CN207053886U - Board structure of circuit and electronic equipment - Google Patents

Abstract

The utility model provides a kind of board structure of circuit and electronic equipment, is related to technical field of electronic equipment.Board structure of circuit includes first medium layer, second dielectric layer, the first conducting wire, the second conducting wire, thermo-sensitive material and thermometric chip, wherein, the first conducting wire is ground network line, and the second conducting wire is temperature-sensitive signal conveying circuit.First conducting wire, the second conducting wire and thermo-sensitive material are between first medium layer and second dielectric layer, one end of thermo-sensitive material electrically connects with the first conducting wire, the other end of thermo-sensitive material electrically connects with one end of the second conducting wire, and the other end of the second conducting wire electrically connects with thermometric chip.So, thermo-sensitive material is arranged on to the inside of circuit board, can accurately reflect circuit board internal temperature, and the layout area of circuit board surface will not be taken.

Description

Board structure of circuit and electronic equipment

Technical field

Technical field of electronic equipment is the utility model is related to, in particular to a kind of board structure of circuit and electronic equipment.

Background technology

With the development of intelligent terminal, the integrated level more and more higher of intelligent terminal, integrated function is more and more, on PCB Integrated number of devices is also more and more, and the power consumption of device is also increasing, causes the power density of unit area on PCB more next Bigger, PCB heating is increasingly severe.

Electronic system to PCB temperature operationally, it is necessary to be monitored, to understand the temperature rise situation of system in real time, from And the corresponding cooling measure that takes measures, to ensure the temperature of mainboard in the reasonable scope, system is working properly, anti-locking system temperature rise Too high to cause device to burn, systematic function reduces equivalent risk.

Existing PCB temperature detections are mainly carried out using thermistor, and the resistance size of thermistor is with temperature Raise and become big or diminish.When system works, the voltage V of thermistor is detected, then can draw the temperature of thermistor, due to Thermistor welded and installed can draw PCB temperature on PCB.But existing temp measuring method, at least exist following Problem：

1. thermistor is welded on PCB surface, not inside PCB, the radiating condition of PCB surface is better than inside PCB, Therefore, the temperature that thermistor detects can be less than PCB internal temperatures, can not represent the actual temperature inside PCB.

2. because thermistor must be welded on PCB surface, and also need to weld other devices on PCB surface, these devices Part has a great impact for the layout of thermistor, causes thermistor to be placed on preferable position；Such as detect Temperature below the upper master chips of PCB, due to the influence of arrangement of master chip, thermistor can not be placed on below master chip, and main Chip circumference and its back side typically layout are quite intensive, cause the layout of thermistor can be away from master chip, the temperature meeting measured Larger error between the actual temperature of master chip be present.

3. thermistor is arranged on PCB surface, the valuable layout area of PCB surface is occupied, especially is needing to detect , it is necessary to be laid out many thermistors when surveying the accurate temperature of multiple spot on PCB so that the range of distribution of PCB surface is actively not enough, And increase cost.

4. due to the Temperature Distribution on PCB and uneven, therefore, the layout of thermistor, the detection of PCB temperature will be influenceed As a result, and its layout causes temperature detecting result inaccurate often with other device conflicts.

Therefore, a kind of board structure of circuit is designed, each point temperature on circuit board can be accurately measured and not take excessively Layout area on circuit board, this is technical problem urgently to be resolved hurrily at present.

Utility model content

In view of the above problems, the purpose of this utility model is to provide a kind of board structure of circuit and electronic equipment, and it is intended to At least partly solve the technology that the temperature detection in existing electronic equipment on circuit board is not accurate, arrangement space occupancy is excessive to ask Topic.

