CN207239859U - A kind of piezoelectric ceramic wafer chamfering tool - Google Patents

A kind of piezoelectric ceramic wafer chamfering tool Download PDF

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Publication number
CN207239859U
CN207239859U CN201721278222.5U CN201721278222U CN207239859U CN 207239859 U CN207239859 U CN 207239859U CN 201721278222 U CN201721278222 U CN 201721278222U CN 207239859 U CN207239859 U CN 207239859U
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CN
China
Prior art keywords
piezoelectric ceramic
rotating platform
ceramic wafer
grinding
grinding base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201721278222.5U
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Chinese (zh)
Inventor
田德辉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wuxi Huifeng Electronics Co Ltd
Original Assignee
Wuxi Huifeng Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wuxi Huifeng Electronics Co Ltd filed Critical Wuxi Huifeng Electronics Co Ltd
Priority to CN201721278222.5U priority Critical patent/CN207239859U/en
Application granted granted Critical
Publication of CN207239859U publication Critical patent/CN207239859U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model provides a kind of chamfering tool of piezoelectric ceramic wafer, it includes grinding base, rotating platform and driving motor, the grinding base is installed on the rotating platform, and the driving motor is connected through belt with the rotating platform to drive the rotating platform to rotate, wherein:Bowl-shape grinding chamber formed with open upper end on the grinding base.The utility model is simple in structure, easy to use, it can be obviously improved the chamfering efficiency of piezoelectric ceramic wafer, so as to meet batch production demand.

Description

A kind of piezoelectric ceramic wafer chamfering tool
Technical field
A kind of milling apparatus of piezoelectric ceramic wafer is the utility model is related to, especially a kind of piezoelectric ceramic wafer chamfering work Dress.
Background technology
, it is necessary to grind off the corner angle of its edge using milling apparatus after piezoelectric ceramic wafer machine-shaping, have to be formed A certain size chamfering.In the prior art, general way is:Piezoelectric ceramic wafer is fixed on fixture, then uses sand paper The edge corner angle of piezoelectric ceramic wafer are ground, to achieve the purpose that chamfering.
The chamfering efficiency of the prior art is very low, and to expend substantial amounts of labour, it is difficult to meets to produce in enormous quantities Demand.For these reasons, it is necessary to a kind of dedicated piezoelectric ceramic wafer chamfering tool is developed, to lift chamfering efficiency.
Utility model content
To achieve the above object, the utility model provides a kind of piezoelectric ceramic wafer chamfering tool, its technical solution is such as Under:
A kind of piezoelectric ceramic wafer chamfering tool, it includes grinding base, rotating platform and driving motor, the grinding base peace On the rotating platform, the driving motor is connected through belt with the rotating platform to drive the rotating platform to revolve Turn, wherein:Bowl-shape grinding chamber formed with open upper end on the grinding base.
In a specific embodiment, the bottom of the grinding base is formed with slot, and the grinding base is through the engaging Groove is snapped connection in the upper end of the rotating platform.
In a specific embodiment, the bottom of the grinding chamber is equipped with connecting hole, the upper surface of the rotating platform Equipped with the mounting hole being used cooperatively with the connecting hole.
In a specific embodiment, the abrasive sand coating covered with predetermined thickness on the inner wall of the grinding chamber.
The utility model is simple in structure, easy to use, it can be obviously improved the chamfering efficiency of piezoelectric ceramic wafer, so that Meet batch production demand.
Brief description of the drawings
, below will be to required practicality in embodiment in order to illustrate more clearly of the technical solution of the utility model embodiment Attached drawing be briefly described, it should be evident that drawings in the following description are only some embodiments of the utility model, it is right For those of ordinary skill in the art, without creative efforts, it can also be obtained according to these attached drawings His attached drawing.Wherein,
Fig. 1 is the structure diagram of the utility model.
Embodiment
For make the above-mentioned purpose of the utility model, feature and advantage, can be more obvious understandable, below in conjunction with the accompanying drawings and tool Body embodiment is described in further detail the utility model.
Shown in please referring to Fig.1, piezoelectric ceramic wafer chamfering tool provided by the utility model includes grinding base 1, rotary flat Platform 2 and driving motor 3.The grinding base 1 is installed on the rotating platform 2, and the driving motor 3 is through belt and the rotation Platform 2 is connected to drive the rotating platform 2 to rotate, wherein:The grinding of bowl dress formed with open upper end on the grinding base 1 Chamber 11.
With continued reference to shown in Fig. 1, when needing to carry out chamfering operation to piezoelectric ceramic wafer 100, first by a certain amount of conjunction The mixture of gold sand and water is poured into the grinding chamber 11, and piezoelectric ceramic wafer 100 then is lain in a horizontal plane in the grinding chamber In 11.Driving motor 3 is opened, rotating platform 2 drives grinding base 1 to be rotated with predetermined angular speed, and operating personnel press pressing with hand The fixed piezoelectric ceramic wafer 100, in the process, the corner angle of 100 periphery of piezoelectric ceramic wafer are subject to 11 inner wall of grinding chamber Grinding, until chamfering terminates.
Certainly, in certain embodiments, there can be predetermined thickness by direct plating last layer on the inner wall of grinding chamber 11 The abrasive sand coating of degree.Like this, alloy sand need not be additionally added in chamfer process.
In order to facilitate the replacement of grinding base 1, in certain embodiments, the grinding base 1 is detachably connected to institute The upper end of rotating platform 2 is stated, specifically, the bottom of the grinding base 1, formed with slot 12, the grinding base 1 is through the card Closing groove 12 can snap connection in the upper end of the rotating platform 2.
Further, in order to lift the degree of being connected firmly of grinding base 1 and rotating platform 2.Wear the bottom of the grinding chamber 11 Equipped with connecting hole 13, the upper surface of the rotating platform 2 is equipped with the mounting hole (not shown) being used cooperatively with the connecting hole 13. Using connecting hole described in bolt-through 13 and the mounting hole, grinding base 1 can be fastened on the rotating platform 2.
The description with certain particularity detailed enough has been carried out to the utility model above.It is common in fields It is to be understood by the skilled artisans that what the description in embodiment was merely exemplary, in the true spirit without departing from the utility model and All changes are made on the premise of scope should all belong to the scope of protection of the utility model.The utility model is claimed Scope is defined by described claims, rather than is limited by the foregoing description in embodiment.

Claims (4)

1. a kind of piezoelectric ceramic wafer chamfering tool, it is characterised in that it includes grinding base, rotating platform and driving motor, institute Grinding base is stated on the rotating platform, the driving motor is connected to drive the rotation through belt with the rotating platform Turn platform rotation, wherein:Bowl-shape grinding chamber formed with open upper end on the grinding base.
2. piezoelectric ceramic wafer chamfering tool as claimed in claim 1, it is characterised in that the bottom of the grinding base formed with Slot, the grinding base are snapped connection in the upper end of the rotating platform through the slot.
3. piezoelectric ceramic wafer chamfering tool as claimed in claim 2, it is characterised in that the bottom of the grinding chamber is equipped with Connecting hole, the upper surface of the rotating platform are equipped with the mounting hole being used cooperatively with the connecting hole.
4. piezoelectric ceramic wafer chamfering tool as claimed in claim 1, it is characterised in that covered on the inner wall of the grinding chamber There is the abrasive sand coating of predetermined thickness.
CN201721278222.5U 2017-09-27 2017-09-27 A kind of piezoelectric ceramic wafer chamfering tool Expired - Fee Related CN207239859U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201721278222.5U CN207239859U (en) 2017-09-27 2017-09-27 A kind of piezoelectric ceramic wafer chamfering tool

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201721278222.5U CN207239859U (en) 2017-09-27 2017-09-27 A kind of piezoelectric ceramic wafer chamfering tool

Publications (1)

Publication Number Publication Date
CN207239859U true CN207239859U (en) 2018-04-17

Family

ID=61889532

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201721278222.5U Expired - Fee Related CN207239859U (en) 2017-09-27 2017-09-27 A kind of piezoelectric ceramic wafer chamfering tool

Country Status (1)

Country Link
CN (1) CN207239859U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115229602A (en) * 2022-09-22 2022-10-25 苏州恒嘉晶体材料有限公司 Wafer chamfering grinding mechanism and use method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115229602A (en) * 2022-09-22 2022-10-25 苏州恒嘉晶体材料有限公司 Wafer chamfering grinding mechanism and use method

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GR01 Patent grant
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20180417

Termination date: 20190927

CF01 Termination of patent right due to non-payment of annual fee