CN206992064U - A kind of jet printing type etching groove limit spray apparatus - Google Patents
A kind of jet printing type etching groove limit spray apparatus Download PDFInfo
- Publication number
- CN206992064U CN206992064U CN201721009221.0U CN201721009221U CN206992064U CN 206992064 U CN206992064 U CN 206992064U CN 201721009221 U CN201721009221 U CN 201721009221U CN 206992064 U CN206992064 U CN 206992064U
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Abstract
The utility model discloses a kind of jet printing type etching groove limit spray apparatus, including limit spray box and be in turn secured to limit catheter, limiting block and the current divider box in spray box inner chamber；The limiting block offers slot, in the slot activity be inserted with baffle plate, the baffle plate is fixedly connected with electric pushrod；The current divider box side wall, which corresponds to, offers tap hole at delivery hole, the bottom wall of inner cavity of the current divider box is fixed with flow distribution plate, the current divider box bottom wall offers discharge orifice with the bottom wall insertion of limit spray box, and the discharge orifice is arranged between flow distribution plate and tap hole, the current divider box offers spray hole away from tap hole side side wall and the side wall insertion of limit spray box.The effect that the utility model passes through limiting block Internal baffle, when the intermediate gaps time in spraying two panels silicon chip, etching liquid is set to be flowed out from discharge orifice, the occurrence of preventing etching liquid to be splashed to silicon chip diffusingsurface, silicon chip erosion quality is greatly improved, reduces economic loss.
Description
Technical field
Silicon chip erosion technical field is the utility model is related to, specially a kind of jet printing type etching groove limit spray apparatus.
Background technology
The manufacturing process of solar battery sheet is needed by many steps, wherein be also to the etching technics of silicon chip must not
The part that can lack, silicon chip is in etching process, it is necessary to use etching liquid to carry out all faces of the silicon chip in addition to diffusingsurface
Etching, currently used etching groove machine uses mucus roller, to be performed etching to silicon chip, by mucus roller by etching liquid
It is bonded on roller, then etching liquid is delivered to silicon chip back side and completes etching by roller, is sprayed for the side wall of silicon chip using nozzle
Etching liquid performs etching, and so as to well etch into four side walls in addition to diffusingsurface, substantially increases
Silicon chip erosion quality.
But the method for being performed etching using nozzle to silicon chip side wall, the defects of following more obvious be present：Because
Silicon chip carries out translatory movement on the roller in etching groove, interval is provided between every two pieces of silicon chips, so working as nozzle upward one
After the side wall of block silicon chip carries out spray etch, before next piece of silicon chip is sprayed to, the time of this section of intermediate gaps, what nozzle sprayed
Etching liquid can be sprayed directly on etching groove liquid level, and liquid level is impacted, and so as to cause liquid level etching liquid to splash, will also be led
Cause etching liquid to splash, fall on the diffusingsurface of silicon chip and cause to etch, and then produce a large amount of inferior silicon chips, have a strong impact on that silicon chip is carved
Quality is lost, causes huge economic losses.
Utility model content
The purpose of this utility model is to provide a kind of jet printing type etching groove limit spray apparatus, to solve above-mentioned background technology
The problem of middle proposition.
To achieve the above object, the utility model provides following technical scheme：
A kind of jet printing type etching groove limit spray apparatus, including limit spray box and be in turn secured to limit leading in spray box inner chamber
Liquid pipe, limiting block and current divider box；
The limit spray box side wall, which corresponds to, offers inlet opening at catheter, the limiting block offers slot, the slot
Madial wall corresponds to catheter and symmetrically offers delivery hole, in the slot activity be inserted with baffle plate, the baffle plate is fixedly connected with
Electric pushrod；
The current divider box side wall, which corresponds to, offers tap hole at delivery hole, the bottom wall of inner cavity of the current divider box is fixed with shunting
Plate, the current divider box bottom wall offers discharge orifice with the bottom wall insertion of limit spray box, and the discharge orifice is arranged at flow distribution plate and shunting
Between hole；
The current divider box offers spray hole away from tap hole side side wall and the side wall insertion of limit spray box.
Preferably, the baffle plate outer wall is arranged with sealant.
Preferably, the flow distribution plate is fixed with auxiliary block away from discharge orifice one end.
Preferably, the limit spray box lateral wall, which corresponds to, is fixed with injector head at spray hole, the injector head is away from spray hole
One end offers spray-hole.
Preferably, buffer board is movably set between the flow distribution plate and spray hole, the buffer board lower end is fixed with bullet
Spring.
