CN207006969U - The evaporation tube of flooded evaporator - Google Patents
The evaporation tube of flooded evaporator Download PDFInfo
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- CN207006969U CN207006969U CN201720808842.9U CN201720808842U CN207006969U CN 207006969 U CN207006969 U CN 207006969U CN 201720808842 U CN201720808842 U CN 201720808842U CN 207006969 U CN207006969 U CN 207006969U
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- structure layer
- capillary structure
- capillary
- evaporation tube
- flooded evaporator
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Abstract
A kind of evaporation tube of flooded evaporator, belongs to heat exchanger tube preparing technical field.Including body, being formed on the inwall of the body has spiral internal tooth, feature:Being formed successively on the outer wall of body has the first capillary structure layer and the second capillary structure layer, the first capillary structure layer and structure is integrally formed with body, and the second capillary structure layer is integrally formed structure with the first capillary structure layer.There is the second capillary structure layer due to forming to have the first capillary structure layer being combined as a whole with body and form outside the first capillary structure layer on the outer wall of body, thermal contact resistance thus will not be produced between body and first, second capillary structure layer, ensures good heat exchange property;Because first, second capillary structure layer has abundant capillary hole, numerous nucleus of boiling can be produced to improve nucleate boiling and then improve heat transfer coefficient;Because first, second capillary structure layer is made up of thin, blister copper powder particles respectively, dimensional homogeneity is ensured, plays the maximization effect of heat transfer.
Description
Technical field
The utility model belongs to heat exchanger tube preparing technical field, and in particular to a kind of evaporation tube of flooded evaporator.
Background technology
As is known in the industry, liquid is related generally in fields such as refrigeration, Air-conditioning Engineering and energy and power engireerings restraining
The refrigeration system unit and air-conditioning system unit of outer surface evaporation, and mostly used for large-scale central air-conditioning centrifugal chiller
Flooded evaporator.Because copper product has good plasticity, thus full-liquid type evaporation tube is usually using copper pipe.In order to increase
Heat exchange area, the coefficient of heat transfer is improved, generally in a manner of extrusion rolling or welding manner forms fin in copper pipe outer(Custom claims outer
Fin), and roll out inner fin in copper pipe inwall.
It is no lack of in disclosed patent document and is seen in the example that copper pipe outer forms outer fin with rolling mode, such as
CN1092327C(Heat-transfer tube for mixed refrigerant)、CN2365635Y(Heat-transfer pipe)、CN2539948Y(Interrupted teeth inner thread is seamless
Efficient heat conducting tube)、CN100365369C(Heat exchange tube of evaporator)、CN102425972A(A kind of heat-exchange tube)、
CN103063072(A kind of heat-exchange tube)、CN201034432Y(High finned heat-exchange tube)And CN2740988Y(Heat exchanger is used
Copper and the seamless high finned tube of copper alloy), etc.;The example such as CN205300349U of fin is formed outside copper pipe with welding manner
(Longitudinal open cell type finned tube)And US2667337(Corrugated pipe with wound fin), etc..
It is more suited to the example such as CN2911555Y of evaporation tube used as flooded evaporator(Flooded evaporator is used
Evaporation tube)、CN201034436Y(The evaporation heat-transfer pipe of dual reinforcing)、CN101782344B(A kind of two-sided strengthened heat exchange
Pipe)、CN103047891B(The falling film evaporation pipe of netted outer surface)、CN104006579B(A kind of High Efficiency Thermal of evaporator is handed over
Change pipe)And CN105300155A(Evaporation tube), etc..
And then as is known in the industry, body and fin root can be produced due to forming fin in copper pipe outer with welding manner
(Fin root)Between thermal contact resistance, thus be not exposed to thinking highly of for industry.Existed with rolling mode with mechanical presses processing mode
Copper pipe outer, which forms fin, can eliminate foregoing thermal contact resistance, but obtained fin and the uniformity of groove size can not expire
The expection of sufficient industry, therefore the evaporation tube obtained by extrusion process mode is difficult to embody the maximum of the heat transfer property of full liquid evaporation
Change.
In view of above-mentioned prior art is necessary to be improved, for this, the applicant has made beneficial design and formd down
The technical scheme that face will be introduced.
The content of the invention
Task of the present utility model, which is to provide, a kind of both can eliminate the thermal contact resistance between tube wall and use guarantor
Hinder good heat exchange property, and can tube wall form capillary structure and use ensure it is numerous to produce in use
The nucleus of boiling improves nucleate boiling and then improves heat transfer coefficient, and can also embody good dimensional homogeneity and use performance
The evaporation tube of the flooded evaporator of the maximization effect of heat transfer property.
What task of the present utility model was performed by, a kind of evaporation tube of flooded evaporator, including body, at this
Being formed on the inwall of body has spiral internal tooth, and being characterised by the outer wall of body forming successively has the first capillary structure layer and the
Two capillary structure layers, the first capillary structure layer and are integrally formed structure with body, and the second capillary structure layer and the first capillary knot
Structure layer is integrally formed structure.
In a specific embodiment of the present utility model, the thickness of the first described capillary structure layer is 0.18-
0.22mm, and the thickness of the second described capillary structure layer is 0.38-0.42mm.
