CN206976301U - A kind of dumping machine for being used to process Wafer - Google Patents
A kind of dumping machine for being used to process Wafer Download PDFInfo
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- CN206976301U CN206976301U CN201720931882.2U CN201720931882U CN206976301U CN 206976301 U CN206976301 U CN 206976301U CN 201720931882 U CN201720931882 U CN 201720931882U CN 206976301 U CN206976301 U CN 206976301U
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- dumping machine
- vibrating disk
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Abstract
The utility model provides a kind of dumping machine for being used to process Wafer, including the first frame and the pusher, the first track, objective table, the second track and the turnover device for transferring to the product on the first track on the second track that are sequentially arranged in frame, second track docks with the vibrating disk in the second frame, sizing material is filled in the vibrating disk, the sizing material is filled to the product on the second track, above dumping machine, instead of adding glue by hand, lifts operation processing efficiency in a manner of adding glue automatically.
Description
Technical field
Industrial processing equipment field is the utility model is related to, more particularly to a kind of dumping machine for being used to process Wafer.
Background technology
, it is necessary to add glue by hand in existing Wafer (wafer) process, production efficiency is low, influences product yield ratio,
Influence the delivery cycle, lack in Wafer process, can filler automatically production equipment.
Utility model content
To solve problem above, the utility model provide can filler automatically it is a kind of for processing Wafer dumping
Machine.
It is a kind of to be used to processing Wafer dumping machine, including the first frame and the pusher that is sequentially arranged in frame, first
Track, objective table, the second track and the turnover device for transferring to the product on the first track on the second track, second rail
Road docks with the vibrating disk in the second frame, sizing material is filled in the vibrating disk, the sizing material is filled to the second track
Product on.
In preferred embodiment of the present utility model, the objective table is used for placing clamp, and the fixture is treated for placement
Filler product.
In preferred embodiment of the present utility model, product is being transferred to the second rail by the turnover device from the first track
While road, sizing material is shaken into the second track.
The beneficial effects of the utility model are as follows：
By having installed vibrating disk additional, plastic cement is inserted in cartridge clip automatically according to Product processing direction by vibrating disk, instead of
Plastic cement is loaded cartridge clip by hand, reaches saving cost of labor, improves the purpose of production efficiency.
Brief description of the drawings
Below in conjunction with the accompanying drawings, by the way that specific embodiment of the present utility model is described in detail, will make of the present utility model
Technical scheme and other beneficial effects are apparent.
Fig. 1 is a kind of dumping machine structural representation for being used to process Wafer.
Main element symbol description：
10th, the first frame；11st, pusher；12nd, the first track；13rd, objective table；14th, turnover device；15th, the second rail
Road；20th, the second frame；21st, vibrating disk.
Embodiment
The technological means and its effect taken for further elaboration the utility model, below in conjunction with of the present utility model
Preferred embodiment and its accompanying drawing are described in detail.
It is a kind of to be used to processing Wafer dumping machine with reference to figure 1, including the first frame 10 and it is sequentially arranged in pushing away in frame
Send device 11, the first track 12, objective table 13, the second track 15 and the product on the first track 12 is transferred into the second track 15
On turnover device 14, second track 15 docks with the vibrating disk 21 in the second frame 20, in the vibrating disk 21
Sizing material is filled, the sizing material is filled to the product on the second track 15.By having installed vibrating disk additional, by vibrating disk according to production
The direction of product is inserted plastic cement in cartridge clip automatically.Plastic cement is loaded cartridge clip instead of craft, reaches saving cost of labor, improves production
The purpose of efficiency.
Preferably, the objective table 13 is used for placing clamp, and the fixture treats filler product for placement.
Preferably, the turnover device 14 from the first track 12 by product while the second track 15 are transferred to, by glue
Material shakes into the second track 15.
It is described above, for the person of ordinary skill of the art, can according to the technical solution of the utility model and
Technical concept makes other various corresponding changes and deformation, and all these changes and deformation should all belong to the utility model power
The protection domain that profit requires.
Claims (3)
1. a kind of dumping machine for being used to process Wafer, it is characterised in that including the first frame and the push being sequentially arranged in frame
Device, the first track, objective table, the second track and the turnover device for transferring to the product on the first track on the second track,
Second track docks with the vibrating disk in the second frame, fills sizing material in the vibrating disk, the sizing material fill to
On product on second track.
2. a kind of dumping machine for being used to process Wafer according to claim 1, it is characterised in that the objective table is used for
Placing clamp, the fixture treat filler product for placement.
3. a kind of dumping machine for being used to process Wafer according to claim 1, it is characterised in that the turnover device exists
By product from the first track transfer to the second track while, sizing material is shaken into the second track.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720931882.2U CN206976301U (en) | 2017-07-28 | 2017-07-28 | A kind of dumping machine for being used to process Wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720931882.2U CN206976301U (en) | 2017-07-28 | 2017-07-28 | A kind of dumping machine for being used to process Wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206976301U true CN206976301U (en) | 2018-02-06 |
Family
ID=61398790
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720931882.2U Active CN206976301U (en) | 2017-07-28 | 2017-07-28 | A kind of dumping machine for being used to process Wafer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206976301U (en) |
-
2017
- 2017-07-28 CN CN201720931882.2U patent/CN206976301U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20180410 Address after: 523000 Liantang Industrial Zone, Chuk Yuen Village, Liaobu Town, Dongguan, Guangdong Patentee after: Dongguan City Department of Precision Electronic Technology Co. Ltd. Address before: 518000 Guangdong city of Shenzhen province Longhua new city streets Meron road B Light International Center No. 441 room 1206 Patentee before: Shenzhen City Branch Electronics Technology Co. Ltd. |