CN206948812U - Graphite-based shields heat conduction diaphragm - Google Patents
Graphite-based shields heat conduction diaphragm Download PDFInfo
- Publication number
- CN206948812U CN206948812U CN201720058681.6U CN201720058681U CN206948812U CN 206948812 U CN206948812 U CN 206948812U CN 201720058681 U CN201720058681 U CN 201720058681U CN 206948812 U CN206948812 U CN 206948812U
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- CN
- China
- Prior art keywords
- graphite
- heat conduction
- graphite film
- thickness
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 title claims abstract description 42
- 229910002804 graphite Inorganic materials 0.000 title claims abstract description 42
- 239000010439 graphite Substances 0.000 title claims abstract description 42
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 18
- 239000003292 glue Substances 0.000 claims abstract description 12
- 229910052802 copper Inorganic materials 0.000 claims abstract description 10
- 239000010949 copper Substances 0.000 claims abstract description 10
- 238000004544 sputter deposition Methods 0.000 claims abstract description 4
- 239000004575 stone Substances 0.000 claims description 4
- 239000011889 copper foil Substances 0.000 abstract description 8
- 239000000463 material Substances 0.000 abstract description 4
- 239000002184 metal Substances 0.000 abstract description 4
- 229910052751 metal Inorganic materials 0.000 abstract description 4
- 230000000694 effects Effects 0.000 abstract description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 2
- 239000000084 colloidal system Substances 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Abstract
The utility model discloses a kind of graphite-based to shield heat conduction diaphragm, including thickness 10 150um graphite film, sputtering has a layer thickness to stick heat-conducting glue of a layer thickness in 10 30um on the nanometer copper foil that 2 5um, copper granularity are 600 800nm, density is more than 8.0, the relative another side of the graphite film in the graphite film one side.The alternative traditional metal shield materials of the utility model, while with preferable function of shielding, the also effect with good three dimentional heat conduction.
Description
Technical field
A kind of shielding heat-conducting piece is the utility model is related to, is specifically related to a kind of graphite-based shielding heat conduction diaphragm.
Background technology
In electric terminal, extensively using there is radome, electromagnetic shielding is provided for some electronic devices in electric terminal
Effect.At present, radome generally use metallic shield, such as stainless steel or tin-coated steel band (black sheet iron) etc., by supporting leg and
Cover body forms, and supporting leg is to be flexibly connected with cover body；But the electronic device covered by metallic shield, radiating can be more difficult.Such as
What solves the equal heat problem of radiating of electronic device in radome, is a current technological difficulties.
The content of the invention
In order to solve the above-mentioned technical problem, the utility model proposes a kind of graphite-based to shield heat conduction diaphragm, alternative tradition
Metal shield materials, while with preferable function of shielding, the also effect with good three dimentional heat conduction.
What the technical solution of the utility model was realized in：
A kind of graphite-based shields heat conduction diaphragm, including thickness in 10-150um graphite film, the graphite film one side
Upper sputtering has a layer thickness in the nanometer copper foil that 2-5um, copper granularity are 600-800nm, density is more than 8.0, the graphite
Heat-conducting glue of a layer thickness in 10-30um is sticked on the relative another side of diaphragm.
Further, the graphite film be thickness 10-50um artificial synthesized graphite film or thickness in 40-
150um natural stone ink film.
Further, the heat-conducting glue uses colloid of the metal powder content for 35-55% solid contents.
The beneficial effects of the utility model are：The utility model provides a kind of graphite-based shielding heat conduction diaphragm, using thickness
In 10-150um graphite film, and it is 600- to sputter a layer thickness in the granularity of 2-5um, copper in graphite film one side
800nm, the nanometer copper foil that density is more than 8.0, a layer thickness has been sticked in 10-30um on the relative another side of graphite film
Heat-conducting glue, realize good shielding heat conductivility.Its principle is that the heat capacity ratio of graphite is relatively low, between only 1.85-2.2,
But the thermal capacitance of copper about 8.8, single graphite are horizontally oriented that heat conduction is fast, it is fast that single copper foil is vertically oriented heat conduction, both
Combine thermal diffusion or the heat accumulation for the hot achievable aspect of thermal capacitance for making full use of two materials.Pass through heat-conducting glue layer
Product surface can be applied to according to required size shape by die-cutting.
Brief description of the drawings
Fig. 1 is that graphite-based shields heat conduction diaphragm schematic diagram in the utility model.
Embodiment
In order to be more clearly understood that technology contents of the present utility model, described in detail especially exemplified by following examples, its mesh
Be only that be best understood from content of the present utility model and unrestricted the scope of protection of the utility model.The structure of embodiment accompanying drawing
In each part do not scaled by normal rates, therefore do not represent the actual relative size of each structure in embodiment.
As shown in figure 1, a kind of graphite-based shielding heat conduction diaphragm, including thickness is in 10-150um graphite film 1, the stone
Sputtering has a layer thickness in the nanometer copper foil that 2-5um, copper granularity are 600-800nm, density is more than 8.0 in ink film piece one side
2, heat-conducting glue 3 of a layer thickness in 10-30um is sticked on the relative another side of the graphite film.So, existed using thickness
10-150um graphite film, and in graphite film one side sputter a layer thickness 2-5um, copper granularity for 600-800nm,
Density is more than 8.0 nanometer copper foil, and heat conduction of a layer thickness in 10-30um is sticked on the relative another side of graphite film
Glue, realize good shielding heat conductivility.Its principle is that the heat capacity ratio of graphite is relatively low, between only 1.85-2.2, but copper
Thermal capacitance about 8.8, single graphite is horizontally oriented that heat conduction is fast, and single copper foil is vertically oriented that heat conduction is fast, and both combine exists
Thermal diffusion or the heat accumulation of the hot achievable aspect of thermal capacitance of two materials are made full use of together.Can root by heat-conducting glue layer
According to required size shape by die-cutting, product surface can is applied to.
Preferably, the graphite film be thickness 10-50um artificial synthesized graphite film or thickness control in 40-
150um natural stone ink film.
Preferably, the heat-conducting glue uses colloid of the metal powder content for 35-55% solid contents.So, heat-conducting glue is passed through
According to base size shape by die-cutting, submounts can is applied to.
To sum up, the utility model provides a kind of graphite-based shielding heat conduction diaphragm, using thickness 10-150um graphite film
Piece, and in graphite film one side sputter a layer thickness 2-5um, copper granularity be 600-800nm, density be more than 8.0
Nanometer copper foil, heat-conducting glue of a layer thickness in 10-30um is sticked on the relative another side of graphite film, is realized good
Shield heat conductivility.
Above example is that referring to the drawings, preferred embodiment of the present utility model is described in detail.The skill of this area
Art personnel are by carrying out modification or change on various forms to above-described embodiment, but without departing substantially from substantive feelings of the present utility model
Under condition, all fall within the scope of protection of the utility model.
Claims (2)
1. a kind of graphite-based shields heat conduction diaphragm, it is characterised in that：Including thickness 10-150um graphite film (1), it is described
Sputtering has a layer thickness in the Nanometer Copper that 2-5um, copper granularity are 600-800nm, density is more than 8.0 in graphite film one side
Paper tinsel (2), heat-conducting glue (3) of a layer thickness in 10-30um is sticked on the relative another side of the graphite film.
2. graphite-based according to claim 1 shields heat conduction diaphragm, it is characterised in that：The graphite film is that thickness exists
Natural stone ink film of the 10-50um artificial synthesized graphite film or thickness in 40-150um.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720058681.6U CN206948812U (en) | 2017-01-17 | 2017-01-17 | Graphite-based shields heat conduction diaphragm |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720058681.6U CN206948812U (en) | 2017-01-17 | 2017-01-17 | Graphite-based shields heat conduction diaphragm |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206948812U true CN206948812U (en) | 2018-01-30 |
Family
ID=61357407
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720058681.6U Active CN206948812U (en) | 2017-01-17 | 2017-01-17 | Graphite-based shields heat conduction diaphragm |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206948812U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112837858A (en) * | 2020-05-18 | 2021-05-25 | 江苏东强股份有限公司 | Optical fiber temperature measurement power cable with uniform temperature electric field |
-
2017
- 2017-01-17 CN CN201720058681.6U patent/CN206948812U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112837858A (en) * | 2020-05-18 | 2021-05-25 | 江苏东强股份有限公司 | Optical fiber temperature measurement power cable with uniform temperature electric field |
| CN112837858B (en) * | 2020-05-18 | 2021-10-19 | 江苏东强股份有限公司 | Optical fiber temperature measurement power cable with uniform temperature electric field |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: No. 98 Wangting Street, Wangting Town, Xiangcheng District, Suzhou City, Jiangsu Province, 215100 Patentee after: Suzhou honglingda Electronic Technology Co.,Ltd. Country or region after: China Address before: Room 3, No. 245 Penglang Liushijing Road, Kunshan Development Zone, Suzhou City, Jiangsu Province, 215300 Patentee before: SUZHOU KANRONICS ELECTRONIC TECHNOLOGY Co.,Ltd. Country or region before: China |
|
| CP03 | Change of name, title or address |