient semiconductor chilling plate (222) continuous firing；When needing to realize heating to lift car (20), then the first caloriscope
(223) hot-side heat dissipation device is used as, hot junction heat caused by semiconductor chilling plate (222) is come out, heating crossing current air passage
(214) air on, so as to fulfill the air heating in lift car (20), while the second caloriscope (221) is dissipated as cold end
Hot device, cold end heat caused by semiconductor chilling plate (222) is come out, to meet that semiconductor chilling plate (222) continues
Work.In whole energy transfer process, since the operation principle of semiconductor chilling plate (222) can realize hot junction heat, then
Hot junction heat is transferred out by hot junction heat by the hot-side heat dissipation device supported, cold end heat is by the cold end radiator supported
Cold end hot junction is transferred out.
It should be noted that the first caloriscope (223), the second caloriscope (221) on semiconductor cooler (22), by electricity
Terraced carriage (20) is actually needed, and realizes the effect of cooling and warming by control terminal, for example, the positive revertive control of electrode or electric current it is positive and negative
The modes such as control are the cold-thermal effect that can be achieved in lift car.
In specific implementation process, the first caloriscope (223) is directly acted on crossing current air passage (214), so as to cool down or add
Moving air on heat crossing current air passage (214), which is formed when being worked by crossflow fan (21), by crossflow fan
(21) under the action of the cross flow fan (212) and the first caloriscope (223) in, the air stream in lift car (20) can be promoted
It is logical, and accelerate heated or be cooled.Second caloriscope (221) acts on the outside of crossflow fan (215), in order to promote the second heat
Measuring device (221) carries out energy exchange, and radiator fan (224) is additionally provided with the second caloriscope (221).Here the first caloriscope
(223) and the second caloriscope (221) is generally guide card (the thermally conductive sheet, cool guide sheet) composition for conducting cold and hot energy, can be quickly from half
Energy is obtained on conductor cooling piece (22), and energy conduction is gone out, ensures energy heat source not on semiconductor chilling plate (22)
Accumulation, but (lift car or exterior space) is transferred in corresponding space.Radiator fan (224) can accelerate second
Energy conduction on caloriscope (221), and cross flow fan (212) can also promote the energy conduction on the first caloriscope (223).
Semiconductor cooler (22) shown in Fig. 2 is installed on semiconductor refrigerating heating fan device using integral way
In, i.e., semiconductor cooler (22) is fixed on the shell (211) of crossflow fan (21) using embedded mode, the first caloriscope
(223) it is fixed on crossing current air passage (214), the second caloriscope (221) is located at shell (211) outside, with reference to crossflow fan (21)
Operating mode, under controlled effect, only one end heat source carries out the air in lift car (20) heat conduction, other end heat
Source is directly discharged to lift car (20) exterior space, so as to fulfill the air heats in lift car (20) or is cooled.This
Air of the semiconductor cooler (12) by one end Source in lift car (20) in invention, it is achieved thereby that elevator car
Railway carriage or compartment (20) interior air being cooled or being heated.
The semiconductor cooler (22) is arranged on the crossing current air passage (214) of air inlet (213) side, relative to partly leading
Corresponding collecting box (216) is additionally provided with below chiller (22), is had between the collecting box (216) and air inlet (213)
Water proof catch, avoids ponding from entering lift car (20), and also has discharge outlet (217) on corresponding collecting box (216), should
Discharge outlet (217) can discharge ponding in time.In specific implementation process, collecting box is set in shell with the exception that, can also
Corresponding drainage pipeline is set, in time discharges ponding.Certainly, ponding here, can also also without disposable drained
Reserve corresponding water and realize humidification function for semiconductor refrigerating heating fan device.
In specific implementation process, one or more semiconductor chilling plate is provided with the semiconductor cooler (22)
(222), the quantity in semiconductor chilling plate (222) is actually opened according to cold cooling and warming effect.Certainly, quantity is fewer, its
Integrally cooling heating effect is less rapid, and quantity is more, its integrally cooling heating effect can be than faster realizing.The semiconductor
The multiple semiconductor chilling plates (222) arranged in a certain order are equipped with refrigerator (22), it can be along crossing current air passage (214)
Wind direction be arranged in order multiple semiconductor chilling plates (222), according to this sequential arrangement, based on crossing current air passage (214) circulation
Air can be cooled or be heated with continuation.
In specific implementation process, air sterilization device (215) is additionally provided with the semiconductor refrigerating heating fan device, should
For air sterilization device (215) on crossing current air passage (214), which can be ultraviolet sterilization, also may be used
To be ozone sterilization etc..
The semiconductor cooler in semiconductor refrigerating heating fan device shown in Fig. 1 and Fig. 2 is overall with embedded mode
In semiconductor refrigerating heating fan device, the cold end of semiconductor cooler or hot-side heat dissipation device are placed in crossing current air passage
On, other end radiator is placed in outside crossflow fan, and the radiator for being placed in crossing current air passage can be complete machine installation by adhering to partly
In the shell of conductor cooling and warming fan assembly or split type pattern is installed in the shell of distinguished and admirable fan assembly, only
Need to be fixed on the radiator on the crossing current air passage of semiconductor refrigerating heating fan device, play cooling and warming effect,
Therefore it be able to can also be positioned adjacent on the distinguished and admirable air passage of air outlet on the crossing current air passage of air inlet is positioned adjacent to.
Fig. 3 and Fig. 4 are illustrated by taking split installation as an example, its concrete application principle is similar with Fig. 1 and Fig. 2.
Fig. 3 shows the semiconductor refrigerating heating fan device applied to lift car in the utility model embodiment
Three example structure schematic diagrams, it is cross-sectional view, is specifically included：Lift car (30), crossflow fan (31) and half
Conductor refrigerator (32), the structure of the crossflow fan (31) no longer repeat one by one, see the technology description described in Fig. 1 and Fig. 2.
Semiconductor cooler (32) in the embodiment is equipped with body and split, and body is independently installed in crossflow fan (31)
Outside, it can be fixed on lift car (30), can also be fixed on crossflow fan (31) shell, and split is then positioned at crossing current
On crossing current air passage in wind turbine (31).
The semiconductor cooler (32) includes：First caloriscope (323), the second caloriscope (321) and semiconductor chilling plate
(322), liquid transmission pump (327) and evaporator (325), are passed between evaporator (325) and liquid transmission pump (327) by liquid
Pipe (326) is sent to connect, liquid transmission pump is on the first caloriscope (323) of body, and the evaporator (325) is positioned at crossing current wind
On road.
Whole semiconductor chilling plate (322) is located among the first caloriscope (323) and the second caloriscope (321), semiconductor
Cooling piece (322), which is based on operation principle, can produce hot junction heat and cold end heat, then based on the first caloriscope (323) surrounded
Promote hot junction heat and cold end heat that energy transfer occurs with the second caloriscope (321), that is, need real to lift car (30)
When now cooling down, then the first caloriscope (323) is used as cold end radiator, by cold end heat caused by semiconductor chilling plate (322)
Amount comes out, and the liquid (i.e. coolant) that liquid transmission pump (327) is stored in the first caloriscope of cooling (323), liquid passes
Send the coolant of pump (327) driving storage to be moved to evaporator (325), heat is distributed in air passage of flowing over by evaporator (325)
Amount, cooling flows through the air in crossing current air passage, so as to fulfill the air cooling in lift car (30), while the second caloriscope
(321) hot-side heat dissipation device is used as, hot junction heat caused by semiconductor chilling plate (322) is come out, to meet semiconductor
Cooling piece (322) continuous firing；When needing to realize heating to lift car (30), then the first caloriscope (323) is as warm
Radiator is held, hot junction heat caused by semiconductor chilling plate (322) is come out, liquid in the first caloriscope of heating (323)
The liquid (i.e. heat but liquid) that body transmission pump (327) is stored, the hot but liquid of liquid transmission pump (327) driving storage is to evaporator
(325) to move, heat is distributed in air passage of flowing over by evaporator (325), heating flows through the air in crossing current air passage, so as to fulfill
Air heating in lift car (30), while the second caloriscope (321) is used as cold end radiator, by semiconductor chilling plate
(322) cold end heat comes out caused by, to meet semiconductor chilling plate (322) continuous firing.In whole energy transfer
During, since the operation principle of semiconductor chilling plate (322) can realize hot junction heat, then hot junction heat is by the warm supported
Hot junction heat is transferred out by end radiator, and cold end hot junction is transferred out of by cold end heat by the cold end radiator supported
Go.