Preferably, the buffer board side wall is respectively and fixedly provided with sealant.
Compared with prior art, the beneficial effects of the utility model are：
Etching liquid is entered in limit spray box from inlet opening in the utility model, is then acted on, entered by the transmission of catheter
Enter into the delivery hole of limiting block, drive limiting block Internal baffle to move up and down by electric pushrod, play regulation etching flow quantity
The effect of size, it is controlled so as to enter the uninterrupted of tap hole to etching liquid；By entering current divider box to etching liquid
Interior uninterrupted is controlled, and control etching liquid flow to the both sides of flow distribution plate, when etch flow quantity it is small when, etching liquid from point
When discharge orifice is entered in current divider box, discharge orifice side is dropped into according to etching liquid self gravitation, then flowed downward out from discharge orifice,
When etch flow quantity it is big when, etching liquid from tap hole enter in current divider box when, according to etching liquid self gravitation, can drop into
Spray hole side, then spray, perform etching from spray hole.
The utility model can be shunted to etching liquid by the effect of limiting block Internal baffle, when needing to carry out silicon chip
During etching, control etching liquid flows to spray hole side, sprays away etching liquid, when empty among spraying two panels silicon chip
During the gap time, control etching liquid flows to discharge orifice side, etching liquid is flowed out from discharge orifice, silicon chip liquid level will not be caused to rush
Hit, also avoid because the situation that impact causes liquid level etching liquid to splash, prevents etching liquid to be splashed to silicon chip diffusingsurface feelings
The generation of condition, silicon chip erosion quality is greatly improved, reduce economic loss.
Brief description of the drawings
Fig. 1 is the utility model overall structure schematic cross-sectional view；
Fig. 2 is limiting block Structure explosion diagram of the present utility model；
Fig. 3 is injection nozzle structure schematic diagram of the present utility model.
In figure：1 limit spray box, 2 catheters, 3 limiting blocks, 31 slots, 4 current divider boxs, 5 inlet openings, 6 delivery holes, 7 baffle plates, 8 electricity
Dynamic push rod, 9 flow distribution plates, 91 auxiliary blocks, 10 tap holes, 11 discharge orifices, 12 spray holes, 13 injector heads, 131 spray-holes, 14 bufferings
Plate, 15 springs.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the embodiment of the utility model is carried out
Clearly and completely describing, it is clear that described embodiment is only the utility model part of the embodiment, rather than whole
Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are not under the premise of creative work is made
The every other embodiment obtained, belong to the scope of the utility model protection.
Fig. 1-3 are referred to, the utility model provides a kind of technical scheme：
A kind of jet printing type etching groove limit spray apparatus, including limit spray box 1 and be in turn secured to limit in the inner chamber of spray box 1
Catheter 2, limiting block 3 and current divider box 4, limit spray box 1 is used for being attached fixation with the nozzle of spraying, and catheter 2 connects
It is connected in limiting block 3, limiting block 3 is connected with the lateral wall of current divider box 4.
The limit side wall of spray box 1, which corresponds to, offers inlet opening 5 at catheter 2, nozzle sprays into etching liquid at inlet opening 5, etching
Liquid flows along catheter 2 to the side of limiting block 3.
Limiting block 3 offers slot 31, and the opening of slot 31 corresponds to drain towards limit spray box 1 bottom, the madial wall of slot 31
Pipe 2 symmetrically offers delivery hole 6, i.e., delivery hole 6 is offered in the both sides of slot 31, and etching liquid flows to out of catheter 2
At the delivery hole 6 in the left side of slot 31, entered from the delivery hole 6 in left side in limiting block 3, in slot 31 activity be inserted with baffle plate 7,
The outer wall of baffle plate 7 is arranged with sealant, the flowing of etching liquid can be lived with better seal, sealant is using the anti-material for etching acid solution
It is made, can prevents from etching corrosion, it is big by the flow of slot 31 to etching liquid to realize by moving up and down for baffle plate 7
Small, etching liquid flows through from slot 31, is then flowed out from the delivery hole 6 on right side, into current divider box 4.
Baffle plate 7 is fixedly connected with electric pushrod 8, and the socket end of electric pushrod 8 is fixed on limit spray box 1, and electric pushrod 8 selects
With Yangzhou meaning along the type electric pushrods of DT I of machinery plant, its profile is simple, convenient installation, and coming putter controller, can be very
The good movement travel to electric pushrod 8 is controlled, and by the effect of electric pushrod 8, is played and is driven what baffle plate 7 moved up and down
Effect, so as to control the uninterrupted of etching liquid.
