CN206909022U - Heat radiator of electronic element - Google Patents
Heat radiator of electronic element Download PDFInfo
- Publication number
- CN206909022U CN206909022U CN201720697324.4U CN201720697324U CN206909022U CN 206909022 U CN206909022 U CN 206909022U CN 201720697324 U CN201720697324 U CN 201720697324U CN 206909022 U CN206909022 U CN 206909022U
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- Prior art keywords
- substrate
- heat radiator
- electronic
- spring
- electronic element
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Abstract
A kind of heat radiator of electronic element, temperature of the electronic component in running can be reduced, and reduce influence of the vibration to electronic component.The heat radiator of electronic element is fixed on an electronic building brick, and the electronic building brick includes a substrate and an electronic component；The heat radiator of electronic element includes：One radiating seat, at least a bottom plate, positioning piece and at least one first spring；When the heat radiator of electronic element is used on above-mentioned electronic building brick, the radiating seat is arranged on the electronic component；The bottom plate is located at the substrate；The keeper screws togather through the radiating seat and the substrate with the bottom plate；First spring is located between the keeper and the radiating seat；Thereby, the bottom plate disperses the substrate vibrational energy and first spring absorbs vibrational energy, causes the risk of damage to reduce electronic component because of vibration.
Description
Technical field
The utility model is relevant with cooling mechanism；Particularly relate to a kind of applicable heat radiator of electronic element of electronic building brick.
Background technology
Various electronic equipment, common computer, data switching exchane, sound equipment etc. in every daily life, in operation
In can produce the electronic component that the heat energy of varying degree, particularly electronic building brick include progress high-speed computation in need, such as：
Central processing unit (CPU) or painting processor (GPU) etc., substantial amounts of heat energy can be produced in computing.These heat energy repertories are in electricity
In sub- equipment, electronic equipment bulk temperature is raised, not only significantly influence the efficiency of electronic component, can also reduce electronic building brick
Stability and function.
To avoid high heat affecting electronic equipment from running, it will usually install a heat abstractor on electronic component.Heat abstractor
Caused air-flow when being rotated by fan, the heat energy that chip is produced are taken away, and reach the function of reducing electronic building brick temperature.
Although existing heat abstractor solves the problems, such as that heat energy repertory in electronic equipment, spreads out caused by electronic component
Bear another problem -- vibration.The fan vibration adjoint when rotating, heat abstractor is set to produce electronic component unequal
Pressure, ultimately result in electronic component rupture, damage, cause electronic building brick to lose function.
In addition to the vibration caused by heat abstractor, the substrate that electronic component is located at may also be shaken by other factors
Move, rock, it is related to move up and down electronic component, also result in and unequal pressure is produced between electronic component and heat abstractor
Power, and then detract the service life of electronic component.
In addition, existing heat abstractor is locked on the substrate of electronic building brick with positioning piece, heat energy can be produced to press close to
Electronic component, but contact area when keeper is locked in substrate between substrate is small, causes to bear pressure at substrate locking
Greatly, substrate damage is caused.
Utility model content
In view of this, the purpose of this utility model is to provide a kind of heat radiator of electronic element, can reduce electronic component
Temperature in running, and reduce influence of the vibration to electronic component.
Another object of the present utility model is to provide a kind of heat radiator of electronic element, when can reduce heat abstractor interlocking
Damage to the substrate of electronic building brick.
In order to reach above-mentioned purpose, a kind of heat radiator of electronic element provided by the utility model, an electronics group is fixed on
On part, the electronic building brick includes：One substrate and an electronic component, the wherein substrate have mutually back to one first side and one the
Two sides, and the electronic component is fixed on the first side of the substrate；The heat radiator of electronic element includes：One radiating seat, tool
There is at least one perforation run through；One bottom plate, in tabular and there is an at least screw；At least positioning piece, there is thread segment；With
And at least one first spring；Thereby, when the heat radiator of electronic element is used on above-mentioned electronic building brick, the radiating seat is sticked
In on the electronic component；The keeper through the radiating seat perforation and the substrate, and with located at the bottom of the side of substrate second
The screwhole spiro bonding of plate；At least one first spring is located between the keeper and the radiating seat.
