CN207050266U - A kind of device using semiconductor chilling plate - Google Patents
A kind of device using semiconductor chilling plate Download PDFInfo
- Publication number
- CN207050266U CN207050266U CN201720189066.9U CN201720189066U CN207050266U CN 207050266 U CN207050266 U CN 207050266U CN 201720189066 U CN201720189066 U CN 201720189066U CN 207050266 U CN207050266 U CN 207050266U
- Authority
- CN
- China
- Prior art keywords
- chilling plate
- semiconductor chilling
- wall
- plate according
- chip microcomputer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
It the utility model is related to a kind of device using semiconductor chilling plate; including two accommodating chambers, semiconductor chilling plate, power supply and protective case; wherein; the accommodating chamber includes inner and outer wall; the interlayer for putting transformer oil is provided between the inner and outer wall, the outer wall is provided with the neck being recessed to interlayer direction；The semiconductor chilling plate is connected to power supply by wire, and the both ends of the semiconductor chilling plate insert in two necks for accommodating cavity outer wall respectively；The protective case is provided with the groove of upper end open, and described two accommodating chambers are fastened in the groove of protective case.The utility model utilizes the Peltie effects of semiconductor chilling plate, and two accommodating chambers are respectively heated and cooled.
Description
Technical field
Toy art is the utility model is related to, especially a kind of educational toy for children.
Background technology the utility model is related to semiconductor refrigerating field, especially a kind of dress using semiconductor chilling plate
Put.
Background technology
In recent years, semiconductor technology is widely used, and it is a kind of heat pump, utilizes semi-conducting material
Peltie effects, when the galvanic couple that direct current is connected into by two kinds of different semi-conducting materials, it can distinguish at the both ends of galvanic couple
Absorb heat and release heat, it is possible to achieve the purpose of refrigeration.It is a kind of Refrigeration Technique for producing negative thermal resistance, is characterized in nothing
Moving component, reliability are also higher.
In daily life, it is often necessary to object is cooled or is incubated, but the electrical equipment body for cooling now and being incubated
Product is huge, not portable, and open air is also energized without enough electric energy.
Utility model content
For described above, the utility model provides a kind of device using semiconductor chilling plate, and it utilizes semiconductor
The Peltie effects of cooling piece, two accommodating chambers are respectively heated and cooled, efficiently solve above mentioned problem.
According to one side of the present utility model, there is provided a kind of device using semiconductor chilling plate, including two appearances
Receive chamber, semiconductor chilling plate, power supply and protective case, wherein, the accommodating chamber includes inner and outer wall, the inner and outer wall it
Between be provided with and put the interlayer of transformer oil, the outer wall is provided with the neck being recessed to interlayer direction；The semiconductor chilling plate leads to
Cross wire and be connected to power supply, the both ends of the semiconductor chilling plate insert in two necks for accommodating cavity outer wall respectively；It is described
Protective case is provided with the groove of upper end open, and described two accommodating chambers are fastened in the groove of protective case.
Further, the side wall of the protective case is provided with the passage communicated with groove, and the passage is provided with fan, the fan
Power supply is connected to by wire, a power switch of also being connected in the circuit of the fan and power supply.
Further, gap is formed between described two accommodating chambers and semiconductor chilling plate, foam is filled with the gap.
Further, in addition to temperature-controlling module, the temperature-controlling module include single-chip microcomputer, manual input device, temperature
Degree sensor, display screen, digital analog converter and drive circuit, the temperature sensor are located in accommodating chamber, the single-chip microcomputer
Input is connected to temperature sensor and manual input device, and the digital analog converter incoming end is connected to the output of single-chip microcomputer
End, other end output end are connected to the incoming end of drive circuit, and the output end of the drive circuit is connected to semiconductor chilling plate.
Further, the single-chip microcomputer is the single-chip microcomputer that 51 serial model No.s are 89C52.
Further, the model TLC5615 of the digital analog converter.
Further, the model DS18B20 of the temperature sensor.
Further, the manual input device is numeric keypad or touch-screen.