In order to mitigate worker labour, can be used according to the interval time between every two panels silicon chip during silicon chip erosion
80C51 type single-chip microcomputer imprinting programs, can allow controller automatically control electric pushrod 8 and move back and forth, when progress silicon
When piece etches, baffle plate 7 is driven to move downward, increase etching flow quantity；When in silicon chip erosion interval time section, baffle plate is driven
7 motions upwards, reduce etching flow quantity, etching liquid automatic drainage is gone out.
The flow control action of baffle plate 7, you can be interpreted as water discharge of water faucet principle, when baffle plate 7 blocks the area of slot 31
When larger, etching flow quantity is small, and when baffle plate 7 moves down, and opens most of 31 area of slot, etching flow quantity substantially increases
Greatly, and flow velocity is also obviously improved.
The side wall of current divider box 4, which corresponds to, offers tap hole 10 at delivery hole 6, etching liquid after being controlled through inflow-rate of water turbine, from point
Discharge orifice 10 is flowed into current divider box 4, and according to level throw motion principle, etching liquid is dished out from tap hole 10 is flat.
The bottom wall of inner cavity of current divider box 4 is fixed with flow distribution plate 9, and current divider box 4 is divided into aerial drainage area and spraying area by flow distribution plate 9,
, can be preferably to aerial drainage area when wherein, as one preferably, in order that obtaining etching liquid above level throw motion to flow distribution plate 9
Flowed with spraying area, be fixed with auxiliary block 91 away from the one end of discharge orifice 11 in flow distribution plate 9, auxiliary block 91 is arranged to a triangle
Shape so that the upper end of auxiliary block 91 forms two inclined-planes, and etching liquid can be made to be more convenient to aerial drainage area and spraying area flowing.
The bottom wall of current divider box 4 offers discharge orifice 11 with the bottom wall insertion of limit spray box 1, and discharge orifice 11 is arranged at the He of flow distribution plate 9
Between tap hole 10, the region of discharge orifice 11 is aerial drainage area, for letting out etching liquid in silicon chip erosion interval time section
Spill out, discharge orifice 11 can be connected in TANK grooves by pipeline, realize the circulation of etching liquid, reduce the waste of etching liquid.
Current divider box 4 offers spray hole 12 away from the side side wall of tap hole 10 and the side wall insertion of limit spray box 1, and spray hole 12 is opened
It is located in side wall, for carrying out spray etch to silicon chip side wall.
By many experiments, the specific experiment data of one group of embodiment are obtained, a diameter of 5cm of delivery hole 6 is set, now
The height of flow distribution plate 9 is arranged to 7cm, it is 5cm to control the vertical distance at delivery hole 6 and the peak of flow distribution plate 9, and flow distribution plate
9 are located at the midpoint of the bottom wall of current divider box 4, and now, controlling baffle plate 7 covers the semi-area of delivery hole 6 one, i.e., baffle plate 7 is located at drain
On the axle datum line in hole 6, etching liquid is just flat to be left on the right side of flow distribution plate 9, drops into spraying area, silicon chip is sprayed；Adjust
Whole baffle plate 7 moves up, and blocks more areas of delivery hole 6, the directly flat throwing of etching liquid is dropped into aerial drainage area, from discharge orifice 11
Outflow.
Buffer board 14 is movably set between flow distribution plate 9 and spray hole 12, the side wall of buffer board 14 is respectively and fixedly provided with sealant, close
Sealing also uses anti-acid liquid corrosion materials for support, can corrode to prevent etching liquid, and can be very good to seal the invalid stream of etching liquid
Dynamic, the lower end of buffer board 14 is fixed with spring 15, and buffer board 14 in an initial condition, completely shelters from spray hole 12, leads to
Cross the effect of spring 15, when etching liquid flows to 14 top of buffer board because the gravity of etching liquid itself, compression spring 15 to
Lower motion, so as to open spray hole 12 so that etching liquid can spray from spray hole 12, and can also be according to etching liquid weight
Amount, the opening size of adjust automatically spray hole 12, so as to adjust the amount that spray hole 12 sprays etching liquid so that hydrojet acts more
It is sensitive, it is highly effective.
As one preferably, the limit lateral wall of spray box 1, which corresponds to, is fixed with injector head 13 at spray hole 12, the installation of injector head 13
Height can offer spray-hole 131 from main modulation, injector head 13 according to the height and thickness of silicon chip away from the one end of spray hole 12,
Spray-hole 131 is uniformly opened on injector head 13 so that the effect of spray etch is more preferable evenly.
