CN206912120U - A kind of shaped device - Google Patents
A kind of shaped device Download PDFInfo
- Publication number
- CN206912120U CN206912120U CN201720695647.XU CN201720695647U CN206912120U CN 206912120 U CN206912120 U CN 206912120U CN 201720695647 U CN201720695647 U CN 201720695647U CN 206912120 U CN206912120 U CN 206912120U
- Authority
- CN
- China
- Prior art keywords
- guide pad
- wedge
- oxide
- semiconductor
- block
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Manufacturing Of Electrical Connectors (AREA)
Abstract
The utility model discloses a kind of shaped device,Including base,Support,Mounting seat,L-type handle,Connector,Depression bar,Guide pad,Lead,First upper holder block and wedge,It is arranged on base support vertical,Mounting seat is fixedly installed on the free end of support,Extension is provided with connecting portion and is hinged with a free end of L-type handle obliquely,The bending part of L-type handle is hinged with connector one end,One end of the connector other end and depression bar is hinged,Oblique lower extension is provided with a sleeve for being used to limit depression bar swing,The other end of depression bar is fixedly connected after passing through sleeve with guide pad,Guide pad and the lead being vertically set on base form kinematic pair,Wedge is fixedly installed on base,The upper surface of wedge is provided with the detent being used for,The one side of wedge is close to detent,Projection is provided with the side,First upper holder block is arranged on the lower surface of guide pad and its one side is provided with resigning groove,Wedge and the first upper holder block mutual cooperation bending metal-oxide-semiconductor pin.
Description
Technical field
It the utility model is related to the electronic applications such as television set, set top box, PCBA, computer, and in particular to a kind of N-
MOSFET pin forming processing unit (plant)s.
Background technology
In the industrial production, production high level and high-efficiency homework are maintained, would have to consider to act hand on production line
Whether method accomplishes simple, uniform.Three pin difference size bendings of metal-oxide-semiconductor at present are the methods using manual bending, by hand folding
The length of the curved pin bending that can cause metal-oxide-semiconductor is not accurate, adds working strength again, operating efficiency is low, it is necessary to be directed to this
More special pin processing mode takes tool to aid in, and improves a hour production capacity, simplifies operation gimmick, it is ensured that quality,
Facilitate the operation of back-end process.
Utility model content
The technical problems to be solved in the utility model is：A kind of shaped device is provided, to realize efficient bending metal-oxide-semiconductor three
Pin difference size, improve operating efficiency, it is ensured that quality.
To achieve these goals, the utility model adopts the technical scheme that：A kind of shaped device, for metal-oxide-semiconductor
Three pin difference size bendings, including base, support, mounting seat, L-type handle, connector, depression bar, guide pad, lead,
First upper holder block and wedge, the base is plate-like, is arranged on base the support vertical, the mounting seat fixed setting
There is extension and an oblique lower extension obliquely in the free end of support and the mounting seat, it is described to extend obliquely
Portion is provided with connecting portion and is hinged with a free end of L-type handle, and bending part and connector one end of the L-type handle are hinged, institute
The one end for stating the connector other end and depression bar is hinged, and the oblique lower extension is provided with a sleeve for being used to limit depression bar swing,
The other end of the depression bar is fixedly connected after passing through sleeve with guide pad, and the guide pad has extension and set on extension
There is guide cylinder, the guide cylinder and the lead being vertically set on base form kinematic pair, and the wedge is fixedly installed on bottom
On seat and positioned at the underface of guide pad, the upper surface of the wedge is provided with the detent for horizontal positioned metal-oxide-semiconductor, described
The one side of wedge is provided with the projection for being used for supporting metal-oxide-semiconductor middle pin close to detent on the side, on described first
Briquetting is arranged on the lower surface of guide pad and its one side is provided with resigning groove, the one side for being provided with projection of the wedge and the
The one side provided with resigning groove of one upper holder block cooperates can be in resigning groove with bending metal-oxide-semiconductor pin, the projection
Relative motion.
Further, including limited post, spring and the second upper holder block, the lower part of the limited post is through being arranged on guiding
It is fixedly connected after shoulder hole on block with the second upper holder block, the upper part of the limited post, which is provided with, is used for a spacing circle projection,
The raised diameter is more than the maximum gauge of the minimum diameter of the shoulder hole of guide pad and the shoulder hole less than guide pad, the bullet
Spring be enclosed on limited post and be directed to block and the second upper holder block extruding with so that the projection of limited post is limited in shoulder hole.Rolling over
During curved, because the body of metal-oxide-semiconductor does not have a stress, during the first upper holder block bending metal-oxide-semiconductor pin, metal-oxide-semiconductor discontinuity meeting
Tilt, be unfavorable for accurately bending metal-oxide-semiconductor pin, therefore, introduced the second upper holder block, in the also non-bending MOS of the first upper holder block
During pipe pin, the second upper holder block pushes metal-oxide-semiconductor body, and when the first briquetting bending metal-oxide-semiconductor pin, the second upper holder block is in spring
Metal-oxide-semiconductor body is tightly pushed down under reaction force, now metal-oxide-semiconductor uniform force, be not in tilt, so as to ensure accurate height
Effect ground bending metal-oxide-semiconductor pin.
Further, including limited block, the limited block are fixedly installed on guide pad provided with ladder hole and limited block
Upper surface, the raised diameter of the limited post upper part are more than the minimum diameter of the shoulder hole of limited block and less than limited blocks
The maximum gauge of shoulder hole, when the second upper holder block pushes metal-oxide-semiconductor, the ladder hole of the upper part of the limited post in limited block
In be moved upwardly until that the projection of limited post is limited block and blocked.This structure is to enter one in bending process to limit limited post
Step motion upwards, to ensure that the second upper holder block has enough forces to metal-oxide-semiconductor.
Compared with prior art, the beneficial effects of the utility model are：Metal-oxide-semiconductor is put into locating slot, metal-oxide-semiconductor draws
Pin extends sideways from wedge, wherein, the projection on wedge side is used for the rear part for supporting the middle pin of metal-oxide-semiconductor,
L-type handle is pulled down, depression bar promotes the first upper holder block to be moved towards wedge, and coordinates three pins of bending metal-oxide-semiconductor with wedge, due to
Pin portions among metal-oxide-semiconductor are by raised support, so the bending length of three pins of metal-oxide-semiconductor is different, so as to efficiently roll over
Curved three pin difference sizes of metal-oxide-semiconductor, improve operating efficiency, it is ensured that quality.
Brief description of the drawings
Fig. 1 show overall structure diagram of the present utility model.
Fig. 2 show the structural representation of the wedge in the utility model.
Fig. 3 show the structural representation of the guide pad in the utility model.
Fig. 4 show partial schematic diagram of the present utility model.
Wherein, base 1, support 2, mounting seat 3, L-type handle 4, connector 5, depression bar 6, guide pad 7, lead 8, first
Upper holder block 9, wedge 10.
Embodiment
Specific embodiment of the present utility model is described further below in conjunction with the accompanying drawings, so as to more be understood that this practicality
Where new creation point.
1 a kind of shaped device of embodiment, with reference to figure 1, for three pin difference size bendings of metal-oxide-semiconductor, including bottom
Seat 1, support 2, mounting seat 3, L-type handle 4, connector 5, depression bar 6, guide pad 7, lead 8, the first upper holder block 9 and wedge 10,
The base 1 is plate-like, and the support 2 is vertically disposed on base 1, and the mounting seat 3 is fixedly installed on the freedom of support 2
End（Pedestal upper end portion in Fig. 1）And the mounting seat 3 has oblique lower extension 3-2 of extension 3-1 and one obliquely,
The 3-1 of extension obliquely is provided with connecting portion and is hinged with a free end of L-type handle 4, another freedom of L-type handle 4
Hold and be used for manual operation, it is preferred that protective case is provided with this free end to protect operator, plastic sheath may be selected in protective case.
The bending part of the L-type handle 4 is hinged with the one end of connector 5, and one end of the other end of connector 5 and depression bar 6 is hinged, described
Oblique lower extension 3-2 is provided with a sleeve 3-3 for being used to limit depression bar swing, after the other end of the depression bar 6 passes through sleeve 3-3
It is fixedly connected with guide pad 7, the guide pad 7 has extension 7-3 and on extension 7-3 provided with guide cylinder 7-1, described to lead
Kinematic pair is formed to cylinder 7-1 and the lead 8 being vertically set on base 1, the wedge 10 is fixedly installed on base 1 and position
In the underface of guide pad 7, the upper surface of the wedge 10 is provided with the detent 10-1 for horizontal positioned metal-oxide-semiconductor, positioning
Groove 10-1 shape is coordinated with the body of metal-oxide-semiconductor, can be designed as the case may be, design principle is：Metal-oxide-semiconductor is placed on fixed
It is horizontal when in the groove 10-1 of position, the one side of the wedge 10 is provided with the side and is used for close to detent 10-1
The raised 10-2 of metal-oxide-semiconductor middle pin is supported, the one side of pin from the wedge 10 of metal-oxide-semiconductor extends, metal-oxide-semiconductor middle pin
It is partially supported upon on raised 10-2, first upper holder block 9 is arranged on the lower surface of guide pad 7 and its one side is recessed provided with stepping down
Groove 9-1, the one side provided with raised 10-2 of the wedge 10 and the one side provided with resigning groove 9-1 of the first upper holder block 9
Mutual cooperation can the relative motion in resigning groove 9-1 with bending metal-oxide-semiconductor pin, the raised 10-2.
In concrete application, the support 2 is formed by some endways panel combinations, but not limited to this structure, and the support 2 is logical
Screw is crossed on the base 1, the connector 5 is connecting rod and its both ends is provided with concavity connecting portion, the one of the connector 5
Concavity connecting portion is connected with the bending part axis hole of L-type handle 4, another concavity connecting portion of the connector 5 and one end of depression bar 6
Axis hole connects.
Reference picture 2, the top view of wedge 10, the wedge 10 shown in the figure are provided with base installing hole 10-3, utilize spiral shell
Nail is inserted into base installing hole, and wedge 10 is arranged on base 1.
Reference picture 3, the top view of guide pad 7, the guide pad 7 shown in the figure have two extension 7-3 and two
Guide cylinder 7-1, the guide cylinder 7-1 and two leads 8 being vertically set on base 1 are respectively equipped with individual extension 7-3
Kinematic pair is formed, to be more stably oriented to the direction of motion of simultaneously restricted guidance block.
Reference picture 4, the other end of the depression bar 6 are threaded mounting hole, wherein a bolt 15, which passes through, is arranged on guide pad
Threaded mounting hole after upper 7 mounting hole 7-4 and a top nut 16 with depression bar 6 tightens fixation, and adjusts top nut 16, top nut
16 and the tightly fixed guide block 7 of bolt 15.
Embodiment 2 is on the basis of embodiment 1, reference picture 4, and a kind of shaped device also includes limited post 14, spring 13
With the second upper holder block 12, the lower part of the limited post 14 is passed through after the shoulder hole 7-2 being arranged on guide pad 7 with being pressed on second
Block 12 is fixedly connected, and the upper part of the limited post 14, which is provided with, is used for a spacing raised 14-1 of circle, the diameter of the raised 14-1
The maximum gauge of minimum diameter more than the shoulder hole 7-2 of guide pad 7 and the shoulder hole 7-2 less than guide pad 7, the spring 13
It is enclosed on limited post 14 and is directed to the upper holder block 12 of block 7 and second and extrudes with so that the raised 14-1 of limited post 14 is limited in ladder
In the 7-2 of hole.In a particular application, there are two limited posts, 14, two springs 13, two limited posts 14 or so are arranged on second
On briquetting 12, two springs 13 are respectively fitted on two limited posts 14, are directed to the upper holder block 12 of block 7 and second and are extruded, guide pad 7
On be correspondingly provided with two shoulder hole 7-2 so that two limited posts move, with reference to figure 3.In bending process, due to metal-oxide-semiconductor
Body does not have a stress, and during the first upper holder block bending metal-oxide-semiconductor pin, metal-oxide-semiconductor discontinuity can tilt, and be unfavorable for accurately bending
Metal-oxide-semiconductor pin, therefore, the second upper holder block is introduced, in the first upper holder block also non-bending metal-oxide-semiconductor pin, under the second upper holder block
Metal-oxide-semiconductor body is pressed, when the first briquetting bending metal-oxide-semiconductor pin, the second upper holder block is tightly pressed under the reaction force of spring
Firmly metal-oxide-semiconductor body, now metal-oxide-semiconductor uniform force, is not in tilt, so as to ensure precisely efficiently bending metal-oxide-semiconductor pin.
Embodiment 3 is on the basis of embodiment 2, and with reference to figure 4, a kind of shaped device is including spacing, and 11, the limited block
11 are provided with the upper surface that ladder hole 11-1 and limited block 11 are fixedly installed on guide pad 7, and set-up mode is that mode connects for screw is fixed
Mode, the raised 14-1 of the upper part of limited post 14 diameter are more than the shoulder hole 11-1 of limited block 11 minimum diameter and small
In the shoulder hole 11-1 of limited block 11 maximum gauge, when the second upper holder block 12 pushes metal-oxide-semiconductor, the top of the limited post 14
Divide and be moved upwardly until that the projection of limited post 14 is limited block 11 and blocked in the ladder hole 11-1 of limited block 11.This structure is
Moved further up in bending process to limit limited post, to ensure that the second upper holder block has enough apply to metal-oxide-semiconductor
Power.
The course of work, metal-oxide-semiconductor is put into locating slot, pin the extending sideways from wedge of metal-oxide-semiconductor, wherein,
Projection on wedge side is used for the rear part for supporting the middle pin of metal-oxide-semiconductor, pulls down L-type handle, and depression bar promotes presses on first
Block moves towards wedge, and coordinates three pins of bending metal-oxide-semiconductor with wedge, because the pin portions among metal-oxide-semiconductor are by projection branch
Support, so the bending length of three pins of metal-oxide-semiconductor is different, it is achieved thereby that the purpose of this utility model.
Preferred embodiment of the present utility model is the foregoing is only, it is all at this not to limit the utility model
All any modification, equivalent and improvement made within the spirit and principle of utility model etc., should be included in the utility model
Protection domain within.
Claims (4)
- A kind of 1. shaped device, for three pin difference size bendings of metal-oxide-semiconductor, it is characterised in that including base, support, Mounting seat, L-type handle, connector, depression bar, guide pad, lead, the first upper holder block and wedge, the base is plate-like, described It is arranged on base, the mounting seat is fixedly installed on the free end of support and the mounting seat is oblique with one support vertical Portion and an oblique lower extension are upwardly extended, the extension obliquely is provided with connecting portion and cut with scissors with a free end of L-type handle Connect, bending part and connector one end of the L-type handle are hinged, and one end of the connector other end and depression bar is hinged, described Oblique lower extension is provided with a sleeve for being used to limit depression bar swing, and the other end of the depression bar is consolidated after passing through sleeve with guide pad Surely connect, the guide pad has extension and guide cylinder is provided with extension, and the guide cylinder is with being vertically set on base On lead form kinematic pair, the wedge is fixedly installed on base and positioned at the underface of guide pad, the wedge Upper surface is provided with the detent for horizontal positioned metal-oxide-semiconductor, and the one side of the wedge is close to detent, on the side Provided with the projection for supporting metal-oxide-semiconductor middle pin, first upper holder block is arranged on the lower surface of guide pad and its one side Provided with resigning groove, the one side provided with resigning groove for being provided with raised one side and the first upper holder block of the wedge is mutual Cooperation can the relative motion in resigning groove with bending metal-oxide-semiconductor pin, the projection.
- 2. a kind of shaped device as claimed in claim 1, it is characterised in that including limited post, spring and the second upper holder block, institute State limited post lower part pass through the shoulder hole that is arranged on guide pad after be fixedly connected with the second upper holder block, the limited post Upper part is raised provided with a spacing circle is used for, and the raised diameter, which is more than the minimum diameter of the shoulder hole of guide pad and is less than, leads To the maximum gauge of the shoulder hole of block, the spring housing is on limited post and is directed to block and the extruding of the second upper holder block with so that limiting The projection of position post is limited in shoulder hole.
- 3. a kind of shaped device as claimed in claim 2, it is characterised in that including limited block, the limited block is provided with ladder Through hole and limited block are fixedly installed on the upper surface of guide pad, and the raised diameter of the limited post upper part is more than limited block The minimum diameter of shoulder hole and the maximum gauge for being less than the shoulder hole of limited block, when the second upper holder block pushes metal-oxide-semiconductor, the limit The upper part of position post is moved upwardly until that the projection of limited post is limited block and blocked in the ladder hole of limited block.
- A kind of 4. shaped device as described in claim 1 or 2, it is characterised in that the connector be connecting rod and its two End is provided with concavity connecting portion, and a concavity connecting portion of the connector is connected with the bending part axis hole of L-type handle, the connector Another concavity connecting portion and depression bar the connection of one end axis hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720695647.XU CN206912120U (en) | 2017-06-15 | 2017-06-15 | A kind of shaped device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720695647.XU CN206912120U (en) | 2017-06-15 | 2017-06-15 | A kind of shaped device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206912120U true CN206912120U (en) | 2018-01-23 |
Family
ID=61314337
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720695647.XU Active CN206912120U (en) | 2017-06-15 | 2017-06-15 | A kind of shaped device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206912120U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112719130A (en) * | 2020-12-11 | 2021-04-30 | 张健 | Angle shaping device |
-
2017
- 2017-06-15 CN CN201720695647.XU patent/CN206912120U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112719130A (en) * | 2020-12-11 | 2021-04-30 | 张健 | Angle shaping device |
| CN112719130B (en) * | 2020-12-11 | 2022-02-22 | 张健 | Angle shaping device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN201126760Y (en) | Capacitor feet-regulating apparatus | |
| CN204935034U (en) | Body alignment pin integrated press-mounting fixture | |
| CN206466807U (en) | Thread clamping mechanism and wire-sending device | |
| CN206912120U (en) | A kind of shaped device | |
| CN107088629B (en) | Outdoor iron tower of power transmission line builds the straightening, cutting device of middle reinforcing bar | |
| CN207615557U (en) | A kind of axial lead component forming frock | |
| CN208825248U (en) | A kind of the tab apparatus for bending and tab bending system of power battery | |
| CN207900082U (en) | A kind of axial diode pin bending device | |
| CN206966830U (en) | A kind of circuit board crosses Wave soldering fixture | |
| CN102489630A (en) | Omnidirectional electronic component pin bending device | |
| CN103594903A (en) | Wire compression jointing work platform | |
| CN202479398U (en) | Comprehensive calipers for electronic component | |
| CN215812919U (en) | Automatic pulling and inserting intelligent jig structure | |
| CN214044281U (en) | High-layer-number ultra-thick circuit board multi-row connector through hole welding equipment | |
| CN213889660U (en) | Clamping device is used in machine parts production | |
| CN218195143U (en) | Marking device convenient to adjust | |
| CN215391942U (en) | Material stripping device for punching electric iron accessories | |
| CN204012128U (en) | A kind of universal crimping tool for cable nose | |
| CN212968462U (en) | Wire harness crimping device for aircraft manufacturing | |
| CN220992655U (en) | High-efficient intramedullary nail mould of bending | |
| CN202406457U (en) | Electronic component caliper for component inserter | |
| CN212734763U (en) | Power strip terminal line welding frock | |
| CN217223972U (en) | Earphone amplifier circuit board welding jig | |
| CN216679985U (en) | Positioning and cutting device for wire and cable processing | |
| CN210966457U (en) | Quick type shackle shape correcting device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |