CN207165542U - A kind of spread sheet device for die Bonder - Google Patents
A kind of spread sheet device for die Bonder Download PDFInfo
- Publication number
- CN207165542U CN207165542U CN201721305382.4U CN201721305382U CN207165542U CN 207165542 U CN207165542 U CN 207165542U CN 201721305382 U CN201721305382 U CN 201721305382U CN 207165542 U CN207165542 U CN 207165542U
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- CN
- China
- Prior art keywords
- ring
- mounting
- pressure ring
- die bonder
- spread sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
A kind of spread sheet device for die Bonder, including mounting seat, pressure ring assembly and mounting ring, wafer film is horizontally installed to mounting ring, mounting ring is installed on pressure ring assembly, pressure ring assembly is installed on mounting seat, and mounting seat includes base ring, jacking part and rotary components, and the portion of rising is in vertically arranged circle, for jacking part integrated setting in base ring, rotary components are installed on the base ring of jacking part outer ring；Rotary components include 6 synchronizing wheels and timing belt, and the mode of 6 synchronizing wheel circular arrays is installed on base ring, and synchronizing wheel lower rotation is installed on base ring, and synchronizing wheel center offers screwed hole；Pressure ring assembly bottom is vertically provided with multiple screw mandrels, the screwed hole screw thread cooperation of screw mandrel and synchronizing wheel in a manner of annular array.The purpose of this utility model is to propose a kind of spread sheet device for die Bonder, and the device is easy to strutting for wafer film, after being installed on die Bonder, driven by drive device, avoids the need for manually strutting wafer film.
Description
Technical field
Plate workpiece field of fixtures is the utility model is related to, particularly a kind of circuit board clamp of quick-clamping.
Background technology
It is also stricter to the requirement after disk spread sheet as electronic market is constantly updated to transistor requirements.Manually
Spread sheet has a strong impact on production efficiency far from being satisfied with the production requirement of present situation.Because existing die Bonder does not possess expansion
Piece function uses, it is necessary to will manually be placed into after the expansion of wafer film in die Bonder, like this increases the labor of staff
Fatigue resistance, and but reduce operating efficiency.
Utility model content
For drawbacks described above, the purpose of this utility model is to propose a kind of spread sheet device for die Bonder, and the device is just
In strutting for wafer film, after being installed on die Bonder, driven by drive device, avoid the need for manually strutting wafer film.
To use following technical scheme up to this purpose, the utility model：
A kind of spread sheet device for die Bonder, including mounting seat, pressure ring assembly and mounting ring, wafer film are horizontally installed to institute
Mounting ring is stated, the mounting ring is installed on the pressure ring assembly, and the pressure ring assembly is installed on the mounting seat；
The mounting seat includes base ring, jacking part and rotary components, and institute jacking part is in vertically arranged circle, the top
Play integrally and be arranged at the base ring, the rotary components are installed on the base ring of the jacking part outer ring；
The rotary components include 6 synchronizing wheels and timing belt, and the mode of 6 synchronizing wheel circular arrays is installed on
The base ring, the synchronizing wheel lower rotation are installed on the base ring, and the synchronizing wheel center offers screwed hole；
The pressure ring assembly bottom is vertically provided with multiple screw mandrels, the screw mandrel and the synchronizing wheel in a manner of annular array
Screwed hole screw thread coordinate.
It is preferred that the pressure ring assembly includes upper press ring, lower pressure ring and mounting blocks；
The upper press ring and the lower horizontal setting of pressure ring, the upper press ring and lower pressure ring both sides are fixed by mounting blocks to be connected
Connect, be provided between the upper press ring and lower pressure ring and accommodate gap；
The mounting ring is contained in the receiving gap.
It is preferred that the mounting ring rear and front end is symmetrical circular arc, to be parallel straight at left and right sides of the mounting ring
Shape.
Further, the pressure ring assembly front end, which offers, takes piece breach, described to take piece breach from the upper press ring upper table
Face, which is run through, to be opened up to the lower pressure ring bottom surface.
Further, the rear end of the pressure ring assembly is provided with countercheck rod, and the countercheck rod passes through from the upper press ring upper surface
Wear to the lower pressure ring.
It is preferred that the rear end of the mounting ring offers stop breach, the stop breach corresponds respectively to the stop
Bar.
It is preferred that the mounting ring material is stainless steel.
It is preferred that phosphorating treatment is passed through on the surface of the mounting seat and pressure ring assembly.