While there has been shown and described that embodiment of the present utility model, for the ordinary skill in the art,
It is appreciated that these embodiments can be carried out with a variety of changes in the case where not departing from principle of the present utility model and spirit, repaiied
Change, replace and modification, the scope of the utility model are defined by the appended claims and the equivalents thereof.
Claims (6)
1. a kind of jet printing type etching groove limit spray apparatus, including limit spray box (1) and be in turn secured to limit in spray box (1) inner chamber
Catheter (2), limiting block (3) and current divider box (4), it is characterised in that：
Described limit spray box (1) side wall corresponds to catheter (2) place and offers inlet opening (5), and the limiting block (3) offers slot
(31), slot (31) madial wall corresponds to catheter (2) and symmetrically offers delivery hole (6), and activity is slotting in the slot (31)
Provided with baffle plate (7), the baffle plate (7) is fixedly connected with electric pushrod (8)；
Current divider box (4) side wall corresponds to delivery hole (6) place and offers tap hole (10), the bottom wall of inner cavity of the current divider box (4)
It is fixed with flow distribution plate (9), current divider box (4) bottom wall offers discharge orifice (11) with limit spray box (1) bottom wall insertion, and described lets out
Discharge orifice (11) is arranged between flow distribution plate (9) and tap hole (10)；
The current divider box (4) offers spray hole (12) away from tap hole (10) side side wall and limit spray box (1) side wall insertion.
A kind of 2. jet printing type etching groove according to claim 1 limit spray apparatus, it is characterised in that：The baffle plate (7) is outside
Wall is arranged with sealant.
A kind of 3. jet printing type etching groove according to claim 1 limit spray apparatus, it is characterised in that：The flow distribution plate (9)
Auxiliary block (91) is fixed with away from discharge orifice (11) one end.
A kind of 4. jet printing type etching groove according to claim 1 limit spray apparatus, it is characterised in that：The limit spray box (1)
Lateral wall corresponds to spray hole (12) place and is fixed with injector head (13), and the injector head (13) offers away from spray hole (12) one end
Spray-hole (131).
A kind of 5. jet printing type etching groove according to claim 1 limit spray apparatus, it is characterised in that：The flow distribution plate (9)
Buffer board (14) is movably set between spray hole (12), buffer board (14) lower end is fixed with spring (15).
A kind of 6. jet printing type etching groove according to claim 5 limit spray apparatus, it is characterised in that：The buffer board (14)
Side wall is respectively and fixedly provided with sealant.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721009221.0U CN206992064U (en) | 2017-08-14 | 2017-08-14 | A kind of jet printing type etching groove limit spray apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721009221.0U CN206992064U (en) | 2017-08-14 | 2017-08-14 | A kind of jet printing type etching groove limit spray apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206992064U true CN206992064U (en) | 2018-02-09 |
Family
ID=61419254
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721009221.0U Withdrawn - After Issue CN206992064U (en) | 2017-08-14 | 2017-08-14 | A kind of jet printing type etching groove limit spray apparatus |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206992064U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107393849A (en) * | 2017-08-14 | 2017-11-24 | 通威太阳能（安徽）有限公司 | A kind of jet printing type etching groove limit spray apparatus |
| WO2024021996A1 (en) * | 2022-07-28 | 2024-02-01 | 常州捷佳创精密机械有限公司 | Compatible tank structure and cleaning apparatus |
-
2017
- 2017-08-14 CN CN201721009221.0U patent/CN206992064U/en not_active Withdrawn - After Issue
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107393849A (en) * | 2017-08-14 | 2017-11-24 | 通威太阳能（安徽）有限公司 | A kind of jet printing type etching groove limit spray apparatus |
| CN107393849B (en) * | 2017-08-14 | 2023-07-04 | 通威太阳能（安徽）有限公司 | Spraying type etching tank is with limit device that spouts |
| WO2024021996A1 (en) * | 2022-07-28 | 2024-02-01 | 常州捷佳创精密机械有限公司 | Compatible tank structure and cleaning apparatus |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20180209 Effective date of abandoning: 20230704 |
|
| AV01 | Patent right actively abandoned |
Granted publication date: 20180209 Effective date of abandoning: 20230704 |
|
| AV01 | Patent right actively abandoned | ||
| AV01 | Patent right actively abandoned |