In one embodiment, the perforation has one first hole section and one second hole section, and wherein the first hole section internal diameter is more than
The second hole section internal diameter, and first hole section forms a terrace with the second hole section junction；First spring is butted on the terrace.
In one embodiment, the keeper has a blocking part；Above-mentioned electronics is used in the heat radiator of electronic element
When on component, the blocking part is located between the radiating seat and the substrate, and the blocking part is butted on the first side of the substrate.
In one embodiment, the keeper is arranged with an annular groove；The heat radiator of electronic element also includes an abutment,
The abutment is equipped in the annular groove and forms another blocking part.
In one embodiment, the keeper has another blocking part；When the keeper does not lock in the bottom plate, this is another to support
Stopper is butted on the radiating seat.
In one embodiment, the keeper is arranged with an annular groove；The heat radiator of electronic element also includes an abutment,
The abutment is equipped in the annular groove and forms another blocking part.
In one embodiment, a second spring is also included；Above-mentioned electronics group is used in the heat radiator of electronic element
When on part, the second spring is located between the radiating seat and another blocking part.
In one embodiment, the heat radiator of electronic element also includes one the 3rd spring；Filled in the electronic element radiating
Put when being used on above-mentioned electronic building brick, the 3rd spring is located between the substrate and the bottom plate.
In one embodiment, a second spring is also included；Above-mentioned electronics group is used in the heat radiator of electronic element
When on part, the second spring is located between the substrate and the bottom plate.
In one embodiment, the bottom plate has one first and at least one second；This first is connected to the substrate, and
With a perforate run through；Second one end is connected in the local peritreme of the perforate, and has the screw.
Effect of the present utility model is the vibration for disperseing the substrate by the bottom plate, reduce vibration reach the radiating seat with
Contact surface between electronic component, to reach the risk for reducing electronic component and causing because of vibration to rupture, damage.
It is of the present utility model further effect is that by bottom plate and substrate large contact area, can reduce the keeper lock
To the infringement caused by substrate when being fixed in substrate.
Brief description of the drawings
Fig. 1 is the schematic diagram of the preferred embodiment of the utility model first.
Fig. 2 is the schematic diagram of the preferred embodiment of the utility model second.
Fig. 3 is the schematic diagram of the preferred embodiment of the utility model the 3rd.
Fig. 4 is the schematic diagram of the preferred embodiment of the utility model the 4th.
Fig. 5 is the schematic diagram of the preferred embodiment of the utility model the 5th.
Fig. 6 is the schematic diagram of the preferred embodiment of the utility model the 6th.
Fig. 7 is the schematic diagram of the preferred embodiment of the utility model the 7th.
【Main element】
1 electronic building brick
2 substrates
The first sides of 2a the second sides of 2b 2c perforates
3 electronic components
100th, 200,300,400,500,600,700 heat radiator of electronic element
10 radiating seats
10a 12 first the first hole sections of side 12a of perforation
The terrace of 14 second the second hole sections of side 14a 16
20 radiating glue-lines
30th, 30 ' bottom plate
30a screw 30b perforates 32 first
34 second
40 keepers
The blocking part of 42 convex portion, 44 first blocking part 46 second
50th, 50 ' first spring
60th, 60 ', 60 " second spring
70 the 3rd springs
80 housings
81 lug boss 81a screw 81b perforates
812 first 814 second
Embodiment
For the utility model can be illustrated more clearly that, now lifts multiple preferred embodiments and coordinate accompanying drawing to describe in detail as after.
It refer to shown in Fig. 1, be the heat radiator of electronic element 100 of the utility model first preferred embodiment, for being used in an electronics
On component 1, wherein the electronic building brick 1 includes：One substrate 2 and an electronic component 3, the wherein substrate 2 have mutually back to one
First side 2a and one second side 2b, with least one perforation 2c for running through the substrate 2.The electronic component 3 is fixed on the of the substrate 2
On the 2a of side, and heat energy can be produced in running, such as：Central processing unit or painting processor etc., but this is not limited to, the electricity
Subcomponent heat abstractor 100 is to reduce temperature of the electronic component 3 in running, to maintain the efficiency of electronic component 3.