To achieve these goals, the technical scheme that the utility model embodiment uses is as follows：

In a first aspect, providing a kind of board structure of circuit in the utility model embodiment, board structure of circuit includes first and is situated between Matter layer, second dielectric layer, the first conducting wire, the second conducting wire, thermo-sensitive material and thermometric chip, wherein, first is conductive Circuit is ground network line, and the second conducting wire is temperature-sensitive signal conveying circuit；First conducting wire, the second conducting wire and Between first medium layer and second dielectric layer, one end of thermo-sensitive material electrically connects thermo-sensitive material with the first conducting wire, heat The other end of quick material electrically connects with one end of the second conducting wire, and the other end and the thermometric chip of the second conducting wire are electrically connected Connect.

So, thermo-sensitive material is arranged on to the inside of circuit board, thermo-sensitive material with the rise of temperature and resistivity becomes big, And then cause the resistance value at its both ends to become big, and by the voltage for detecting its both ends, you can the temperature of circuit board herein is detected, can Accurately to reflect circuit board internal temperature.Thermo-sensitive material will not take the layout area of circuit board surface, and thermo-sensitive material Do not influenceed by other device layouts, can cloth be placed on optional position inside circuit board.Thermistor need not be reused, is reduced Cost, is especially can significantly reduce project cost in the temperature for needing to detect multiple positions.

With reference in a first aspect, the utility model in the first implementation of first aspect, the first conducting wire, second Conducting wire and thermo-sensitive material are set with layer.So, the first conducting wire and the second conducting wire use a photoetching process It is i.e. plastic, prepare simple.

With reference in a first aspect, the utility model in second of implementation of first aspect, board structure of circuit also includes 3rd conducting wire, via is offered in second dielectric layer, the 3rd conducting wire is arranged in via, and the one of the 3rd conducting wire End electrically connects with the second conducting wire, and the other end of the 3rd conducting wire electrically connects with thermometric chip, and thermometric chip is located at second Opposite side of the dielectric layer with respect to first medium layer.

With reference to second of implementation of first aspect, the utility model in the third implementation of first aspect, Board structure of circuit also includes pad, and pad is arranged on the surface away from first medium layer in second dielectric layer and positioned at via Opening, the side of pad are welded with the pin of thermometric chip, and the opposite side of pad and the 3rd conducting wire are welded.

With reference to second of implementation of first aspect, the utility model in the 4th kind of implementation of first aspect, First conducting wire, the second conducting wire and the 3rd conducting wire are made of copper.

With reference in a first aspect, the utility model in the 5th kind of implementation of first aspect, thermo-sensitive material is macromolecule PTC thermo-sensitive materials.High molecular PTC (Positive Temperature Coefficient) thermo-sensitive material is the polymerization by insulating Thing and the inorganic filler of conduction are combined, and have the thermistor material of positive temperature coefficient, under certain transition temperature, electricity Resistance rate can be rapidly increased to a limiting value, have good thermo-sensitive property.

With reference to the first implementation of first aspect, the utility model in the 6th kind of implementation of first aspect, The thickness of first conducting wire is equal with the thickness of the second conducting wire.So, it is easy to the first conducting wire and the second conductor wire Road is molded.

With reference to the 6th kind of implementation of first aspect, the utility model in the 7th kind of implementation of first aspect, The thickness of thermo-sensitive material is equal with the thickness of the first conducting wire.

With reference in a first aspect, the utility model in the 8th kind of implementation of first aspect, board structure of circuit also includes Component, component are mounted on the surface away from first medium layer in second dielectric layer.

Second aspect, a kind of electronic equipment is provided in the utility model embodiment, electronic equipment carries including first aspect The board structure of circuit of confession.Electronic equipment uses the board structure of circuit that first aspect provides, and can accurately detect circuit board Temperature, ensure the corresponding cooling measure that takes measures in time, maintain system working properly, and thermistor need not be reused, Reduce cost.

To enable above-mentioned purpose of the present utility model, feature and advantage to become apparent, preferred embodiment cited below particularly, and Accompanying drawing appended by cooperation, is described in detail below.

