CN206961799U - Isosceles triangle metal-oxide-semiconductor apparatus for shaping - Google Patents
Isosceles triangle metal-oxide-semiconductor apparatus for shaping Download PDFInfo
- Publication number
- CN206961799U CN206961799U CN201720630521.4U CN201720630521U CN206961799U CN 206961799 U CN206961799 U CN 206961799U CN 201720630521 U CN201720630521 U CN 201720630521U CN 206961799 U CN206961799 U CN 206961799U
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- CN
- China
- Prior art keywords
- cylinder
- oxide
- workbench
- plate
- riser
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
A kind of isosceles triangle metal-oxide-semiconductor apparatus for shaping is the utility model is related to, it carries out shaping operation to metal-oxide-semiconductor, and workbench is located at the middle part of riser, and cylinder supports plate is located at the top of riser；Mould support plate is located between cylinder supports plate and workbench, cylinder driven mold supporting plate moves up and down between cylinder supports plate and workbench, mold is connected at the center of mould support plate, mold bottom is provided with the tooth that punching press is carried out to stitch, it carries out punching press by cylinder driven mold to metal-oxide-semiconductor, the shaping operation to metal-oxide-semiconductor is realized, it is simple in construction, but practical effect is good.
Description
Technical field
The production equipment of electronic component is the utility model is related to, specifically isosceles triangle metal-oxide-semiconductor apparatus for shaping.
Background technology
The full name of metal-oxide-semiconductor is MOS type FET, the insulated-gate type belonged in FET, because
This, metal-oxide-semiconductor is sometimes referred to as isolated gate FET, in general electronic circuit, metal-oxide-semiconductor be normally used for amplifying circuit or
On-off circuit.
Switching power supply parts are in addition to employing PFC technologies in present high definition, liquid crystal, plasma TV, in first device
Switching tube on part substitutes past High-power Semiconductor Triode using the metal-oxide-semiconductor of excellent performance, makes the efficiency, reliable of complete machine
Property, fault rate significantly decline.
Metal-oxide-semiconductor typically has three stitch, and during production, the connection of three stitch is arranged side by side, still
In actual use, it is sometimes desirable to three stitch are handled, make three stitch be in Chinese character pin-shaped arrangement, existing shaping device
It is complicated and expensive.
The content of the invention
The utility model is the product word row metal-oxide-semiconductor apparatus for shaping that shaping operation is carried out to metal-oxide-semiconductor, and it passes through cylinder band dynamic model
Tool carries out punching press to metal-oxide-semiconductor, realizes the shaping operation to metal-oxide-semiconductor, simple in construction, but practical effect is good.
The utility model realizes that above-mentioned purpose uses following technical scheme：
Product word row metal-oxide-semiconductor apparatus for shaping, it includes riser, workbench, cylinder supports plate, cylinder, mould support plate, punching
Compression mould.
Described riser is provided with two pieces set relatively, and workbench and cylinder supporting plate are located between riser；Work is flat
Platform is located at the middle part of riser, and cylinder supports plate is located at the top of riser；Mould support plate is located at cylinder supports plate and workbench
Between, cylinder is located at the top of cylinder supports plate and the expansion link of cylinder is connected to described mould support plate, cylinder band dynamic model
Tool supporting plate moves up and down between cylinder supports plate and workbench；Diel includes mold and lower mould, mold
It is connected at the center of mould support plate, mold bottom is provided with the tooth that punching press is carried out to stitch, and lower mould includes entering metal-oxide-semiconductor
The pressing plate of row clamping；The position of mold and lower mould in the vertical direction is mutually corresponding.
Further, the guide pillar to be intersected with mould support plate is provided between described workbench and cylinder supporting plate,
The position corresponding with guide pillar is provided with sliding sleeve on mould support plate.
The utility model is had the advantages that using above-mentioned technical proposal：
The diel that the present apparatus the uses no-float corresponding, mutual to the structure of metal-oxide-semiconductor, can be very good reality
Now to the punching press of metal-oxide-semiconductor stitch, overall structure is relatively simple, and cost is low, but using effect is excellent.