It should be noted that the first caloriscope (223), the second caloriscope (321) on semiconductor cooler (32), by electricity
Terraced carriage (20) is actually needed, and realizes the effect of cooling and warming by control terminal, for example, the positive revertive control of electrode or electric current it is positive and negative
The modes such as control are the cold-thermal effect that can be achieved in lift car.
In specific implementation process, this split type semiconductor cooler is by the first caloriscope (323) indirectly-acting in crossing current
On air passage (314), it needs to be combined with realization energy by liquid transmission pump (327), evaporator (325) and liquid delivery line (326)
Amount conduction, so as to cool down or heat the moving air on crossing current air passage, the moving air is by crossflow fan (31) work when institute's shape
Into under the action of the cross flow fan in crossflow fan (31) and the first caloriscope (323), can promoting in lift car (30)
Air circulation, and accelerate heated or be cooled.Radiator fan (324) is additionally provided with the second caloriscope (321).Here
One caloriscope (323) and the second caloriscope (321) are generally guide card (the thermally conductive sheet, cool guide sheet) composition for conducting cold and hot energy, energy
Energy quickly is obtained from semiconductor chilling plate (32), and energy conduction is gone out, ensures energy heat source not in semiconductor refrigerating
Piece gathers on (322), but is transferred in corresponding space (lift car or exterior space).Radiator fan (324) can
To accelerate the energy conduction on the second caloriscope (321), and cross flow fan (312) can also promote on the first caloriscope (323)
Energy conduction.
Semiconductor cooler (22) split can be arranged on the crossing current air passage of air inlet side, relative to semiconductor
Refrigerator is additionally provided with corresponding collecting box below (32), has water proof catch between the collecting box and air inlet, avoids ponding
Lift car (30) is entered, and also there is discharge outlet on corresponding collecting box, which can discharge ponding in time.
In specific implementation process, collecting box is set in shell with the exception that, corresponding drainage pipeline can also be set, in time discharge ponding
Go.Certainly, ponding here can also reserve corresponding water for semiconductor refrigerating heating fan dress also without disposable drained
Put and realize humidification function.
In specific implementation process, one or more semiconductor chilling plate is provided with the semiconductor cooler (32)
(322), the quantity in semiconductor chilling plate (322) is actually opened according to cold cooling and warming effect.Certainly, quantity is fewer, its
Integrally cooling heating effect is less rapid, and quantity is more, its integrally cooling heating effect can be than faster realizing.
In specific implementation process, air sterilization device is additionally provided with the semiconductor refrigerating heating fan device, the air
For sterilizing unit on crossing current air passage, which can be ultraviolet sterilization or ozone sterilization etc..
Fig. 4 shows that the semiconductor refrigerating heating fan device the 4th applied to lift car in the embodiment of the present invention is real
A structure diagram is applied, it is cross-sectional view, is specifically included：Lift car (40), crossflow fan (41) and semiconductor
Refrigerator (42), the structure of the crossflow fan (41) no longer repeat one by one, see the technology description described in Fig. 1 and Fig. 2.
Semiconductor cooler (42) in the embodiment is equipped with body and split, in its specific body, Split type structure and Fig. 3
It is identical, the difference is that the Split type structure is located on the crossing current air passage of the air inlet side of crossflow fan (41), and point of Fig. 3
Body structure is located on the cross-flow passes of the air outlet side of crossflow fan (31), no longer repeat one by one here it is whole realize process and
Principle, in detail refering to the content shown in Fig. 1 to Fig. 3.
In the split installation shown in Fig. 3 and Fig. 4, liquid delivery line can penetrate shell and is connected with evaporator, this reality
The crossing current air passage that crossflow fan in example internally forms a sealing based on shell is applied, avoids crossing current air passage and the sky of non-lift car
Gas swaps.
Semiconductor refrigerating heating fan device involved by the utility model embodiment may be mounted in lift car before,
Afterwards, either party position of left and right, can also be installed on the space of elevator car roof by the way of furred ceiling, or installed in electricity
On top outside terraced carriage.Lift car inner top, side wall surrounding, bottom etc. are fixed on according to lift car form, guarantee is partly led
The cold heating fan device of system can be specifically used, and air inlet, the air outlet of this cross flow fan are embedded into elevator structure,
Wind turbine in semiconductor refrigerating heating fan device promotees under wind circulation, and the air in lift car can be promoted to be subject to semiconductor system
The effect of cooler, completes the heated or effect that is cooled, and improves the comfort level of air in lift car space.
The semiconductor refrigerating heating fan device may be mounted in elevator car either party position of forward and backward, left and right；The wind
Mouthful and the shape of air outlet include but not limited to flute profile, square or circular；Formed on the lift car by several air inlet/outlets
Mouthful, separated with semiconductor refrigerating heating fan device, the air inlet and air outlet realize that multiple inlet and outlets connect by guide duct
Connect.The shape of air inlet and air outlet can be with the semiconductor that flows over including but not limited to flute profile, square or circular, inlet and outlet
Refrigerating and heating combined equipment separates, and realizes that multiple inlet and outlets connect by guide duct.Fig. 5 shows the elevator in the embodiment of the present invention
Top structure for elevator car schematic diagram, it is equipped with elevator cage door 51 and several inlet and outlets 52, semiconductor refrigerating heating fan dress
Air inlet in putting can select several inlet and outlets 52 to be used as air intake passage by several guide ducts, the semiconductor refrigerating system
Air outlet in cold wind fan device can select several inlet and outlets 52 to be used as exit passageway by several guide ducts.
To sum up, the utility model embodiment is provided with corresponding semiconductor refrigerating on semiconductor refrigerating heating fan device
Device, produces heat based on semiconductor cooler, the air circulation of cab interior is realized by cross flow fan, it is achieved thereby that elevator
Internal air cooling or the effect of heating.Since the air outlet and air inlet of whole semiconductor refrigerating heating fan device are all
Towards in lift car, the control flow that can be realized under the work of cross flow fan inside lift car is imported and exported, half
When conductor refrigerator works, air can be realized cold under the heat effect that semiconductor cooler produces in whole lift car
Or heat effect, entering in whole lift car, so as to fulfill in whole lift car space air it is cold or hot
Effect.Using this semiconductor cooler, cold and hot control is cold to complete by multiple semiconductor chilling plates on semiconductor cooler
Fuel factor, there is no compressor, does not have the equipment such as refrigerant yet, and whole equipment is also convenient for installation on the elevator car, overall
Power consumption is also more much smaller than air-conditioning, the influence of noise that compressor-free produces.
The semiconductor refrigerating heating fan device and electricity applied to elevator provided above the utility model embodiment
Ladder is described in detail, and specific case used herein is set forth the principle and embodiment of the utility model,
The explanation of above example is only intended to the method and its core concept that help understands the utility model；Meanwhile for this area
Those skilled in the art, according to the thought of the utility model, there will be changes in specific embodiments and applications,
In conclusion this specification content should not be construed as the limitation to the utility model.
One of ordinary skill in the art will appreciate that all or part of step in the various methods of above-described embodiment is can
To instruct relevant hardware to complete by program, which can be stored in a computer-readable recording medium, storage
Medium can include：Read-only storage (ROM, Read Only Memory), random access memory (RAM, Random
Access Memory), disk or CD etc..
Claims (10)
1. a kind of semiconductor refrigerating heating fan device applied to elevator, it is characterised in that the semiconductor refrigerating heats wind
Fan device can be fixed on elevator car top or in carriage, including crossflow fan and semiconductor cooler, the crossflow fan
Including shell and the cross flow fan that is fixed in shell, the shell is provided with air inlet and air outlet, the air inlet and goes out
Air port is arranged on the both sides of cross flow fan, and semiconductor cooler described in elevator includes semiconductor chilling plate, the first caloriscope and the
Two caloriscopes, first caloriscope are arranged on crossing current air passage, and the crossing current air passage is by the air inlet, air outlet and shell
Formed inside the shell, second caloriscope is arranged at outside shell；The air inlet is towards in lift car, or the inlet air
Mouth is connected towards in lift car by guide duct；And the air outlet is towards in lift car, or the air outlet is by leading
Air hose is connected towards in lift car.
2. it is applied to the semiconductor refrigerating heating fan device of elevator as claimed in claim 1, it is characterised in that described second
Radiator fan is additionally provided with caloriscope.
3. it is applied to the semiconductor refrigerating heating fan device of elevator as claimed in claim 1, it is characterised in that described partly to lead
Chiller is installed in semiconductor refrigerating heating fan device using integral way, wherein：The semiconductor cooler is overall
Fixed on the housing using embedded mode, first caloriscope is fixed on the crossing current air passage, second heat
Measuring device is located at outside the shell；
Or the semiconductor cooler is installed in semiconductor refrigerating heating fan device using split mode, wherein：It is described
The body of semiconductor cooler can be fixed on elevator or on the shell, first caloriscope include liquid transmission pump and
Evaporator, evaporator and the liquid transmission are connected between pumping by liquid delivery line, and the liquid transmission pump is located on body,
The evaporator is on the crossing current air passage.
4. it is applied to the semiconductor refrigerating heating fan device of elevator as claimed in claim 1, it is characterised in that described partly to lead
The cold heating fan device of system is installed on either party position of forward and backward, left and right in elevator car；The shape of institute's air inlet and air outlet
Including：It is flute profile, square or circular；Formed on the lift car by several inlet and outlets, wind is heated with semiconductor refrigerating
Fan device separates, and the air inlet realizes that multiple inlet and outlets connect with air outlet by guide duct.
5. it is applied to the semiconductor refrigerating heating fan device of elevator as claimed in claim 1, it is characterised in that described first
Caloriscope is located on the crossing current air passage of air outlet side, or first caloriscope is located at the crossing current air passage of air inlet side
On.
6. it is applied to the semiconductor refrigerating heating fan device of elevator as claimed in claim 1, it is characterised in that the shell
Inside it is provided with collecting box or drainage pipeline.
7. it is applied to the semiconductor refrigerating heating fan device of elevator as claimed in claim 6, it is characterised in that described to catchment
Discharge outlet is provided with box.
8. it is applied to the semiconductor refrigerating heating fan device of elevator as claimed in claim 1, it is characterised in that described first
Caloriscope and second caloriscope realize that cooling and warming exchanges according to control system, when first caloriscope is radiator,
Second caloriscope is cooler；Or first caloriscope, when being cooler, second caloriscope is radiator.
9. it is applied to the semiconductor refrigerating heating fan device of elevator as claimed in claim 1, it is characterised in that described partly to lead
The multiple semiconductor chilling plates arranged in a certain order are equipped with chiller.
10. a kind of elevator, it is characterised in that the elevator is partly led including lift car such as claim 1 to 9 any one of them
The cold heating fan device of system, the air inlet is towards in lift car, or the air inlet is connected towards electricity by guide duct
In terraced carriage；And the air outlet is towards in lift car, or the air outlet is connected towards lift car by guide duct
It is interior.
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| CN201721318579.1U CN207299347U (en) | 2017-10-13 | 2017-10-13 | A kind of semiconductor refrigerating heating fan device and elevator applied to elevator |
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| CN201721318579.1U CN207299347U (en) | 2017-10-13 | 2017-10-13 | A kind of semiconductor refrigerating heating fan device and elevator applied to elevator |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107525183A (en) * | 2017-10-13 | 2017-12-29 | 广东寰宇电子科技股份有限公司 | A kind of semiconductor refrigerating heating fan device and elevator applied to elevator |
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2017
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107525183A (en) * | 2017-10-13 | 2017-12-29 | 广东寰宇电子科技股份有限公司 | A kind of semiconductor refrigerating heating fan device and elevator applied to elevator |
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