Brief description of the drawings

By reading the detailed description of hereafter preferred embodiment, it is various other the advantages of and benefit it is common for this area Technical staff will be clear understanding.Accompanying drawing is only used for showing the purpose of preferred embodiment, and is not considered as to this practicality New limitation.And in whole accompanying drawing, identical part is denoted by the same reference numerals.In the accompanying drawings：

Fig. 1 is the structured flowchart for the electronic equipment that the utility model embodiment provides.

Fig. 2 is the schematic diagram for the board structure of circuit that the utility model embodiment provides.

Fig. 3 to Fig. 6 is the schematic diagram of the preparation process of board structure of circuit.

Icon：10- electronic equipments；11- input blocks；111- contact panels；Other input equipments of 112-；12- display screens； 121- display panels；13- memories；14- processors；15- board structure of circuit；151- first medium layers；152- second dielectric layer； The conducting wires of 153- first；The conducting wires of 154- second；The conducting wires of 155- the 3rd；156- pads；157- thermo-sensitive materials；158- Thermometric chip；1581- pins；159- components；16-RF circuits；17- sensors；18- voicefrequency circuits；19-WiFi modules；20- Power supply；21- loudspeakers；22- microphones；30- photoresists.

Embodiment

Below in conjunction with accompanying drawing in the utility model embodiment, the technical scheme in the embodiment of the utility model is carried out clear Chu, it is fully described by, it is clear that described embodiment is only the utility model part of the embodiment, rather than whole realities Apply example.The component of the utility model embodiment being generally described and illustrated herein in the accompanying drawings can be come with a variety of configurations Arrangement and design.Therefore, the detailed description of the embodiment of the present utility model to providing in the accompanying drawings is not intended to limit below Claimed the scope of the utility model, but it is merely representative of selected embodiment of the present utility model.Based on the utility model Embodiment, the every other embodiment that those skilled in the art are obtained on the premise of creative work is not made, all Belong to the scope of the utility model protection.

The utility model embodiment provides electronic equipment, for convenience of description, illustrate only and implements with the utility model The related part of example, particular technique details do not disclose, refer to the utility model embodiment method part.The electronic equipment can Think mobile phone, tablet personal computer, PDA (Personal Digital Assistant, personal digital assistant), POS (Point of Sales, point-of-sale terminal), any terminal device such as vehicle-mounted computer.

So that electronic equipment is mobile phone as an example：As shown in figure 1, electronic equipment 10 includes input block 11, display screen 12, storage The parts such as device 13, processor 14, RF circuits 16, sensor 17, voicefrequency circuit 18, WiFi module 19 and power supply 20.This area Technical staff is appreciated that the handset structure shown in Fig. 1 does not form the restriction to mobile phone, can include than illustrate it is more or Less part, either combine some parts or different parts arrangement.

Each component parts of mobile phone is specifically introduced with reference to Fig. 1：

RF circuits 16 can be used for receive and send messages or communication process in, the reception and transmission of signal, especially, by under base station After row information receives, handled to processor 14；In addition, it is sent to base station by up data are designed.Generally, RF circuits 16 include But be not limited to antenna, at least one amplifier, transceiver, coupler, low-noise amplifier (Low Noise Amplifier, LNA), duplexer etc..In addition, RF circuits 16 can also be communicated by radio communication with network and other equipment.Above-mentioned channel radio Letter can use any communication standard or agreement, including but not limited to global system for mobile communications (Global System of Mobile communication, GSM), general packet radio service (General Packet Radio Service, GPRS), CDMA (Code Division Multiple Access, CDMA), WCDMA (Wideband Code Division Multiple Access, WCDMA), it is Long Term Evolution (Long Term Evolution, LTE), Email, short Messenger service (Short Messaging Service, SMS) etc..

Memory 13 can be used for storage software program and module, and processor 14 is stored in the soft of memory 13 by operation Part program and module, so as to perform the various function application of mobile phone and data processing.Memory 13 can mainly include storage Program area and storage data field, wherein, storing program area can storage program area, the application program needed at least one function (such as sound-playing function, image player function etc.) etc.；Storage data field can store uses created number according to mobile phone According to (such as voice data, phone directory etc.) etc..In addition, memory 13 can include high-speed random access memory, can also wrap Include nonvolatile memory, a for example, at least disk memory, flush memory device or other volatile solid-state parts.