Brief description of the drawings
Fig. 1 is schematic diagram of the present utility model.
Fig. 2 is the corresponding diagram of present apparatus work upper/lower die.
Embodiment
The utility model is described further below in conjunction with the accompanying drawings.
Product word row metal-oxide-semiconductor apparatus for shaping as shown in Figure 1, it includes riser 1, workbench 2, cylinder supports plate 3, cylinder
4th, mould support plate 5, diel.
Described riser 1 is provided with two pieces set relatively, and workbench 2 and cylinder supporting plate 3 are located between riser 1；Work
Make the middle part that platform 2 is located at riser 1, cylinder supports plate 3 is located at the top of riser 1；Mould support plate 5 is located at cylinder supports plate 3
Between workbench 2, cylinder 4 is located at the top of cylinder supports plate 3 and the expansion link of cylinder 4 is connected to described mould support
Plate 5, the driven mold supporting plate 5 of cylinder 4 move up and down between cylinder supports plate 3 and workbench 2；Diel includes upper mould
Tool 601 and lower mould 602, mold 601 are connected at the center of mould support plate 5, and the bottom of mold 301 is provided with to enter stitch
The tooth of row punching press, lower mould 602 include the pressing plate 603 clamped to metal-oxide-semiconductor；Mold 601 and lower mould 602 are in vertical side
Upward position is mutually corresponding.
The guide pillar 7 to be intersected with mould support plate 5, mould branch are provided between described workbench 2 and cylinder supporting plate 3
The position corresponding with guide pillar 7 is provided with sliding sleeve 8 on fagging 5.
Design sketch when being used for the present apparatus as shown in Figure 2, places a certain amount of metal-oxide-semiconductor, Ran Houshang in lower mould
Mould moves down under the support of cylinder, so as to realize the punching press to metal-oxide-semiconductor stitch, makes up to expected delta structure
Stitch.
Claims (2)
1. product word row metal-oxide-semiconductor apparatus for shaping, it includes riser, workbench, cylinder supports plate, cylinder, mould support plate, punching press
Mould, it is characterised in that：Described riser be provided with relative and set two pieces, workbench and cylinder supporting plate be located at riser it
Between；Workbench is located at the middle part of riser, and cylinder supports plate is located at the top of riser；Mould support plate be located at cylinder supports plate and
Between workbench, cylinder is located at the top of cylinder supports plate and the expansion link of cylinder is connected to described mould support plate, gas
Cylinder driven mold supporting plate moves up and down between cylinder supports plate and workbench；Diel includes mold and lower mould
Tool, mold are connected at the center of mould support plate, and mold bottom is provided with the tooth that punching press is carried out to stitch, and lower mould includes
The pressing plate clamped to metal-oxide-semiconductor；The position of mold and lower mould in the vertical direction is mutually corresponding.
2. product word row metal-oxide-semiconductor apparatus for shaping according to claim 1, it is characterised in that：Described workbench and cylinder
It is provided with the guide pillar that is intersected with mould support plate between supporting plate, the position corresponding with guide pillar, which is provided with, on mould support plate slides
Set.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720630521.4U CN206961799U (en) | 2017-06-02 | 2017-06-02 | Isosceles triangle metal-oxide-semiconductor apparatus for shaping |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720630521.4U CN206961799U (en) | 2017-06-02 | 2017-06-02 | Isosceles triangle metal-oxide-semiconductor apparatus for shaping |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206961799U true CN206961799U (en) | 2018-02-02 |
Family
ID=61379703
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720630521.4U Expired - Fee Related CN206961799U (en) | 2017-06-02 | 2017-06-02 | Isosceles triangle metal-oxide-semiconductor apparatus for shaping |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206961799U (en) |
-
2017
- 2017-06-02 CN CN201720630521.4U patent/CN206961799U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180202 Termination date: 20210602 |