Further, the manual input device is embedded on the protective sleeve.
Brief description of the drawings
Fig. 1 is the utility model structure diagram.
Fig. 2 is accommodating chamber structural representation.
Fig. 3 is temperature-controlling module structured flowchart.
In figure, 1- protective cases, 2- accommodating chambers, 3- semiconductor chilling plates, 4- passages, 5- outer walls, 6- inwalls, 7- interlayers, 8-
Neck.
Embodiment
The utility model is described in further detail with reference to the accompanying drawings and detailed description.
As illustrated, a kind of device using semiconductor chilling plate, including two accommodating chambers, semiconductor chilling plate, power supplys
And protective case, in addition to temperature-controlling module.
The accommodating chamber includes inner and outer wall, the upper end sealing of the outer wall and inwall, the side of the inner and outer wall
Body and lower end form the interlayer for putting transformer oil, and the outer wall is provided with the neck being recessed to interlayer direction, wherein, the outer wall
It is made up of not Heat Conduction Material, such as ceramics, epoxy resin etc.；The inwall and neck are made from a material that be thermally conductive, such as metallic copper.
In the present embodiment, sealed after the injection transformer oil into interlayer, then by the upper end of inner and outer wall.
The protective case is provided with the groove of upper end open, and described two accommodating chambers are fastened in the groove of protective case, thus,
In the presence of stiction, play a part of fixing two accommodating chambers.
The both ends of the semiconductor chilling plate insert in two necks for accommodating cavity outer wall respectively；The semiconductor refrigerating
Piece is coupled by N-type semiconductor material and p-type semiconductor material to be formed, and is coupled in N-type semiconductor material and p-type semiconductor material
During galvanic couple pair, after connecting DC current in this circuit, the transfer with regard to that can produce energy, electric current is by N-type semiconductor material stream
Heat is absorbed to the joint of p-type semiconductor material, turns into cold end；The joint of N-type semiconductor material is flowed to by p-type semiconductor material
Heat is discharged, turns into hot junction.
In the present embodiment, the size of semiconductor chilling plate heat absorption and heat release is size and semi-conducting material by electric current
N, P element logarithm determines, due to N, P bad change of element logarithm, therefore, heat absorption is realized by the size for changing electric current
With the regulation of heat release, i.e., realized by temperature-controlled package.
The temperature-controlling module includes single-chip microcomputer, manual input device, temperature sensor, display screen, digital analog converter
And drive circuit, the single-chip microcomputer connect power supply by wired in series, the input of the single-chip microcomputer is connected to temperature sensor
And manual input device, the digital analog converter incoming end are connected to the output end of single-chip microcomputer, other end output end is connected to drive
The incoming end of dynamic circuit, the output end of the drive circuit are connected to semiconductor chilling plate.
In the present embodiment, temperature sensor is arranged in accommodating chamber, and it can be main to use by the way of stickup or clamping
To detect the temperature in accommodating chamber；Manual input device and display screen are set on the protective sleeve, both can use embed by the way of,
Manual input device plays the purpose for setting temperature manually, and display screen plays the purpose of display accommodating chamber temperature；Single-chip microcomputer, digital-to-analogue
Converter and drive circuit are placed in a groove.
In the present embodiment, single-chip microcomputer uses model 89C52 single-chip microcomputers, and manual input device is touch-screen, TEMP
The model DS18B20 of device, the model TLC5615 of digital analog converter, drive circuit fall size of current for common regulation
Drive circuit (utilizes PWM square wave control electric currents size).
After energization, the temperature in temperature sensor examinations accommodating chamber, and be input in single-chip microcomputer, turn by data
Change, on a display screen come out temperature display.
When adjusting temperature, first by touch-screen preset temperature, after the processing of single-chip microcomputer pid control algorithm, to receiving
Actual temperature calculated, draw the Current Temperatures controlled quentity controlled variable to be exported, by digital analog converter carry out D/A conversions, finally
The voltage of simulation is obtained, by drive circuit, voltage is changed into the driving semiconductor chilling plate work of electric current drive volume, reached
To temperature controlled purpose.
After the utility model is powered, the heat absorption of semiconductor chilling plate one end, other end heat release, due to the two of semiconductor chilling plate
End is fastened in the groove of accommodating chamber respectively, and therefore, in the presence of heat transfer, an accommodating chamber gradually heats up, and is changed into being incubated
Chamber, another accommodating chamber gradually cool, and are changed into refrigeration chamber；Meanwhile the temperature of real-time two accommodating chambers of temperature sensor, and transmit
To single-chip microcomputer, single-chip microcomputer is shown after conversion by display screen, it is necessary to manually change temperature (the i.e. semiconductor of accommodating chamber
The power of cooling piece) when, pass through the method for aforementioned temperature control assembly striped.
Some embodiments of the present utility model are these are only, to those skilled in the art, are not being departed from
On the premise of the utility model creates design, several modifications and improvements can be also carried out, these belong to the utility model protection model
Enclose.
Claims (9)
1. a kind of device using semiconductor chilling plate, including two accommodating chambers, semiconductor chilling plate, power supply and protective case, its
It is characterised by, the accommodating chamber includes inner and outer wall, and the interlayer for putting transformer oil, institute are provided between the inner and outer wall
State outer wall and be provided with the neck being recessed to interlayer direction；The semiconductor chilling plate is connected to power supply, the semiconductor by wire
The both ends of cooling piece insert in two necks for accommodating cavity outer wall respectively；The protective case is provided with the groove of upper end open, institute
Two accommodating chambers are stated to be fastened in the groove of protective case.
A kind of 2. device using semiconductor chilling plate according to claim 1, it is characterised in that：The side of the protective case
Wall is provided with the passage that is communicated with groove, and the passage is provided with fan, and the fan is connected to power supply by wire, the fan with
Also connected in the circuit of power supply a power switch.
A kind of 3. device using semiconductor chilling plate according to claim 1, it is characterised in that：Described two accommodating chambers
Gap is formed between semiconductor chilling plate, foam is filled with the gap.
A kind of 4. device using semiconductor chilling plate according to claim 1, it is characterised in that：Also include temperature control
Component, the temperature-controlling module include single-chip microcomputer, manual input device, temperature sensor, display screen, digital analog converter and drive
Dynamic circuit, the temperature sensor be located in accommodating chamber, and the input of the single-chip microcomputer is connected to temperature sensor and manual defeated
Enter equipment, the digital analog converter incoming end is connected to the output end of single-chip microcomputer, and other end output end is connected to drive circuit
Incoming end, the output end of the drive circuit are connected to semiconductor chilling plate.
A kind of 5. device using semiconductor chilling plate according to claim 4, it is characterised in that：The single-chip microcomputer is 51
Serial model No. is 89C52 single-chip microcomputer.
A kind of 6. device using semiconductor chilling plate according to claim 4, it is characterised in that：The digital analog converter
Model TLC5615.
A kind of 7. device using semiconductor chilling plate according to claim 4, it is characterised in that：The TEMP
The model DS18B20 of device.
A kind of 8. device using semiconductor chilling plate according to claim 4, it is characterised in that：Described be manually entered sets
Standby is numeric keypad or touch-screen.
A kind of 9. device using semiconductor chilling plate according to claim 8, it is characterised in that：Described be manually entered sets
It is standby to embed on the protective sleeve.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720189066.9U CN207050266U (en) | 2017-02-28 | 2017-02-28 | A kind of device using semiconductor chilling plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720189066.9U CN207050266U (en) | 2017-02-28 | 2017-02-28 | A kind of device using semiconductor chilling plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207050266U true CN207050266U (en) | 2018-02-27 |
Family
ID=61488937
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720189066.9U Expired - Fee Related CN207050266U (en) | 2017-02-28 | 2017-02-28 | A kind of device using semiconductor chilling plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207050266U (en) |
-
2017
- 2017-02-28 CN CN201720189066.9U patent/CN207050266U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180227 Termination date: 20190228 |