CN206901306U - A kind of device of vacuum suction wafer - Google Patents

A kind of device of vacuum suction wafer Download PDF

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Publication number
CN206901306U
CN206901306U CN201720861580.2U CN201720861580U CN206901306U CN 206901306 U CN206901306 U CN 206901306U CN 201720861580 U CN201720861580 U CN 201720861580U CN 206901306 U CN206901306 U CN 206901306U
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CN
China
Prior art keywords
vacuum
wafer
control valve
pneumatic control
compressor machine
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Active
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CN201720861580.2U
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Chinese (zh)
Inventor
彭逆舟
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Chengdu Hiwafer Technology Co Ltd
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Chengdu Hiwafer Technology Co Ltd
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Priority to CN201720861580.2U priority Critical patent/CN206901306U/en
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Abstract

The utility model discloses a kind of device of vacuum suction wafer, including air compressor machine, wafer tray, vavuum pump, pneumatic control valve, pneumatic control valve includes factory service vacuum incoming end, pneumatic actuator end, wafer adsorption end, factory service vacuum incoming end is connected by the first vacuum hose with vavuum pump, pneumatic actuator end is connected by the second vacuum hose with the gas outlet of air compressor machine, as the power of pneumatic actuator to drive the valve body of pneumatic control valve, wafer adsorption end is connected the compressed air of air compressor machine by the 3rd vacuum hose with wafer tray.The utility model instead of traditional vacuum generator using pneumatic control valve, it is that pneumatic control valve imports factory service vacuum by vavuum pump, the valve switch of pneumatic control valve is controlled by compressed air, this device can produce bigger negative pressure of vacuum, so as to firmly adsorb the wafer for having certain angularity after bonding technology.

Description

A kind of device of vacuum suction wafer
Technical field
It the utility model is related to field of semiconductor processing, and in particular to a kind of device with vacuum suction wafer.
Background technology
Current wafer adsorption vacuum system, including CDA magnetic valves, vacuum generator, wafer adsorption pallet.CDA electromagnetism Valve is the part for controlling CDA break-makes, and make-and-break signal is sent by master controller;Vacuum generator is quickly produced using CDA as condition Vacuum;Wafer adsorption pallet is the physical support for adsorbing wafer, and it is connected with vacuum generator by a vacuum hose.CDA Magnetic valve, empty generator and wafer adsorption pallet form a stable vacuum system, and wafer is adsorbed in wafer support On disk, it is ensured that for pallet when high speed rotates, wafer will not produce movement, or even come off, and ensure that technique is normally carried out.It is existing Vacuum generator can also produce more than 0.7Bar negative pressure, and such negative pressure can be adsorbed for the silicon chip of standard, but for The wafer after bonding technology is taken, because warpage becomes big, pull of vacuum is insufficient for adsorption conditionses caused by vacuum generator, There is vacuum deficiency alarm in board, and the situation so as to scrap occurs coming off because of vacuum deficiency in wafer.
Utility model content
The purpose of this utility model is to provide a kind of device of vacuum suction wafer, filled with solving existing wafer adsorption Put in adsorption process because negative pressure of vacuum deficiency causes the caducous problem of wafer.
Reach above-mentioned technical purpose, a kind of dress of vacuum suction wafer provided by the utility model to solve technical problem Put, including air compressor machine, wafer tray, it is characterised in that:Also include vavuum pump, pneumatic control valve, the pneumatic control valve includes Factory service vacuum incoming end, pneumatic actuator end, wafer adsorption end, the factory service vacuum incoming end by the first vacuum hose with The vavuum pump connection, the pneumatic actuator end are connected by the second vacuum hose with the gas outlet of the air compressor machine, institute The compressed air of air compressor machine is stated as the power of pneumatic actuator to drive the valve body of the pneumatic control valve, the crystalline substance Circle absorption end is connected by the 3rd vacuum hose with the wafer tray.
Further, the air pressure of compressed air caused by the air compressor machine is in more than 5.0Bar.
Further, the air pressure of factory service vacuum caused by the vavuum pump is less than -0.8Bar.
Further, the model F-AVP125-1W of the pneumatic control valve.
Compared with prior art, the beneficial effects of the utility model are:
(1) traditional vacuum generator instead of using pneumatic control valve, is that pneumatic control valve imports factory by vavuum pump Business vacuum, so as to firmly adsorb wafer after bonding;Retain the air compressor machine of former vacuum system, compressed caused by air compressor machine Power gas source of the air as pneumatic control valve, to control the valve body of pneumatic control valve, so as to control valve open or Close, be increased without new driving source of the gas.
(2) for the air pressure of compressed air caused by air compressor machine in more than 5.0Bar, can produce bigger power makes pneumatic control Faster, valve switch is more smooth, in this manner it is ensured that the normal break-make of factory service vacuum for the speed that the valve of valve is opened.
(3) air pressure of factory service vacuum caused by vavuum pump is less than -0.8Bar, so can firmly adsorb the wafer after bonding Piece.
(4) model F-AVP125-1W pneumatic control valve, the diameter of the gas outlet of its control valve is at 1/4 inch or 3/8 Inch, it can be ensured that enough vacuum in pneumatic control valve.
Brief description of the drawings
Accompanying drawing of the present utility model is used for providing further understanding of the present application, the part of the application is formed, at this Same or analogous part is represented using identical reference number in a little accompanying drawings, in the accompanying drawings:
Fig. 1 is external connection schematic diagram of the present utility model;
The mark of accompanying drawing for:1- air compressor machines, the vacuum hoses of 2- second, 3- vavuum pumps, the vacuum hoses of 4- first, 5- are pneumatically controlled Valve processed, the vacuum hoses of 6- the 3rd, 7- wafer trays.
Embodiment
To make the purpose, technical scheme and advantage of the application clearer, below in conjunction with drawings and the specific embodiments, to this Application is described in further detail, and the schematic description and description of the application is used to explain the application, composition pair The improper restriction of the application.
A kind of device of vacuum suction wafer, including vavuum pump 3, air compressor machine 1, wafer tray 7, pneumatic control valve 5, pneumatically Control valve 5 includes factory service vacuum incoming end, pneumatic actuator end, wafer adsorption end, and factory service vacuum incoming end is true by first Empty flexible pipe 4 is connected with vavuum pump 3, and pneumatic actuator end is connected by the second vacuum hose 2 with the gas outlet of air compressor machine 1, empty As the power of pneumatic actuator to drive the valve body of pneumatic control valve 5, wafer adsorption end leads to the compressed air of press 1 The 3rd vacuum hose 6 is crossed to connect with wafer tray 7.
Wherein, the matching size of the diameter of the first vacuum hose 4 and the factory service vacuum incoming end of pneumatic control valve 5 closes, and keeps away Exempt from gas leakage, the diameter of the second vacuum hose 2 closes with the gas outlet matching size of air compressor machine 1, avoids gas leakage;3rd vacuum hose 6 The wafer adsorption end matching size of diameter and pneumatic control valve 5 close, avoid gas leakage.The both ends of first vacuum hose 4 and vacuum The connected mode of pump 3 and pneumatic control valve 5, the both ends of the second vacuum hose 2 and the connection side of air compressor machine 1 and pneumatic control valve 5 The connected mode of formula, the both ends of the 3rd vacuum hose 6 and pneumatic control valve 5 and wafer tray 7 is the industry in the prior art Generic way, it is not described here in detail.
In use, the break-make of compressed air caused by air compressor machine 1 determines the break-make of vacuum in pneumatic control valve 5, compression When air is opened, the valve of pneumatic control valve 5 is opened, and factory service vacuum caused by vavuum pump 3 connects by valve and with wafer tray 7 It is logical, so as to adsorb wafer;When compressed air disconnects, the valve for moving control valve 5 is closed, and factory service vacuum caused by vavuum pump 3 is not It can be disconnected by valve vacuum, so as to put down wafer.
As a kind of advantageous measure of the present embodiment, the air pressure of compressed air caused by air compressor machine 1 is more than 5.0Bar.
As a kind of advantageous measure of the present embodiment, the air pressure of factory service vacuum is less than -0.8Bar caused by vavuum pump 3.
The present embodiment describes more specific and detailed, also gives some advantageous measures of embodiment, still, the implementation Example and advantageous measure can not be used as to limitation of the present utility model, when those skilled in the art sees the program, made Other deformations and the replacement of equivalent arrangements, all should be within the scope of protection of the utility model.

Claims (4)

1. a kind of device of vacuum suction wafer, including air compressor machine, wafer tray, it is characterised in that:Also including vavuum pump, pneumatically Control valve, the pneumatic control valve include factory service vacuum incoming end, pneumatic actuator end, wafer adsorption end, and the factory service is true Empty incoming end is connected by the first vacuum hose with the vavuum pump, the pneumatic actuator end by the second vacuum hose with The gas outlet connection of the air compressor machine, the compressed air of the air compressor machine is as the power of pneumatic actuator to drive the gas The valve body of dynamic control valve, the wafer adsorption end is connected by the 3rd vacuum hose with the wafer tray.
A kind of 2. device of vacuum suction wafer according to claim 1, it is characterised in that:Pressed caused by the air compressor machine The air pressure of contracting air is more than 5.0Bar.
A kind of 3. device of vacuum suction wafer according to claim 1, it is characterised in that:Factory caused by the vavuum pump The air pressure of business vacuum is less than -0.8Bar.
A kind of 4. device of vacuum suction wafer according to claim 1, it is characterised in that:The type of the pneumatic control valve Number it is F-AVP125-1W.
CN201720861580.2U 2017-07-14 2017-07-14 A kind of device of vacuum suction wafer Active CN206901306U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201720861580.2U CN206901306U (en) 2017-07-14 2017-07-14 A kind of device of vacuum suction wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201720861580.2U CN206901306U (en) 2017-07-14 2017-07-14 A kind of device of vacuum suction wafer

Publications (1)

Publication Number Publication Date
CN206901306U true CN206901306U (en) 2018-01-19

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201720861580.2U Active CN206901306U (en) 2017-07-14 2017-07-14 A kind of device of vacuum suction wafer

Country Status (1)

Country Link
CN (1) CN206901306U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111613566A (en) * 2020-05-29 2020-09-01 北京工业大学 Ultra-thin wafer transfer device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111613566A (en) * 2020-05-29 2020-09-01 北京工业大学 Ultra-thin wafer transfer device

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