The beneficial effects of the utility model：1st, in actual use, a synchronizing wheel rotation is driven, other synchronizing wheels are all
It can rotate, after synchronizing wheel rotation, screw mandrel can be deep into the screwed hole of synchronizing wheel, so that between pressure ring assembly and base ring
Spacing diminishes, meanwhile, wafer film is withstood in jacking part, and wafer film is tightened, so as to which the integrated circuit on wafer film be separated；We
The structure that case uses is especially suitable for driving by drive device, and the lowering or hoisting gear of multiple screw structures ensure that the equal of the dynamics of strutting
Weighing apparatus property, and then ensure that the spacing between chip is uniform；2nd, when in use, mounting ring is inserted and accommodates gap, it is possible to be whole
Individual device, which is placed in die Bonder, to be operated, and due to above mounting ring and following, that is, the free degree of Z axis is restrained
, so when mounting ring lifts, lower section sets the constant device in a position, it is possible to by installed in the wafer film of mounting ring
Strut；Use mounting blocks that upper press ring and lower pressure ring are fixedly mounted in this programme, such structure is also to be easily installed ring to determine
To it is circular to avoid mounting ring, it is not easy to is positioned.
Brief description of the drawings
Fig. 1 is the decomposing state schematic diagram of one embodiment of the present utility model.
Wherein：Mounting seat 100, base ring 110, jacking part 120, rotary components 130, synchronizing wheel 131, timing belt 132, pressure
Ring assemblies 200, upper press ring 210, lower pressure ring 220, mounting blocks 230, accommodate gap 240, countercheck rod 250, take piece breach 260, silk
Bar 270, mounting ring 300, stop breach 310.
Embodiment
Further illustrate the technical solution of the utility model below in conjunction with the accompanying drawings and by embodiment.
As shown in figure 1, a kind of spread sheet device for die Bonder, including mounting seat 100, pressure ring assembly 200 and mounting ring
300, wafer film is horizontally installed to the mounting ring 300, and the mounting ring 300 is installed on the pressure ring assembly 200, the pressure ring
Component 200 is installed on the mounting seat 100；
The mounting seat 100 includes base ring 110, jacking part 120 and rotary components 130, and institute jacking part 120 is in vertically to set
The circle put, the integrated setting of jacking part 120 are installed on the jack-up in the base ring 110, the rotary components 130
The base ring 110 of the outer ring of portion 120；
The rotary components 130 include 6 synchronizing wheels 131 and the circular array of synchronizing wheel 131 of timing belt 132,6
Mode be installed on the base ring 110, the lower rotation of synchronizing wheel 131 is installed on the base ring 110, the synchronizing wheel
131 centers offer screwed hole；
The bottom of pressure ring assembly 200 is vertically provided with multiple screw mandrels 270, the He of screw mandrel 270 in a manner of annular array
The screwed hole screw thread of the synchronizing wheel 131 coordinates.
In actual use, a synchronizing wheel 131 is driven to rotate, other synchronizing wheels 131 can all rotate, synchronizing wheel rotation
Afterwards, screw mandrel 270 can be deep into the screwed hole of synchronizing wheel 131, so that the spacing between pressure ring assembly 200 and base ring 110
Diminish, meanwhile, wafer film is withstood in jacking part 120, and wafer film is tightened, so as to which the integrated circuit on wafer film be separated；We
The structure that case uses is especially suitable for driving by drive device, and the lowering or hoisting gear of multiple screw structures ensure that the equal of the dynamics of strutting
Weighing apparatus property, and then ensure that the spacing between chip is uniform.
Wherein, the pressure ring assembly 200 includes upper press ring 210, lower pressure ring 220 and mounting blocks 230；
The 220 horizontal setting of the upper press ring 210 and lower pressure ring, the upper press ring 210 and the lower both sides of pressure ring 220 pass through
Mounting blocks 230 are fixedly connected, and are provided between the upper press ring 210 and lower pressure ring 220 and are accommodated gap 240；
The mounting ring 300 is contained in the receiving gap 240.
When in use, mounting ring 300 is inserted and accommodates gap 240, it is possible to which whole device, which is placed in die Bonder, carries out work
Make, due to above mounting ring 300 and following, that is, the free degree of Z axis is restrained, so when mounting ring 300 lifts
When, lower section sets the constant device in a position, it is possible to will be strutted installed in the wafer film of mounting ring 300；Make in this programme
Upper press ring 210 and lower pressure ring 220 are fixedly mounted with mounting blocks 230, such structure is also to be easily installed ring 300 to orient,
It is circular to avoid mounting ring 300, it is not easy to is positioned.
Wherein, the rear and front end of mounting ring 300 is symmetrical circular arc, and the left and right sides of mounting ring 300 is parallel
Flat.
Mounting ring 300 coordinates pressure ring assembly 200, is easy to the orientation of wafer.
In addition, the front end of pressure ring assembly 200 offers and takes piece breach 260, it is described to take piece breach 260 from the upper press ring
210 upper surfaces, which are run through, to be opened up to the lower bottom surface of pressure ring 220.
Take the effect of piece breach 260 to be conveniently replaceable mounting ring 300, mounting ring 300 is easily taken in gap 240 is accommodated
Go out.
In addition, the rear end of the pressure ring assembly 200 is provided with countercheck rod 250, the countercheck rod 250 is from the upper press ring 210
Upper surface is through to the lower pressure ring 220.
Countercheck rod 250 be used for stop mounting ring 300, avoid the rear end of 300 pressure ring assembly of mounting ring 200 from skidding off.
