CN207182385U - A kind of Miniaturization anti-metal electronic tag - Google Patents
A kind of Miniaturization anti-metal electronic tag Download PDFInfo
- Publication number
- CN207182385U CN207182385U CN201721260468.XU CN201721260468U CN207182385U CN 207182385 U CN207182385 U CN 207182385U CN 201721260468 U CN201721260468 U CN 201721260468U CN 207182385 U CN207182385 U CN 207182385U
- Authority
- CN
- China
- Prior art keywords
- label
- antenna
- electronic tag
- ceramic substrate
- miniaturization
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The utility model provides a kind of Miniaturization anti-metal electronic tag, including ceramic substrate, label antenna and label chip, label antenna is coated on the periphery of ceramic substrate, flows back to form loop by via, the label chip shunt capacitance, electric current circulate through the label antenna path.The utility model passes through loading capacitance, the emotional resistance of anti-metal tag antenna is greatly improved, improve the level of impedance match of label antenna and label chip, so that in conventional design, the size of label antenna matching ring is significantly reduced, and scene is used in the miniaturization for greatly having widened label.
Description
Technical field
Electronic label technology field is the utility model is related to, especially a kind of Miniaturization anti-metal electronic tag.
Background technology
In the utilization of UHF RFID label tags, through being commonly encountered the situation for having rigors to label sizes, pliability：Such as
It is embedded into the label in rubber for tire, flexible anti-Miniaturization anti-metal label etc. to use；But label antenna is carried out small-sized
The design of change annoyings designer always, and conventional miniaturization scheme is exactly that the dielectric constant for improving antenna substrate comes to label
Antenna carries out Miniaturization Design -- because the operation wavelength of antenna and the dielectric constant of antenna substrate are inversely proportional, in theory, day
Line substrate dielectric constant is higher, and the size of antenna is with regard to smaller.But the selection of the base material of high-k be it is very limited amount of, one
As the Miniaturization Design of row label entered using the ceramic base material of high-k, but this scheme has a series of problem and disadvantage
End；
(1) possess one using the label of the PCB substrate of high-k or the ceramics of high-k as base material, size
Fixed miniaturization feature, but often and do not possess flexible characteristic, it can not be embedded into some special use environments, such as
The body surface of Surface Mount label is bending.
(2) its electrical parameter of the base material of high-k is difficult often to do stabilization, and the instability of its dielectric constant even reaches
To 30%, this is greatly to threaten to the consistency of performance for ensureing label antenna；
(3) the prints labels antenna on the base material of high-k, antenna cabling is very easy to come off, so that label
Failure；
(4) base material of high-k is often very expensive so that is significantly increased using the label cost of the base material, this is right
Promote label with being very unfavorable.
Based on current technology situation, pole needs a kind of stabilization, easy, inexpensive label miniaturization scheme, can
To be easily applied in various forms of label antennas.
Utility model content
The technical problems to be solved in the utility model is the defects of being directed to prior art, there is provided a kind of stabilization, easy,
The label miniaturization hyperfrequency anti-metal electronic tag of low cost.
In order to solve the above technical problems, the utility model adopts the following technical scheme that：A kind of Miniaturization anti-metal electronics mark
Label, including ceramic substrate, label antenna and label chip, label antenna are coated on the periphery of ceramic substrate, flowed back by via
Loop, the label chip shunt capacitance are formed, electric current circulates through the label antenna path.
Further, the label chip at least one electric capacity in parallel.
Further, the capacitance value range is 0.5pF-15pF.
Further, by loading the matching capacitance (0.5pF-15pF) of different value, anti-metal tag antenna can be adjusted
Imaginary impedance value；The matching capacitance value of loading is bigger, and its emotional resistance is bigger；Otherwise it is just smaller, by this method, can be with
The easily impedance conjugate impedance match degree of abstract factory antenna and label chip, to realize the requirement of different reading distances, lead to
Cross and change different matching capacitance values, to realize the impedance matching of various sizes of label antenna and label chip.
Further, the label chip and electric capacity are arranged side by side in the middle part of label antenna.
Further, the width in label antenna is arranged side by side in the label chip and electric capacity.
Further, the via is symmetrically opened in ceramic substrate both sides.
Further, the label antenna includes first antenna and the second antenna, and first antenna and the second antenna are set respectively
In the upper and lower surface of label antenna.
Further, the label antenna is using balance duplex feeding structure；The via is opened in ceramic substrate both ends, the
One antenna and the second antenna mutually form electrical connection by being placed in the plated conductive medium of via.
Further, it is provided with label chip anchor point in ceramic substrate upper surface centre position.
Further, the ceramic substrate is square body or cuboid.