Input block 11 can be used for the numeral or character information for receiving input, and produce set with the user of mobile phone and The relevant key signals input of function control.Specifically, input block 11 may include contact panel 111 and other input equipments 112.Contact panel 111 is also referred to as touch-screen, and collecting touch operation of the user on or near it, (for example user uses hand The operation of any suitable object such as finger, stylus or annex on contact panel 111 or near contact panel 111), and according to Formula set in advance drives corresponding attachment means.Optionally, contact panel 111 may include touch detecting apparatus and touch to control Two parts of device processed.Except contact panel 111, input block 11 can also include other input equipments 112.Specifically, other Input equipment 112 can include but is not limited to physical keyboard, function key (such as volume control button, switch key etc.), track One or more in ball, mouse, action bars etc..

Display screen 12 can be used for display by the information of user's input or be supplied to the information of user and respectively planting vegetables for mobile phone It is single.Display screen 12 may include display panel 121, optionally, can use liquid crystal display (Liquid Crystal Display, LCD), the form such as Organic Light Emitting Diode (Organic Light-Emitting Diode, OLED) it is aobvious to configure Show panel 121.Further, contact panel 111 can cover display panel 121, when contact panel 111 is detected thereon or attached After near touch operation, processor 14 is sent to determine the type of touch event, is followed by subsequent processing device 14 according to touch event Type processes.Although in Fig. 1, contact panel 111 and display panel 121 are the parts independent as two to realize mobile phone Input and input function, it is but in some embodiments it is possible to contact panel 111 and display panel 121 is integrated and realize The input of mobile phone and output function.

Mobile phone may also include at least one sensor 17, such as optical sensor, motion sensor and other sensors.Tool Body, optical sensor may include ambient light sensor and proximity transducer, wherein, ambient light sensor can be according to ambient light Light and shade adjusts the brightness of display panel, and proximity transducer can close display panel and/or the back of the body when mobile phone is moved in one's ear Light.As one kind of motion sensor, accelerometer sensor can detect in all directions the size of (generally three axles) acceleration, Size and the direction of gravity are can detect that when static, application (such as horizontal/vertical screen switching, related trip available for identification mobile phone posture Play, magnetometer pose calibrating), Vibration identification correlation function (such as pedometer, tap) etc.；The gyro that can also configure as mobile phone The other sensors such as instrument, barometer, hygrometer, thermometer, infrared ray sensor, will not be repeated here.

Voicefrequency circuit 18, loudspeaker 21, microphone 22 can provide the COBBAIF between user and mobile phone.Voicefrequency circuit 18 Electric signal after can the voice data that received be changed, is transferred to loudspeaker 21, it is defeated to be converted to voice signal by loudspeaker 21 Go out；On the other hand, the voice signal of collection is converted to electric signal by microphone 22, and audio is converted to after being received by voicefrequency circuit 18 Data, then after voice data output processor 14 is handled, through RF circuits 16 to be sent to such as another mobile phone, or by audio Data output is to memory further to handle.

WiFi belongs to short range wireless transmission technology, and mobile phone can help user's transceiver electronicses postal by WiFi module 19 Part, browse webpage and access streaming video etc., it has provided the user wireless broadband internet and accessed.Although Fig. 1 is shown WiFi module 19, but it is understood that, it is simultaneously not belonging to must be configured into for mobile phone, can not change as needed completely Omitted in the essential scope of utility model.

Processor 14 is the control centre of mobile phone, using various interfaces and the various pieces of connection whole mobile phone, is led to Cross operation or perform the software program and/or module being stored in memory 13, and call the number being stored in memory 13 According to performing the various functions and processing data of mobile phone.Optionally, processor 14 may include one or more processing units；It is preferred that , processor 14 can integrate application processor and modem processor, wherein, application processor mainly handle operating system, User interface and application program etc., modem processor mainly handles radio communication.It is understood that above-mentioned modulation /demodulation Processor can not also be integrated into processor 14.

Mobile phone also includes the power supply 20 (such as battery) to all parts power supply, it is preferred that power supply 20 can pass through power supply 20 management systems and processor 14 are logically contiguous, so as to realize management charging, electric discharge and power consumption by the management system of power supply 20 The functions such as management.

Although being not shown, mobile phone can also include camera, bluetooth module etc., will not be repeated here.

It is appreciated that the structure shown in Fig. 1 is only to illustrate, mobile phone may also include more more than shown in Fig. 1 or less Component, or there is the configuration different from shown in Fig. 1.Each component shown in Fig. 1 can use hardware, software or its combination real It is existing.

The electronic equipment that the present embodiment provides can be mobile phone, video camera, MP3, MP4, PDA, tablet personal computer and instrument board Any one, but be not restricted to this.Wherein, instrument board is primarily referred to as the hand-held instrument board with physical button, such as hand Hold formula sensor, tester, digital display meter, living things feature recognition instrument, GPS device etc..The electronic equipment of the present embodiment is preferably intelligence Can mobile phone.

The electronic equipment 10 that the present embodiment provides also includes board structure of circuit 15, and board structure of circuit 15 is primarily referred to as printing electricity Road plate (PCB).Referring to Fig. 2, board structure of circuit 15 includes first medium layer 151, second dielectric layer 152, the first conducting wire 153rd, the second conducting wire 154, the 3rd conducting wire 155, pad 156, thermo-sensitive material 157, thermometric chip 158 and component 159, wherein, the first conducting wire 153 is ground network line, and the second conducting wire 154 is temperature-sensitive signal conveying circuit, and first is situated between The combination of matter layer 151 and second dielectric layer 152 is equivalent to circuit board.

First conducting wire 153, the second conducting wire 154 and thermo-sensitive material 157 are located at first medium layer 151 and second Between dielectric layer 152.One end of thermo-sensitive material 157 electrically connects with the first conducting wire 153, the other end of thermo-sensitive material 157 with One end electrical connection of second conducting wire 154, the other end of the second conducting wire 154 and one end electricity of the 3rd conducting wire 155 Connection, the other end of the 3rd conducting wire 155 electrically connect with the pin 1581 of thermometric chip 158, and thermometric chip 158 is located at second Opposite side of the dielectric layer 152 with respect to first medium layer 151.

First conducting wire 153, the second conducting wire 154 and thermo-sensitive material 157 are set with layer.Preferably, first lead The thickness of electric line 153, the second conducting wire 154 and the three of thermo-sensitive material 157 is equal.So, the He of the first conducting wire 153 Second conducting wire 154 is plastic using a photoetching process, is prepared simple.Via is offered in second dielectric layer 152, the Three conducting wires 155 are arranged in via.

Pad 156 is arranged on the surface away from first medium layer 151 in second dielectric layer 152 and positioned at the opening of via Place, the side of pad 156 are welded with the pin 1581 of thermometric chip 158, the opposite side of pad 156 and the 3rd conducting wire 155 Welding, so as to realize that the 3rd conducting wire 155 electrically connects with the pin 1581 of thermometric chip 158.

Board structure of circuit 15 also includes component 159, and component 159 is mounted in second dielectric layer 152 to be situated between away from first The surface of matter layer 151.The quantity more than one of the component 159 integrated in second dielectric layer 152, can integrate multiple components 159。

First conducting wire 153, the second conducting wire 154 and the 3rd conducting wire 155 are made of copper.Thermo-sensitive material 157 be high molecular PTC (Positive Temperature Coefficient) thermo-sensitive material.High molecular PTC heat sensitive material is It is combined by the polymer and the inorganic filler of conduction that insulate, there is the thermistor material of positive temperature coefficient, certain Under transition temperature, resistivity can be rapidly increased to a limiting value, have good thermo-sensitive property.

The board structure of circuit 15 that the present embodiment provides, resistance technique is buried using PCB, is embedded to thermo-sensitive material 157, heat in the pcb Quick material 157 with the rise of temperature and resistivity becomes big, and then make it that the resistance value at its both ends becomes big, the voltage at its both ends becomes Change reflects temperature change, and then can detect the temperature inside circuit board.

The operation principle of thermo-sensitive material 157：

Assuming that the thickness of thermo-sensitive material 157 is t, the width of thermo-sensitive material 157 is W, and the length of thermo-sensitive material 157 is L, then The resistance value of thermo-sensitive material 157：

R=ρ * L/ (W*t) (1)

In formula (1), ρ is the resistivity of thermo-sensitive material 157, and thermo-sensitive material 157 is by the polymer of carbon black-filled particle Material is made, and the resistivity of thermo-sensitive material 157 increases and increased with temperature.

System injects the electric current of fixing intensity to conducting wire by constant-current source, because conducting wire is made of copper, electricity Hinder extremely low, therefore, the voltage of constant current source output terminal can be considered the voltage at the both ends of thermo-sensitive material 157：

V=I*R (2)

According to above-mentioned analysis, the temperature of circuit board uprises, i.e. the temperature of first medium layer 151 or second dielectric layer 152 Uprise, thermo-sensitive material 157 is heated, resistance increase, according to formula (2), voltage increase.Therefore, the voltage at the both ends of thermo-sensitive material 157 The temperature inside circuit board can be reflected.

The present embodiment also provides the preparation method of board structure of circuit 15：

Referring to Fig. 3, coating one layer of copper on first medium layer 151, and etch for accommodating thermo-sensitive material 157 Hole, while the first conducting wire 153 and the second conducting wire 154 are formed, the first conducting wire 153 is ground network line, described Second conducting wire 154 is temperature-sensitive signal conveying circuit.

Referring to Fig. 4, photoresists 30 are coated in the first conducting wire 153 and the second conducting wire 154, and through overexposure Light, remove photoresist to form the hole pattern that selective electroplating buries resistance material.

Referring to Fig. 5, filling thermo-sensitive material 157 in the hole of formation, and photoresists 30 are divested after electroplating.

Referring to Fig. 6, forming second dielectric layer 152 on first medium layer 151, and formed in second dielectric layer 152 Via, then the 3rd conducting wire 155 is formed in via, pad 156 is then formed in the 3rd conducting wire 155, by thermometric The pin 1581 of chip 158 is welded on pad 156, finally, paster technique attachment member is carried out on the surface of second dielectric layer 152 Device 159.

The board structure of circuit 15 that the present embodiment provides has the advantages that：

1. thermo-sensitive material 157 is filled in inside circuit board, and between first medium layer 151 and second dielectric layer 152, because This truly can accurately reflect circuit board internal temperature.

2. the layout area of circuit board surface will not be taken by setting thermo-sensitive material 157, and thermo-sensitive material 157 can cloth be placed on electricity The optional position of road intralamellar part.

3. thermistor need not be reused, reduce cost, especially when the position of detection is more, can effectively reduce Project cost.

In embodiment provided herein, it should be understood that disclosed device, can also be by another way Realize.Device embodiment described above is only schematical, for example, the block diagram in accompanying drawing is shown according to this practicality newly The device of the embodiment of type.At this point, each square frame in block diagram can represent a module, the module include one or Multiple executable instructions for being used to realize defined logic function.

In addition, each functional module or unit in the utility model embodiment can integrate to form an independence Part or modules individualism, can also two or more modules be integrated to form an independent portion Point.

It should be noted that herein, such as first and second or the like relational terms are used merely to a reality Body or operation make a distinction with another entity or operation, and not necessarily require or imply and deposited between these entities or operation In any this actual relation or order, can not be interpreted as indicating or implying relative importance.Moreover, term " bag Include ", "comprising" or any other variant thereof is intended to cover non-exclusive inclusion so that the mistake including a series of elements Journey, method, article or equipment not only include those key elements, but also the other element including being not expressly set out, either Also include for this process, method, article or the intrinsic key element of equipment.In the absence of more restrictions, by sentence The key element that "including a ..." limits, it is not excluded that also deposited in the process including the key element, method, article or equipment In other identical element.

Preferred embodiment of the present utility model is the foregoing is only, is not limited to the utility model, for this For the technical staff in field, the utility model can have various modifications and variations.It is all in the spirit and principles of the utility model Within, any modification, equivalent substitution and improvements made etc., it should be included within the scope of protection of the utility model.It should be noted that Arrive：Similar label and letter represents similar terms in following accompanying drawing, therefore, once determined in a certain Xiang Yi accompanying drawing Justice, then it further need not be defined and explained in subsequent accompanying drawing.

It is described above, only specific embodiment of the present utility model, but the scope of protection of the utility model is not limited to In this, any one skilled in the art can readily occur in change in the technical scope that the utility model discloses Or replace, it should all cover within the scope of protection of the utility model.Therefore, the scope of protection of the utility model should be described with power The protection domain that profit requires is defined.

Claims (10)

1. a kind of board structure of circuit (15), it is characterised in that the board structure of circuit (15) includes first medium layer (151), the Second medium layer (152), the first conducting wire (153), the second conducting wire (154), thermo-sensitive material (157) and thermometric chip (158), wherein, first conducting wire (153) is ground network line, and second conducting wire (154) is temperature-sensitive signal Conveying circuit；

First conducting wire (153), second conducting wire (154) and the thermo-sensitive material (157) are positioned at described Between first medium layer (151) and the second dielectric layer (152), one end of the thermo-sensitive material (157) is led with described first Electric line (153) electrically connects, and the other end of the thermo-sensitive material (157) and one end of second conducting wire (154) are electrically connected Connect, the other end of second conducting wire (154) electrically connects with the thermometric chip (158).

2. board structure of circuit (15) according to claim 1, it is characterised in that first conducting wire (153), described Second conducting wire (154) and the thermo-sensitive material (157) are set with layer.

3. board structure of circuit (15) according to claim 1, it is characterised in that the board structure of circuit (15) also includes the Three conducting wires (155), via are offered on the second dielectric layer (152), the 3rd conducting wire (155) is arranged on institute State in via, one end of the 3rd conducting wire (155) electrically connects with second conducting wire (154), and the described 3rd leads The other end of electric line (155) electrically connects with the thermometric chip (158), and the thermometric chip (158) is situated between positioned at described second The opposite side of the relatively described first medium layer (151) of matter layer (152).

4. board structure of circuit (15) according to claim 3, it is characterised in that the board structure of circuit (15) also includes weldering Disk (156), the pad (156) are arranged on the table away from the first medium layer (151) in the second dielectric layer (152) Face and the opening for being located at the via, the side of the pad (156) and the pin (1581) of the thermometric chip (158) Welding, opposite side and the 3rd conducting wire (155) of the pad (156) are welded.

5. board structure of circuit (15) according to claim 3, it is characterised in that first conducting wire (153), described Second conducting wire (154) and the 3rd conducting wire (155) are made of copper.

6. board structure of circuit (15) according to claim 1, it is characterised in that the thermo-sensitive material (157) is macromolecule PTC thermo-sensitive materials (157).

7. board structure of circuit (15) according to claim 2, it is characterised in that the thickness of first conducting wire (153) Degree is equal with the thickness of second conducting wire (154).

8. board structure of circuit (15) according to claim 7, it is characterised in that the thickness of the thermo-sensitive material (157) with The thickness of first conducting wire (153) is equal.

9. board structure of circuit (15) according to claim 1, it is characterised in that the board structure of circuit (15) also includes member Device (159), the component (159) are mounted in the second dielectric layer (152) away from the first medium layer (151) Surface.

10. a kind of electronic equipment (10), it is characterised in that the electronic equipment (10) is included described in any one of claim 1 to 9 Board structure of circuit (15).