Wherein, the rear end of the mounting ring 300, which offers, stops breach 310, and the stop breach 310 corresponds respectively to institute
State countercheck rod.
Stop that breach 310 corresponds to countercheck rod 250, such structure further limit mounting ring 300 and axially be revolved in Z axis
The possibility turned, makes the state of mounting ring 300 more stable.
Wherein, the material of mounting ring 300 is stainless steel.
In addition, phosphorating treatment is passed through on the surface of the mounting seat 100 and pressure ring assembly 200.
Technical principle of the present utility model is described above in association with specific embodiment.These descriptions are intended merely to explain this reality
With new principle, and the limitation to scope of protection of the utility model can not be construed in any way.Based on explanation herein,
Those skilled in the art, which would not require any inventive effort, can associate other embodiments of the present utility model,
These modes are fallen within the scope of protection of the utility model.
Claims (8)
1. a kind of spread sheet device for die Bonder, including mounting seat, pressure ring assembly and mounting ring, wafer film is horizontally installed to described
Mounting ring, the mounting ring are installed on the pressure ring assembly, and the pressure ring assembly is installed on the mounting seat, it is characterised in that：
The mounting seat includes base ring, jacking part and rotary components, and institute jacking part is in vertically arranged circle, the jacking part
For integrated setting in the base ring, the rotary components are installed on the base ring of the jacking part outer ring；
The rotary components include 6 synchronizing wheels and timing belt, and the modes of 6 synchronizing wheel circular arrays is installed on described
Base ring, the synchronizing wheel lower rotation are installed on the base ring, and the synchronizing wheel center offers screwed hole；
The pressure ring assembly bottom is vertically provided with the spiral shell of multiple screw mandrels, the screw mandrel and the synchronizing wheel in a manner of annular array
Pit screw thread coordinates.
2. the spread sheet device according to claim 1 for die Bonder, it is characterised in that：The pressure ring assembly includes upper pressure
Ring, lower pressure ring and mounting blocks；
The upper press ring and the lower horizontal setting of pressure ring, the upper press ring are fixedly connected with lower pressure ring both sides by mounting blocks,
It is provided between the upper press ring and lower pressure ring and accommodates gap；
The mounting ring is contained in the receiving gap.
3. the spread sheet device according to claim 2 for die Bonder, it is characterised in that：The mounting ring rear and front end is pair
The circular arc of title, the mounting ring left and right sides is parallel flat.
4. the spread sheet device according to claim 3 for die Bonder, it is characterised in that：The pressure ring assembly front end offers
Take piece breach, it is described to take piece breach from the upper press ring upper surface through opening up to the lower pressure ring bottom surface.
5. the spread sheet device according to claim 4 for die Bonder, it is characterised in that：The rear end of the pressure ring assembly is provided with
Countercheck rod, the countercheck rod are through to the lower pressure ring from the upper press ring upper surface.
6. the spread sheet device according to claim 5 for die Bonder, it is characterised in that：The rear end of the mounting ring offers
Stop breach, the stop breach corresponds respectively to the countercheck rod.
7. the spread sheet device according to claim 6 for die Bonder, it is characterised in that：The mounting ring material is stainless
Steel.
8. the spread sheet device according to claim 7 for die Bonder, it is characterised in that：The mounting seat and pressure ring assembly
Phosphorating treatment is passed through on surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721305382.4U CN207165542U (en) | 2017-10-10 | 2017-10-10 | A kind of spread sheet device for die Bonder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721305382.4U CN207165542U (en) | 2017-10-10 | 2017-10-10 | A kind of spread sheet device for die Bonder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207165542U true CN207165542U (en) | 2018-03-30 |
Family
ID=61724709
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721305382.4U Active CN207165542U (en) | 2017-10-10 | 2017-10-10 | A kind of spread sheet device for die Bonder |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207165542U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109065494A (en) * | 2018-07-27 | 2018-12-21 | 广东阿达智能装备有限公司 | The tensioning and regulating device of sealed in unit and its wafer indigo plant film |
| CN111739842A (en) * | 2020-06-30 | 2020-10-02 | 青岛歌尔微电子研究院有限公司 | Wafer expanding method |
-
2017
- 2017-10-10 CN CN201721305382.4U patent/CN207165542U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109065494A (en) * | 2018-07-27 | 2018-12-21 | 广东阿达智能装备有限公司 | The tensioning and regulating device of sealed in unit and its wafer indigo plant film |
| CN109065494B (en) * | 2018-07-27 | 2020-10-20 | 广东阿达智能装备有限公司 | Packaging equipment and tensioning and adjusting device of blue membrane of wafer thereof |
| CN111739842A (en) * | 2020-06-30 | 2020-10-02 | 青岛歌尔微电子研究院有限公司 | Wafer expanding method |
| CN111739842B (en) * | 2020-06-30 | 2022-11-22 | 青岛歌尔微电子研究院有限公司 | Wafer expanding method |
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