Further, the ceramic substrate size be 68mm length × 20mm it is wide × 3mm is thick, the length of ceramic substrate, width
And thickness is adjustable.
Further, label antenna is covered in the upper and lower surface of label ceramic substrate by metal material and formed, and it can pass through
The mode of etching or printing is pasted onto ceramic base plate surface；The metal materials such as copper foil, aluminium foil can be selected in described metal material.Erosion
Antenna is carved using copper foil or aluminium foil as conductive material, day is formed with the etched formed figure of the substrate for being covered with copper foil or aluminium foil
Line, while be the circuit board for loading chip component；There is preferable performance using etching mode, its high resolution, radio frequency
Can be good.
Further, the materials such as PVC, plastics, FR4PCB plates may be selected in ceramic substrate；FR4PCB plates as ceramic substrate,
Both it ensure that product had fabulous fire-retardant and high-temperature stability, properties of product are not at a high temperature of can meeting 200 degrees Celsius again
The requirement of decay.
Further, hyperfrequency anti-metal tag uses 3mm ultrathin designs, not only mitigates label weight, and expansion pair
For hyperfrequency anti-metal tag setting height(from bottom) using harsh application field, the base material thickness that ceramic substrate uses can be in 1mm-5mm
Scope, it can obtain wider frequency band.
When plug-in reader meets electronic tag, plug-in reader sends electromagnetic wave, and electromagnetic field is formed around, and label is from electromagnetic field
The electromagnetic wave is changed, sent to plug-in reader, by solving by the middle label chip circuit obtained in energy activated label, label chip
The data that device converts electromagnetic waves into correlation are read, control computer can is managed control according to the data processing of correlation.
The beneficial effects of the utility model are：By loading matching capacitance, under the limited size of electronic tag, significantly carry
The emotional resistance of high antenna, and the level of impedance match of label antenna and label chip, greatly improve the read-write of label
Distance, the volume of anti-metal tag is reduced, the miniaturization for greatly having widened label is used；By the side for loading matching capacitance
Case, under finite size, the emotional resistance of anti-metal tag antenna greatly improved, label antenna and label core greatly improved
The level of impedance match of piece so that in conventional design, the size of label antenna matching ring has obtained significantly reducing, and greatly opens up
Scene is used in the miniaturization of wide label.
Brief description of the drawings
Fig. 1 is a kind of Miniaturization anti-metal electronic tag schematic diagram of the utility model；
Fig. 2 is a kind of Miniaturization anti-metal electronic tag schematic equivalent circuit of the utility model.
In figure, ceramic substrate 10, via 101, label antenna 20, label chip 30, electric capacity 40.
Embodiment
In the present embodiment, reference picture 1, a kind of Miniaturization anti-metal electronic tag, including ceramic substrate 10, label antenna 20
With label chip 30, label antenna 20 is coated on the periphery of ceramic substrate 10, forms loop by the backflow of via 101, institute
The shunt capacitance 40 of label chip 30 is stated, electric current circulates through the path of label antenna 20.
In the present embodiment, ceramic substrate 10 is in cuboid, and its both sides offers symmetrical via 101, returned by via 101
Stream forms loop, and the anchor point of label chip 30 is provided with the upper surface centre position of ceramic substrate 10, is made from FR4PCB plates
For ceramic substrate 10, it both ensure that product had fabulous fire-retardant and high-temperature stability, 200 degrees Celsius of high temperature can be met again
The unattenuated requirement of lower properties of product.
Label chip 30 is connected in parallel with a capacitor 40 and is arranged side by side in the middle part of label antenna 20 and is arranged at label antenna 20
On width；By loading the matching capacitance 40 (0.5pF-15pF) of different value, anti-metal tag antenna 20 can be adjusted and hindered
Anti- imaginary values；The matching capacitance value of loading is bigger, and its emotional resistance is bigger；Otherwise it is just smaller, by this method, can be very
The easily impedance conjugate impedance match degree of abstract factory antenna 20 and label chip 30, to realize the requirement of different reading distances,
By changing different matching capacitance values, to realize the impedance matching of various sizes of label antenna 20 and label chip 30；Together
When the emotional resistance of anti-metal tag antenna 20 is greatly improved, improve the impedance of label antenna 20 and label chip 30
With degree so that in conventional design, the size that label antenna 20 matches ring is significantly reduced, and has greatly widened label
Scene is used in miniaturization.