The heat radiator of electronic element 100 includes a radiating seat 10, one radiating glue-line 20, a bottom plate 30, positioning piece
40 and one first spring 50.The radiating seat 10 have mutually back to one first side 12 and one second side 14, and one is scattered through this
The perforation 10a (perforation i.e. defined in the utility model) of hot seat 10, the radiating seat 10 are attached at the electronic component 3, and should
A radiating glue-line 20 is scribbled between second side 14 of radiating seat 10 and the electronic component 3, to fill up the electronic component 3 and the radiating
10 intermediate gaps of seat, help thermal energy conduction to the radiating seat 10 certainly, in one embodiment, also can be without radiating glue-line 20, and this dissipates
Second side 14 of hot seat 10 also can directly be butted on electronic component 3.
The perforation 10a of the radiating seat 10 has a first hole section 12a close to first side 12 and close second side 14
The second hole section 14a, wherein first hole section 12a internal diameter is more than second hole section 14a internal diameter, and first hole section 12a
A terrace 16 is formed with the second hole section 14a junctions.
The bottom plate 30 is in tabular and has an at least screw 30a.In the present embodiment, the bottom plate 30 passes through the screw
30a is affixed with the keeper 40, and is installed in the second side 2b of the substrate.
There is the keeper 40 thread segment and end to be provided with a convex portion 42, also, the keeper 40 is from the of the radiating seat 10
Side 12 screws togather through perforation 10a and the perforation 2c of the substrate 2 with the screw 30a of the bottom plate 30；The convex portion 42 is located at should
Perforate in 10a the first hole section 12a, and the external diameter of the convex portion 42 is more than second hole section 14a internal diameter.
The keeper 40 has two blocking parts, respectively one first blocking part 44 and one second blocking part 46, and this first
Blocking part 44 and second blocking part 46 are located between the radiating seat 10 and the substrate 2, wherein, first blocking part 44 is located at should
Between radiating seat 10 and second blocking part 46, and the external diameter of the first blocking part 44 is more than second hole section 14a internal diameter.At this
In embodiment, the keeper 40 is arranged with an annular groove, the heat radiator of electronic element 100 also include an abutment (such as：C
Shape ring), and the abutment is equipped in the annular groove and forms first blocking part 44.
The external diameter of second blocking part 46 is more than the perforation 2c of the substrate 2 internal diameter, and second blocking part 46 be located at this
Between one blocking part 44 and the substrate 2.When the keeper 40 is locked in the bottom plate 30, the second blocking part 46 is butted on the substrate 2
The first side 2a, to avoid the depth that the keeper 40 locks in the bottom plate 30 too deep, cause the radiating seat 10 urgent in the electronics
Part 3, and cause electronic component 3 to damage.
First spring 50 is located between the keeper 40 and the radiating seat 10, and the both ends of the first spring 50 are butted on respectively
The convex portion 42 of the keeper 40 and the terrace 16, make first spring 50 be located in first hole section 12a.
The external diameter of the first blocking part 44 of the keeper 40 is more than second hole section 14a internal diameter, makes the keeper 40 unlocked
When the bottom plate 30, first blocking part 44 can be butted on the second side 14 of the radiating seat 10, to avoid the keeper 40 because in lock
Gu first spring 50 is extruded during, and first spring 50 restores to the original state when removing external force, is caused the keeper 40
Release the perforation 10a of the radiating seat 10.
In use, bottom plate 30 not only can support substrate 2 to heat radiator of electronic element 100, and can disperse substrate 2 and shake
Energy, the contact surface that vibration reaches the radiating seat 10 (or the radiating glue-line 20) and electronic component 3 is reduced, reduces the radiating seat
10 is poor with relative displacement of the electronic component 3 in the second side 14.In other words, electronic component 3 is produced not by reduction radiating seat 10
Impartial pressure, to reach the risk for reducing electronic component 3 and causing because of vibration to rupture, damage.