In another specific embodiment of the present utility model, first capillary structure layer is sintered by thin copper powder particle
Form, the second described capillary structure layer is made up of blister copper powder particles sintering.
In another specific embodiment of the present utility model, the mesh number of the thin copper powder particle is 800-1000 mesh,
The mesh number of the blister copper powder particles is 300-500 mesh.
In another specific embodiment of the present utility model, described body is copper pipe.
One of technique effect of technical scheme provided by the utility model, have and body due to being formed on the outer wall of body
The first capillary structure layer for being combined as a whole and formed outside the first capillary structure layer and have the second capillary structure layer, thus in pipe
Thermal contact resistance will not be produced between body and first, second capillary structure layer, is able to ensure good heat exchange property;Two, due to
First, second capillary structure layer has abundant capillary hole, thus can produce numerous nucleus of boiling in a state of use
Improve nucleate boiling and then improve heat transfer coefficient;Three, because first, second capillary structure layer is respectively by thin, blister copper powder particles
Form, thus dimensional homogeneity is ensured, can play the maximization effect of heat transfer.
Brief description of the drawings
Fig. 1 is the sectional view of the evaporation tube of flooded evaporator of the present utility model.
Fig. 2 is Fig. 1 A portions enlarged drawing.
Embodiment
Embodiment 1:
Fig. 1 and Fig. 2 are referred to, shows body 1, being made up of on the inwall of the body 1 rolling mode has in spiral
Tooth 11, body 1 are copper pipe.
Technical essential as technical scheme provided by the utility model:Being formed successively on the outer wall of light-emitting diode body 1 has
First capillary structure layer 12 and the second capillary structure layer 13, the first capillary structure layer 12 and are integrally formed structure with body 1, and
Two capillary structure layers 13 are integrally formed structure with the first capillary structure layer.First capillary structure layer 12 is sintered in by sintering processing
Outside body 1, structure is integrally formed with body 1, the second capillary structure layer 13 is formed in the first capillary structure layer by sintering processing
Outside 12, structure is integrally formed with the first capillary structure layer 12.First, second foregoing capillary structure layer 12,13 is step sintering
Formed.
The thickness of the first foregoing capillary structure layer 12 is preferably 0.18-0.22mm, is preferably 0.19-0.21mm, most
It is 0.2mm, the present embodiment selection 0.2mm well, and the thickness of the second foregoing capillary structure layer 13 is preferably 0.38-0.42mm,
Preferably it is 0.39-0.41mm, preferably 0.4mm, the present embodiment selects 0.4mm.
Foregoing first capillary structure layer 12 is made up of thin copper powder particle sintering, and the second foregoing capillary structure layer 13 is by blister copper
Powder particles sintering is formed.
The mesh number of foregoing thin copper powder particle is 800-1000 mesh, is preferably 850-950 mesh, preferably 900 mesh,
The present embodiment selects 900 mesh, and the mesh number of aforementioned crude copper powder particle is preferably 300-500 mesh, is preferably 350-450 mesh, best
For 400 mesh, the mesh of the present embodiment 400.
Rolled finned tube in the complex heat transfer coefficient and prior art of the evaporation tube of the utility model flooded evaporator
Compared to can improve 50-100%, heat transfer coefficient improves 15-25 times compared with the light pipe in prior art, can yet be regarded as one it is ultimate attainment
Technical scheme.
Claims (5)
1. a kind of evaporation tube of flooded evaporator, including body (1), being formed on the inwall of the body (1) has spiral internal tooth
(11), it is characterised in that being formed successively on the outer wall of body (1) has the first capillary structure layer (12) and the second capillary structure layer
(13), the first capillary structure layer (12) and structure is integrally formed with body (1), and the second capillary structure layer (13) and the first capillary
Structure sheaf is integrally formed structure.
2. the evaporation tube of flooded evaporator according to claim 1, it is characterised in that the first described capillary structure layer
(12) thickness is 0.18-0.22mm, and the thickness of described the second capillary structure layer (13) is 0.38-0.42mm.
3. the evaporation tube of flooded evaporator according to claim 1 or 2, it is characterised in that first capillary structure layer
(12) it is made up of thin copper powder particle sintering, described the second capillary structure layer (13) is made up of blister copper powder particles sintering.
4. the evaporation tube of flooded evaporator according to claim 3, it is characterised in that the mesh number of the thin copper powder particle
For 800-1000 mesh, the mesh number of the blister copper powder particles is 300-500 mesh.
5. the evaporation tube of flooded evaporator according to claim 1, it is characterised in that described body (1) is copper pipe.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201720808842.9U CN207006969U (en) | 2017-07-05 | 2017-07-05 | The evaporation tube of flooded evaporator |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201720808842.9U CN207006969U (en) | 2017-07-05 | 2017-07-05 | The evaporation tube of flooded evaporator |
Publications (1)
Publication Number | Publication Date |
---|---|
CN207006969U true CN207006969U (en) | 2018-02-13 |
Family
ID=61453399
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201720808842.9U Active CN207006969U (en) | 2017-07-05 | 2017-07-05 | The evaporation tube of flooded evaporator |
Country Status (1)
Country | Link |
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CN (1) | CN207006969U (en) |
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2017
- 2017-07-05 CN CN201720808842.9U patent/CN207006969U/en active Active
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