First antenna is located at the upper surface of ceramic substrate 10, and the second antenna is located at the lower surface of ceramic substrate 10, label day
Line 20 connects the prevention at radio-frequency port of label chip 30 using balance duplex feeding structure, first antenna and the second antenna by via 101
Both positive and negative polarity, form the balance duplex feeding structure；The via 101 is symmetrically opened in the both ends of ceramic substrate 10, first antenna and
Second antenna mutually forms electrical connection by being placed in the plated conductive medium of via 101；Label antenna 20 is covered by metal material
The upper and lower surface composition in label ceramic substrate 10 is covered, it can be pasted onto the table of ceramic substrate 10 by way of etching or printing
Face；The metal materials such as copper foil, aluminium foil can be selected in described metal material.Etching antenna using copper foil or aluminium foil as conductive material,
Antenna is formed with the etched formed figure of the substrate for being covered with copper foil or aluminium foil, while is the circuit board for loading chip component；
There is preferable performance using etching mode, its high resolution, radio-frequency performance is good.
The size of ceramic substrate 10 be 68mm length × 20mm it is wide × 3mm is thick, Miniaturization anti-metal electronic tag is ultra-thin using 3mm
Design, not only mitigate label weight, and expand and Miniaturization anti-metal electronic tag setting height(from bottom) is led using harsh application
Domain, the base material thickness that ceramic substrate 10 uses can obtain wider frequency band in 1mm-5mm scopes.
When plug-in reader meets electronic tag, plug-in reader sends electromagnetic wave, and electromagnetic field is formed around, and label is from electromagnetic field
The electromagnetic wave is changed, sent to plug-in reader by the middle circuit of label chip 30 obtained in energy activated label, label chip 30,
The data of correlation are converted electromagnetic waves into by plug-in reader, control computer can is managed control according to the data processing of correlation
System.The length of label antenna 20 is kept when making Miniaturization anti-metal electronic tag, to improve its gain performance so that antenna
Improved towards a specific direction receiving and transmitting signal function, the coverage of network is increased up in the certain party.
The utility model is described in detail above, it is described above, only the preferred embodiment of the utility model and
, it is when the utility model practical range can not be limited, i.e., all to make equivalent changes and modifications according to the application scope, it all should still belong to this
In utility model covering scope.
Claims (9)
1. a kind of Miniaturization anti-metal electronic tag, including ceramic substrate, label antenna and label chip, label antenna are coated on
The periphery of ceramic substrate, flows back to form loop by via, it is characterised in that：The label chip shunt capacitance, electric current
Circulated through the label antenna path.
A kind of 2. Miniaturization anti-metal electronic tag according to claim 1, it is characterised in that：The label chip is in parallel
At least one electric capacity.
A kind of 3. Miniaturization anti-metal electronic tag according to claim 2, it is characterised in that：The capacitance value range is
0.5pF-15pF。
A kind of 4. Miniaturization anti-metal electronic tag according to claim 2, it is characterised in that：The label chip and electricity
Appearance is arranged side by side in the middle part of label antenna.
A kind of 5. Miniaturization anti-metal electronic tag according to claim 4, it is characterised in that：The label chip and electricity
Hold the width being arranged side by side in label antenna.
A kind of 6. Miniaturization anti-metal electronic tag according to claim 1, it is characterised in that：The via symmetrically opens up
In ceramic substrate both sides.
A kind of 7. Miniaturization anti-metal electronic tag according to claim 1, it is characterised in that：The label antenna includes
First antenna and the second antenna, first antenna and the second antenna are respectively arranged on the upper and lower surface of ceramic substrate.
A kind of 8. Miniaturization anti-metal electronic tag according to claim 6, it is characterised in that：In ceramic substrate upper surface
Centre position is provided with label chip anchor point.
A kind of 9. Miniaturization anti-metal electronic tag according to claim 8, it is characterised in that：The ceramic substrate is side
Body or cuboid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721260468.XU CN207182385U (en) | 2017-09-28 | 2017-09-28 | A kind of Miniaturization anti-metal electronic tag |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721260468.XU CN207182385U (en) | 2017-09-28 | 2017-09-28 | A kind of Miniaturization anti-metal electronic tag |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207182385U true CN207182385U (en) | 2018-04-03 |
Family
ID=61748518
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721260468.XU Expired - Fee Related CN207182385U (en) | 2017-09-28 | 2017-09-28 | A kind of Miniaturization anti-metal electronic tag |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207182385U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111079884A (en) * | 2018-10-19 | 2020-04-28 | 相丰科技股份有限公司 | Tire electronic tag |
-
2017
- 2017-09-28 CN CN201721260468.XU patent/CN207182385U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111079884A (en) * | 2018-10-19 | 2020-04-28 | 相丰科技股份有限公司 | Tire electronic tag |
| CN111079884B (en) * | 2018-10-19 | 2023-08-18 | 相丰科技股份有限公司 | Electronic label for tyre |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180403 Termination date: 20200928 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |