CN207148868U - A kind of ultra-thin fingerprint recognition module - Google Patents
A kind of ultra-thin fingerprint recognition module Download PDFInfo
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- CN207148868U CN207148868U CN201721104806.0U CN201721104806U CN207148868U CN 207148868 U CN207148868 U CN 207148868U CN 201721104806 U CN201721104806 U CN 201721104806U CN 207148868 U CN207148868 U CN 207148868U
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Abstract
It the utility model is related to fingerprint identification technology field, more particularly to a kind of ultra-thin fingerprint recognition module, including IC chip, substrate, FPC, the first end of the FPC is on the substrate, and the second end is towards outside substrate, for connecting intelligent terminal, the IC chip scolding tin is attached at the FPC first end, the IC chip is provided with ceramic cover plate, and the IC chip reaches below 0.6mm with ceramic cover plate by bath of glass gemel connection, the gross thickness of the module.The utility model makes module integral thickness be reduced to 0.6mm, greatly improves the space availability ratio of terminal intelligent equipment inner structure, improve the limitation of appearance design by using the assembling of TSV encapsulation technologies and optimization FPC.
Description
Technical field
Fingerprint identification technology field is the utility model is related to, more particularly to a kind of ultra-thin fingerprint recognition module.
Background technology
In recent years, with the progress of fingerprint identification technology and image procossing, the continuous improvement of recognizer research level, its
Also more and more ripe in the application of smart machine, in order to adapt to pursuit and design of the people for intelligent ultrathin equipment, it refers to
Line identification module also needs to reduce thickness accordingly, to realize flexible industrial design.
However, at present, the IC chip of fingerprint recognition module internal takes traditional BGA package technology, its core
Piece packing density and package area ratio are very limited, cause the integral thickness of fingerprint recognition module to reduce end in more than 1.2mm
Hold the space availability ratio of smart machine internal structure, it is impossible to adapt to the requirement that people design for intelligent ultrathin equipment.
Utility model content
The purpose of this utility model is to overcome the deficiencies in the prior art, there is provided a kind of ultra-thin fingerprint recognition mould
Group, it can be applied to the safe unlocking function of some intelligent ultrathin terminal devices such as mobile phone, computer, flat board.
The utility model is achieved through the following technical solutions：
A kind of ultra-thin fingerprint recognition module, including：IC chip, substrate, FPC, the first end of FPC are set
On substrate, the second end is towards outside substrate, and for connecting intelligent terminal, IC chip scolding tin is attached at FPC
First end, IC chip are provided with ceramic cover plate, and IC chip is reached with ceramic cover plate by bath of glass gemel connection, the gross thickness of module
Below 0.6mm.
Further, IC chip uses TSV encapsulation technologies, and thickness is below 0.25mm.
Further, the first end of FPC is provided with steel disc reinforcement in substrate bottom surface, and the second end is mended provided with film
By force.
Further, ceramic cover plate is provided with decorative pattern, and the thickness of ceramic cover plate is below 0.1mm.
Further, outer surface of substrate profile is that bloom decorates anchor ring.
The beneficial effects of the utility model are：
By using the assembling of TSV encapsulation technologies and optimization FPC, it is reduced to module integral thickness
0.6mm, the space availability ratio of terminal intelligent equipment inner structure is greatly improved, improve the limitation of appearance design.
Brief description of the drawings
Fig. 1 is front view of the present utility model
Fig. 2 is rearview of the present utility model
Fig. 3 is side view of the present utility model
Embodiment
In order that technical problem, technical scheme and beneficial effect that the utility model solves are more clearly understood, below
In conjunction with the embodiments, the utility model is further elaborated.It should be appreciated that specific embodiment described herein is only
To explain the utility model, it is not used to limit the utility model.
It should be appreciated that in description of the present utility model, the orientation or position relationship of the instruction such as term "left", "right"
Based on orientation shown in the drawings or position relationship, to be for only for ease of description the utility model, rather than require that this practicality is new
Type must be with specific azimuth configuration and operation, therefore it is not intended that to limitation of the present utility model.
Refering to Fig. 1, a kind of ultra-thin fingerprint recognition module, including：IC chip 1, substrate 2, FPC 3, flexible circuitry
The first end 301 of plate 3 is on the substrate 2, and the second end 302 is towards outside substrate 2, for connecting intelligent terminal, IC cores
The scolding tin of piece 1 is attached at the first end of FPC 3, and IC chip 1 is provided with ceramic cover plate 4, and IC chip 1 passes through with ceramic cover plate 4
Bath of glass gemel connection, ceramic cover plate 4 are provided with decorative pattern, and the outer surface profile of substrate 2 is that bloom decorates anchor ring 201.
Refering to Fig. 2, the first end of FPC is provided with steel disc reinforcement 5 in substrate bottom surface, and the second end is mended provided with film
It is strong by 6.
Refering to Fig. 3, IC chip 1 uses TSV encapsulation technologies, and thickness is below 0.25mm, and the thickness of ceramic cover plate 4 is
Below 0.1mm, the gross thickness of module reach below 0.6mm.
Fingerprint recognition module of the present utility model is capacitance sensing type, and finger print data is gathered by sensor, by integrated electricity
The algorithm process finger print data of road IC chip, then the CPU of terminal intelligent equipment is transferred to by flexible PCB, refer to so as to reach
The effect of line identification.
Preferred embodiment of the present utility model is the foregoing is only, not to limit the utility model, therefore, only
This is should be included in all any modification, equivalent and improvement that the utility model specification and drawings content is made etc.
Within the protection domain of utility model.
Claims (5)
- A kind of 1. ultra-thin fingerprint recognition module, it is characterised in that including：IC chip, substrate, FPC, the flexible wires The first end of road plate is on the substrate, and the second end is towards outside substrate, for connecting intelligent terminal, the IC chip weldering Tin is attached at the FPC first end, and the IC chip is provided with ceramic cover plate, and the IC chip is led to ceramic cover plate Bath of glass gemel connection is crossed, the gross thickness of the module reaches below 0.6mm.
- 2. a kind of ultra-thin fingerprint recognition module according to claim 1, it is characterised in that the IC chip is sealed using TSV Dress technology, thickness are below 0.25mm.
- A kind of 3. ultra-thin fingerprint recognition module according to claim 1, it is characterised in that the first of the FPC End is provided with steel disc reinforcement in substrate bottom surface, and the second end is provided with film reinforcement.
- 4. a kind of ultra-thin fingerprint recognition module according to claim 1, it is characterised in that the ceramic cover plate is provided with decoration Decorative pattern, the thickness of the ceramic cover plate is below 0.1mm.
- 5. a kind of ultra-thin fingerprint recognition module according to claim 1, it is characterised in that the outer surface of substrate profile is Bloom decorates anchor ring.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721104806.0U CN207148868U (en) | 2017-08-31 | 2017-08-31 | A kind of ultra-thin fingerprint recognition module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721104806.0U CN207148868U (en) | 2017-08-31 | 2017-08-31 | A kind of ultra-thin fingerprint recognition module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207148868U true CN207148868U (en) | 2018-03-27 |
Family
ID=61669242
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721104806.0U Active CN207148868U (en) | 2017-08-31 | 2017-08-31 | A kind of ultra-thin fingerprint recognition module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207148868U (en) |
-
2017
- 2017-08-31 CN CN201721104806.0U patent/CN207148868U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20210322 Address after: 432900 group 3, Beixin village, Wangdian Town, Xiaochang County, Xiaogan City, Hubei Province Patentee after: Wang Xiangmin Address before: 518000 4th floor, building 25, Longwangmiao Industrial Zone, Fuyong street, Bao'an District, Shenzhen City, Guangdong Province Patentee before: SHENZHEN QINXI TECHNOLOGY DEVELOPMENT Co.,Ltd. |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20211222 Address after: 833499 building 6, block C, electronic industrial park, border economic cooperation zone, Bole City, Bortala Mongol Autonomous Prefecture, Xinjiang Uygur Autonomous Region Patentee after: Bole yizhitong Intelligent Technology Co.,Ltd. Address before: 432900 group 3, Beixin village, Wangdian Town, Xiaochang County, Xiaogan City, Hubei Province Patentee before: Wang Xiangmin |