Again because the contact area of bottom plate 30 and substrate 2 is big, to this when the dispersible keeper 40 is locked in the bottom plate 30
Pressure caused by substrate 2, reduce to the infringement caused by the substrate 2.
First spring 50 can absorb vibrational energy and produces deformation, also reduces vibration and reaches the radiating seat 10 (or this dissipates
Hot glue layer 20) with the contact surface of electronic component 3, reduce electronic component 3 and damaged caused by vibration.
Radiating seat 10 is combined fixation, but is not limited by the present embodiment with a keeper 40 with substrate 2, bottom plate 30
System, also multiple keepers 40 and the first spring 50 of relative populations can be used to wear the radiating seat 10 respectively and be located at electronics group
It on part 1, can not only increase the fixed effect of radiating seat 10, acceleration of the electronic component 3 in vibration can more be less than and uses
The acceleration that single fixture 40 is fixed is small, and in other words, the first spring 50 using multiple keepers 40 and relative populations is matched somebody with somebody
Close use and can reach preferable effectiveness in vibration suppression.
In order to reach more preferably effectiveness in vibration suppression, heat radiator of electronic element also has following a variety of embodiment, with enhancing
The function of vibrational energy is absorbed, reaching reduces the risk that electronic component 3 causes to rupture, damage because of vibration.
See shown in Fig. 2 to Fig. 4, the respectively heat radiator of electronic element of the preferred embodiment of the utility model the second to four
200th, 300,400, using multiple springs to increase absorption vibrational energy.
As shown in Fig. 2 the heat radiator of electronic element 200 of the present embodiment, include the electricity of above-mentioned first preferred embodiment
Subcomponent heat abstractor 100, also include a second spring 60.The second spring 60 can be located at the radiating seat 10 with this first
Between blocking part 44；Or such as Fig. 3, in the heat radiator of electronic element 300 of third preferred embodiment, the second spring 60 '
Between the substrate 2 and the bottom plate 30；Suppression or, as shown in figure 4, the heat radiator of electronic element 400 is except including position
The first spring 50 between the keeper 40 and the radiating seat 20, between the radiating seat 10 and first blocking part 44
Second spring 60, also include one the 3rd spring 70, the 3rd spring 70 is located between the substrate 2 and the bottom plate 30.
Above-mentioned the first spring 50, second spring 60,60 ' and the 3rd spring 70 is not limited by taking wire spring as an example
System, please as shown in Figure 5, it is disclosed as the heat radiator of electronic element 500 that the utility model is the 5th preferred embodiment, central the
One spring 50 ', second spring 60 " are ware shape spring, also can be other kinds of spring certainly, such as：Wave spring, shell fragment bullet
Spring, helical spring ... etc., as long as using part made of the elastic reaction of material, and can stretch under external force
It is long, shorten, bending, the deformation such as reverse, remove after external force again can the person of reinstatement, all can reach the effect for absorbing vibrational energy,
Not using above-mentioned spring as limitation.
Please as shown in Figure 6, the heat radiator of electronic element 600 of the preferred embodiment of the utility model the 6th is disclosed as, it is similar
In the heat radiator of electronic element 100 of the utility model first preferred embodiment, can be installed in a housing 80, unlike：
Heat radiator of electronic element 600 has no independent bottom plate, but strikes out a lug boss 81 towards the electronic component with housing 80
Heat abstractor 600 simultaneously forms the bottom plate, and the interlocking of keeper 40 is in the screw 81a of the lug boss 81.
It refer to shown in Fig. 7, be disclosed as the heat radiator of electronic element 700 of the preferred embodiment of the utility model the 7th, class
The heat radiator of electronic element 600 of above-mentioned 6th preferred embodiment is similar to, unlike：The lug boss 81 has one first
812 and one second 814, this first 812 is connected to the substrate 2, and has a perforate 81b run through；This second 814
One end is connected in perforate 81b local peritreme, and has screw 81a.
The housing 80 of the present embodiment can be made by plastics or metal, such as：Iron, aluminium etc., because plastics and metal can bullets
Property deformation, also, the keeper 40 is locked in this second 814, therefore when the vibration of radiating seat 10 reaches the shell by keeper 40
During the lug boss 81 of body 80, this second 814 absorbs vibrational energy and produces deformation, and when vibration disappearance, then this second
814 states returned back to before producing deformation.This second 814 absorb vibrational energy equally can reach reduce the radiating seat 10 with
The relative displacement of electronic component 3 is poor, reduce electronic component 3 because vibration and caused by damage.Similarly, this second 814, this is fixed
The quantity also visual increase in demand setting of position part 40 and first spring 50, is fixed on increasing heat radiator of electronic element 600
The effect of electronic building brick 1.
It the foregoing is only the preferred possible embodiments of the utility model, every application the utility model specification and power
The equivalence changes that sharp claim is done, it ought to be included in the scope of the claims of the present utility model.
Claims (9)
1. a kind of heat radiator of electronic element, being fixed on an electronic building brick, the electronic building brick includes：One substrate and an electronics
Part, the wherein substrate have mutually back to one first side and one second side, and the electronic component is fixed on the first of the substrate
On side；The heat radiator of electronic element includes：
One radiating seat, there is at least one perforation run through；
One bottom plate, in tabular and there is an at least screw；
At least positioning piece, there is thread segment；And
At least one first spring；
Thereby, when the heat radiator of electronic element is used on above-mentioned electronic building brick, the radiating seat is attached at the electronic building brick
On；The keeper through the radiating seat perforation and the substrate, and with the screwhole spiro bonding of the bottom plate located at the side of substrate second；
At least one first spring is located between the keeper and the radiating seat.
2. heat radiator of electronic element as claimed in claim 1, the wherein perforation have one first hole section and one second hole section,
Wherein the first hole section internal diameter is more than the second hole section internal diameter, and first hole section forms single order with the second hole section junction
Face；First spring is butted on the terrace.
3. heat radiator of electronic element as claimed in claim 1, the wherein keeper have a blocking part；In the electronic component
When heat abstractor is used on above-mentioned electronic building brick, the blocking part is located between the radiating seat and the substrate, and the blocking part is supported
In the first side of the substrate.
4. heat radiator of electronic element as claimed in claim 3, the wherein keeper have another blocking part；In the keeper
When not locking in the bottom plate, another blocking part is butted on the radiating seat.
5. heat radiator of electronic element as claimed in claim 4, the wherein keeper are arranged with an annular groove；The electronic component dissipates
Thermal also includes an abutment, and the abutment is equipped in the annular groove and forms another blocking part.
6. heat radiator of electronic element as claimed in claim 4, also include a second spring；Filled in the electronic element radiating
Put when being used on above-mentioned electronic building brick, the second spring is located between the radiating seat and another blocking part.
7. heat radiator of electronic element as claimed in claim 6, also include one the 3rd spring；Filled in the electronic element radiating
Put when being used on above-mentioned electronic building brick, the 3rd spring is located between the substrate and the bottom plate.
8. heat radiator of electronic element as claimed in claim 4, also include a second spring；Filled in the electronic element radiating
Put when being used on above-mentioned electronic building brick, the second spring is located between the substrate and the bottom plate.
9. heat radiator of electronic element as claimed in claim 1, the wherein bottom plate have one first and at least one second；
This first is connected to the substrate, and has a perforate run through；Second one end is connected in the local peritreme of the perforate,
And there is the screw.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720697324.4U CN206909022U (en) | 2017-06-15 | 2017-06-15 | Heat radiator of electronic element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720697324.4U CN206909022U (en) | 2017-06-15 | 2017-06-15 | Heat radiator of electronic element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206909022U true CN206909022U (en) | 2018-01-19 |
Family
ID=61284660
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720697324.4U Expired - Fee Related CN206909022U (en) | 2017-06-15 | 2017-06-15 | Heat radiator of electronic element |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206909022U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110876249A (en) * | 2018-09-04 | 2020-03-10 | 宏碁股份有限公司 | Electronic assembly |
-
2017
- 2017-06-15 CN CN201720697324.4U patent/CN206909022U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110876249A (en) * | 2018-09-04 | 2020-03-10 | 宏碁股份有限公司 | Electronic assembly |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180119 Termination date: 20190615 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |